The document discusses zero defect tools in the semiconductor industry, highlighting statistical process control (SPC), failure mode and effects analysis (FMEA), and design of experiments (DOE) as key techniques. SPC monitors production processes in real-time to identify deviations, FMEA helps identify potential failures in early design stages, and DOE systematically tests process factors to minimize variation. Additional tools mentioned include automated assemble map generation and cross work center correlation.

1. Zero Defect Tools in the
Semiconductor Industry
There are several tools and techniques that are commonly
used in the industry to achieve, zero defects or near-zero
defect rates.

2. Statistical Process Control
(SPC)
This is a data-driven method that monitors and controls the production
process by collecting and analyzing data in real-time. SPC
semiconductor can identify when a process is deviating from its normal
behavior, allowing engineers to take corrective action before a defect
occurs.

3. Failure Mode and Effects
Analysis (FMEA)
This is a method used to identify potential failure modes and their
impact on the product, process, or system. FMEA is often used in the
early stages of product design to identify potential issues and take
corrective action before the product goes into production.

4. Design of Experiments (DOE)
This is a method used to systematically test and analyze the effects of
various factors on a process or product. DOE can identify the optimal
settings for process parameters and help to minimize variation in the
production process.

5. Add Ons
• Automated Assemble Map Generation
• Cross Work Center Correlation