Karel Spee

Production of OLED & OPVKarel Spee (karel.spee@tno.nl)

Presentation overviewIntroductionFrom S2S to R2RProcess flowMovie OLED S2S productionMovie R2R processingExcursion to Mi-PlazaKarel Spee - Mikrocentrum Theme day 10-11-2011

© Holst Centre < 7 Anatomy of an OLED device Total stack < 1 mm! Cathode (e.g. Ba-Al) OLED stack (1->20 layers!) Hole injection layer Transparent conductive anode Substrate (e.g. glass, plastic or metal foil LIGHT Karel Spee - Mikrocentrum Theme day 10-11-2011

© Holst Centre < 8 OLED & OPV – Layout with ITOITO IndiumTinOxide (typical 90 % In2O3 + 10 % SnO2)OPV Organic PhotoVoltaicOLED Organic Licht Emitting DiodePEDOT:PSS Organic Conductor - Poly(3,4-EthyleneDiOxyThiophen):Poly(StyreneSulfonat) Karel Spee - Mikrocentrum Theme day 10-11-2011

© Holst Centre < 11 From S2S  R2R • Stage 1: initial development (MiPlaza) • Stage 2: up scaling (MiPlaza) • Stage 3: transfer to production equipment (MiPlaza & Holst R2R lab) • Stage 4: full R2R (Holst R2R lab) • Stage 5: transfer to pilot production (partners) R2R 30 cm wide S2S 30x30 cm2 S2S & R2RS2S 3x3 cm2 Karel Spee - Mikrocentrum Theme day 10-11-2011

© Holst Centre < 14 Pre-pilot research line under development Clean room NO clean room Class <1000 (100 local) R2R DM4 DM3 DM2 DM1 line 3 R2R nanoimprint R2R DM8 DM7 DM6 DM5 DM4 DM3 DM2 DM1 line 2 R2R lamination R2R DM4 DM3 DM2 DM1 line 1 R2R metal Inspection Post cure & Wind Dryer Foil U-turner Alignment Module x Cleaning (DMx) Depositie Un- & wind Alignment Karel Spee - Mikrocentrum Theme day 10-11-2011

© Holst Centre < 16 Process flow: OPV TCO/ Foil Substrate Photoactive Pattern Selective Electrode/ + barrier Metal grid Conductive layer (Optional) conductor Metal (grid) Pattern Module (S2S, R2R) TCO (optional) polymer Rotary or Rotary or Laser Laser Print/coat Baseline ink jet Slot die Slot die Slot die Slot die ink jet PECVD Scribe Scribe barrier or print & coating coating coating coating print & (optional) (optional) encapsul. sinter sinter Electro- laserAlternative I Ink jet Ink jet Ink jet Ink jet Laminate (less) metal printing printing printing printing deposition deposition laser Spray Slot die Spray SprayAlternative II ALD metal coating coating coating coating deposition Karel Spee - Mikrocentrum Theme day 10-11-2011

© Holst Centre < 19 Barrier multilayer Equipment inkjet printing Equipment: Plasma CVD Multilayer: x times organic OCP & inorganic SiON SiON OCP SiON OCP SiON Barrier OCP SiON Foil Temporary carrier Karel Spee - Mikrocentrum Theme day 10-11-2011

Visit us atwww.holstcentre.com

Karel Spee

by Themadagen on Nov 16, 2011

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Karel Spee — Presentation Transcript