Personal Information
Organization / Workplace
Austin, Texas Area United States
Occupation
Reliability Expert, High Tech Detective, World Traveler & Innovator
Industry
Electronics / Computer Hardware
Website
www.ni.com
About
Cheryl has over 30 years of experience in electronics manufacturing focusing on failure analysis and reliability. She is passionate about applying her unique background to enable her clients to maximize and accelerate product design and development while saving time, managing resources, and improving customer satisfaction.
Throughout her career, Cheryl has had extensive training experience and is a published author and a senior member of both ASQ and IEEE. She views teaching as a two-way process that enables her to impart her knowledge on to others as well as reinforce her own understanding and ability to explain complex concepts through student interaction.
Tags
cheryl tulkoff
electronics reliability
reliability
pcb
printed circuit board
wearable electronics
smta
pb-free
flexure
dfr solutions
immersion oil
sherlock ada
wearable reliability
smtai
glass style
copper dissolution
thermal cycling
coefficient of thermal expansion
immersion oil cooling
data center
physics of failure
ecm
electrochemical migration
nanocoating
cheryl tulkoff. asq reliability division
wearable technology
server
innovation
uv exposure
wearable medical
wearable tech
use environment
design for manufacturing
flexure warpage. cte
qfn
rohs
sac
sac305
vibration
lead free
shock
ipc-tr-579
pof
reliability prediction
tg
cte
btc
ict
ipc 9704
immersion technology
liquid immersion cooling
reliability modeling
failure analysis
printed board
corrosion
hydrophobicity
medical electronics
counterfeit electronics
risk
electronics
quality
risk management
privacy
medical apps
healthcare
ehealth
healthcare apps
security
ehealth apps
fitness tracker
mobile health
health tracker
health app
digital health
advocate
innovate
selling ideas
john daly
advocacy
ctea
central texas electronics association
sweat
liquid flux
cored solder wire
surface finish
manual soldering
hand cleaning
sir
hand soldering
surface insulation resistance
standoff height
mcc
mlp
son
mlf
lga
ipc-7093
bottom termination component
modulus of elasticity
thermo-mechanical reliability
fatigue
temperature cycling
market validation
brett cornwell
innovation commercialization
rob adams
asq innovation conference
mstc
electronic medical devices
degradation
capacitance
delamination
moisture sensitivity
pb-free reflow
moisture absorption
process audit
fabrication
supply chain
frequency
observability
severity
detectability
rpn
risk priority number
failure modes and effects analysis
fmea
asq
failure inducing loads
test plan development
wicking
drilling
silane
conductive anodic filament
caf
mixed soldering
ipc
soldering
dfm
compressive stress
whisker
whisker mitigation
tin whisker
fr-4
ipc-dr-579
ptv
plated through via
pth. plated through hole
potting
coating
mixed assembly
lead-free
sac405
creep
ada
randy schueller
automated design analysis
nate blattau
underfill
low-k dielectric
pop
tmv
package on package
semi
sae as5553
ndaa
idea
iacc
gidep
erai
counterfeit
anti-counterfeit
counterfeit detection
counterfeit prevention
medical device regulation
fda
medical devices
mttf. mtbf
mil-hdbk-217
jim lance
telcordia sr-332
ipc-hdbk-830
j-std-001
ipc2221
silicone
urethane
epoxy
acrylic
glass transition temperature
conformal coating
laminate cracking
trace fracture
strain
bga
pad cratering
charged device model
charged board event
human body model
hbm
cbe
cbm
electrical overstress
cdm
ted dangelmayer
dangelmayer associates
esd
electrostatic discharge
eol
in circuit test
acoustic emissions
ipc 9702
ipc 9708
strain gage test
hot bump pull
cold bump pull
transient bending
pad crater
design failure mode and effects analysis
dfmea
oil cooling
dielectric oil
atomic layer deposition
multi layer barrier films
ald
lotus leaf
hydrophobic
hermiticity
accelerated testing
auto reliability
step stress
root cause analysis
highly accelerated reliability test
reliability test
halt
pb-free hasl
electroless palladium
enig
enepig
immersion silver
osp
cleaning processes
cleanliness
dendritic growth
dendrites
contamination
super hydrophobic coating
medical device
component storage
long term storage
obsolescence
die banking
non-functional pads
non functional pads
nfp
See more
Presentations
(41)Likes
(4)Is there an optimal exercise stimulus for mitochondrial adaptations?
David Bishop
•
7 years ago
Using Risk Analysis and Simulation in Project Management
Mike Tulkoff
•
8 years ago
Procrastination and How to Beat it!
BrightCarbon
•
9 years ago
Dare to Ask: Negotiating When it Matters, Texas Enterprise Speaker Series, March 28, 2012
UT Austin McCombs School of Business
•
12 years ago
Personal Information
Organization / Workplace
Austin, Texas Area United States
Occupation
Reliability Expert, High Tech Detective, World Traveler & Innovator
Industry
Electronics / Computer Hardware
Website
www.ni.com
About
Cheryl has over 30 years of experience in electronics manufacturing focusing on failure analysis and reliability. She is passionate about applying her unique background to enable her clients to maximize and accelerate product design and development while saving time, managing resources, and improving customer satisfaction.
Throughout her career, Cheryl has had extensive training experience and is a published author and a senior member of both ASQ and IEEE. She views teaching as a two-way process that enables her to impart her knowledge on to others as well as reinforce her own understanding and ability to explain complex concepts through student interaction.
Tags
cheryl tulkoff
electronics reliability
reliability
pcb
printed circuit board
wearable electronics
smta
pb-free
flexure
dfr solutions
immersion oil
sherlock ada
wearable reliability
smtai
glass style
copper dissolution
thermal cycling
coefficient of thermal expansion
immersion oil cooling
data center
physics of failure
ecm
electrochemical migration
nanocoating
cheryl tulkoff. asq reliability division
wearable technology
server
innovation
uv exposure
wearable medical
wearable tech
use environment
design for manufacturing
flexure warpage. cte
qfn
rohs
sac
sac305
vibration
lead free
shock
ipc-tr-579
pof
reliability prediction
tg
cte
btc
ict
ipc 9704
immersion technology
liquid immersion cooling
reliability modeling
failure analysis
printed board
corrosion
hydrophobicity
medical electronics
counterfeit electronics
risk
electronics
quality
risk management
privacy
medical apps
healthcare
ehealth
healthcare apps
security
ehealth apps
fitness tracker
mobile health
health tracker
health app
digital health
advocate
innovate
selling ideas
john daly
advocacy
ctea
central texas electronics association
sweat
liquid flux
cored solder wire
surface finish
manual soldering
hand cleaning
sir
hand soldering
surface insulation resistance
standoff height
mcc
mlp
son
mlf
lga
ipc-7093
bottom termination component
modulus of elasticity
thermo-mechanical reliability
fatigue
temperature cycling
market validation
brett cornwell
innovation commercialization
rob adams
asq innovation conference
mstc
electronic medical devices
degradation
capacitance
delamination
moisture sensitivity
pb-free reflow
moisture absorption
process audit
fabrication
supply chain
frequency
observability
severity
detectability
rpn
risk priority number
failure modes and effects analysis
fmea
asq
failure inducing loads
test plan development
wicking
drilling
silane
conductive anodic filament
caf
mixed soldering
ipc
soldering
dfm
compressive stress
whisker
whisker mitigation
tin whisker
fr-4
ipc-dr-579
ptv
plated through via
pth. plated through hole
potting
coating
mixed assembly
lead-free
sac405
creep
ada
randy schueller
automated design analysis
nate blattau
underfill
low-k dielectric
pop
tmv
package on package
semi
sae as5553
ndaa
idea
iacc
gidep
erai
counterfeit
anti-counterfeit
counterfeit detection
counterfeit prevention
medical device regulation
fda
medical devices
mttf. mtbf
mil-hdbk-217
jim lance
telcordia sr-332
ipc-hdbk-830
j-std-001
ipc2221
silicone
urethane
epoxy
acrylic
glass transition temperature
conformal coating
laminate cracking
trace fracture
strain
bga
pad cratering
charged device model
charged board event
human body model
hbm
cbe
cbm
electrical overstress
cdm
ted dangelmayer
dangelmayer associates
esd
electrostatic discharge
eol
in circuit test
acoustic emissions
ipc 9702
ipc 9708
strain gage test
hot bump pull
cold bump pull
transient bending
pad crater
design failure mode and effects analysis
dfmea
oil cooling
dielectric oil
atomic layer deposition
multi layer barrier films
ald
lotus leaf
hydrophobic
hermiticity
accelerated testing
auto reliability
step stress
root cause analysis
highly accelerated reliability test
reliability test
halt
pb-free hasl
electroless palladium
enig
enepig
immersion silver
osp
cleaning processes
cleanliness
dendritic growth
dendrites
contamination
super hydrophobic coating
medical device
component storage
long term storage
obsolescence
die banking
non-functional pads
non functional pads
nfp
See more