Richard Gonzalez is a highly accomplished global engineering professional with over 29 years of experience at Lear Corporation. He has extensive management and technical experience, including managing a team of 26 employees in the Process Assurance Lab. Gonzalez is a certified Six Sigma Black Belt who led projects saving over $750k. He has global failure analysis experience and provides troubleshooting and problem solving skills.

1. RICHARD A. GONZALEZ
8731 Osage Drive, Tampa, FL 33634 H: 813.886.3003 / C: 813468.1199
http://www.linkedin.com/in/richardgonzaleztampa rgonza17@tampabay.rr.com
PROFESSIONAL SUMMARY
Highly accomplished global engineering professional with extensive management experience. Managed the
Technical Analysis group with a total of 26 direct reports. Provided failure analysis training to other Lear and
United Technologies facilities throughout the world. Extensive experience in high volume automotive electronic
circuit board assembly manufacturing. Excelled in root cause determination and corrective action implementation
for various internal and external customer quality issues. Certified Six Sigma Black Belt who performed this
function full time for more than two years with a total project savings of $750K.
Certified Six Sigma Black Belt Global Failure Analysis Experience
Extensive Technical Management Skills Highly Accomplished Problem Solving
Component Level Troubleshooting Skills Failure Analysis to Component Die Level
PROFESSIONAL EXPERIENCE
LEAR CORPORATION, Tampa, FL Nov. 1980 – Dec. 2009
UNITED TECHNOLOGIES AUTOMOTIVE (UTA)
Process Assurance Lab (Pal) Supervisor (July 2004 - Dec. 2009)
Managed the Process Assurance Lab (PAL) which included Failure Analysis Technicians, Diagnostic Technicians,
and Incoming Receiving Inspectors. The Lear plant manufactured approximately 8M electronic assemblies of
various types per year. Responsible for performing global root cause failure analysis on production and plant /
warranty returns (electronic assembly component level troubleshooting and failure analysis to component die
level). Additional PAL responsibilities included the Identification of production and warranty failure trends
including root cause determination. Proactive activities included component placement and solder printing
capability studies, Optimization of Automatic Optical Inspection (AOI), and Solder Paste Inspection (SPI) systems.
Developed defect detection method using an Eddy current meter which resulted in a total savings of
$254,000
Improved the average plant wide Automated Optical Inspection test yield from 83.2% in Jan. 2006 to
96.5% in Sept. 2008 which significantly reduced the hidden factory
Global failure analysis trainer
International and domestic travel performing root cause determination of various quality issues and
corrective action implementation at the customer site (Ford, GM, Honda, Nissan, and BMW)
Six Sigma Process Blackbelt (Feb. 2001 – July 2004)
Received extensive statistical training and attained my Six Sigma Black Belt certification in June 2002. Performed
the function of a Six Sigma Process Black Belt on a full- time basis for over two years. Responsible for the
implementation of process improvements utilizing the six sigma methodology. In addition I was responsible for the
internal training and mentoring of process green belts.
At the completion of my two year six sigma black belt assignment, I had a total project savings of $750,000
Trained and mentored 12 six sigma process green belts
Six Sigma Presentations: Presented to suppliers, customers, executives, and colleague
Technical Analysis Supervisor (June 1993 – Feb. 2001)
Managed the Technical Analysis group (A total of 26 direct reports which included: two staff supervisors, 19
technicians, one Tool Designer, three Machinist and three assemblers). Responsible for production and plant
warranty module diagnostics to component level including failure analysis to component die level, module /
component construction analysis, customer and supplier problem resolution, new test equipment scheduling,
construction, and debugging (this includes all electrical and mechanical aspects). Test equipment preventative

2. RICHARD A. GONZALEZ Page 2
H: 813.886-3003 / C: 813.468-1199 rgonza17@tampabay.rr.com
LEAR CORPORATION, continued
maintenance and repair, Electro-Static Discharge (ESD) program, design hardware and write software for room
temp functional, temp functional, durability, and Power Temperature Cycle (PTC) test equipment
Supervision of 26 associates
Started the UTA/Lear failure analysis lab in April 1996
World Wide Electronic Component Quality Council (WWECQC) Vice Chairman
International and domestic travel working with various failure analysis labs within United Technologies
(UTA, UTRC, Carrier, Otis, Pratt & Whitney, Sikorsky, Hamilton Sundstrand)
Associate Test Engineer (June 1988 – June 1993)
Responsible for designing hardware and the development of software for room temp functional, temp functional,
durability, and Power Temperature Cycle (PTC) test equipment. Additional responsibilities include the
troubleshooting of test equipment software / hardware and the investigate of test equipment test yield issues and
implement corrective actions
Sr. Technician, Electronic Technician, Diagnostic Tech (Nov. 1980 – June 1988)
Responsible for designing hardware and the development of software for Product Durability and Power
Temperature Cycle (PTC) test equipment. Additional responsibilities included preventative maintenance and repair
of test equipment, construction of test equipment, module diagnostic’s to component level
TECHNICAL SKILLS
Troubleshooting: Analog and digital circuits to component level
Failure Analysis: Chemical de-capsulation and cross sectioning capability to die level
Failure Analysis Equipment: Chemical fume hood, Cross Section, Curve Tracer,
Stereo and Metallurgical Microscope, Strain gage amplifier, Oscilloscope, DMM
Software Languages: Assembler, Basic, C, C++
Communication Buses: RS232, GPIB-IEEE488, CAN
Analytical: Certified Six Sigma Black Belt
PROFESIONAL DEVELOPMENT TRAINING & CERTIFICATES
Six Sigma Black Belt Six Sigma Design of Statistics Training
Experiments
Failure Mode Effects Kepner Tregoe Failure Analysis
Analysis
How to Handle Difficult SPI AOI
People
Strain Gage Analysis
EDUCATION
A.S. Degree, Electronic Engineering Technology, United Electronics Institute, Tampa, FL
Continuing Education (C Programming and General Education Classes), Metropolitan University, Tampa, FL
High School Diploma; Industrial Electronics Certificate (900 hours), Hillsborough High School, Tampa, FL