•Immersion Oil Cooling Technology Overview •Data Center Efficiency •Cost & Size Benefits •Technology Challenges •Reliability Enhancements •Summary •Challenges & Next Steps

1. Improved Efficiency & Reliability for
Data Center Servers Using Immersion
Oil Cooling
Cheryl Tulkoff & Chris Boyd
ctulkoff@dfrsolutions.com
clb@midasnetworks.com
May 2013 Las Vegas, Nevada

2. • Immersion Oil Cooling Technology Overview
• Data Center Efficiency
• Cost & Size Benefits
• Technology Challenges
• Reliability Enhancements
• Summary
• Challenges & Next Steps
Agenda

3. • Not a new concept!
– Direct liquid immersion
cooling has been used within
IBM for over 20 years to cool
high powered chips on multi-
chip substrates during
electrical testing prior to final
module assembly.
– Early supercomputers relied
on liquid cooling technologies.
• Cray 2 supercomputer
Liquid Immersion Cooling
http://www.electronics-cooling.com/1996/05/direct-liquid-immersion-cooling-for-
high-power-density-microelectronics/

4. • Liquid Submersion Blade Server
– LiquidCool Solutions (Hardcore
Computer) Supports High
Frequency Trading with Liquid
Submersion Cooled Computers
• Released in 2010
– 2012: LSS is the world’s first rack-
mounted total liquid submerged
server. The system’s patented
liquid submersion cooling
technology promises
improvements in speed,
performance, reliability and
latency, while reducing
environmental impact.
Liquid Immersion Cooling Example
http://www.liquidcoolsolutions.com/

5. Cooling Using Dielectric Oil
1200X more
effective at
removing
heat than
air
Oil costs ~$500 per 55 gallon barrel, ~35C

6. Tanks, Not Racks
Tanks can
dissipate
40kW of
power or
more

7. Business Value of Immersion Technology
• Greatly reduced capital and operating
expense vs. conventional data centers
• Data center can be built in non-traditional
facilities, including transportable “pods”
– No need for air conditioning, raised floors or
chemical fire suppression
• No impact on software or network
infrastructure
– Retraining of support personnel not required
• A truly “green” solution
• Reliability Enhancements
Will redefine
how data
centers and
servers will
be built in
the future

8. Typical Data Center Operating Costs
Profile
8%
13%
18%
4%
57%
Networking
Equipment
Power
Power Distribution
& Cooling
Other
Infrastructure
Servers
Power costs
represent
25-40%
of monthly
operating
expenses
3 yr. Server; 10 yr. Infrastructure Amortization

9. Power Usage Efficiency (PUE)
PUE =
Total Facility Power
IT Load
Total
Facility
Power
Power
• Switchgear
• UPS
• Battery Backup
• Lighting
• Etc.
Cooling
• Chillers
• CRACs
• Etc.
IT Load
• Servers
• Switches
• Storage
• Etc.
Any energy
expended
other than
that to drive
the IT Load
contributes to
inefficiency

10. Industry PUE Profile
0
5
10
15
20
25
30
35
40
45
1-1.39 1.4-1.69 1.7-1.9 2.0-2.9 3.0-3.9 4.0 + Don't
Know
n=300
Source: Digital Realty Trust 2012 Survey
%
Immersion Oil
Cooling
PUE ≤ 1.08
Average PUE:
•Per Uptime
Institute: 1.8
•Per EPA
Energy Star
Program: 1.91

11. Huge Energy and Cost Savings
Fan-less,
ultra-
efficient
data center

12. Traditional Data Center vs. Immersion Cooled Data Center
Identical Processing Capacity Comparison
(10,000 servers)
Traditional
Data Center*
Immersion Oil
Cooling Data Center
Data Center
Size (sq. ft.)
Power
Consumption
(MW)
12,500
6.88
4,000
3.12
32%
45%
Of the Size
Of the Power
*Assumes PUE of 1.8 and Dell PowerEdge R520 servers

13. Traditional Data Center vs. Immersion Cooled Data Center
*Assumes PUE of 1.8 and Dell PowerEdge R520 servers
Identical Power Comparison (5 MW)
Traditional
Data Center*
Immersion Oil Cooling
Data Center
Number of
Servers
16,030
6,430
7,275
9,100
120%
71%
More
Processing Capacity
Of the Size
Data Center
Size (sq. ft.)

14. • Simpler than typical air cooling system
• Improvements in the instrumentation and
reporting in progress
Oil Cooling System Components Schematic

15. Preparation: Works With Any OEM Server
Prep takes less
than
10 minutes
Remove fans
Replace thermal paste
Use sealed or
solid-state drives

16. Server Maintenance
• If you do get thermal paste into the system, it can be easily
filtered by temporarily replacing the catch screen in the pump
module with a 2 um filter.
– The thermal paste dissolves in the oil, making it cloudy.
• How do you work on a server in immersion oil cooling?
– Pull the server out, wait for it to drain
– Keep a paper towel nearby
– Potential need to clean if returned to a repair center

17. Optimized Loading Design
• The SLED: custom server design takes optimal
advantage of the cooling technology
– Based on experience gained from more than 18 months of
experience operating an immersion cooled data center

18. • Skepticism from OEMs
– This is changing--Intel's recent positive report
– SuperMicro Computer is developing SKUs for immersion boards
• http://www.datacenterknowledge.com/archives/2012/03/22/submerged-
supermicro-servers-accelerated-by-gpus/
– Network gear manufacturers are lagging behind server vendors
• Disk Arrays
– Current hard disks leak, and the oil crashes the heads
– Solid State Drives (SSDs) are expensive
– Waiting to test the new Western Digital helium filled drives when
they ship next year, hermetically sealed
• http://www.hgst.com/press-room/2012/hgst-announces-radically-new-
helium-filled-hard-disk-drive-platform
Some Immersion Technology Challenges

19. • Proving technology
• Impact on optical
components
– TTCP transfer times and
ping times are very similar
crossing the switch
network, regardless of
whether the optical
interfaces are immersed
– In all cases, no pings were
lost
• Coolant immersion does not
appear to adversely affect
the error rate on the links.
Immersion Technology Challenges

20. • Impact on RF
components?
• Performance
Impacts?
– None detected yet
– Trials underway
– Image of Ethernet
switch which has
been running
immersed since
January 2011
Immersion Technology Challenges

21. Potential Reliability Enhancements
Minimizes
Common
Operational
Issues like:
•Overheating
•Temperature
swings
•Server fan
failures
•Dust
•Air quality
•Corrosion
•Whiskers

22. • Tin Whisker Mitigation
– Arcing
• Zinc Whisker Mitigation
• Reduction in Corrosion & Electrochemical
Migration
– Corrosive exposure reduction
– Moisture reduction
• Environmental contaminant reduction
– Dust, debris, particulates
• More stable and even thermal environment
– No hot spots
Reliability Enhancements

23. Tin Whiskers
 Tin whiskers are hair-like single crystal metallic
filaments that grow from tin films.
 Their unpredictability is the greatest concern.
 The Aerospace and Defense industries consider tin
whiskers the, “greatest reliability risk associated with
Pb-free electronics”.
 Manhattan project phase 2 report

24. What are the potential failure modes?
 Direct Contact
 Causes an electrical short (arcing)
 Requires growth of sufficient length and
in the correct orientation
 Electromagnetic (EM) Radiation
 Emits or receives EM signal and noise at
higher frequencies
 Deterioration of signal for frequencies
above 6 GHz independent of whisker
length
 Debris
 Whisker breaks off and shorts two leads
(primarily during handling)
 These can be mitigated by immersion
oil
Courtesy of P. Bush, SUNY Buffalo
Observation of tin whisker debris as
reported to NASA from Sanmina-SC
DfR Solutions

25. Response to Tin Whisker Risk
 Biggest challenges are high reliability
applications with high volumes and strong
cost pressures
 Examples: Enterprise servers, external
defibrillators, first-responder radios, industrial
process monitoring, etc.
 Every mitigation must be looked at closely in
regards to need and cost
 Requires a clear understanding of why and when
tin whiskers occur

26. • “If you manage a data center, especially one that sits on
a raised floor, zinc whiskers might eventually have an
impact on your operations.”
• “The whisker formation process consists of an
unpredictable incubation period—typically lasting
months or even years without any growth at all—
followed by a period of growth at rates as high as 1
mm/year.”
• “Unfortunately, accelerated techniques do not currently
exist to predict if, when, and to what extent a zinc-
coated surface will produce zinc whiskers.”
– Excerpts from paper by Jay Brusse and Michael Sampson
Zinc Whiskers: Hidden Cause of Equipment
Failure

27. Zinc Whiskers
Zinc whiskers (here, magnified100×) growing on the underside of a
raised-access floor tile. Image courtesy of Jay Brusse et al
• Failure mechanism appears to be
quite widespread
• Awareness by facility or data
center management personnel
appears to be limited

28. Why Worry about Contamination and Cleanliness?
• Believed to be one of the primary drivers of field issues in
electronics today
– Induces corrosion and metal migration
(electrochemical migration – ECM)
• Intermittent behavior lends itself to
no-fault-found (NFF) returns
– Driven by self-healing behavior
– Difficult to diagnosis
• Pervasive
– Failure modes observed on batteries, LCDs, PCBAs, wiring,
switches, etc.
• Will continue to get worse

29. Future of Contamination / Cleanliness Issues
• Continued reductions in pitch between conductors will make
future packaging more susceptible
• Increased use of leadless packages (QFN, land grid array, etc.)
results in reduction in standoff
– Will reduce efficiency of cleaning, which may lead to increased
concentration of contaminants
• Increased product sales into countries with polluted and tropical
environments (East Asia, South Asia, etc.)
– ECM occurrence very sensitive to ambient humidity conditions
• Pb-Free and smaller bond pads
– Require more aggressive flux formulations

30. What is ECM?
• One definition
– Movement of metal through an electrolytic solution under
an applied electric field between insulated conductors
• Electrochemical migration (ECM) can occur on or in
almost all electronic packaging
– Die surface
– Epoxy encapsulant
– Printed board
– Passive components
– Etc.

31. • Temperature
• Moisture
• Contamination
• Voltage/Electrical Field
• Temperature, moisture, and contamination
aspects can all be reduced and/or
eliminated with immersion oil cooling
ECM Drivers

32. Sources of Contaminants
• Printed board fabrication process
– Insufficiently cured polymers
– Rinse water
• Printed board assembly processes
– Fluxes
– Handling
• Salts from human contact (KCl and NaCl)
• Storage and use environment

33. Contaminants: Storage & Environment
• Storage
– Cleaning chemicals
– Outgassing
– Polymeric materials
• Use Environment
– Dust, Debris, Zinc whiskers
– Moisture, Evaporated sea water
– Industrial pollutants – sulfur, etc.
• Filtered oil prevents these from accumulating
on electronics

34. Influence of Pollutants: Creepage Corrosion
• Recent field issues with printed circuit
boards (PCBs) plated with immersion silver
– Sulfur-based creepage corrosion
• Failures in customer locations with elevated
levels of sulfur-based gases
– Rubber manufacturing
– Sewage/waste-water treatment plants
– Vehicle exhaust fumes (exit / entrance
ramps)
– Petroleum refineries
– Coal-generation power plants
– Paper mills
– Landfills
– Large-scale farms
– Automotive modeling studios
– Swamps
• Immersion oil would prevent this
exposure!
P. Mazurkiewicz , ISTFA 2006

35. 35
Creepage Corrosion Failure of ImAg
•Corrosion product is semi-conductive (resistance of about 1Mohm).
•Resistance decreases as humidity increases.
•Traces sensitive to leakage current trigger the system failure.
•Visual inspection required to identify failures (most are CNDs).
Initiation of
a short

36. Pollutants: Not Always in Industrial Settings
• Chinese Drywall Cited in Building Woes
– The drywall is emitting sulfur-based gases that are corroding air-
conditioner coils, computer wiring and metal picture frames.
• Drywall blamed for A.C. failures
– Air-conditioning coils have turned black, along with wiring, piping
and even silver jewelry.
– "We have definitely identified that a combination of sulfide gases
are the cause of the corrosion," said Robert P. DeMott, managing
principal of Environ.
– "Foul odors reported by people living in the homes may also be
caused by the combination of sulfur gases being released from the
drywall,
• Chinese drywall class action lawsuit
– LEE COUNTY, Fla. - The Lawsuit was filed against Knauf Plasterboard
Tianjin Co., LTD, The Knauf Group, Rothchilt International Limited
and the Banner Supply Company.
– Known as "Chinese Drywall", it was manufactured oversees and
was made from waste materials. As a result, it emits sulfur
compounds that corrode copper wiring and other metals found in
homes. Copper Corroded by Sulfur flumes
Drywall Sulfur Fumes Blamed for A.C. & Electrical Equipment failures

37. Infra-Red Thermal Evaluation
D11
Alum Caps
Q16
Thermal Anomalies Detected
- Q16 producing heat when is it supposed to
be in an off state - sneak circuit detected
- D11 detected a hot spot that exceeded
thermal limit
Expect to see hot spot reduction and improved
thermal uniformity using immersion oil cooling

38. Reliability
Engineer
Qual
Engineer
Test
Engineer
Mechanical
Engineer
Thermal
Engineer
Software Reliability Modeling & Prediction Tool
How Hot it Too
Hot?
• PCB Design
• Temp Cycling
• Vibration
• Shock
• Bending
• In Circuit
Test
• DFMEA
• Thermal
Derating
• Failure Rate

39. Thermal Modeling &
Prediction
• Create Thermal
Environment for a
typical, air-cooled
data center
• Create 2nd
environment for
immersion oil
cooled data center
• Compare
• Correlate to longer
term actual data

40. Thermal Modeling & Prediction Life Curves
Can do what if scenarios changing lifetime,
acceptable failure rate, and thermal
environment

41. Produces a
Failure Rate
EM
HCI
NBTI
TDDB
EM
HCI
NBTI
TDDB
EM
HCI
NBTI
TDDB
Acceleration Factors
Analysis of
Functional
Groups
Functional Group A Functional Group B Functional Group i
Simulated Device
Deconstruction
Device
Properties
Manufacturer
Testing
Functional Group A Functional Group B Functional Group i
Device
Accelerated
Failure Rate
o Models the simultaneous
degradation behaviors of
multiple failure mechanisms on
integrated circuit devices
o Devised from published research
literature, technological
publications, and accepted
degradation models from:
o NASAJPL
o University of Maryland
o Semiconductor Reliability
Community
o Easy to use software solution by
multiple engineering disciplines
ICs – Lifetime Prediction & Impact of Temperature

42. • Intel tests oil immersion to cool servers
– “If you are going to add a significant amount of capacity
and have systems with a lot of density and don’t have
good air flow in your data center, this is worth looking
at,” said Mike Patterson, a senior thermal architect for
data centers at Intel.
– “We asked a lot of tough questions and they had pretty
good answers for all of them so we put a pilot together,”
said Patterson. “There’s almost an emotional reaction
[against oil immersion] at first, so people say they would
never do that, but when they see the potential [energy]
savings, they see there’s something there,” he said.
Industry Evaluation – Intel Experience

43. • Intel plans to start developing motherboards
optimized for immersion cooling.
• Various OEMs involved in server hardware are
expected to create modified designs with oil
immersion in mind as well.
• Intel also found that no computer components
— processors, hard drives etc. – were
damaged from the yearlong immersion in
mineral oil.
Industry Evaluation – Intel Experience
http://green.blogs.nytimes.com/2012/09/06/cooling-a-computer-server-
with-mineral-oil/

44. Has what it thinks is the
best of both worlds:
putting the whole server
"blade" (the individual
hardware component of
a server "farm") inside a
container full of a special
liquid called Novec.
Industry Evaluations – Iceotope
http://www.nbcnews.com/technology/futureoftech/new-way-keep-pcs-
cool-submerge-them-goo-1C8603909

45. Technology Summary
• Immersion cooling technology has been used previously in
the computing and electric power industries
• More than 600,000 hours of server time logged by
customers including one of the largest grocery chains in
Texas and Texas Multicore
• Virtually unlimited heat density and scalability
• Using highly effective enviro-friendly fluid for cooling
greatly improves server reliability
• Will be vital for “hot” CPUs currently in development
• Dramatically reduced carbon footprint

46. • Immersion oil cooling offers significant
environmental, cost, performance, and
reliability advantages.
– Reduces potential for failure in:
• Tin Whisker Mitigation via arcing
• Zinc Whisker Mitigation
• Corrosion & Electrochemical Migration (ECM)
• Moisture reduction
• Environmental contaminant reduction
• Provides stable and even thermal environment
Technology Summary

47. • Oil bath monitoring
– Water (primarily initial equipment insertion)
– Contaminants (over time, leaching out from
cables, plastics, etc).
– Cleaning of assemblies if offsite repair required
Future Work – Questions & Challenges

48. • Optimum oil temperature – how was it determined (35C)
and how low can it go?
• Does the oil affect the contact resistance of connectors,
relay contacts, or other electro-mechanical interconnects
over time? That is, does the oil penetrate the metal-to-
metal interface and create an insulating layer?
• Test specifically to show that electrolytic capacitors are not
affected over the long term by immersion. They are not
hermetic and they use ethylene glycol as the main solvent
with adipic acid as the main charge carrier. These may
slightly dissolve in the oil
Future Work – Questions &
Challenges

49. • Extra performance
– Oil immersion may enable over-clocking of processors in ways not possible with air cooling
• Humidity barrier
– Oil immersion might be a good solution for small businesses in humid regions of the world
such as southeast Asia. With the oil, they could build their data center in a warehouse with a
concrete floor and not need all of the traditional chiller or HVAC equipment
• NEBS and telecom applications
– Oil immersion can significantly extend ride through time in the event of a cooling system
failure.
– Could be useful for telecom where uptime and excursion capability is critical.
• Reduces component temperatures
– Helps extend the life of life limited and high temp components such as electrolytic caps, FETs,
and silicon ICs.
Future Work – Questions &
Challenges

50. • Oil Monitoring & Breakdown
• Cleaning of assemblies if offsite repair
required
Future Work – Questions &
Challenges

51. • Use a high humidity environment –
– Choose a couple of servers and place them in oil (experiment cell) and place a couple of servers in air
(control cell).
– Place both the oil immersion tank and the air servers in the same high humidity atmosphere.
– Something like 30 or 35C and 80% RH.
– Review climate of some of the humidity capitols of the world like Mumbai, Delhi, Singapore, Shanghai,
Kuala Lumpur, etc. and design a test that is accelerated relative to them.
• Use thermocouples to show how oil immersion reduces temps of high temp components
– calculations to show improved life, lower failure rate of key components such as silicon ICs, FETs,
electrolytic caps
• Do over-clocking analysis on the processor
– if oil keeps the processor much cooler, could you trade off processor life for performance, i.e. over-
clocking?
– If the processor temp is kept low in oil, you should be able to over-clock and get more performance for
the same expected lifetime, e.g. 5-7 years.
• Ride through
– cut off the oil cooling system and study the ride-through time.
– Compare ride through time of oil (at least 30 min to 1 hour) to the ride through time for an air cooled
data center (couple of minutes).
Potential Experiment Conditions

52. Speaker Biography
 Cheryl Tulkoff has over 22 years of experience in electronics manufacturing with an
emphasis on failure analysis and reliability. She has worked throughout the electronics
manufacturing life cycle beginning with semiconductor fabrication processes, into printed
circuit board fabrication and assembly, through functional and reliability testing, and
culminating in the analysis and evaluation of field returns. She has also managed no clean
and RoHS-compliant conversion programs and has developed and managed comprehensive
reliability programs.
 Cheryl earned her Bachelor of Mechanical Engineering degree from Georgia Tech. She is a
published author, experienced public speaker and trainer and a Senior member of both ASQ
and IEEE. She has held leadership positions in the IEEE Central Texas Chapter, IEEE WIE
(Women In Engineering), and IEEE ASTR (Accelerated Stress Testing and Reliability) sections.
She chaired the annual IEEE ASTR workshop for four years, is an ASQ Certified Reliability
Engineer, and a member of SMTA and iMAPS.
 She has a strong passion for pre-college STEM (Science, Technology, Engineering, and Math)
outreach and volunteers with several organizations that specialize in encouraging pre-
college students to pursue careers in these fields.

53. Co-Author Biography
• Chris Boyd, Chief Technology Officer, Midas Green Technology, LLC. Chris Boyd has 20+ years’
experience in the telecommunications industry as a network operator, system engineer, and
technical trainer. He is the co-founder of Midas Green Technology, LLC, a managed hosting provider
which deploys a new server immersion cooling technology for commercial users.
• Chris is a recognized technologist and is a frequently requested consultant for data center, hosting
and telecommunications companies. Chris has extensive experience developing and implementing
leading innovative technology solutions in network management, performance management and
patents for packet telephony routing. Chris is also treasurer of the Electric Frontier Foundation -
Austin, working to ensure the internet remains a “level playing”
• field for the end user.
• Chris received a degree from UT Dallas in May, 1989 with areas of specialization in communication,
computer science, and management.

54. • 1. Danielson, R.D., Tousignant, L., and Bar-Cohen, A.,Saturated Pool
Boiling Characteristics of Commercially Available Perfluorinated
Liquids, Proc. of ASME/JSME Thermal Engineering Joint Conference,
1987.
• 2. Bergles, A.E., and Bar-Cohen, A., Immersion Cooling of Digital
Computers, Cooling of Electronic Systems , Kakac, S., Yuncu, H., and
Hijikata,K., eds, Kluwer Academic Publishers, Boston, MA, pp. 539-
621, 1994.
• 3. Mudawar, I., and Maddox, D.E., Critical Heat Flux in Subcooled Flow
Boiling of Fluorocarbon Liquid on a Simulated Chip in a Vertical
Rectangular Channel, Intl. J Heat and Mass Transfer, 32, 1989.
• 4. Chrysler, G.M., Chu, R.C., and Simons, R.E., Jet Impingement Boiling
of a Dielectric Coolant in Narrow Gaps, IEEE Trans. CHMT-Part A, Vol.
18 (3), pp.527-533, 1995.
• 5. Danielson, R.D., Krajewski, N., and Brost, J., Cooling a Superfast
Computer, Electronic Packaging and Production, pp. 44-45, July 1986.
References

55. • “Are Zinc Whiskers Growing in Your Computer Room?” R. Hill, Data Clean Corp.; http://www.dataclean.com/pdf/
zincwhiskers3.pdf.
• “Testing Your Mettle: Zinc Whiskers in the Data Center,”B. Brown, Network World, Nov. 2004,
http://www.nwfusion.com/news/2004/110104widernetwhiskers.html
• Pesky ‘Whiskers’ Zap PCs in Secretary of State’s Office,” Aldo Svaldi, The Denver Post, 1 July 2004, pp. C-01.
• • “Precautions Against Zinc Whiskers,” Compaq Corp., Power Requirements for Non-Stop Himalaya Servers—
429905-001, http://h71033.www7.hp.com/TechPubs/PDF/Power_Requirements/TPSEC05.pdf.
• “What Nasty Little Things Are Lurking Inside Your Data Center?” S. Tucker, Unisys World Monthly, Nov. 2002;
http://www.unisysworld.com/monthly/2002/11/whiskers.shtml.
• “Zinc Whisker Abatement,” Worldwide Environmental Services; http://www.wes.net/field_engineering_services-
zinc_
• whisker_detail.htm.
• “Zinc Whiskers: Could Zinc Whiskers Be Impacting Your Electronics?” J. Brusse, Apr. 2003; http://
nepp.nasa.gov/whisker/reference/tech_papers/Brusse2003-Zinc-Whisker-Awareness.pdf.
• “Zinc Whisker Contamination: A Paper on the Effect and Abatement of Zinc Whiskers in Data Processing Centers,”
D. Loman, HP Services; http://www.dataclean.com/pdf/ZincWhiskerWhitePaper.pdf.
• “Zinc Whiskers Growing on Raised Floor Tiles are Causing Conductive Contamination Failures and Equipment
• Shutdowns,” The Uptime Institute; http://www.upsite.com/TUIpages/tuiflashzinc.html.
• “Zinc Whiskers on Floor Tiles,” Infinite Access Floors; http://www.accessfloors.com.au/zincwhiskers.htm.
• “Zinc Whisker Induced Failures in Electronic Systems,” ERA Technology, Winter 2003,
http://www.era.co.uk/news/rfa_feature_06.asp.
• “Whisker Alert,” Japan Electronics & Information Technology Industries Association (JEITA), Jan. 2002;
http://it.jeita.or.jp/infosys/info/whisker/ (in Japanese).
• http://www.layerzero.com/Innovations/stainless_steel_hardware.html (Data Center & Zinc whisker mitigation)
Zinc Whisker References

56. Contact Information
 Questions?
 Contact Cheryl Tulkoff,
ctulkoff@dfrsolutions.com,
512-913-8624
 www.dfrsolutions.com
 Connect with me in LinkedIn as well!
 See the server dunking videos at
http://www.midasgreentech.com/svlg/