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The perfect
combination of
production and supply chain!
Shenzhen Yaxinda Technology Co.,Ltd
+86 755 3663 2568 27671575
+86 755 2372 7499
services@yaxindatech.com / services@yxdpcb.cn
www.yaxindatech.com / www.yxdpcb.cn
Room 318-326, Buliding H, Zhigu, No.4, Yintian Road, Bao’an District, Shenzhen(Office Address)
The Second Industrial Area, Caowei Community, Zhongwu, Bao'an District, Shenzhen(Factory Address)
Better than the best!
Faster than the fastest!
www.yxdpcb.cn
Enterprise introduction
Shenzhen Yaxinda Technology co ., Ltd, is dedicated to R&D and manufacture fast & high-den-
sity multilayer as well as special boards to provide customers with technical support and PCB fabri-
cation service. The factory is close to the Shenzhen airport with the plant area of 3,000㎡, total
employees around 260 and annual production capacity of 180,000㎡. The plant was established by
PCB professionals who trained a group of experienced workers. With high-quality management,
advanced equipments and perfect quality assurance system, Yaxinda is enhancing it’s status in the
PCB industry and leaving good impression on the customers.
To improve the production capacity, Yaxinda has purchased various advanced equipments from
America, Italy, Japan, Hong Kong, Taiwan etc. It has obtained ISO-9OOl certificate and the UL of
American & Canada (E466113).By dopting the advanced technologies for fast production at pres-
ent, we are able to deliver 200 items per day. More importantly, 2-8 layers boards can be delivered
in 24-hours, large volumes with expedite service can also be achieved. Even 2-6 layer within 100㎡
can be finished in 3 days. Except manufacture PCB boards, we can also offer good supplier-chain
management, so far, 50 layer boards can be realized through our partners.
Our products include: high-density multilayer boards , HDI, High multi-layer blind&buried PCB ,
Rogers+FR4 Mixed laminated boards, Backplane, Embedded resistance board, Heavy copper power
PCB, Backdrill, Semiconductor Test products, high TG boards(TG 280℃ ),MCPCB, rigid-flexible
integrated printed boards etc, we are capable to provide various PCB services to our customers.
We promote technological innovation to get a dominate position in business operation, established
stable management system including market development, engineering orders, processing control,
quality assurance, material control and after-sales service etc. ”Technology is the first productive
forces”. Fully respect R&D and innovation, Yaxinda grows up steadily in the fierce competition. To be
the top PCB manufacture in China is our unremitting goal.
Pursuing excellent quality is our eternal faith. Shenzhen Yaxinda Technology co., LTD will always be
your reliable business partner! Welcome all friends to visit our factory.
01Faster than the fastest 02Faster than the fastest
Better than the bestBetter than the best
Integrity, Diligent, we strive to offer
customer any conceivable service!
Create value for customers, 
and benefit for employees!
Company Value
Qualification
certification
Yaxinda pursuit “Zero Defect; Detail Oriented; Quality Satisfied; Considerate Service; Customer Con-
fidence" as the goal of quality management.
By set up outstanding management systems with ISO international organization for standardization
and create company's quality management system platform through the use of PDCA mode of opera-
tion, Yaxinda is approved by a multi-industry quality management system certification ISO9001,
ROHS, UL, SGS etc.
0403 04Faster than the fastest Faster than the fastest
Better than the bestBetter than the best
ZP MV8.E466113
Wiring, P rinted Certified for Canada - Component
For enhanced search functionality, please visit UL's iQ™ Family of Databases.
Click on a product designation for complete information.
Page Bottom
Wiring, P rinted Certified for Canada - Component
See General Information for Wiring, Printed Certified for Canada - Component
Y A XIN DA INT'L ELECTRONIC TECHNOLOGY CO E466113
Blk J 14th Fl Tsun Wan Ind Bldg
60 Tsun Yip St
Kwun Tong
Kln, HONG KONG
Cond W idth Max Max
Min Cond SS/ Area Solder Oper Meets C
Min Edge Thk DS/ Diam Limits Temp Flame UL796 T
Type mm(in) mm(in) mic(mil) DSO mm(in) C sec C Class DSR I
Multilayer printed w iring boards.
Y XD-
ML
0.075 (0.003) 0.075 (0.003) 17 (0.67)
Int:70
DS 50.8 (2.0) 288 20 130 V-0 All 3
Single layer printed w iring boards.
Y XD-
DS
0.075 (0.003) 0.075 (0.003) 17 (0.67) DS 50.8 (2.0) 288 20 130 V-0 All 3
Marking: Company name or trademark , or file number and type designation and the Recognized
Component Mark for Canada, . May be followed by a suffix to denote factory identification or burning test
classification.
Last Updated on 2016-09-14
Questions? Print this page Terms of Use Page Top
� 2016 UL LLC
The appearance of a company's name or product in this database does not in itself assure that products so
identified have been manufactured under UL's Follow-Up Service. Only those products bearing the UL Mark should
be considered to be Certified and covered under UL's Follow-Up Service. Always look for the Mark on the product.
UL permits the reproduction of the material contained in the Online Certification Directory subject to the following
conditions: 1. The Guide Information, Assemblies, Constructions, Designs, Systems, and/or Certifications (files) must
be presented in their entirety and in a non-misleading manner, without any manipulation of the data (or drawings).
2. The statement "Reprinted from the Online Certifications Directory with permission from UL" must appear adjacent
to the extracted material. In addition, the reprinted material must include a copyright notice in the following format:
"© 2016 UL LLC".
2016/9/23 ZPMV8.E466113 - Wiring, Printed Certified for Canada- Component
http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/showpage.html?name=ZPMV8.E466113&ccnshorttitle=Wiring,+Printed+Certified+for+Can… 1/1
2016/9/23 ZPMV2.E466113 - Wiring, Printed - Component
http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/showpag.html?name=ZPMV8.E466113&ccnshorttitle=Wiring,+Printed+-+Component&obji… 1/1
ZP MV2.E466113
Wiring, P rinted - Component
For enhanced search functionality, please visit UL's iQ™ Family of Databases.
Click on a product designation for complete information.
Page Bottom
Wiring, P rinted - Component
See General Information for Wiring, Printed - Component
Y A XIN DA INT'L ELECTRONIC TECHNOLOGY CO E466113
Blk J 14th Fl Tsun Wan Ind Bldg
60 Tsun Yip St
Kwun Tong
Kln, HONG KONG
Cond W idth Max Max
Min Cond SS/ Area Solder Oper Meets C
Min Edge Thk DS/ Diam Limits Temp Flame UL796 T
Type mm(in) mm(in) mic(mil) DSO mm(in) C sec C Class DSR I
Multilayer printed w iring boards.
Y XD-
ML
0.075 (0.003) 0.075 (0.003) 17 (0.67)
Int:70
DS 50.8 (2.0) 288 20 130 V-0 All 3
Single Layer Metal Base P rinted W iring Board, employing metal base laminate.
Y XD-AL 0.10 (0.004) 0.10 (0.004) 34 (1.34) DS 50.8 (2.0) 288 10 50 V-0 All 0
Single layer printed w iring boards.
Y XD-
DS
0.075 (0.003) 0.075 (0.003) 17 (0.67) DS 50.8 (2.0) 288 20 130 V-0 All 3
Y XD-
DS1(#)
0.075 (0.003) 0.100 (0.004) 17 (0.67) DS 50.8 (2.0) 288 20 130 V-0 All 4
(#) - the min conductor width and min edge conductor width is 0.25mm when the external copper weight is from
103mic to 204mic
Marking: Company name or trademark or file number and type designation. May be followed by a suffix to
denote factory identification or burning test classification.
Last Updated on 2016-09-14
Questions? Print this page Terms of Use Page Top
� 2016 UL LLC
The appearance of a company's name or product in this database does not in itself assure that products so
identified have been manufactured under UL's Follow-Up Service. Only those products bearing the UL Mark should
be considered to be Certified and covered under UL's Follow-Up Service. Always look for the Mark on the product.
UL permits the reproduction of the material contained in the Online Certification Directory subject to the following
conditions: 1. The Guide Information, Assemblies, Constructions, Designs, Systems, and/or Certifications (files) must
be presented in their entirety and in a non-misleading manner, without any manipulation of the data (or drawings).
2. The statement "Reprinted from the Online Certifications Directory with permission from UL" must appear adjacent
to the extracted material. In addition, the reprinted material must include a copyright notice in the following format:
"© 2016 UL LLC".
With sufficient raw
materials stock of
standingbrands,
Yaxinda can offer the
best solution for
allkinds of materials.
Standard
materials
High
frequency materials
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
30
Type
PTFE Laminates
Hybrid laminating
Multilayers
Buried/Blind Via
HDI
Flex & Rigid-Flex PCB
Soldermask Type(LPI)/Soldermask color
Peelable Soldermask/color
Carbon ink
HASL/Lead Free HASL
OSP
ENIG (Ni-Au)
Electro-bondable Ni-Au
ENEIPG
Electro. Hard Gold
Thick tin
Copper thickness
Min Mechanical Drill Hole
Min. Laser Drill Hole
Line Width/Spacing
Max. Panel Size
Line Width/Spacing Tolerance
PTH Hole Tolerance
NPTH Hole Tolerance
Hole Location Tolerance
Hole to Edge Tolerance
Edge to Edge Tolerance
Layer to Layer Tolerance
Impedance Tolerance
Warpage %
KB,Shengyi, ITEQ,Isola,Nelco,Ventec,Tuc,Elite,Panasonic, Getek,NanYa,Bergquist,laird
4-50 layers, board thickness 0.4mm-10mm
4-50 layers, board thickness 0.5mm-10mm
1+N+1、2+N+2、3+N+3、Anylayer HDI
1-12layers Flex PCB ,2-20layers Rigid-flex PCB HDI+Rigid-flex PCB
PETER SD2955/Blue-Green
Nipon
Thickness: 0.5-40um
Entek Plus HT, Preflux F2 LX
Au:0.03um≤max<0.06um Ni:3um≤max≤6um
Au:0.2-1.0um Ni:2.54-10um
Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm
Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)
1.0-1.4um
12oz max.
0.15mm
4mil (0.100mm)
2mil/2mil
650mm X 1200mm
Non electro coating:+/-5um,Electro coating:+/-10um
+/-0.002inch(0.050mm)
+/-0.002inch(0.050mm)
+/-0.002inch(0.050mm)
+/-0.004inch(0.100mm)
+/-0.004inch(0.100mm)
+/-0.003inch(0.075mm)
+/- 10% /Max >50ohm +/- 5%
Max ≤0.5%
Normal FR4/Halogen free/High Tg FR4/
Aluminum
Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK
series、TP series;
Rogers/Taconic/Arlon/Nelco laminate with FR-4 material -including partial Ro4350B
hybrid laminating with FR-4
kuangshun,Taiyo、Himonia,Nanya,Onstatic,Chung Yu,MSDS/Green,Yellow, Black, Blue,
Red, White, Purple,Orange ,Matte Green,Matte Blue,Matte Black
Capability of Rigid board
05
Faster than the fastest
06
Faster than the fastest
Capability of Rigid-flex board
No.
1
2
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
Item
Flex & Rigid-Flex PCB
FCCL(adhesive)
PI stiffener
3M
NO FLOW PP
CCL
Other CCL
Board thickness
Tolerance of boad thickness(thickness>1.0mm)
Tolerance of boad thickness(thickness≤1.0mm)
Min. board size
Max. board size
Impedance control tolerance
Min. bow&twist
Min. BGA pad size
Max. finished copper thickness
Max. buried via
Tolerance of non‐plated holes
Solder mask color
Min. solder dam (copper≤1oz)
Min. solder dam (copper2‐4oz)
Min. clearance
thickness (ENIG)
Nickel thickness (ENIG)
Gold thickness (ENEPIG)
Palladium thickness (ENEPIG)
Nickel thickness (ENEPIG)
Hard gold thickness(leadless)
Hard gold thickness(including lead)
Electrolytic Nickel thickness
Electrolytic Gold thickness
Immersion silver thickness
OSP thickness
Tolerance of board outline
Standard
1-12layers Flex PCB ,2-20layers Rigid-flex PCB HDI+Rigid-flex PCB
Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz
Panasonic R‐F775(ER):PI=1mil&2mill; Cu=0.33oz&0.5oz &1oz
DuPont Pyralux AP:PI=1mil&2mil&3mil; Cu= 0.5oz&1oz
Shengyi SF305C: 0515&0525&1025&2030
Taiflex FHK: 1025&1035
Taiflex BT: AD=10um&25um& 40um
shengyi SF302B: AD=35um&40um
Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil
9077&6677&9458
Ventec:VT‐47N(TG 170℃)&EM‐285B(TG 150℃)
ITEQ: IT‐180A; Shengyi: S1141& S1000‐2
Arlon: 85N; Rogers: RO4000 series; Nelco:N4000‐13 series,Ventec:VT‐901
0.3mm‐3.0mm
±10%
±0.1mm
10mm*15mm
406.4mm*558.8mm
±10%
0.75%(symmetrical),2%(unsymmetrical)
12mil(8mil for electrical soft gold board)
3oz
0.4mm
±2mil(limited is +0/‐2mil or +2mil/‐0)
green,blue,red, matte green,
4mil(green, red and blue), 5mil(black and white)
8mil
2.5mil (2.0mil)
HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft
Gold,Hard Gold, Immersion silver, Immersion tin and OSP
0.05‐0.10um
3‐8um
0.05‐0.10um
0.05‐0.15um
3‐8um
0.1‐1.5um
0.1‐4.0um
≥3um
0.05‐0.10um
0.2‐0.4um
0.1‐0.3um
±6mil(exclude complicated board outline and cutout)
3 FCCL(adhesiveless)
Coverlay4
Adhesive5
26
27
28
29
30
31
32
Surface treatment
1. Enquires and consultation responded within 2 hours
2. Full QYT Regular orders on time delivery over 90%; Full QTY Expedite orders on time delivery over 99%
3. Experienced PCB manufacturing services team
4. Complete materials including stock special materials made by world’s top companies such as Rogers, ISOLA,,Nanya,
Arlon, Taconic, Ventec, Dupont, Teflon, Panasonic, Berquist,etc
5. In an effort to offer our customer complete PCB solutions with best price and service, our factory not only manufacture
PCB in our own house, but also cooperate with Chinese Top PCB manufacturer for very complicated boards.
6. We provide expedite services for both prototype and volume production:
Fastest prototype 1L to 8L : 24 hours
Fastest volume production(within100㎡) 2L to 6L: 72 hours
7. Our factory manufacture all standard orders in our own house without outsourcing, therefore we can offer you extremely
competitive price with reliable quality.
8. We offer flexible payment terms: Prepayment, Payment after delivery;
Monthly Payment. You can also let us know about your usual way of 
payment, we will try best to meet your requirements if needed.
9. We guarantee our customers with excellent after-sales service to fully protect customers’ rights and interests.
Core strengths
Complete Stock
Special Materials
Extremely
competitive price
Excellent after
-sales service
2 hours
rapid response
Flexible
Payment Terms
All kinds of
PCB services
Better than the bestBetter than the best
07Faster than the fastest 08Faster than the fastest
Product
introduction
1009Faster than the fastest Faster than the fastest
Parameters
Layers: 8
Material: TU768+Rogers 6010
Thicknes:  1.5mm
Copper thicknes: 1OZ
Surface Treatment: ENIG
Min. Hole Size: 0.3mm
Crafts
mix dielectric
Applications
communication
Parameters
Layers:  16
Material: S1000-2
Thicknes: 1.6mm
Copper thicknes: 1OZ
Surface Treatment:  ENIG
Min. Hole Size: 0.25mm
Width/Space:   0.1mm/0.1mm
Crafts
2Steps HDI Board
No-Flow PP
Applications
Communications satellite
Parameters
Layers: 18
Material: Rogers 4350
Thicknes: 1.55mm
Copper thicknes 1OZ
Surface Treatment:  ENIG
Min. Hole Size: 0.2mm
Width/Space:  0.1mm/0.1mm
Crafts
3Steps HDI Board
Laser via , L1-L2;L2-L3;L3-L4;L15-L16;L16-L17;L17-L18
Applications
Communications satellite
Parameters
Layers:  2
Material : rogers Tmm 10i
Thicknes:  1.8mm
Copper thicknes: 1OZ
Surface Treatment:  immersion Ag
Min. Hole Size: 0.6mm
Width/Space:  0.25mm/0.25mm
Crafts
Especial material
Applications
Communications satellite
Parameters
Layers:  32
Material: IT180A
Thicknes: 5.0mm
Copper thicknes : 1OZ/4OZ
Surface Treatment:  ENIG+hard gold
Min. Hole Size: 0.2mm
Width/Space:  0.15mm/0.15mm
Crafts
POFV
plated hard gold
Applications
Telecommunication
Parameters
Layers:  12
Material:Halogen free S1165
Thicknes:   1.6mm
Copper thicknes 1OZ
Surface Treatment:   ENIG
Min. Hole Size: 0.1mm
Width/Space:   0.1mm/0.1mm
Crafts
3 Steps HDI Board
Applications
Communications satellite
Better than the bestBetter than the best
11 12Faster than the fastest Faster than the fastest
Parameters
Layers:   2
Material: VT901
Thicknes:  1.5mm
Copper thicknes: 5OZ
Surface Treatment: HASL LF
Min. Hole Size: 0.7mm
Crafts
especial material
Applications
Industry control
Parameters
Layers: 18
Material: IT180A
Thicknes:  5.0mm
Copper thicknes: 2OZ
Surface Treatment:  Hard gold 50U"
Min. Hole Size: 0.4mm
Width/Space: 0.51mm/0.15mm
Crafts
Impedance Control
Unsymmetrical Layer Structure
Aspect ratio 13:1
Applications
Base Station
Parameters
Layers:  4
Material: DuPont PI+FR4
Thicknes:  1.6mm
Copper thicknes 1OZ
Surface Treatment:  ENIG
Min. Hole Size: 0.2mm
Width/Space:  0.15mm/0.12mm
Crafts
Rigid - flexible Board
Applications
Industry control
Parameters
Layers:  8
Material:DuPont PI+FR4
Thicknes:   1.6mm
Copper thicknes 1OZ
Surface Treatment:   ENIG
Min. Hole Size: 0.2mm
Width/Space:   0.1mm/0.1mm
Crafts
Super length Rigid-Flex board
Applications
Telecommunication
Better than the bestBetter than the best
Parameters
Layers:4
Material :TU768+ThinFlex
Thicknes:   1.6mm
Copper thicknes 1OZ
Surface Treatment:    ENIG+Hard gold 50U"
Min. Hole Size: 0.2mm
Width/Space:   0.1mm/0.1mm
Crafts
Rigid-Flex board
Applications
Medical care
Parameters
Layers: 1
Material :Aluminum 3.0 W/Mk
Thicknes:    1.6mm
Copper thicknes 1OZ
Surface Treatment:HASL
Crafts
Taiyo LEW03
Applications
LED
Better than the bestBetter than the best
13Faster than the fastest 14Faster than the fastest
Flow chart
Export Sales Dept:
More than 50 profes-
sional sales of many
languages who are
familiar with the
business process can
supply the superior and
multiple service.
Lamination: Advanced
lamination equipment
can guarantee the
quality and delivery
time.
Drilling: Many
Imported drilling
machine can guar-
antee the accuracy
of drilling and the
quality of micro-vi-
as.
Panel Plating and
Pattern Plating
Technics works
together with Plasma
equipment can well
guarantee cooper
thickness and quality
of micro cooper.
Etching: Auto etch-
ing line can guaran-
tee an identical track
width of different
copper thickness.
Many AOI testing
equipments can
well guarantee the
quality of circuit.
The latest printing and
developing technology
can well guarantee
the quality of solder
resist.
Surface treatment: ENIG, HASL, 
Lead free HASL, Hard gold,
ENEPIG, OSP, Immersion silver, 
Immersion Tin, etc.
Profiling: Many imported
gong routing machine, V-CUT 
machine can keep the
outline accuracy.
Testing: Latest
testing equipments
are used to guaran-
tee all the customer
ordered products are
100% electrically
tested.
Image Transfer:
Super clean work-
shop of grade 10K
prevents dust entry
effectively.
Shipment: Providing
multi-channel
logistics: such as
UPS, DHL,FedEx,
TNT, sea and air
service etc.
After-sales Service:
Excellent and timely
after-sales service can
solve customers wor-
ries.

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Yaxinda technology

  • 1. The perfect combination of production and supply chain! Shenzhen Yaxinda Technology Co.,Ltd +86 755 3663 2568 27671575 +86 755 2372 7499 services@yaxindatech.com / services@yxdpcb.cn www.yaxindatech.com / www.yxdpcb.cn Room 318-326, Buliding H, Zhigu, No.4, Yintian Road, Bao’an District, Shenzhen(Office Address) The Second Industrial Area, Caowei Community, Zhongwu, Bao'an District, Shenzhen(Factory Address) Better than the best! Faster than the fastest! www.yxdpcb.cn
  • 2. Enterprise introduction Shenzhen Yaxinda Technology co ., Ltd, is dedicated to R&D and manufacture fast & high-den- sity multilayer as well as special boards to provide customers with technical support and PCB fabri- cation service. The factory is close to the Shenzhen airport with the plant area of 3,000㎡, total employees around 260 and annual production capacity of 180,000㎡. The plant was established by PCB professionals who trained a group of experienced workers. With high-quality management, advanced equipments and perfect quality assurance system, Yaxinda is enhancing it’s status in the PCB industry and leaving good impression on the customers. To improve the production capacity, Yaxinda has purchased various advanced equipments from America, Italy, Japan, Hong Kong, Taiwan etc. It has obtained ISO-9OOl certificate and the UL of American & Canada (E466113).By dopting the advanced technologies for fast production at pres- ent, we are able to deliver 200 items per day. More importantly, 2-8 layers boards can be delivered in 24-hours, large volumes with expedite service can also be achieved. Even 2-6 layer within 100㎡ can be finished in 3 days. Except manufacture PCB boards, we can also offer good supplier-chain management, so far, 50 layer boards can be realized through our partners. Our products include: high-density multilayer boards , HDI, High multi-layer blind&buried PCB , Rogers+FR4 Mixed laminated boards, Backplane, Embedded resistance board, Heavy copper power PCB, Backdrill, Semiconductor Test products, high TG boards(TG 280℃ ),MCPCB, rigid-flexible integrated printed boards etc, we are capable to provide various PCB services to our customers. We promote technological innovation to get a dominate position in business operation, established stable management system including market development, engineering orders, processing control, quality assurance, material control and after-sales service etc. ”Technology is the first productive forces”. Fully respect R&D and innovation, Yaxinda grows up steadily in the fierce competition. To be the top PCB manufacture in China is our unremitting goal. Pursuing excellent quality is our eternal faith. Shenzhen Yaxinda Technology co., LTD will always be your reliable business partner! Welcome all friends to visit our factory. 01Faster than the fastest 02Faster than the fastest Better than the bestBetter than the best Integrity, Diligent, we strive to offer customer any conceivable service! Create value for customers,  and benefit for employees! Company Value
  • 3. Qualification certification Yaxinda pursuit “Zero Defect; Detail Oriented; Quality Satisfied; Considerate Service; Customer Con- fidence" as the goal of quality management. By set up outstanding management systems with ISO international organization for standardization and create company's quality management system platform through the use of PDCA mode of opera- tion, Yaxinda is approved by a multi-industry quality management system certification ISO9001, ROHS, UL, SGS etc. 0403 04Faster than the fastest Faster than the fastest Better than the bestBetter than the best ZP MV8.E466113 Wiring, P rinted Certified for Canada - Component For enhanced search functionality, please visit UL's iQ™ Family of Databases. Click on a product designation for complete information. Page Bottom Wiring, P rinted Certified for Canada - Component See General Information for Wiring, Printed Certified for Canada - Component Y A XIN DA INT'L ELECTRONIC TECHNOLOGY CO E466113 Blk J 14th Fl Tsun Wan Ind Bldg 60 Tsun Yip St Kwun Tong Kln, HONG KONG Cond W idth Max Max Min Cond SS/ Area Solder Oper Meets C Min Edge Thk DS/ Diam Limits Temp Flame UL796 T Type mm(in) mm(in) mic(mil) DSO mm(in) C sec C Class DSR I Multilayer printed w iring boards. Y XD- ML 0.075 (0.003) 0.075 (0.003) 17 (0.67) Int:70 DS 50.8 (2.0) 288 20 130 V-0 All 3 Single layer printed w iring boards. Y XD- DS 0.075 (0.003) 0.075 (0.003) 17 (0.67) DS 50.8 (2.0) 288 20 130 V-0 All 3 Marking: Company name or trademark , or file number and type designation and the Recognized Component Mark for Canada, . May be followed by a suffix to denote factory identification or burning test classification. Last Updated on 2016-09-14 Questions? Print this page Terms of Use Page Top � 2016 UL LLC The appearance of a company's name or product in this database does not in itself assure that products so identified have been manufactured under UL's Follow-Up Service. Only those products bearing the UL Mark should be considered to be Certified and covered under UL's Follow-Up Service. Always look for the Mark on the product. UL permits the reproduction of the material contained in the Online Certification Directory subject to the following conditions: 1. The Guide Information, Assemblies, Constructions, Designs, Systems, and/or Certifications (files) must be presented in their entirety and in a non-misleading manner, without any manipulation of the data (or drawings). 2. The statement "Reprinted from the Online Certifications Directory with permission from UL" must appear adjacent to the extracted material. In addition, the reprinted material must include a copyright notice in the following format: "© 2016 UL LLC". 2016/9/23 ZPMV8.E466113 - Wiring, Printed Certified for Canada- Component http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/showpage.html?name=ZPMV8.E466113&ccnshorttitle=Wiring,+Printed+Certified+for+Can… 1/1 2016/9/23 ZPMV2.E466113 - Wiring, Printed - Component http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/showpag.html?name=ZPMV8.E466113&ccnshorttitle=Wiring,+Printed+-+Component&obji… 1/1 ZP MV2.E466113 Wiring, P rinted - Component For enhanced search functionality, please visit UL's iQ™ Family of Databases. Click on a product designation for complete information. Page Bottom Wiring, P rinted - Component See General Information for Wiring, Printed - Component Y A XIN DA INT'L ELECTRONIC TECHNOLOGY CO E466113 Blk J 14th Fl Tsun Wan Ind Bldg 60 Tsun Yip St Kwun Tong Kln, HONG KONG Cond W idth Max Max Min Cond SS/ Area Solder Oper Meets C Min Edge Thk DS/ Diam Limits Temp Flame UL796 T Type mm(in) mm(in) mic(mil) DSO mm(in) C sec C Class DSR I Multilayer printed w iring boards. Y XD- ML 0.075 (0.003) 0.075 (0.003) 17 (0.67) Int:70 DS 50.8 (2.0) 288 20 130 V-0 All 3 Single Layer Metal Base P rinted W iring Board, employing metal base laminate. Y XD-AL 0.10 (0.004) 0.10 (0.004) 34 (1.34) DS 50.8 (2.0) 288 10 50 V-0 All 0 Single layer printed w iring boards. Y XD- DS 0.075 (0.003) 0.075 (0.003) 17 (0.67) DS 50.8 (2.0) 288 20 130 V-0 All 3 Y XD- DS1(#) 0.075 (0.003) 0.100 (0.004) 17 (0.67) DS 50.8 (2.0) 288 20 130 V-0 All 4 (#) - the min conductor width and min edge conductor width is 0.25mm when the external copper weight is from 103mic to 204mic Marking: Company name or trademark or file number and type designation. May be followed by a suffix to denote factory identification or burning test classification. Last Updated on 2016-09-14 Questions? Print this page Terms of Use Page Top � 2016 UL LLC The appearance of a company's name or product in this database does not in itself assure that products so identified have been manufactured under UL's Follow-Up Service. Only those products bearing the UL Mark should be considered to be Certified and covered under UL's Follow-Up Service. Always look for the Mark on the product. UL permits the reproduction of the material contained in the Online Certification Directory subject to the following conditions: 1. The Guide Information, Assemblies, Constructions, Designs, Systems, and/or Certifications (files) must be presented in their entirety and in a non-misleading manner, without any manipulation of the data (or drawings). 2. The statement "Reprinted from the Online Certifications Directory with permission from UL" must appear adjacent to the extracted material. In addition, the reprinted material must include a copyright notice in the following format: "© 2016 UL LLC". With sufficient raw materials stock of standingbrands, Yaxinda can offer the best solution for allkinds of materials. Standard materials High frequency materials
  • 4. No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 30 Type PTFE Laminates Hybrid laminating Multilayers Buried/Blind Via HDI Flex & Rigid-Flex PCB Soldermask Type(LPI)/Soldermask color Peelable Soldermask/color Carbon ink HASL/Lead Free HASL OSP ENIG (Ni-Au) Electro-bondable Ni-Au ENEIPG Electro. Hard Gold Thick tin Copper thickness Min Mechanical Drill Hole Min. Laser Drill Hole Line Width/Spacing Max. Panel Size Line Width/Spacing Tolerance PTH Hole Tolerance NPTH Hole Tolerance Hole Location Tolerance Hole to Edge Tolerance Edge to Edge Tolerance Layer to Layer Tolerance Impedance Tolerance Warpage % KB,Shengyi, ITEQ,Isola,Nelco,Ventec,Tuc,Elite,Panasonic, Getek,NanYa,Bergquist,laird 4-50 layers, board thickness 0.4mm-10mm 4-50 layers, board thickness 0.5mm-10mm 1+N+1、2+N+2、3+N+3、Anylayer HDI 1-12layers Flex PCB ,2-20layers Rigid-flex PCB HDI+Rigid-flex PCB PETER SD2955/Blue-Green Nipon Thickness: 0.5-40um Entek Plus HT, Preflux F2 LX Au:0.03um≤max<0.06um Ni:3um≤max≤6um Au:0.2-1.0um Ni:2.54-10um Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um) 1.0-1.4um 12oz max. 0.15mm 4mil (0.100mm) 2mil/2mil 650mm X 1200mm Non electro coating:+/-5um,Electro coating:+/-10um +/-0.002inch(0.050mm) +/-0.002inch(0.050mm) +/-0.002inch(0.050mm) +/-0.004inch(0.100mm) +/-0.004inch(0.100mm) +/-0.003inch(0.075mm) +/- 10% /Max >50ohm +/- 5% Max ≤0.5% Normal FR4/Halogen free/High Tg FR4/ Aluminum Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK series、TP series; Rogers/Taconic/Arlon/Nelco laminate with FR-4 material -including partial Ro4350B hybrid laminating with FR-4 kuangshun,Taiyo、Himonia,Nanya,Onstatic,Chung Yu,MSDS/Green,Yellow, Black, Blue, Red, White, Purple,Orange ,Matte Green,Matte Blue,Matte Black Capability of Rigid board 05 Faster than the fastest 06 Faster than the fastest Capability of Rigid-flex board No. 1 2 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Item Flex & Rigid-Flex PCB FCCL(adhesive) PI stiffener 3M NO FLOW PP CCL Other CCL Board thickness Tolerance of boad thickness(thickness>1.0mm) Tolerance of boad thickness(thickness≤1.0mm) Min. board size Max. board size Impedance control tolerance Min. bow&twist Min. BGA pad size Max. finished copper thickness Max. buried via Tolerance of non‐plated holes Solder mask color Min. solder dam (copper≤1oz) Min. solder dam (copper2‐4oz) Min. clearance thickness (ENIG) Nickel thickness (ENIG) Gold thickness (ENEPIG) Palladium thickness (ENEPIG) Nickel thickness (ENEPIG) Hard gold thickness(leadless) Hard gold thickness(including lead) Electrolytic Nickel thickness Electrolytic Gold thickness Immersion silver thickness OSP thickness Tolerance of board outline Standard 1-12layers Flex PCB ,2-20layers Rigid-flex PCB HDI+Rigid-flex PCB Shengyi SF305:PI=0.5mil&1mil&2mil; Cu=0.33oz&0.5oz&1oz Panasonic R‐F775(ER):PI=1mil&2mill; Cu=0.33oz&0.5oz &1oz DuPont Pyralux AP:PI=1mil&2mil&3mil; Cu= 0.5oz&1oz Shengyi SF305C: 0515&0525&1025&2030 Taiflex FHK: 1025&1035 Taiflex BT: AD=10um&25um& 40um shengyi SF302B: AD=35um&40um Taiflex MHK: PI=3mil, 5mil, 7mil and 9mil 9077&6677&9458 Ventec:VT‐47N(TG 170℃)&EM‐285B(TG 150℃) ITEQ: IT‐180A; Shengyi: S1141& S1000‐2 Arlon: 85N; Rogers: RO4000 series; Nelco:N4000‐13 series,Ventec:VT‐901 0.3mm‐3.0mm ±10% ±0.1mm 10mm*15mm 406.4mm*558.8mm ±10% 0.75%(symmetrical),2%(unsymmetrical) 12mil(8mil for electrical soft gold board) 3oz 0.4mm ±2mil(limited is +0/‐2mil or +2mil/‐0) green,blue,red, matte green, 4mil(green, red and blue), 5mil(black and white) 8mil 2.5mil (2.0mil) HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold,Hard Gold, Immersion silver, Immersion tin and OSP 0.05‐0.10um 3‐8um 0.05‐0.10um 0.05‐0.15um 3‐8um 0.1‐1.5um 0.1‐4.0um ≥3um 0.05‐0.10um 0.2‐0.4um 0.1‐0.3um ±6mil(exclude complicated board outline and cutout) 3 FCCL(adhesiveless) Coverlay4 Adhesive5 26 27 28 29 30 31 32 Surface treatment
  • 5. 1. Enquires and consultation responded within 2 hours 2. Full QYT Regular orders on time delivery over 90%; Full QTY Expedite orders on time delivery over 99% 3. Experienced PCB manufacturing services team 4. Complete materials including stock special materials made by world’s top companies such as Rogers, ISOLA,,Nanya, Arlon, Taconic, Ventec, Dupont, Teflon, Panasonic, Berquist,etc 5. In an effort to offer our customer complete PCB solutions with best price and service, our factory not only manufacture PCB in our own house, but also cooperate with Chinese Top PCB manufacturer for very complicated boards. 6. We provide expedite services for both prototype and volume production: Fastest prototype 1L to 8L : 24 hours Fastest volume production(within100㎡) 2L to 6L: 72 hours 7. Our factory manufacture all standard orders in our own house without outsourcing, therefore we can offer you extremely competitive price with reliable quality. 8. We offer flexible payment terms: Prepayment, Payment after delivery; Monthly Payment. You can also let us know about your usual way of  payment, we will try best to meet your requirements if needed. 9. We guarantee our customers with excellent after-sales service to fully protect customers’ rights and interests. Core strengths Complete Stock Special Materials Extremely competitive price Excellent after -sales service 2 hours rapid response Flexible Payment Terms All kinds of PCB services Better than the bestBetter than the best 07Faster than the fastest 08Faster than the fastest Product introduction
  • 6. 1009Faster than the fastest Faster than the fastest Parameters Layers: 8 Material: TU768+Rogers 6010 Thicknes:  1.5mm Copper thicknes: 1OZ Surface Treatment: ENIG Min. Hole Size: 0.3mm Crafts mix dielectric Applications communication Parameters Layers:  16 Material: S1000-2 Thicknes: 1.6mm Copper thicknes: 1OZ Surface Treatment:  ENIG Min. Hole Size: 0.25mm Width/Space:   0.1mm/0.1mm Crafts 2Steps HDI Board No-Flow PP Applications Communications satellite Parameters Layers: 18 Material: Rogers 4350 Thicknes: 1.55mm Copper thicknes 1OZ Surface Treatment:  ENIG Min. Hole Size: 0.2mm Width/Space:  0.1mm/0.1mm Crafts 3Steps HDI Board Laser via , L1-L2;L2-L3;L3-L4;L15-L16;L16-L17;L17-L18 Applications Communications satellite Parameters Layers:  2 Material : rogers Tmm 10i Thicknes:  1.8mm Copper thicknes: 1OZ Surface Treatment:  immersion Ag Min. Hole Size: 0.6mm Width/Space:  0.25mm/0.25mm Crafts Especial material Applications Communications satellite Parameters Layers:  32 Material: IT180A Thicknes: 5.0mm Copper thicknes : 1OZ/4OZ Surface Treatment:  ENIG+hard gold Min. Hole Size: 0.2mm Width/Space:  0.15mm/0.15mm Crafts POFV plated hard gold Applications Telecommunication Parameters Layers:  12 Material:Halogen free S1165 Thicknes:   1.6mm Copper thicknes 1OZ Surface Treatment:   ENIG Min. Hole Size: 0.1mm Width/Space:   0.1mm/0.1mm Crafts 3 Steps HDI Board Applications Communications satellite Better than the bestBetter than the best
  • 7. 11 12Faster than the fastest Faster than the fastest Parameters Layers:   2 Material: VT901 Thicknes:  1.5mm Copper thicknes: 5OZ Surface Treatment: HASL LF Min. Hole Size: 0.7mm Crafts especial material Applications Industry control Parameters Layers: 18 Material: IT180A Thicknes:  5.0mm Copper thicknes: 2OZ Surface Treatment:  Hard gold 50U" Min. Hole Size: 0.4mm Width/Space: 0.51mm/0.15mm Crafts Impedance Control Unsymmetrical Layer Structure Aspect ratio 13:1 Applications Base Station Parameters Layers:  4 Material: DuPont PI+FR4 Thicknes:  1.6mm Copper thicknes 1OZ Surface Treatment:  ENIG Min. Hole Size: 0.2mm Width/Space:  0.15mm/0.12mm Crafts Rigid - flexible Board Applications Industry control Parameters Layers:  8 Material:DuPont PI+FR4 Thicknes:   1.6mm Copper thicknes 1OZ Surface Treatment:   ENIG Min. Hole Size: 0.2mm Width/Space:   0.1mm/0.1mm Crafts Super length Rigid-Flex board Applications Telecommunication Better than the bestBetter than the best Parameters Layers:4 Material :TU768+ThinFlex Thicknes:   1.6mm Copper thicknes 1OZ Surface Treatment:    ENIG+Hard gold 50U" Min. Hole Size: 0.2mm Width/Space:   0.1mm/0.1mm Crafts Rigid-Flex board Applications Medical care Parameters Layers: 1 Material :Aluminum 3.0 W/Mk Thicknes:    1.6mm Copper thicknes 1OZ Surface Treatment:HASL Crafts Taiyo LEW03 Applications LED
  • 8. Better than the bestBetter than the best 13Faster than the fastest 14Faster than the fastest Flow chart Export Sales Dept: More than 50 profes- sional sales of many languages who are familiar with the business process can supply the superior and multiple service. Lamination: Advanced lamination equipment can guarantee the quality and delivery time. Drilling: Many Imported drilling machine can guar- antee the accuracy of drilling and the quality of micro-vi- as. Panel Plating and Pattern Plating Technics works together with Plasma equipment can well guarantee cooper thickness and quality of micro cooper. Etching: Auto etch- ing line can guaran- tee an identical track width of different copper thickness. Many AOI testing equipments can well guarantee the quality of circuit. The latest printing and developing technology can well guarantee the quality of solder resist. Surface treatment: ENIG, HASL,  Lead free HASL, Hard gold, ENEPIG, OSP, Immersion silver,  Immersion Tin, etc. Profiling: Many imported gong routing machine, V-CUT  machine can keep the outline accuracy. Testing: Latest testing equipments are used to guaran- tee all the customer ordered products are 100% electrically tested. Image Transfer: Super clean work- shop of grade 10K prevents dust entry effectively. Shipment: Providing multi-channel logistics: such as UPS, DHL,FedEx, TNT, sea and air service etc. After-sales Service: Excellent and timely after-sales service can solve customers wor- ries.