Flexible Colour Active Matrix EP
   Display Using Low Distortion
              oTFT Backplanes
Plastic Electronics Technology

Uses plastic instead of traditional silicon semiconductors
 and glass
Enables a revolutionary design and form-factor

  Shatterproof, Thin, Large and Light Display
Company History

                                       Display Development




10+ transistors         100+ transistors      1.2 M transistors       Colour EPD             2.8 M transistors




                  Research, Process Development & Manufacturing




                                       2000: Cambridge Technology      2008: Dresden Display Factory
     Cambridge University               Center translating research   First plastic electronics factory in
     Research in organic electronics           into products                       the world



                                                                                                             3
R&D and Production Set-Up

                          Technology

                           Transfer
    Cambridge R&D
   Prototype Line (14”)


              Cambridge R&D Prototype Line
                                      Proof of concepts
                                      Highly configurable process
                                      New designs in < 1 month
                                      1” Chips to A4 displays
                                      R&D Engineers




                                                                     4
R&D and Production Set-Up

                  Technology

                   Transfer

                                Dresden Factory (Gen 3.5)


            Dresden Gen. 3.5 Factory
                           Backplane Manufacturing
                           Qualified volume process
                           Production equipment
                           Fully Automated Handling
                           Process, Equipment, Integration
                            Engineers
                           Thousands of displays/week


                                                            5
The Manufacturing Challenge

It is one thing to show a single display at a tradeshow…




...quite another to develop a high yield manufacturing process

                                                           6
Plastic Logic’s Manufacturing Process

•   Key differences in manufacturing organic and flexible electronics:
 Solution processing
 Direct-write fabrication techniques to avoid mask-alignment
 Low process temperatures to permit use of cheap flexible substrates

• Developed unique process know how and IP:
 Handling plastic sheets throughout the process line
 Large area deposition technologies of organic and inorganic materials
 Cleaning and conditioning of the layers to improve device performance


• Industrialisation means:
 Reproducibility
 Homogeneity
                                                                                                                                                                      327.0-328.0
                                                                                                                                                                      326.0-327.0
                          328.0
                                                                                                                                                                      325.0-326.0
                          327.0
                                                                                                                                                                      324.0-325.0
                          326.0
                                                                                                                                                                590   323.0-324.0
                           325.0
                                                                                                                                                               585    322.0-323.0
                           324.0
                                                                                                                                                             580      321.0-322.0
                            323.0
                            322.0                                                                                                                                     320.0-321.0
                                                                                                                                                         575
                            321.0                                                                                                                                     319.0-320.0
                                                                                                                                                       570
                             320.0
                             319.0                                                                                                                 565
                                     60
                                          62.5
                                                 65




                                                                                                                                                 560
                                                      67.5
                                                             70
                                                                  72.5
                                                                         75
                                                                              77.5




                                                                                                                                             555
                                                                                     80
                                                                                          82.5
                                                                                                 85
                                                                                                      87.5
                                                                                                             90
                                                                                                                  92.5




                                                                                                                                           550
                                                                                                                         95
                                                                                                                              97.5
                                                                                                                                     100




                                                                                                                                                                                    7
Processing challenges in development phase

                  Optimising process conditions is critical part of industrialisation process



Monitoring data from coating process in the first year (2009)
 Thickness mean




                                  Monitoring data from same process one year later
                                   Thickness mean




                                                                                                8
Display Testing and Reliability

 Testing requires precise handling and alignment of flexible displays


 Test development for transistor and display parameters
     − Definition of test specifications
     − Electrical and Optical tests for production
     − Test methods for OTFT and other characterisation structures




 Reliability optimization for quality and lifetime behavior
     − Accelerated test under different environmental conditions for lifetime projections
     − Based on existing models for Si-based integrated circuits
     − Parameters adapted to organic materials in terms of
        temperature sensitivities and reaction to cycling




                                                                                            9
Reliability challenges in development phase

      Reliability problem solving was critical part of industrialisation process




Typical problem in early development (2009)
                                                            Problem solved
     Delamination during climatic tests

      Today, Plastic Logic displays have been stressed beyond 10M updates

                                                                                   10
Technology Position Today
               Developed the lightest, most durable display
                technology available today

               Demonstrated scalability in the first and largest
                production facility

               Developed the first flexible colour display

               Protected with a strong IP position
                 – 101 patents and applications
                 – 36 granted to date

               1-2 year lead over the competition for flexible
                backplane technology

               A single display has 1.2M uniform and reliable
                plastic transistors

                                                                    11
Thin, Light, and Robust




                          12
Colour EP Display Architecture

                   Encapsulation sheet                   Colour Filter Array
                     Plastic Substrate
                                                         E Ink Frontplane

             Plastic Logic Backplane Technology
                                                         Low Distortion Plastic
                 Plastic Substrate                       Logic Backplane



 Colour Filter patterned by multiple approaches (wet printing, sheet-to-sheet
  alignment).
 During CFA pattern formation, the backplane pixel electrodes are not
  visible (obscured by E Ink layer).

 Backplane:
    1280 x 960 pixels (monochrome) = 640 x 480 Colour
    150PPI (monochrome) = 75PPI Colour
    Active Area: 217.6mm x 163.2mm

                                                                                  13
Low Distortion Backplane

                                                                                      Pixel
 Conventional glass                                                                  Electrode
  backplanes require regular
  grid for all layers (source,
                                                                                       Interlayer
  drain, gate, via, etc)                                       Via                     Dielectric


 This allows overlay of pre-
  patterned layers (eg Colour
  Filter)

 Distortion in flexible
  substrates makes this
  difficult

 Plastic Logic Process resets
  distortion at the pixel
  electrode layer, with no loss
  in pixel performance.                                              Plastic Backplane: Top Pixels
                                  Glass Backplane: All stack
                                    layers on a regular grid          maintained on a regular grid


                                                                                                  14
Colour Filter Overlay

 RGBW colour filter patterned onto E Ink surface

 Overlay accuracy of 10µm achieved across the active area

 Four variants of different colour density investigated




      RGBW CFA pattern over E Ink       R pixels driven “white” to show alignment

                                                                               15
Colour Display Performance - Gamut

                                  4 colour densities tested
                                   (A,B,C,D)

                                  Gamut (∆E3):

                                          Type A: 5000
                                          Type B: 4000
                                          Type C: 3400
                                          Type D: 3000

                                  Excellent colour
                                   uniformity, viewing angle




                          Acknowledgement: A. Bouchard, E Ink
                                                                16
Flexible Displays: Now Available

      Display size          1” - 10.7”
  Backplane Grey Levels       4 – 16
       Pixel pitch         up to 225ppi
     Contrast Ratio            12:1
       Thickness          thin as 130 µm
         Weight            down to 11g
         Colour              Available
         NTSC                  2-5%


 Paper-like finish
 Excellent readability
 Colour gamut high enough to
  enable distinguishability
 Bistable enables long battery life




                                           1280 x 960 Colour Display

                                                                       17
Plastic Logic Technology in Action




     •   10 to 12.5 frames per second video on e-ink with colour filters
     •   Driven with 20 sub-frames to maintain voltage across e-ink.
     •   Backplane driving at 200 to 225fps


                   www.youtube.com/plasticlogic
                                                                           18
Plastic Logic’s Displays


• Plastic Logic is a flexible display OEM and technology provider. We can
  supply displays in variety of sizes and resolutions and enable others to
  do so through licensing arrangements.


• Plastic Logic is a global leader in OTFT devices and the challenges of
  manufacturing on plastic.


• Plastic Logic is actively looking to partner with companies who can
  open up new markets for our display technology.




                                                                        19
20

Plastic Logic Flexible Colour Display

  • 1.
    Flexible Colour ActiveMatrix EP Display Using Low Distortion oTFT Backplanes
  • 2.
    Plastic Electronics Technology Usesplastic instead of traditional silicon semiconductors and glass Enables a revolutionary design and form-factor Shatterproof, Thin, Large and Light Display
  • 3.
    Company History Display Development 10+ transistors 100+ transistors 1.2 M transistors Colour EPD 2.8 M transistors Research, Process Development & Manufacturing 2000: Cambridge Technology 2008: Dresden Display Factory Cambridge University Center translating research First plastic electronics factory in Research in organic electronics into products the world 3
  • 4.
    R&D and ProductionSet-Up Technology Transfer Cambridge R&D Prototype Line (14”) Cambridge R&D Prototype Line  Proof of concepts  Highly configurable process  New designs in < 1 month  1” Chips to A4 displays  R&D Engineers 4
  • 5.
    R&D and ProductionSet-Up Technology Transfer Dresden Factory (Gen 3.5) Dresden Gen. 3.5 Factory  Backplane Manufacturing  Qualified volume process  Production equipment  Fully Automated Handling  Process, Equipment, Integration Engineers  Thousands of displays/week 5
  • 6.
    The Manufacturing Challenge Itis one thing to show a single display at a tradeshow… ...quite another to develop a high yield manufacturing process 6
  • 7.
    Plastic Logic’s ManufacturingProcess • Key differences in manufacturing organic and flexible electronics:  Solution processing  Direct-write fabrication techniques to avoid mask-alignment  Low process temperatures to permit use of cheap flexible substrates • Developed unique process know how and IP:  Handling plastic sheets throughout the process line  Large area deposition technologies of organic and inorganic materials  Cleaning and conditioning of the layers to improve device performance • Industrialisation means:  Reproducibility  Homogeneity 327.0-328.0 326.0-327.0 328.0 325.0-326.0 327.0 324.0-325.0 326.0 590 323.0-324.0 325.0 585 322.0-323.0 324.0 580 321.0-322.0 323.0 322.0 320.0-321.0 575 321.0 319.0-320.0 570 320.0 319.0 565 60 62.5 65 560 67.5 70 72.5 75 77.5 555 80 82.5 85 87.5 90 92.5 550 95 97.5 100 7
  • 8.
    Processing challenges indevelopment phase Optimising process conditions is critical part of industrialisation process Monitoring data from coating process in the first year (2009) Thickness mean Monitoring data from same process one year later Thickness mean 8
  • 9.
    Display Testing andReliability  Testing requires precise handling and alignment of flexible displays  Test development for transistor and display parameters − Definition of test specifications − Electrical and Optical tests for production − Test methods for OTFT and other characterisation structures  Reliability optimization for quality and lifetime behavior − Accelerated test under different environmental conditions for lifetime projections − Based on existing models for Si-based integrated circuits − Parameters adapted to organic materials in terms of temperature sensitivities and reaction to cycling 9
  • 10.
    Reliability challenges indevelopment phase Reliability problem solving was critical part of industrialisation process Typical problem in early development (2009) Problem solved Delamination during climatic tests Today, Plastic Logic displays have been stressed beyond 10M updates 10
  • 11.
    Technology Position Today  Developed the lightest, most durable display technology available today  Demonstrated scalability in the first and largest production facility  Developed the first flexible colour display  Protected with a strong IP position – 101 patents and applications – 36 granted to date  1-2 year lead over the competition for flexible backplane technology  A single display has 1.2M uniform and reliable plastic transistors 11
  • 12.
  • 13.
    Colour EP DisplayArchitecture Encapsulation sheet Colour Filter Array Plastic Substrate E Ink Frontplane Plastic Logic Backplane Technology Low Distortion Plastic Plastic Substrate Logic Backplane  Colour Filter patterned by multiple approaches (wet printing, sheet-to-sheet alignment).  During CFA pattern formation, the backplane pixel electrodes are not visible (obscured by E Ink layer).  Backplane:  1280 x 960 pixels (monochrome) = 640 x 480 Colour  150PPI (monochrome) = 75PPI Colour  Active Area: 217.6mm x 163.2mm 13
  • 14.
    Low Distortion Backplane Pixel  Conventional glass Electrode backplanes require regular grid for all layers (source, Interlayer drain, gate, via, etc) Via Dielectric  This allows overlay of pre- patterned layers (eg Colour Filter)  Distortion in flexible substrates makes this difficult  Plastic Logic Process resets distortion at the pixel electrode layer, with no loss in pixel performance. Plastic Backplane: Top Pixels Glass Backplane: All stack layers on a regular grid maintained on a regular grid 14
  • 15.
    Colour Filter Overlay RGBW colour filter patterned onto E Ink surface  Overlay accuracy of 10µm achieved across the active area  Four variants of different colour density investigated RGBW CFA pattern over E Ink R pixels driven “white” to show alignment 15
  • 16.
    Colour Display Performance- Gamut  4 colour densities tested (A,B,C,D)  Gamut (∆E3):  Type A: 5000  Type B: 4000  Type C: 3400  Type D: 3000  Excellent colour uniformity, viewing angle Acknowledgement: A. Bouchard, E Ink 16
  • 17.
    Flexible Displays: NowAvailable Display size 1” - 10.7” Backplane Grey Levels 4 – 16 Pixel pitch up to 225ppi Contrast Ratio 12:1 Thickness thin as 130 µm Weight down to 11g Colour Available NTSC 2-5%  Paper-like finish  Excellent readability  Colour gamut high enough to enable distinguishability  Bistable enables long battery life 1280 x 960 Colour Display 17
  • 18.
    Plastic Logic Technologyin Action • 10 to 12.5 frames per second video on e-ink with colour filters • Driven with 20 sub-frames to maintain voltage across e-ink. • Backplane driving at 200 to 225fps www.youtube.com/plasticlogic 18
  • 19.
    Plastic Logic’s Displays •Plastic Logic is a flexible display OEM and technology provider. We can supply displays in variety of sizes and resolutions and enable others to do so through licensing arrangements. • Plastic Logic is a global leader in OTFT devices and the challenges of manufacturing on plastic. • Plastic Logic is actively looking to partner with companies who can open up new markets for our display technology. 19
  • 20.