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NiO results
Javier García Molleja
In collaboration with:
Julien Keraudy
Pierre-Yves Jouan
Free mean path
 Different gas mixtures used:
 Ni: 100% Ar – 0% O2
 NiO7: 87,72% Ar – 12,28% O2
 NiO9: 84,75% Ar – 15,25% O2
 NiO13: 79,37% Ar – 20,63% O2
 NiO19: 72,46% Ar – 27,54% O2
 Depositions at 3 cm of target substrate distance, at 5
mTorr of working pressure, DC power supply and 100 W
of power and 0,1 µTorr of base pressure.
 Target cleaning of 5 min with Ar plasma. Target
poisoning during 5-10 min.
 Substrates used: Si (100) and glass.
Free mean path
 Sigmund-Thompson distribution when Ar+
collides with Ni
target.
 [Kudriavtsev, 2005] proposes a binding energy of 3,74
eV.
 SRIM uses the approximation of heat of sublimation: 4,5
eV.
 If Ar+
has energy between 400-450 eV:
 Sputtering yield is 1,62-1,74 at/ion,
 Mean energy of sputtered Ni is 19,81-20,63 eV/at (SRIM
calculation) or 23,73-24,61 eV/at (theoretical values; using heat
of sublimation gives 26,89-27,95 eV/at),
 Ar backscattered is 5,64-5,78% of total impinging particles
Free mean path
 Particle travelling in a gas composed by many species
has a free mean path given by [Chen, 2005].
 Ni0
in 97% Ar – 3% Ar+
gas at 5 mTorr and 150 °C has a
λ=3,57 cm.
 Ni0
in Ar-O2 gas depends on molecular oxygen
percentage. It is assumed that ionization coefficient is
very low and in each discharge we have 80% O – 20%
O2 of reactive gas.
 NiO7: λ=3,509 cm.
 NiO9: λ=3,474 cm.
 NiO13: λ=3,411 cm.
 NiO19: λ=3,333 cm.
 There are no collisions during the trip.
Conduction mechanism
 Our NiO films, under such a high oxygen concentration
in the atmosphere has an oxygen excess.
 This process creates vacancies and electrical holes, so
NiO is a type-p conductor.
 Electrical holes are delocalized (band structure is over
the whole lattice), so Ni3+
localization is not definite a
priori.
 Two mechanisms are calculated, i.e., substitutional
process and interstitial process:

O2 2OO + 2V’’Ni + 4h
.

O2 O’’i + V’’Ni + OO + 4h
.
NiO
NiO
X-ray diffraction
 Parameters:
 CuKα @ 40 kV and 40 mA
 In and out slits: 1 mm
 Filter: Ni
 Scintillator slit: 0,2 mm
 Diffraction angle: 20-90°
 Steps: 0,03°
 Time: 1 s
 Technique: Bragg-Brentano
XRD: thickness
Ni
XRD: thickness
NiO7 NiO9
XRD: thickness
NiO13 NiO19
XRD: thickness (comparison)
XRD: bias
Ni
XRD: bias
NiO7 NiO9
XRD: bias
NiO13 NiO19
XRD: bias (comparison)
Thickness: plane contribution
Thickness: plane contribution
Thickness: plane contribution
 Area calculated by fitting with a Voigt function (ideal in X-
ray analyses).
 Different regimes of discharge:
 Metallic regime: Ni, NiO7
 Transition regime: NiO9
 Poisoned regime: NiO13, NiO19
 (111) and (200) planes are prominent in Ni and poisoned
conditions.
 In NiO7 other planes prevail.
 In NiO9 (222) planes appears.
 Oxygen augmentation provokes (200) increase.
Thickness: strain and grain size
NiO7
NiO13NiO7 is tensile. Other
samples are compressive.
High thickness produces
stress relief.
Bias: Plane contribution
Bias: plane contribution
Bias: plane contribution
 Area calculated by fitting with a Voigt function (ideal in X-
ray analyses).
 Different regimes of discharge:
 Metallic regime: Ni, NiO7
 Transition regime: NiO9
 Poisoned regime: NiO13, NiO19
 (111) and (200) planes are prominent in Ni and poisoned
conditions.
 In NiO7 other planes prevail.
 Oxygen augmentation provokes (200) increase.
 Bibliography says:
 (200) reduces surface energy
 (111) has a lot of adsorption sites, lower energy
Bias: stress and grain size
 [Mallikarjuna Reddy, 2011] has an
expresion to obtain residual stresses by
the peak shifting.
 Lorentz contribution has information about
the grain size using Scherrer’s formula.
 Lattice parameters have been calculated
by the Nelson-Riley method only for Kα1
contribution (a versus cotθcosθ).
Bias: stress and grain size
NiO7
NiO13
NiO7 is tensile. NiO13
changes with bias (from
compressive to tensile).

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Results in NiO (1 of 3)

  • 1. NiO results Javier García Molleja In collaboration with: Julien Keraudy Pierre-Yves Jouan
  • 2. Free mean path  Different gas mixtures used:  Ni: 100% Ar – 0% O2  NiO7: 87,72% Ar – 12,28% O2  NiO9: 84,75% Ar – 15,25% O2  NiO13: 79,37% Ar – 20,63% O2  NiO19: 72,46% Ar – 27,54% O2  Depositions at 3 cm of target substrate distance, at 5 mTorr of working pressure, DC power supply and 100 W of power and 0,1 µTorr of base pressure.  Target cleaning of 5 min with Ar plasma. Target poisoning during 5-10 min.  Substrates used: Si (100) and glass.
  • 3. Free mean path  Sigmund-Thompson distribution when Ar+ collides with Ni target.  [Kudriavtsev, 2005] proposes a binding energy of 3,74 eV.  SRIM uses the approximation of heat of sublimation: 4,5 eV.  If Ar+ has energy between 400-450 eV:  Sputtering yield is 1,62-1,74 at/ion,  Mean energy of sputtered Ni is 19,81-20,63 eV/at (SRIM calculation) or 23,73-24,61 eV/at (theoretical values; using heat of sublimation gives 26,89-27,95 eV/at),  Ar backscattered is 5,64-5,78% of total impinging particles
  • 4. Free mean path  Particle travelling in a gas composed by many species has a free mean path given by [Chen, 2005].  Ni0 in 97% Ar – 3% Ar+ gas at 5 mTorr and 150 °C has a λ=3,57 cm.  Ni0 in Ar-O2 gas depends on molecular oxygen percentage. It is assumed that ionization coefficient is very low and in each discharge we have 80% O – 20% O2 of reactive gas.  NiO7: λ=3,509 cm.  NiO9: λ=3,474 cm.  NiO13: λ=3,411 cm.  NiO19: λ=3,333 cm.  There are no collisions during the trip.
  • 5. Conduction mechanism  Our NiO films, under such a high oxygen concentration in the atmosphere has an oxygen excess.  This process creates vacancies and electrical holes, so NiO is a type-p conductor.  Electrical holes are delocalized (band structure is over the whole lattice), so Ni3+ localization is not definite a priori.  Two mechanisms are calculated, i.e., substitutional process and interstitial process:  O2 2OO + 2V’’Ni + 4h .  O2 O’’i + V’’Ni + OO + 4h . NiO NiO
  • 6. X-ray diffraction  Parameters:  CuKα @ 40 kV and 40 mA  In and out slits: 1 mm  Filter: Ni  Scintillator slit: 0,2 mm  Diffraction angle: 20-90°  Steps: 0,03°  Time: 1 s  Technique: Bragg-Brentano
  • 17. Thickness: plane contribution  Area calculated by fitting with a Voigt function (ideal in X- ray analyses).  Different regimes of discharge:  Metallic regime: Ni, NiO7  Transition regime: NiO9  Poisoned regime: NiO13, NiO19  (111) and (200) planes are prominent in Ni and poisoned conditions.  In NiO7 other planes prevail.  In NiO9 (222) planes appears.  Oxygen augmentation provokes (200) increase.
  • 18. Thickness: strain and grain size NiO7 NiO13NiO7 is tensile. Other samples are compressive. High thickness produces stress relief.
  • 21. Bias: plane contribution  Area calculated by fitting with a Voigt function (ideal in X- ray analyses).  Different regimes of discharge:  Metallic regime: Ni, NiO7  Transition regime: NiO9  Poisoned regime: NiO13, NiO19  (111) and (200) planes are prominent in Ni and poisoned conditions.  In NiO7 other planes prevail.  Oxygen augmentation provokes (200) increase.  Bibliography says:  (200) reduces surface energy  (111) has a lot of adsorption sites, lower energy
  • 22. Bias: stress and grain size  [Mallikarjuna Reddy, 2011] has an expresion to obtain residual stresses by the peak shifting.  Lorentz contribution has information about the grain size using Scherrer’s formula.  Lattice parameters have been calculated by the Nelson-Riley method only for Kα1 contribution (a versus cotθcosθ).
  • 23. Bias: stress and grain size NiO7 NiO13 NiO7 is tensile. NiO13 changes with bias (from compressive to tensile).