The document discusses Amphenol's RADSOK® technology which uses a stamped and formed flat grid that is twisted into a hyperbolic geometry to provide robust, high-density connections. It provides details on RADSOK® features and products like RADSERTsTM, PowerBloksTM, and PGYsTM which use this technology to deliver high power to printed circuit boards. These products are targeted at manufacturers of PCBs, servers, and any company using PCBs for applications up to 120 amps.