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Production of OLED & OPV
Karel Spee (karel.spee@tno.nl)
Presentation
                                          overview
Introduction

From S2S to R2R


Process flow


Movie OLED S2S production


Movie R2R processing


Excursion to Mi-Plaza



Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 4




    Programs aligned with industrial needs aimed at
      large area low cost processing




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 5




    Flexible OLED lighting




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                              < 6




    R2R Manufactured Organic Photovoltaics

   •      Program by ECN, Holst Centre, Imec & TU/E in Solliance




                                                               ECN Petten




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                              < 7




    Anatomy of an OLED device
                                                      Total stack < 1 mm!

                                                        Cathode (e.g. Ba-Al)



                                                        OLED stack (1->20 layers!)



                                                        Hole injection layer




                                                        Transparent conductive anode

                                                        Substrate (e.g. glass, plastic or
                                                        metal foil
            LIGHT

     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                           < 8




    OLED & OPV – Layout with ITO




ITO               IndiumTinOxide (typical 90 % In2O3 + 10 % SnO2)
OPV               Organic PhotoVoltaic
OLED              Organic Licht Emitting Diode
PEDOT:PSS         Organic Conductor - Poly(3,4-EthyleneDiOxyThiophen):Poly(StyreneSulfonat)

     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 9




    OLED & OPV - Layout without ITO




     Karel Spee - Mikrocentrum Theme day 10-11-2011
Presentation
                                          overview
Introduction


From S2S to R2R

Process flow


Movie OLED S2S production


Movie R2R processing


Excursion to Mi-Plaza



Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                               < 11




    From S2S  R2R

   •      Stage 1: initial development (MiPlaza)
   •      Stage 2: up scaling (MiPlaza)
   •      Stage 3: transfer to production equipment
                   (MiPlaza & Holst R2R lab)
   •      Stage 4: full R2R (Holst R2R lab)
   •      Stage 5: transfer to pilot production (partners)



                                                                  R2R 30 cm wide

                     S2S 30x30 cm2
                                                      S2S & R2R

S2S 3x3 cm2




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 12




    Large area production by R2R

   •      Large area
   •      Cost effective
   •      Development of full printing
          processes




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                            < 13




     Existing R2R lines at Holst Centre




Metal print
and sinter
R2R-line




R2R coat-                                              R2R
en print line                                          Lamina-
with long                                              tion line
dryer




      Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                                         < 14




    Pre-pilot research line under development

                                                                                 Clean room
                                  NO clean room
                                                                           Class <1000 (100 local)




                                                                       R2R
                                                    DM4 DM3 DM2 DM1    line 3        R2R nanoimprint

                                                                       R2R
                                     DM8 DM7 DM6 DM5 DM4 DM3 DM2 DM1   line 2         R2R lamination

                                                                       R2R
                                                    DM4 DM3 DM2 DM1    line 1         R2R metal



                                                                                   Inspection
                                                                       Post cure       &        Wind
                                                Dryer
                               Foil U-turner                                       Alignment
                                                Module
                                                x
                                                                                    Cleaning
                                                (DMx)                  Depositie                Un-
                                                                                       &
                                                                                                wind
                                                                                   Alignment



     Karel Spee - Mikrocentrum Theme day 10-11-2011
Presentation
                                          overview
Introduction


From S2S to R2R


Process flow

Movie OLED S2S production


Movie R2R processing


Excursion to Mi-Plaza



Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                                                                       < 16




       Process flow: OPV




                                              TCO/
    Foil            Substrate                          Photoactive Pattern       Selective   Electrode/
                     + barrier
                                 Metal grid Conductive
                                                          layer   (Optional)     conductor              Metal (grid) Pattern        Module
 (S2S, R2R)                                                                                     TCO                  (optional)
                                             polymer


                                 Rotary or                                                               Rotary or
                                                                      Laser                                             Laser      Print/coat
   Baseline                       ink jet     Slot die   Slot die                Slot die     Slot die    ink jet
                     PECVD                                            Scribe                                            Scribe     barrier or
                                  print &     coating    coating                 coating      coating     print &
                                                                    (optional)                                        (optional)   encapsul.
                                   sinter                                                                  sinter


                                  Electro-                                                                 laser
Alternative I                                 Ink jet    Ink jet                 Ink jet      Ink jet
                    Laminate       (less)                                                                  metal
                                              printing   printing                printing     printing
                                 deposition                                                              deposition



                                   laser
                                               Spray     Slot die                  Spray       Spray
Alternative II         ALD         metal
                                              coating    coating                  coating     coating
                                 deposition




        Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 17




    OLED sheet-to-sheet production


                     Encapsulation

                            Metal electrode


                                     LEP


                        HC-PEDOT + metal grid




                     Barrier


                     Foil


                     Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                       < 18




    Lamination




                 Equipment: Laminator




                        Foil                          Polymer foil

                                                      Glass-plate
                        Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                              < 19




    Barrier multilayer

                     Equipment inkjet printing                      Equipment: Plasma CVD



                               Multilayer: x times organic OCP & inorganic SiON




                                                                                  SiON
                                                                                  OCP
                                                                                  SiON
                                                                                  OCP
                                                                                  SiON
                     Barrier                                                      OCP
                                                                                  SiON


                     Foil


                     Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                             < 20




    Metal grid




          Equipment: screenprinting (or inkjet printing)




                         metal grid




                      Barrier


                      Foil


                      Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                < 21




    Conducting polymer electrode



                                 Equipment: inkjet printing




                        HC-PEDOT + metal grid




                     Barrier


                     Foil


                     Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 22




    Light emitting polymer

         Equipment: inkjet printing




                                      LEP


                        HC-PEDOT + metal grid




                     Barrier


                     Foil


                     Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                < 23




    Back electrode

                                                      Equipment: evaporator



                            Metal electrode


                                     LEP


                        HC-PEDOT + metal grid




                     Barrier


                     Foil


                     Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                                                      < 24




    Encapsulation
                                                      Same process sequence as barrier


                     Encapsulation

                            Metal electrode


                                     LEP


                        HC-PEDOT + metal grid




                     Barrier


                     Foil


                     Temporary carrier




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 25




    Delamination


                     Encapsulation

                            Metal electrode


                                     LEP


                        HC-PEDOT + metal grid




                     Barrier


                     Foil




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 26




    Working device




     Karel Spee - Mikrocentrum Theme day 10-11-2011
Presentation
                                          overview
Introduction


From S2S to R2R


Process flow


Movie OLED S2S production


Movie R2R processing

Excursion to Mi-Plaza


Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 28




    Movie: Sheet to sheet production of OLEDs




     Karel Spee - Mikrocentrum Theme day 10-11-2011
© Holst Centre                                        < 29




    Movie: Roll to Roll Processes




     Karel Spee - Mikrocentrum Theme day 10-11-2011
Presentation
                                          overview
Introduction


From S2S to R2R


Process flow


Movie OLED S2S production


Movie R2R processing


Excursion to Mi-Plaza


Karel Spee - Mikrocentrum Theme day 10-11-2011
Visit us at
www.holstcentre.com

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Karel Spee

  • 1.
  • 2. Production of OLED & OPV Karel Spee (karel.spee@tno.nl)
  • 3. Presentation overview Introduction From S2S to R2R Process flow Movie OLED S2S production Movie R2R processing Excursion to Mi-Plaza Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 4. © Holst Centre < 4 Programs aligned with industrial needs aimed at large area low cost processing Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 5. © Holst Centre < 5 Flexible OLED lighting Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 6. © Holst Centre < 6 R2R Manufactured Organic Photovoltaics • Program by ECN, Holst Centre, Imec & TU/E in Solliance ECN Petten Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 7. © Holst Centre < 7 Anatomy of an OLED device Total stack < 1 mm! Cathode (e.g. Ba-Al) OLED stack (1->20 layers!) Hole injection layer Transparent conductive anode Substrate (e.g. glass, plastic or metal foil LIGHT Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 8. © Holst Centre < 8 OLED & OPV – Layout with ITO ITO IndiumTinOxide (typical 90 % In2O3 + 10 % SnO2) OPV Organic PhotoVoltaic OLED Organic Licht Emitting Diode PEDOT:PSS Organic Conductor - Poly(3,4-EthyleneDiOxyThiophen):Poly(StyreneSulfonat) Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 9. © Holst Centre < 9 OLED & OPV - Layout without ITO Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 10. Presentation overview Introduction From S2S to R2R Process flow Movie OLED S2S production Movie R2R processing Excursion to Mi-Plaza Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 11. © Holst Centre < 11 From S2S  R2R • Stage 1: initial development (MiPlaza) • Stage 2: up scaling (MiPlaza) • Stage 3: transfer to production equipment (MiPlaza & Holst R2R lab) • Stage 4: full R2R (Holst R2R lab) • Stage 5: transfer to pilot production (partners) R2R 30 cm wide S2S 30x30 cm2 S2S & R2R S2S 3x3 cm2 Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 12. © Holst Centre < 12 Large area production by R2R • Large area • Cost effective • Development of full printing processes Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 13. © Holst Centre < 13 Existing R2R lines at Holst Centre Metal print and sinter R2R-line R2R coat- R2R en print line Lamina- with long tion line dryer Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 14. © Holst Centre < 14 Pre-pilot research line under development Clean room NO clean room Class <1000 (100 local) R2R DM4 DM3 DM2 DM1 line 3 R2R nanoimprint R2R DM8 DM7 DM6 DM5 DM4 DM3 DM2 DM1 line 2 R2R lamination R2R DM4 DM3 DM2 DM1 line 1 R2R metal Inspection Post cure & Wind Dryer Foil U-turner Alignment Module x Cleaning (DMx) Depositie Un- & wind Alignment Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 15. Presentation overview Introduction From S2S to R2R Process flow Movie OLED S2S production Movie R2R processing Excursion to Mi-Plaza Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 16. © Holst Centre < 16 Process flow: OPV TCO/ Foil Substrate Photoactive Pattern Selective Electrode/ + barrier Metal grid Conductive layer (Optional) conductor Metal (grid) Pattern Module (S2S, R2R) TCO (optional) polymer Rotary or Rotary or Laser Laser Print/coat Baseline ink jet Slot die Slot die Slot die Slot die ink jet PECVD Scribe Scribe barrier or print & coating coating coating coating print & (optional) (optional) encapsul. sinter sinter Electro- laser Alternative I Ink jet Ink jet Ink jet Ink jet Laminate (less) metal printing printing printing printing deposition deposition laser Spray Slot die Spray Spray Alternative II ALD metal coating coating coating coating deposition Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 17. © Holst Centre < 17 OLED sheet-to-sheet production Encapsulation Metal electrode LEP HC-PEDOT + metal grid Barrier Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 18. © Holst Centre < 18 Lamination Equipment: Laminator Foil Polymer foil Glass-plate Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 19. © Holst Centre < 19 Barrier multilayer Equipment inkjet printing Equipment: Plasma CVD Multilayer: x times organic OCP & inorganic SiON SiON OCP SiON OCP SiON Barrier OCP SiON Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 20. © Holst Centre < 20 Metal grid Equipment: screenprinting (or inkjet printing) metal grid Barrier Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 21. © Holst Centre < 21 Conducting polymer electrode Equipment: inkjet printing HC-PEDOT + metal grid Barrier Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 22. © Holst Centre < 22 Light emitting polymer Equipment: inkjet printing LEP HC-PEDOT + metal grid Barrier Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 23. © Holst Centre < 23 Back electrode Equipment: evaporator Metal electrode LEP HC-PEDOT + metal grid Barrier Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 24. © Holst Centre < 24 Encapsulation Same process sequence as barrier Encapsulation Metal electrode LEP HC-PEDOT + metal grid Barrier Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 25. © Holst Centre < 25 Delamination Encapsulation Metal electrode LEP HC-PEDOT + metal grid Barrier Foil Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 26. © Holst Centre < 26 Working device Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 27. Presentation overview Introduction From S2S to R2R Process flow Movie OLED S2S production Movie R2R processing Excursion to Mi-Plaza Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 28. © Holst Centre < 28 Movie: Sheet to sheet production of OLEDs Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 29. © Holst Centre < 29 Movie: Roll to Roll Processes Karel Spee - Mikrocentrum Theme day 10-11-2011
  • 30. Presentation overview Introduction From S2S to R2R Process flow Movie OLED S2S production Movie R2R processing Excursion to Mi-Plaza Karel Spee - Mikrocentrum Theme day 10-11-2011