This document provides capability specifications for a printed circuit board manufacturer. It includes details on:
- Board layer counts and thickness options ranging from 2-24 layers and thicknesses from 0.3-3.2mm
- Minimum feature sizes for lines, spaces, holes, and tolerances
- Surface finish, solder mask, legend and carbon ink options
- Process capabilities like drilling, imaging, plating, testing
- Process tolerances for features like registration, line widths, and hole positions
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Dear Sir,
It gives me immense pleasure to introduce our self to your esteemed organization.
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Nichrome Wire
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Compensating Cables
Furnace,Ovens & Power Houses.
Industrial Ceramics & Anscellories
Ceramic Fibre Insulation & Refractories
Heat Treatment Materials & Spares
Heaters , Thermocouples & Resistance Wires
Control Panels & Industrial Electricals
Special Ceramics & General Industrial Supplies.
I look forward to hearing from you.
Hope to get your kind cooperation to start a long term business relation.
If you have any further queries, please revert to us for our prompt response and actions.
Thanks & Regards,
Santosh Jain
INCERTECH
Mumbai,Maharashtra,India.
Phone # +91 22 2844 6052
# +91 22 2807 7364
Fax # +91 22 2807 5350
Phone # +91 9920492491
# +91 9821226051
Email: incertech@yahoo.com
incertech@gmail.com
Skype: incertech
Sun Tk300 U Fiber Connector Termination Tool KitVillat2012
ย
SUN-TK300U fiber optic stripping, polishing and termination tool kits contain all of the latest popular fiber
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Remote sensing and monitoring are changing the mining industry for the better. These are providing innovative solutions to long-standing challenges. Those related to exploration, extraction, and overall environmental management by mining technology companies Odisha. These technologies make use of satellite imaging, aerial photography and sensors to collect data that might be inaccessible or from hazardous locations. With the use of this technology, mining operations are becoming increasingly efficient. Let us gain more insight into the key aspects associated with remote sensing and monitoring when it comes to mining.
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A Memorandum of Association (MOA) is a legal document that outlines the fundamental principles and objectives upon which a company operates. It serves as the company's charter or constitution and defines the scope of its activities. Here's a detailed note on the MOA:
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Name Clause: This clause states the name of the company, which should end with words like "Limited" or "Ltd." for a public limited company and "Private Limited" or "Pvt. Ltd." for a private limited company.
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Registered Office Clause: It specifies the location where the company's registered office is situated. This office is where all official communications and notices are sent.
Objective Clause: This clause delineates the main objectives for which the company is formed. It's important to define these objectives clearly, as the company cannot undertake activities beyond those mentioned in this clause.
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Liability Clause: It outlines the extent of liability of the company's members. In the case of companies limited by shares, the liability of members is limited to the amount unpaid on their shares. For companies limited by guarantee, members' liability is limited to the amount they undertake to contribute if the company is wound up.
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Capital Clause: This clause specifies the authorized capital of the company, i.e., the maximum amount of share capital the company is authorized to issue. It also mentions the division of this capital into shares and their respective nominal value.
Association Clause: It simply states that the subscribers wish to form a company and agree to become members of it, in accordance with the terms of the MOA.
Importance of Memorandum of Association:
Legal Requirement: The MOA is a legal requirement for the formation of a company. It must be filed with the Registrar of Companies during the incorporation process.
Constitutional Document: It serves as the company's constitutional document, defining its scope, powers, and limitations.
Protection of Members: It protects the interests of the company's members by clearly defining the objectives and limiting their liability.
External Communication: It provides clarity to external parties, such as investors, creditors, and regulatory authorities, regarding the company's objectives and powers.
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Binding Authority: The company and its members are bound by the provisions of the MOA. Any action taken beyond its scope may be considered ultra vires (beyond the powers) of the company and therefore void.
Amendment of MOA:
While the MOA lays down the company's fundamental principles, it is not entirely immutable. It can be amended, but only under specific circumstances and in compliance with legal procedures. Amendments typically require shareholder
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3. 6.Surface Finish and Thickness
6.1 HASL 1~38um in hole, 2.54~25.4um on SMT
6.2 Gold Flash Ni: 2.5~7.62um, Au: 0.05~0.25um
6.3 Selective Gold Plating: Ni: 2.5~7.62um, Au: 0.05~0.25um
6.4 Immersion Gold: Ni: 2.5~7.62um, Au: 0.127~1.27um
6.5 Gold-Edge Contacts: Ni: 2.5~7.62um, Au: 0.127~1.27um
6.6 Entek M2602 (For single side and Double sides)
7.Solder mask
7.1Heat Cured Ink: ZSR-150 (PA-5B, NA-402)
7.2LPI resist ink: Green gloss (FSR-8000-9G05, R500-2G, PSR2000-G35A, PSR4000-
LDSM-3000 G-7, APR-8000 G-102)
Green matte (LM-600 5GM)
White (LSM-3000NW)
Black (FSR-8000 (10C10))
Red (LSM-3000SR)
Blue (FSR 8b89, LSM-3000NSBL)
Yellow (LSM-3000NSY-6)
7.3 UV Ink: Green (UVS-1000)
White (UVM-1800W)
8. Legend Ink
8.1 White: (ZM-400WF)
8.2 Black: (BK-3)
8.3 Yellow: (ZM-400YR)
9.Carbon Ink: PR-406, TU-15ST (25 Ohm/square)
10.Peelable Mask: B99-84B, PETERS SD 2955
Website: www.standardpcb.com E-mail: info@standardpcb.com
3
4. File number: P ME-M-II VER: B DATE: 2007-Sep-9
File name: Capability manual
5.2 Surface copper plating thickness:
Board type Bonding Flash gold HAL & Entek
Copper thickness 5um~10um 10um~25um 20um~40um
6. Etching
6.1 Etching factor: 1.5 max, 1.0Std.
6.2 Etch tolerance:
Board type Flash gold HAL
Line width tolerance +/-12% +/-20%(L>5mil) +/-1mil(L<=5mil)
(min.)
7. Solder Mask (LPI) Printing:
7.1 Registration Tolerance of Solder Mask to pattern: +/-2mil (min), +/-3mils(Std)
7.2 Solder Mask Thickness: 10um~40um on line surface, 6um min. at line edge
7.4 Plugged Hole Size: 0.6mm (Max.)
7.5 Minimum Solder Mask hide: 0.35mm
7.6 Minimum Spacing of Solder Mask Opening to Line: 3mil
7.7 Minimum solder bridge: 4mil
8. Silkscreen Printing
8.1 Legend Printing
8.1.1 Minimum Line Width 6mil, Minimum height of Legend 40mil
8.1.2 Registration of Legend to Reference Hole +/-6mil
8.2 Carbon Printing
8.2.1 Minimum Line Width/ Spacing 10mil/14mil
8.2.2 Registration of Carbon to Reference Hole +/-7mil
8.3 Peelable Mask
8.3.1 Thickness of Mask 0.2mm~0.4mm
8.3.2 Maximum Size of Tenting hole 4.0mm
9. Profile finish:
9.1 Outline Finish Tolerance: +/-0.1mm(min), +/-0.13mm(Std.)
9.2 Routing
9.2.1 Minimum Milling Cutter Size 0.8mm
9.2.2 Minimum Radius of Inner Copper 0.4mm
Website: www.standardpcb.com E-mail: info@standardpcb.com
4
5. 9.2.3 Minimum Position Tolerance of Routing Hole (Slot) or Edge to Drill hole +/-5mil
9.2.4 Minimum Position Tolerance of Routing Hole to Routing Hole (Slot) +/-3mil
9.2.5 Minimum Position Tolerance of Routing Hole (Slot) to Routing Edge +/-4mil
9.3 Punching
9.3.1 Minimum Size of Punching Hole (Slot) 1.0mm
9.3.2 Maximum Size of Punching Board (panel) 350mm x 270mm
9.3.3 Maximum Thickness of Punching Board 1.6mm
9.3.4 Minimum Position Tolerance of Punching Hole (Slot) or Edge to Drill hole +/-5mil
9.3.5 Minimum Position Tolerance of Punching Hole to Punching Hole (Slot) +/-3mil
9.3.6 Minimum Position Tolerance of Punching Hole (Slot) to Punching Edge +/-4mil
9.4 V-cutting
9.4.1 Minimum Size of V-cut Board 50mm x 85 (v-cut direction) mm
9.4.2 Minimum Thickness of V-cut Board 0.6mm
9.4.3 Minimum Space of V-cut Line Per customer requirement
9.4.4 Minimum Space of V-cut Line to Panel Edge 3mm
9.4.5 Minimum Position Tolerance of V-cut Line to Primary Drilling Hole +/-7mil
9.4.6 Minimum Position Tolerance of V-cut Line to Second Drilling Hole +/-9mil
9.4.7 Minimum Position Tolerance of V-cut Line to Routing Edge +/-6mil
9.4.8 Minimum Position Tolerance of V-cut Line to Punching Edge +/-7mil
9.4.9 Minimum Position Tolerance of V-cut Line to V-cut line+/-4mil
9.4.10 Registration Tolerance of V-cut lines +/-4mil
9.4.11 V-Cut residual +/-4mil
10. E-Testing
10.1 Test Voltage 50V~300V Commonly: 200V~300V
10.2 Isolated Resistance 1K ohm~100M ohm Commonly: 20M ohm~40M ohm
10.3 Continuity Resistance 10 ohm~20K ohm Commonly: 50 ohm~100 ohm
11. FQC
11.1 Warp & Trap
Board Thk. <0.5mm 0.5~0.8mm 1.0~1.2mm >1.5mm
Warpage 1.5% max. 1% max. 0.75% max. 0.5% max.
Website: www.standardpcb.com E-mail: info@standardpcb.com
5
6. File number: ME-M-II VER: B DATE: 2007-Spe-9
File name: Capability manual
Capability of Individual PROCESS
1. Drill Process
Min. drill bit: 0.2mm, Max drill bit 6.5mm
Min. working panel size: 6โx6โ, Max. working panel size: 24โx20โ
Hole Position tolerance: +/-3mil (primary drilled), +/-5mil(Secondary drilled)
Min slot drill bit: 0.5mm
2. PTH and Panel Plating
Max. aspect ratio: 6 : 1
Copper plating thickness 5~10um
3. Imaging (Outer)
3.1 Minimum Line Width/Spacing 4mil/4mil (0.5OZ), 6mil/6mil (1OZ)
3.2 Minimum SMT Pitch 16 mil, Std. SMT Pith 20mil
3.3 Minimum Bonding Pitch 9 mil Std. Bonding Pitch 12mil
3.4 Minimum Theoretic Annual Ring 5mil, Std. Annual Ring 6mil
3.5 Minimum Mesh Gap: 8mil
3.6 Maximum Size of D/F Tending Hole D5.5mm, Slot Width 4.5mm (Board Thk. 0.8mm)
3.7 Registration tolerance of pattern to reference Hole: +/-2mil(min), +/-3mil(std.)
3.8 Film Compensation Value of Pattern:
Item 0.5 OZ 1.0 OZ 2 OZ
Outer (expect F/G board) 0.04mm 0.08mm 0.12mm
Inner 0.02mm 0.04mm 0.08mm
3.9 Minimum Spacing:
Item Line-Line Line-Logo Line-Plane Copper or Line-Npth Pad or
Line-Edge(R)
Spacing 4mil 5mil 4mil 8mil 10mil
Website: www.standardpcb.com E-mail: info@standardpcb.com
6
7. Item Via Pad-Via Pad Comp. Pad-Comp. Pad Pad or Line-Edge (V) Pad or Line-Edge
(P)
Spacing 4mil 4mil or 10 mil 14 mil 12 mil
Item Line-Via Pad Line-Comp. Plane Via Pad-Plane Comp. Pad-Plane
Spacing 4mil 6mil 4mil 6mil
3.10 Imaging (Inner)
4.1 Minimum Line Width/Spacing 4mil/4mil (0.5OZ), 6mil/6mil (1OZ)
4.2 Minimum Theoretic Annual Ring of Signal Pad & Thermal Pad 6mil
4.3 Minimum Theoretic Annual Ring of Non-Functional Pad 10mil
4.4 Minimum Clearance of Isolation Pad 12mil (via) or 10mil (PTH>1mm)
4.5 Film Compensation Value of Pattern (Ref to 3.5)
4.6 Registration Tolerance of Layer of Layer to Layer: +/-3mil (min.), +/-4mil (Std)
4.7 Minimum Spacing
Item Line-Line Line-d Copper or Line-Npth Pad or Line-Edge(R)
Spacing 4mil 4mil 8mil 10mil
Item Pad-Pad Line-Plane Pad or Line-Edge (V) Pad or Line-Edge (P)
Spacing 5mil 4mil 14 mil 16 mil
Item Pad-Plane Plane-Plane Line-PHT Edge (isolated)
Spacing 4mil 6mil 6mil (4L) or 8mil (>6L)
5. Pattern Plating
5.1 Hole wall copper plating thickness
Board type Bonding Flash gold HAL & Entek
Copper thickness 5um~10um 10um~20um 18um~35um
Website: www.standardpcb.com E-mail: info@standardpcb.com
7