The SEMI standard E164 is discussed in relation to EDA/Interface A. EDA Common Metadata

1. www.cimetrix.com
The Power of E164:
EDA Common Metadata
March 2017
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2.  Explain rationale for creation of common metadata
standards
 Summarize scope, content, and benefits of E164
 Share application examples that leverage these
models
 Highlight the impact of E164 on equipment
purchasing process
Objectives
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3. Node (nm) 800 600 350 250 180 130 90 45 32 22 14 10
Process
Window (Cpk)
Key Applications SPC R2R FDC VM PDM Big Data
Data Generated 0.016 0.3 2.4 40 240 1500
(MB/sec)
Supporting SECS-II GEM GEM300 EDA I EDA II E164…
SEMI Standards
Insatiable demand for data
And the evolution of the supporting standards
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4.  Consistent implementations of GEM300
 Commonality across equipment types
 Automation of many data collection processes
 Less work to interpret collected data
 Enables true “plug and play” applications
 Major increases in engineering efficiency
Why is E164* so important?
Common metadata results in…
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E164 is to EDA what GEM was to SECS-II
* EDA Common Metadata standard

5. Equipment modeling (before E164)
E120 nodes, E125 behavior and self-description
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6.  E120/E125 Common Equipment Model usage/content
 Nodes and parameters must have meaningful descriptions
 Equipment element attributes for all E120 nodes must have
meaningful values
 All definitions (exceptions, SMs, parameter types, units, SEMI
object types) must be referenced
 Strict event name enforcement
 State Machines
 Strict State Machine definitions
 Requires E157 State Machines for all process modules
 Requires E90 State Machines for all substrate locations
 Requires all Parameters, Events and Exceptions defined in
Freeze II standards to be present
 State and transition names must match GEM300 standards
What does E164 specify?
Structure and content of equipment metadata
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7. E164 GEM300 specifics
E90 Substrate Tracking – key objects
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8. E164 GEM300 specifics
E90 Substrate Tracking – state machines
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9. E164 GEM300 specifics
E157 Module Process Tracking – state machines
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10. Hardware
 EFEM
 2 load ports
 1 transfer robot
 Substrate pre-aligner
 2 process chambers
Simulated equipment configuration
GEM300 and E164 compliant
Operation
• 25 wafers per carrier
• 2 recipes
• Carrier 1 – 10 steps, 10 secs each
• Carrier 2 – 10 steps, 10 secs each
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11. E164-based application examples
System components
E164-based GUI
+
EDAConnect
(EDA client)
GEM300
Equipment
Simulator
CIMPortal Plus
(EDA server)
Equipment Demo
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12. E164-based application examples
CIMPortal Plus Architecture
E164-based GUI
+
EDAConnect
(EDA client)
GEM300
Equipment
Simulator
CIMPortal Plus
(EDA server)
Equipment Demo
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13.  Features
 Build tool production monitoring screen layout
 Generate required data collection plans (DCPs)
 Animate monitoring screen from collected data
 “Self-configuring” – no programming required
 E164 leverage
 Dictates model structure and node types
 Specifies standard parameter and event names
 Used E90 substrate movement and location status and E157 process
module tracking events
 Used E87 Carrier and E90 Substrate SEMIObjects
E164-based application example
“Quick connect” generic production monitor
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14. E164 required elements
Used by “quick connect” production monitor
SubstrateLocation
state transition
events
Referenced in
auto-generated
DCP
Event Report
Contents
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15. E164-based application example
Screen layout and animation automatically
generated
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16. Product Time Measurement (SEMI E168)
How does it work with E164?
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Process
Equipment
Event
Processor
$avings
EDA E164
Events
Material Movement
Events (E90, E87)

17. PTM Case Study (pre-EDA)
Throughput/Cycle Time Optimization
Source: NXP (not EDA
user)
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18.  Inter-process wait times have direct negative impact on
yield for critical process steps
 Many advanced processes include a number of direct tool-
to-tool material delivery steps
 Productivity KPIs are also affected by inaccurate carrier
completion estimates
Example E164 application
Lot (or carrier) completion estimation
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19.  Features
 Provide continuously updated estimates for current
lot completion and equipment idle time for
MCS/AMHS dispatching decision support
 Provide notification events at configurable thresholds
 Maintain substrate process times per recipe
 E164 leverage (using required elements)
 Material Manager: E90 substrate transport events;
E87 Carrier instance attributes
 Job Manager: attributes for ControlJob and
ProcessJob instances
 Process Module nodes: E157 module process events
Example E164 application
Lot (or carrier) completion estimation
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20. E164 required elements
Used in carrier completion algorithm (1)
Carrier ObjID
attribute
High-level
Equipment
structure
E90 Substrate
Transport
events
MaterialManager
Module
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21. E164 required elements
Used in carrier completion algorithm (2)
High-level
Equipment
structure
JobManager
Module
ControlJob
CarrierInputSpec
attribute
ProcessJob
PRMtlNameList
attribute
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22.  “Quick-connect” generic production monitor
 Dynamic sampling capability for wafer-level APC
 Process characterization and experiment automation
 Automated waveform analysis, “characteristic value” calculation
 “Golden run” analysis and related tool/chamber matching
 Precision trace data framing for MVA-based FDC
 Equipment data mapping to fab structure/naming conventions
 Component behavior monitoring for variability reduction
 Feature extraction for predictive maintenance algorithms
 Lot completion estimation (based on equipment metadata model)
 Product Time Measurement (Wait Time Waste)
 External sensor/subsystem integration
Factory applications
That directly leverage EDA and E164
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23. 1. Manufacturing objectives
2. SEMI standards required (EDA and others)
3. Metadata model content and scope
4. Process-specific requirements
5. Performance requirements
6. Conformance and acceptance testing
EDA purchasing implications
Important elements of requirements spec
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24. 감사합니다
唔該
Merci
Danke
多謝
ありがとうございます
Thank you
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