ODSA - Power and Heat
•
0 likes•58 views
The document discusses power distribution and thermal management challenges for future chiplet-based architectures. It describes the current power architecture for Intel cores that uses a 1.8V input converted to an unregulated 0.9V supply. Future architectures may use local PMICs/chiplets with higher 3.3V or 5V inputs to reduce pins and separate analog and digital power domains, though conversion losses need to be dissipated. An active interposer could provide these conversion functions but poses technology and heat dissipation challenges. Thermal budgeting and local heating effects will require power/thermal controllers using temperature sensors. Chiplet specifications like voltage, current, thermal resistance, and interfaces will need to be standardized.
Report
Share
Report
Share
Download to read offline
Recommended
Clap switch
A clap switch circuit uses a condenser microphone, transistor, 555 timer IC, LED, and battery to turn on lights or appliances when it detects the sound of a clap. The microphone converts sound into an electrical signal that triggers the transistor and 555 timer IC, causing the LED to illuminate anything connected to the circuit like a light bulb. This provides a hands-free way to operate devices that can benefit elderly or mobility-impaired users.
Reverse power relay
Reverse Power Relay for Rooftop Solar Pv system A simulation related to the project to turn off the panels when power produced is excess than demanded
1.3.4speedy
This document discusses high-performance computing, mentioning teraflop and petaflop computers as well as the "Roadrunner", which was an early petaflop computer. It appears to be about advances in computing power and speed over time.
Trading Power and Performance to Achieve Optimal Thermal Design for Battery-P...
Presentation at Communications, Microsystems, Optoelectronics, and Sensors (CMOS) in Vancouver, BC, by Mark Benson on July 18th, 2012.
ABSTRACT: In embedded systems there is a science to choosing the right processor for a given design. Usually processors are chosen based on objective factors such as peripheral support, physical packaging, memory, architecture family, and software tools available.
This type of quantitative analysis lends itself well to spreadsheets and formulas that can help choose which processor is best.
However, for small high-performance battery-powered devices that have heavy processing requirements, thermal performance quickly becomes an urgent design issue to overcome and is often viewed as an elusive and opinion-fraught black-art.
Modeling, managing, and characterizing the efficient dissipation of heat in these types of devices is complex. Fortunately, there are new processors coming to the embedded marketplace that have advanced features for managing thermal performance.
This, combined with new advances in software modeling techniques and algorithms gives us a fresh playground to innovate new ways to manage thermals in a way that was not previously possible.
19 characterizing pv modules using microinverter data final
19 characterizing pv modules using microinverter data finalSandia National Laboratories: Energy & Climate: Renewables
This document discusses using microinverter data from Enphase systems to characterize photovoltaic modules and identify underperformance. Microinverter data provides detailed performance data at the individual module level. The approach infers site orientation metadata like tilt and azimuth by correlating current output with clear sky irradiance models. It also infers module metadata like voltage and current references by analyzing output trends. Together this allows visualization of module performance over time and identification of issues. The analysis does not require external sensors or site visits, using only the microinverter data, with the goal of automatically monitoring many systems.12 pvpmc
Cell String-Level Energy Production Simulation with Aurora is powerful software used to create over 10k solar projects per week. It provides the most granular submodule-level modeling to capture partial shading, bypass diodes, and cell string-level power electronics in PV systems. The simulation initializes site and panel configurations in 3D space, computes irradiance and temperature for each cell string, and models each string as an electrical circuit to solve for maximum power point at each hour. Results show cell string-level simulation can improve energy production and lifetime energy bill savings accuracy by 1-4% compared to module-level simulation due to its ability to account for unique string configurations, bypass diodes, and cell string optimizers.
PULSE GENERATOR_Hazzan Aj
This document describes the design and development of a pulse generator circuit using a 555 timer integrated circuit. It includes a list of components, a schematic diagram, and descriptions of the design process from conceptualization to testing. The circuit produces oscillations that can be used in applications like digital clocks, meters, and security systems. The design was verified through calculation of duty cycle and frequency formulas and by confirming the lights glow as intended.
All digital energy sensing for minimum energy tracking
This document presents a digital energy sensing method for minimizing energy consumption in energy-starved systems with relaxed performance requirements. The method requires neither a constant voltage reference nor a time reference. An energy minimizing loop uses this sensing method to find the minimum energy point and sets the supply voltage between 0.2 and 0.5 volts, achieving energy savings of up to 1275% over existing minimum energy tracking techniques.
Recommended
Clap switch
A clap switch circuit uses a condenser microphone, transistor, 555 timer IC, LED, and battery to turn on lights or appliances when it detects the sound of a clap. The microphone converts sound into an electrical signal that triggers the transistor and 555 timer IC, causing the LED to illuminate anything connected to the circuit like a light bulb. This provides a hands-free way to operate devices that can benefit elderly or mobility-impaired users.
Reverse power relay
Reverse Power Relay for Rooftop Solar Pv system A simulation related to the project to turn off the panels when power produced is excess than demanded
1.3.4speedy
This document discusses high-performance computing, mentioning teraflop and petaflop computers as well as the "Roadrunner", which was an early petaflop computer. It appears to be about advances in computing power and speed over time.
Trading Power and Performance to Achieve Optimal Thermal Design for Battery-P...
Presentation at Communications, Microsystems, Optoelectronics, and Sensors (CMOS) in Vancouver, BC, by Mark Benson on July 18th, 2012.
ABSTRACT: In embedded systems there is a science to choosing the right processor for a given design. Usually processors are chosen based on objective factors such as peripheral support, physical packaging, memory, architecture family, and software tools available.
This type of quantitative analysis lends itself well to spreadsheets and formulas that can help choose which processor is best.
However, for small high-performance battery-powered devices that have heavy processing requirements, thermal performance quickly becomes an urgent design issue to overcome and is often viewed as an elusive and opinion-fraught black-art.
Modeling, managing, and characterizing the efficient dissipation of heat in these types of devices is complex. Fortunately, there are new processors coming to the embedded marketplace that have advanced features for managing thermal performance.
This, combined with new advances in software modeling techniques and algorithms gives us a fresh playground to innovate new ways to manage thermals in a way that was not previously possible.
19 characterizing pv modules using microinverter data final
19 characterizing pv modules using microinverter data finalSandia National Laboratories: Energy & Climate: Renewables
This document discusses using microinverter data from Enphase systems to characterize photovoltaic modules and identify underperformance. Microinverter data provides detailed performance data at the individual module level. The approach infers site orientation metadata like tilt and azimuth by correlating current output with clear sky irradiance models. It also infers module metadata like voltage and current references by analyzing output trends. Together this allows visualization of module performance over time and identification of issues. The analysis does not require external sensors or site visits, using only the microinverter data, with the goal of automatically monitoring many systems.12 pvpmc
Cell String-Level Energy Production Simulation with Aurora is powerful software used to create over 10k solar projects per week. It provides the most granular submodule-level modeling to capture partial shading, bypass diodes, and cell string-level power electronics in PV systems. The simulation initializes site and panel configurations in 3D space, computes irradiance and temperature for each cell string, and models each string as an electrical circuit to solve for maximum power point at each hour. Results show cell string-level simulation can improve energy production and lifetime energy bill savings accuracy by 1-4% compared to module-level simulation due to its ability to account for unique string configurations, bypass diodes, and cell string optimizers.
PULSE GENERATOR_Hazzan Aj
This document describes the design and development of a pulse generator circuit using a 555 timer integrated circuit. It includes a list of components, a schematic diagram, and descriptions of the design process from conceptualization to testing. The circuit produces oscillations that can be used in applications like digital clocks, meters, and security systems. The design was verified through calculation of duty cycle and frequency formulas and by confirming the lights glow as intended.
All digital energy sensing for minimum energy tracking
This document presents a digital energy sensing method for minimizing energy consumption in energy-starved systems with relaxed performance requirements. The method requires neither a constant voltage reference nor a time reference. An energy minimizing loop uses this sensing method to find the minimum energy point and sets the supply voltage between 0.2 and 0.5 volts, achieving energy savings of up to 1275% over existing minimum energy tracking techniques.
final thesis presentation.pptx
The document is a presentation on a study of a low power Radix-4 Booth multiplier using Pass Transistor Logic (PTL). It discusses existing Radix-4 Booth multiplier topologies and their limitations. It then proposes a novel design that uses PTL to implement the zero-generator, encoder, and decoder components of the partial product generator (PPG) in order to reduce glitches and power consumption. Simulation results show the proposed design has a power-delay product of 4.307 fJ, lower than the compared existing designs. While the delay is higher, the power is the lowest at 18.63 μW. The design thus achieves lower power consumption for the Radix-4 Booth multiplier PPG
Low power in vlsi with upf basics part 1
The document discusses low power design techniques in VLSI. It begins by explaining why low power has become important, especially with the rise of mobile devices. It then discusses the different sources of power consumption, including dynamic and static power. Several low power design techniques are covered, such as clock gating, multi-Vt libraries, multi-voltage design, and power gating. The document emphasizes analyzing power at the system level and using EDA tools to implement low power techniques throughout the design flow. Overall, it provides an overview of analyzing power consumption and the goals and methods of low power VLSI design.
TechShanghai2016 - Wireless Power – Ready for Prime Time
Wireless power technology has reached a tipping point in 2015 with major companies like Samsung and Apple adopting it. The document discusses the reasons for wireless power's adoption after over 100 years, reviews wireless power trends and standards, and looks at enabling mass market adoption. Key points include magnetic resonance and induction technologies, standards like Qi and A4WP merging, the smartphone driving infrastructure build-out, and the need for solutions optimized for ease of use and integration to reach the mass market.
Ecofriendly solutions at work - SMB Datacenters
Data centers consume a large and growing amount of global electricity, accounting for 1-5% of worldwide consumption. Eco-friendly switches can help reduce this impact by using more efficient components and designs that lower power consumption, such as single-chip switches, removing cooling fans, implementing sleep modes, and utilizing more integrated silicon. Allied Telesis has implemented various eco-friendly manufacturing and design practices that have significantly reduced the power needs of their switches, such as using lead-free and water-based manufacturing processes.
Low power
The document discusses various techniques for reducing power consumption at different levels, from circuit-level optimizations like transistor sizing and voltage scaling, to logic synthesis techniques like clock gating and state encoding, to algorithm-level optimizations and architecturally-static pipelining supported by an optimizing compiler. It notes that power optimization is important for cost, dependability, and extending battery life, and that while proposed approaches show potential, accurate energy assessments of new techniques are still needed.
Aged Data Center Infrastructure.pptx
This document discusses options for data center owners and operators to consider when their aging infrastructure may no longer meet current or future needs. As digital traffic and the internet of things continue to grow rapidly, data center infrastructure is facing unprecedented challenges. The document outlines various strategies to evaluate such as tuning up existing facilities, targeted modernization of critical components, adopting pod-based architectures, and building new infrastructure to right-size capacity. Each option involves analyzing business needs, costs, efficiency gains, and potential downtime to determine the best path forward.
Low power vlsi design ppt
Low power VLSI design has become an important discipline due to increasing device densities, operating frequencies, and proliferation of portable electronics. Power dissipation, which was previously neglected, is now a primary design constraint. There are several sources of power dissipation in CMOS circuits, including switching power due to charging and discharging capacitances, short-circuit power during signal transitions, and leakage power from subthreshold and gate leakage currents. Designers have some control over power consumption by optimizing factors such as activity levels, clock frequency, supply voltage, transistor sizing and architecture.
8051 interfacing
This consists of Interfacing of 8051 with ADC, DAC, LED, Seven segment Dispaly, Stepper motor, Temperature Sensor etc
8051interfacing 190425062221
This document provides an overview of interfacing various devices with the 8051 microcontroller, including LCDs, LEDs, 7-segment displays, ADCs, DACs, temperature sensors, stepper motors, keyboards, and more. It includes diagrams of pin connections and code examples. The document was prepared by Ms. K. D. Patil and covers topics related to processor architecture and interfacing for a class.
Scaling Green Instrumentation to more than 10 Million Cores
In this deck from SC18, Satoshi Matsuoka from RIKEN presents: Scaling Green Instrumentation to more than 10 Million Cores.
"We now have some sites that are extremely well instrumented for measuring power and energy. Lawrence Berkeley National Laboratory’s supercomputing center is a prime example, with sensors, data collection and analysis capabilities that span the facility and computing equipment. We have made major gains in improving the energy efficiency of the facility as well as computing hardware, but there are still large gains to be had with software- particularly application software. Just tuning code for performance isn’t enough; the same time to solution can have very different power profiles. We are at the point where measurement capabilities are allowing us to see cross-cutting issues- such as the cost of spin waits. These new measurement capabilities should provide a wealth of information to see the tall poles in the tent. This panel will explore how we can identify these emerging tall poles."
Learn more: http://sc18.supercomputing.org/proceedings/panel/panel_pages/pan101.html
and
https://wp.me/p3RLHQ-jHZ
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
Embedded system
The document discusses the 8051 microcontroller architecture. It provides an overview of the 8051 including its Harvard architecture, block diagram showing CPU, RAM, ROM, I/O ports, and timers. It compares features of the 8051, 8052, and 8031 family members and describes the pin functions including power, clock, reset, I/O ports, and external memory interface. It also provides examples of software tools like Keil uVision and Proteus used for 8051 development and programming and discusses a sample traffic light project implemented using an 8051.
IRJET- Intelligent Power Emulator
This document describes an intelligent power emulator module that allows testing of various power converters on a single integrated device. Key features of the proposed module include:
- Housing various converter circuits like rectifiers, buck converters, and inverters along with a driver circuit, protective devices, sensors, and microcontroller on one module.
- Incorporating a digital storage oscilloscope to monitor and analyze output waveforms without occupying additional space.
- Utilizing less space compared to conventional setups that require separate modules for testing individual converters.
IRJET- Intelligent Power Emulator
This document describes an intelligent power emulator module that allows testing of various power converters on a single integrated device. Key features of the proposed module include:
- Housing various converter circuits, driver circuits, protective devices, sensors, and a microcontroller on one module to save space compared to testing converters individually.
- Using a transformer with multiple outputs as the driver circuit and a rectifier IC to provide constant DC voltage to switches in the module.
- Incorporating a digital storage oscilloscope within the module to monitor and analyze output waveforms without occupying additional space.
- Implementing rotary switches and patch cords on the module to easily configure different converter circuit connections and test various operating conditions in a compact
Siemon Carrie Higbie
This document provides an overview of data center design considerations for a green and agile environment. It discusses the need for increased energy efficiency in data centers and standards like TIA-942, PUE, and green building initiatives. Specific strategies are presented for efficient power usage, cooling, and cabling infrastructure to support virtualization, consolidation and high-speed networking.
CLOCKLESS CHIP BY Saurabh singh
This document discusses clockless or asynchronous chips. It notes that synchronous chips require a global clock signal which wastes power and limits performance. Clockless chips use handshake signals instead of a clock to coordinate data exchange between components, allowing different parts to work at individual speeds. This reduces power consumption and heat generation compared to synchronous chips. While clockless chips offer advantages, challenges remain in interfacing them with existing synchronous devices and a lack of expertise and tools in asynchronous design.
Design of a 45nm TIQ Comparator for High Speed and Low Power 4-Bit Flash ADC
The continued speed improvement of serial links
and appearance of new communication technologies, such as
ultra-wideband (UWB), have introduced increasing demands
on the speed and power specifications of high-speed low-tomedium
resolution analog-to-digital converters (ADCs).This
paper presents the design of high speed and ultra low power
comparator of a 4-bit ADC. The comparator used is Threshold
Inverter Quantization (TIQ) consuming less than 145μW power
with the input frequency of 1GHz and is designed using
standard CMOS (Complementary Metal Oxide
Semiconductor) technology. The power supply voltage is 0.7V
minimum which makes this design adaptable to wide variety
of System-on-Chip (SoC) applications. The complete design of
ADC is clockless which reduces the electromagnetic
interference and gives better modularity. The ADC is targeted
for 45nm as it was the mainstream CMOS technology, at the
beginning of this research. However, the circuit should be
portable to smaller feature size CMOS technologies with lower
supply voltages.
Final Year Report (6bits DACs)
This document is a final year project report for a 6-bit current steering digital to analogue converter. It includes an introduction that describes the objectives and design specifications of the project. The background section provides an overview of digital to analogue conversion, thermometer decoding, and current source DAC architectures. The design and architecture section describes the implementation of the thermometer decoder and current source DAC. The simulation results are presented and the document is concluded by discussing potential future work.
1.1 integrating renewables srm
Recent presentation on how the integration of renewable energy can provide benefits to both the customer and the utility.
Major project presentation
The document describes a proposed automated wireless meter reading system. It would consist of meter reading retrieval units with microcontrollers and Zigbee transceivers attached to electricity meters. A wireless personal area network using Zigbee would transfer meter readings to a handheld device. This would allow readings to be collected remotely without manual inspection, reducing costs and errors. Digital meters would measure voltage, current and power consumption. Readings would be sent via Zigbee and stored on the handheld device for later transfer to a computer database. The system aims to make meter reading easier, more accurate and help utilities better manage electricity distribution.
2013-03-11-seminario-artecs-mzapater
This document summarizes a presentation about improving energy efficiency in data centers through proactive and reactive thermal optimization techniques. It discusses how data center energy consumption is a growing problem and motivation for optimization. It outlines a holistic approach to jointly minimize IT and cooling power through application awareness, leveraging server heterogeneity, and optimizing the leakage-cooling tradeoff at the server level. Current work is developing a thermal model to jointly allocate computational and cooling resources through sensor data and genetic algorithms.
ODSA - Business Workstream
The document discusses the formation of a new subgroup within ODSA focused on developing open standards for system-in-package solutions using chiplet technology. The subgroup aims to define an open architectural interface to allow best-of-breed chiplets from multiple vendors to be used together. It outlines several workstreams for participants to join related to developing the interface standards, building proof-of-concept demonstrations, and defining business and intellectual property models. A survey is also discussed that gathers input on drivers and barriers for adopting chiplet and system-in-package technologies as well as supply chain considerations.
ODSA - PoC Planning & Call for Help
The document discusses a Proof of Concept (PoC) project being undertaken by the PoC Working Group of ODSA. It provides an overview of the project leadership and participants. The PoC is finalizing its architecture, which will include identified chiplets and mechanical/connector specifications. It outlines the high level schedule and key tasks through December and calls for help with PCB design, manufacturing sponsorship, and software/firmware volunteers.
More Related Content
Similar to ODSA - Power and Heat
final thesis presentation.pptx
The document is a presentation on a study of a low power Radix-4 Booth multiplier using Pass Transistor Logic (PTL). It discusses existing Radix-4 Booth multiplier topologies and their limitations. It then proposes a novel design that uses PTL to implement the zero-generator, encoder, and decoder components of the partial product generator (PPG) in order to reduce glitches and power consumption. Simulation results show the proposed design has a power-delay product of 4.307 fJ, lower than the compared existing designs. While the delay is higher, the power is the lowest at 18.63 μW. The design thus achieves lower power consumption for the Radix-4 Booth multiplier PPG
Low power in vlsi with upf basics part 1
The document discusses low power design techniques in VLSI. It begins by explaining why low power has become important, especially with the rise of mobile devices. It then discusses the different sources of power consumption, including dynamic and static power. Several low power design techniques are covered, such as clock gating, multi-Vt libraries, multi-voltage design, and power gating. The document emphasizes analyzing power at the system level and using EDA tools to implement low power techniques throughout the design flow. Overall, it provides an overview of analyzing power consumption and the goals and methods of low power VLSI design.
TechShanghai2016 - Wireless Power – Ready for Prime Time
Wireless power technology has reached a tipping point in 2015 with major companies like Samsung and Apple adopting it. The document discusses the reasons for wireless power's adoption after over 100 years, reviews wireless power trends and standards, and looks at enabling mass market adoption. Key points include magnetic resonance and induction technologies, standards like Qi and A4WP merging, the smartphone driving infrastructure build-out, and the need for solutions optimized for ease of use and integration to reach the mass market.
Ecofriendly solutions at work - SMB Datacenters
Data centers consume a large and growing amount of global electricity, accounting for 1-5% of worldwide consumption. Eco-friendly switches can help reduce this impact by using more efficient components and designs that lower power consumption, such as single-chip switches, removing cooling fans, implementing sleep modes, and utilizing more integrated silicon. Allied Telesis has implemented various eco-friendly manufacturing and design practices that have significantly reduced the power needs of their switches, such as using lead-free and water-based manufacturing processes.
Low power
The document discusses various techniques for reducing power consumption at different levels, from circuit-level optimizations like transistor sizing and voltage scaling, to logic synthesis techniques like clock gating and state encoding, to algorithm-level optimizations and architecturally-static pipelining supported by an optimizing compiler. It notes that power optimization is important for cost, dependability, and extending battery life, and that while proposed approaches show potential, accurate energy assessments of new techniques are still needed.
Aged Data Center Infrastructure.pptx
This document discusses options for data center owners and operators to consider when their aging infrastructure may no longer meet current or future needs. As digital traffic and the internet of things continue to grow rapidly, data center infrastructure is facing unprecedented challenges. The document outlines various strategies to evaluate such as tuning up existing facilities, targeted modernization of critical components, adopting pod-based architectures, and building new infrastructure to right-size capacity. Each option involves analyzing business needs, costs, efficiency gains, and potential downtime to determine the best path forward.
Low power vlsi design ppt
Low power VLSI design has become an important discipline due to increasing device densities, operating frequencies, and proliferation of portable electronics. Power dissipation, which was previously neglected, is now a primary design constraint. There are several sources of power dissipation in CMOS circuits, including switching power due to charging and discharging capacitances, short-circuit power during signal transitions, and leakage power from subthreshold and gate leakage currents. Designers have some control over power consumption by optimizing factors such as activity levels, clock frequency, supply voltage, transistor sizing and architecture.
8051 interfacing
This consists of Interfacing of 8051 with ADC, DAC, LED, Seven segment Dispaly, Stepper motor, Temperature Sensor etc
8051interfacing 190425062221
This document provides an overview of interfacing various devices with the 8051 microcontroller, including LCDs, LEDs, 7-segment displays, ADCs, DACs, temperature sensors, stepper motors, keyboards, and more. It includes diagrams of pin connections and code examples. The document was prepared by Ms. K. D. Patil and covers topics related to processor architecture and interfacing for a class.
Scaling Green Instrumentation to more than 10 Million Cores
In this deck from SC18, Satoshi Matsuoka from RIKEN presents: Scaling Green Instrumentation to more than 10 Million Cores.
"We now have some sites that are extremely well instrumented for measuring power and energy. Lawrence Berkeley National Laboratory’s supercomputing center is a prime example, with sensors, data collection and analysis capabilities that span the facility and computing equipment. We have made major gains in improving the energy efficiency of the facility as well as computing hardware, but there are still large gains to be had with software- particularly application software. Just tuning code for performance isn’t enough; the same time to solution can have very different power profiles. We are at the point where measurement capabilities are allowing us to see cross-cutting issues- such as the cost of spin waits. These new measurement capabilities should provide a wealth of information to see the tall poles in the tent. This panel will explore how we can identify these emerging tall poles."
Learn more: http://sc18.supercomputing.org/proceedings/panel/panel_pages/pan101.html
and
https://wp.me/p3RLHQ-jHZ
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
Embedded system
The document discusses the 8051 microcontroller architecture. It provides an overview of the 8051 including its Harvard architecture, block diagram showing CPU, RAM, ROM, I/O ports, and timers. It compares features of the 8051, 8052, and 8031 family members and describes the pin functions including power, clock, reset, I/O ports, and external memory interface. It also provides examples of software tools like Keil uVision and Proteus used for 8051 development and programming and discusses a sample traffic light project implemented using an 8051.
IRJET- Intelligent Power Emulator
This document describes an intelligent power emulator module that allows testing of various power converters on a single integrated device. Key features of the proposed module include:
- Housing various converter circuits like rectifiers, buck converters, and inverters along with a driver circuit, protective devices, sensors, and microcontroller on one module.
- Incorporating a digital storage oscilloscope to monitor and analyze output waveforms without occupying additional space.
- Utilizing less space compared to conventional setups that require separate modules for testing individual converters.
IRJET- Intelligent Power Emulator
This document describes an intelligent power emulator module that allows testing of various power converters on a single integrated device. Key features of the proposed module include:
- Housing various converter circuits, driver circuits, protective devices, sensors, and a microcontroller on one module to save space compared to testing converters individually.
- Using a transformer with multiple outputs as the driver circuit and a rectifier IC to provide constant DC voltage to switches in the module.
- Incorporating a digital storage oscilloscope within the module to monitor and analyze output waveforms without occupying additional space.
- Implementing rotary switches and patch cords on the module to easily configure different converter circuit connections and test various operating conditions in a compact
Siemon Carrie Higbie
This document provides an overview of data center design considerations for a green and agile environment. It discusses the need for increased energy efficiency in data centers and standards like TIA-942, PUE, and green building initiatives. Specific strategies are presented for efficient power usage, cooling, and cabling infrastructure to support virtualization, consolidation and high-speed networking.
CLOCKLESS CHIP BY Saurabh singh
This document discusses clockless or asynchronous chips. It notes that synchronous chips require a global clock signal which wastes power and limits performance. Clockless chips use handshake signals instead of a clock to coordinate data exchange between components, allowing different parts to work at individual speeds. This reduces power consumption and heat generation compared to synchronous chips. While clockless chips offer advantages, challenges remain in interfacing them with existing synchronous devices and a lack of expertise and tools in asynchronous design.
Design of a 45nm TIQ Comparator for High Speed and Low Power 4-Bit Flash ADC
The continued speed improvement of serial links
and appearance of new communication technologies, such as
ultra-wideband (UWB), have introduced increasing demands
on the speed and power specifications of high-speed low-tomedium
resolution analog-to-digital converters (ADCs).This
paper presents the design of high speed and ultra low power
comparator of a 4-bit ADC. The comparator used is Threshold
Inverter Quantization (TIQ) consuming less than 145μW power
with the input frequency of 1GHz and is designed using
standard CMOS (Complementary Metal Oxide
Semiconductor) technology. The power supply voltage is 0.7V
minimum which makes this design adaptable to wide variety
of System-on-Chip (SoC) applications. The complete design of
ADC is clockless which reduces the electromagnetic
interference and gives better modularity. The ADC is targeted
for 45nm as it was the mainstream CMOS technology, at the
beginning of this research. However, the circuit should be
portable to smaller feature size CMOS technologies with lower
supply voltages.
Final Year Report (6bits DACs)
This document is a final year project report for a 6-bit current steering digital to analogue converter. It includes an introduction that describes the objectives and design specifications of the project. The background section provides an overview of digital to analogue conversion, thermometer decoding, and current source DAC architectures. The design and architecture section describes the implementation of the thermometer decoder and current source DAC. The simulation results are presented and the document is concluded by discussing potential future work.
1.1 integrating renewables srm
Recent presentation on how the integration of renewable energy can provide benefits to both the customer and the utility.
Major project presentation
The document describes a proposed automated wireless meter reading system. It would consist of meter reading retrieval units with microcontrollers and Zigbee transceivers attached to electricity meters. A wireless personal area network using Zigbee would transfer meter readings to a handheld device. This would allow readings to be collected remotely without manual inspection, reducing costs and errors. Digital meters would measure voltage, current and power consumption. Readings would be sent via Zigbee and stored on the handheld device for later transfer to a computer database. The system aims to make meter reading easier, more accurate and help utilities better manage electricity distribution.
2013-03-11-seminario-artecs-mzapater
This document summarizes a presentation about improving energy efficiency in data centers through proactive and reactive thermal optimization techniques. It discusses how data center energy consumption is a growing problem and motivation for optimization. It outlines a holistic approach to jointly minimize IT and cooling power through application awareness, leveraging server heterogeneity, and optimizing the leakage-cooling tradeoff at the server level. Current work is developing a thermal model to jointly allocate computational and cooling resources through sensor data and genetic algorithms.
Similar to ODSA - Power and Heat (20)
TechShanghai2016 - Wireless Power – Ready for Prime Time
TechShanghai2016 - Wireless Power – Ready for Prime Time
Scaling Green Instrumentation to more than 10 Million Cores
Scaling Green Instrumentation to more than 10 Million Cores
Design of a 45nm TIQ Comparator for High Speed and Low Power 4-Bit Flash ADC
Design of a 45nm TIQ Comparator for High Speed and Low Power 4-Bit Flash ADC
More from ODSA Workgroup
ODSA - Business Workstream
The document discusses the formation of a new subgroup within ODSA focused on developing open standards for system-in-package solutions using chiplet technology. The subgroup aims to define an open architectural interface to allow best-of-breed chiplets from multiple vendors to be used together. It outlines several workstreams for participants to join related to developing the interface standards, building proof-of-concept demonstrations, and defining business and intellectual property models. A survey is also discussed that gathers input on drivers and barriers for adopting chiplet and system-in-package technologies as well as supply chain considerations.
ODSA - PoC Planning & Call for Help
The document discusses a Proof of Concept (PoC) project being undertaken by the PoC Working Group of ODSA. It provides an overview of the project leadership and participants. The PoC is finalizing its architecture, which will include identified chiplets and mechanical/connector specifications. It outlines the high level schedule and key tasks through December and calls for help with PCB design, manufacturing sponsorship, and software/firmware volunteers.
ODSA - DirectConnect Options for the PoC
The document discusses Firefly DirectConnect options for an ODSA proof of concept. It describes Firefly's small size and ability to fit 4 modules across a 50mm package edge. Firefly offers high performance through direct connection to the silicon package, eliminating signal distortion through the ball grid array region. It also provides flexibility by supporting both optical and high-speed copper modules in the same slot, and high power efficiency enabling 56G PAM4 transmission at minimal power per bit.
ODSA - PoC Physical Design Elements
The document discusses plans for a proof-of-concept multi-chiplet package. It will include an 8-layer flip chip ball grid array substrate containing chiplets, optical/electrical connectors, and decoupling capacitors. It also proposes an early software development vehicle using equivalent chips on a printed circuit board to speed up software and testing development while hardware is being designed. Developing the package involves tasks like design, simulation, fabrication, assembly, and reporting. The schedule estimates timelines for the various stages including substrate fabrication, assembly, design reviews, and simulations.
ODSA - NXP PoC Presentation
The document describes the NXP Layerscape series of Arm-based system on chip families. It provides details on several SoC models ranging from 1-100GbE networking, PCIe connectivity, memory support, security features, and power consumption between 1-35W. The LX2160 model is highlighted which features a 16-core 64-bit Arm Cortex-A72 CPU, networking up to 100GbE, memory controllers supporting up to 3.2GT/s DDR4, and integrated security accelerators while consuming around 30W.
ODSA - PoC Requirements and Use Cases
The document discusses requirements for a proof-of-concept (POC) involving a smart network interface card (NIC) and computational storage solutions. It proposes using an FPGA, network processor, and CPU module connected via PCIe and Ethernet to demonstrate different POC configurations for the smart NIC and computational storage, including as a standalone device, bump-in-the-wire, and with a data accelerator. The POC aims to validate interfaces and protocols, evaluate performance, and develop software models while exploring challenges of chiplet integration and business aspects of collaboration.
ODSA - Speedster22i FPGA for POC
The document discusses the Speedster22i HD1000 FPGA from Achronix, an older FPGA design that started shipping in 2013. It features 700,000 programmable logic units running up to 750 MHz, along with 40G Ethernet connectivity via three 40G links, PCIe Gen3 x8 support via two controllers, and DDR3 memory via six channels.
ODSA Design Tools for Chiplet-Based Design
The document discusses tools needed for chiplet-based integrated circuit design. It notes that while EDA companies offer many necessary design tools, they are currently offered piecemeal. Standards for defining chiplets electrically, mechanically, and thermally would help enable a chiplet marketplace. zGlue has developed a data exchange format for defining chiplets and their mechanical I/O, and power specifications to allow chiplet vendors to list their products while maintaining access control. The document promotes zGlue's ChipBuilder software and shuttle prototype program for designing with chiplets.
ODSA - PIPE Adapters
This document discusses the need for PIPE adapters to allow chiplet-based designs to function as a single die. It notes that while several high-speed SerDes exist, none directly support the PIPE interface which was developed by Intel for PCIe. PIPE adapters would be needed to divide the PIPE interface into multiple lanes that could be supported by the SerDes, which generally have higher speeds than individual PCIe lanes. The document outlines how a Kandou PIPE adapter would work and notes that while the complexity is less than the SerDes, PIPE adapters have not yet been developed into products and test chips would be useful to develop the interfaces.
ODSA - PHY Layer
The document discusses proposals for a standard physical layer interface to enable high data rate connections between chiplet products from different sources. Seven interface options are being considered, including AIB, silicon interposer, various parallel and SERDES-based approaches. Metrics for comparing the options are discussed, such as cost, performance, and design/integration complexity. Relative ratings of the options are provided based on initial discussions. Feedback is sought on priority metrics for different target markets.
OODSA - BoW: Basic, Fast, Turbo Die-to Die Open Interface Solutions
The document proposes the Bow interface standard for chiplet-based systems. Bow would define a simple source synchronous interface using CMOS IO to enable communication between dies up to 4Gbps per line untetherminated, or up to 12Gbps per line when terminated. It could also define a bidirectional "Bow Turbo" mode using hybrid circuits to allow simultaneous transmission and reception at up to 2x12Gbps per line. The proposal suggests this standard could improve compatibility for chiplet communication where bandwidth needs are modest, while examples from silicon implementation suggest it could efficiently deliver over 1Tbps of throughput per mm of chip edge. Volunteers are sought to further define options like test approaches and applications to evaluate the standard's value.
ODSA - Samsung Welcomes OCP's ODSA
Samsung Foundry is expanding from mobile chips to high performance computing. The author is personally interested in chiplet technology for several reasons: it could enable larger chip designs by connecting chiplets in multiple dimensions; allow for easier upgrading by swapping out chiplets; lower costs by reusing chiplets across designs; and enable new business models. The author sees a need for innovation in hardware to keep pace with the rapid advancement of software and AI models, and chiplet technology may help address this. Samsung is interested in contributing to the Open Domain Specific Architecture initiative but has not yet determined how.
ODSA - Technical Introduction
The document discusses the Open Domain Specific Architecture (ODSA) project, which aims to define an open interface for building complex application-specific integrated circuits (ASICs) from multiple die or "chiplets". This would allow best-of-breed chiplets from different vendors to be combined, reducing development costs compared to monolithic designs. The document provides an overview of domain-specific architectures and chiplets, proposes a reference multi-chiplet architecture and open interface, and outlines next steps to define standards and build a proof-of-concept through collaborative workstreams.
ODSA - OCP Welcome
The document is an agenda for the OCP ODSA Workshop held on March 28, 2019. It lists the schedule of presentations for the day-long workshop organized by the Open Compute Project (OCP). The workshop included presentations on accelerator technologies, standards and interfaces, design tools, proof of concept requirements and components, as well as discussions on business models and collaboration with OCP. Speakers came from companies like Samsung, Facebook, Netronome, Avera Semi, Kandou, Achronix, NXP and others.
ODSA - OCP Accelerator Module and the Infrastructure
The document discusses the need for an open accelerator infrastructure to support the growing variety of AI hardware accelerators. It proposes the Open Compute Project Accelerator Module specification to standardize the form factor and interfaces of accelerator modules. It also introduces the concept of a Universal Baseboard that can host multiple accelerator modules and uses a standardized interconnect to provide flexible topologies to scale performance for different AI workloads. The open infrastructure is intended to foster innovation while providing interoperability between accelerator modules and systems.
ODSA Sub-Project Launch
The charter of the ODSA (Open Domain Specification Architecture) Workgroup is to define an open specification that enables building of Domain Specific Accelerator silicon using best-of-breed components from the industry made available as chiplet dies that can be integrated together as Lego blocks on an organic substrate packaging layer. The resulting multi-chip module (MCM) silicon can be produced at significantly lower development and manufacturing costs, and will deliver much needed performance per watt and performance per dollar efficiencies in networking, security, machine learning and other applications. The ODSA Workgroup also intends to deliver implementations of the specification as board-level prototypes, RTL code and libraries.
ODSA Workshop: Development Effort Summary
NXP presented, "ODSA Workshop: Development Effort Summary," at the ODSA Workshop. The charter of the ODSA (Open Domain Specification Architecture) Workgroup is to define an open specification that enables building of Domain Specific Accelerator silicon using best-of-breed components from the industry made available as chiplet dies that can be integrated together as Lego blocks on an organic substrate packaging layer. The resulting multi-chip module (MCM) silicon can be produced at significantly lower development and manufacturing costs, and will deliver much needed performance per watt and performance per dollar efficiencies in networking, security, machine learning and other applications. The ODSA Workgroup also intends to deliver implementations of the specification as board-level prototypes, RTL code and libraries.
Design and Testing Challenges for Chiplet Based Design: Assembly and Test View
zGlue Inc presented, "Design and Testing Challenges for Chiplet Based Design: Assembly and Test View," at the ODSA Workshop. The charter of the ODSA (Open Domain Specification Architecture) Workgroup is to define an open specification that enables building of Domain Specific Accelerator silicon using best-of-breed components from the industry made available as chiplet dies that can be integrated together as Lego blocks on an organic substrate packaging layer. The resulting multi-chip module (MCM) silicon can be produced at significantly lower development and manufacturing costs, and will deliver much needed performance per watt and performance per dollar efficiencies in networking, security, machine learning and other applications. The ODSA Workgroup also intends to deliver implementations of the specification as board-level prototypes, RTL code and libraries.
ODSA Proof of Concept SmartNIC Speeds & Feeds
The document discusses using a smart NIC as a proof-of-concept for the ODSA. A smart NIC offloads networking tasks from the CPU. It proposes using an FPGA, NIC, and CPU chiplets on an organic substrate with PCIe and Ethernet interfaces. This would provide programmable packet inspection and processing. Storage could connect via a smart NVMe. Alternative designs placing the PHY/MAC in the FPGA or using next-gen chiplets are discussed. The goal is a flexible, high-performance smart NIC prototype.
ODSA Use Case - SmartNIC
TitanIC presented, "ODSA Use Case - SmartNIC," at the ODSA Workshop. The charter of the ODSA (Open Domain Specification Architecture) Workgroup is to define an open specification that enables building of Domain Specific Accelerator silicon using best-of-breed components from the industry made available as chiplet dies that can be integrated together as Lego blocks on an organic substrate packaging layer. The resulting multi-chip module (MCM) silicon can be produced at significantly lower development and manufacturing costs, and will deliver much needed performance per watt and performance per dollar efficiencies in networking, security, machine learning and other applications. The ODSA Workgroup also intends to deliver implementations of the specification as board-level prototypes, RTL code and libraries.
More from ODSA Workgroup (20)
OODSA - BoW: Basic, Fast, Turbo Die-to Die Open Interface Solutions
OODSA - BoW: Basic, Fast, Turbo Die-to Die Open Interface Solutions
ODSA - OCP Accelerator Module and the Infrastructure
ODSA - OCP Accelerator Module and the Infrastructure
Design and Testing Challenges for Chiplet Based Design: Assembly and Test View
Design and Testing Challenges for Chiplet Based Design: Assembly and Test View
Recently uploaded
Digital Banking in the Cloud: How Citizens Bank Unlocked Their Mainframe
Inconsistent user experience and siloed data, high costs, and changing customer expectations – Citizens Bank was experiencing these challenges while it was attempting to deliver a superior digital banking experience for its clients. Its core banking applications run on the mainframe and Citizens was using legacy utilities to get the critical mainframe data to feed customer-facing channels, like call centers, web, and mobile. Ultimately, this led to higher operating costs (MIPS), delayed response times, and longer time to market.
Ever-changing customer expectations demand more modern digital experiences, and the bank needed to find a solution that could provide real-time data to its customer channels with low latency and operating costs. Join this session to learn how Citizens is leveraging Precisely to replicate mainframe data to its customer channels and deliver on their “modern digital bank” experiences.
5th LF Energy Power Grid Model Meet-up Slides
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
zkStudyClub - LatticeFold: A Lattice-based Folding Scheme and its Application...
Folding is a recent technique for building efficient recursive SNARKs. Several elegant folding protocols have been proposed, such as Nova, Supernova, Hypernova, Protostar, and others. However, all of them rely on an additively homomorphic commitment scheme based on discrete log, and are therefore not post-quantum secure. In this work we present LatticeFold, the first lattice-based folding protocol based on the Module SIS problem. This folding protocol naturally leads to an efficient recursive lattice-based SNARK and an efficient PCD scheme. LatticeFold supports folding low-degree relations, such as R1CS, as well as high-degree relations, such as CCS. The key challenge is to construct a secure folding protocol that works with the Ajtai commitment scheme. The difficulty, is ensuring that extracted witnesses are low norm through many rounds of folding. We present a novel technique using the sumcheck protocol to ensure that extracted witnesses are always low norm no matter how many rounds of folding are used. Our evaluation of the final proof system suggests that it is as performant as Hypernova, while providing post-quantum security.
Paper Link: https://eprint.iacr.org/2024/257
Skybuffer AI: Advanced Conversational and Generative AI Solution on SAP Busin...
Skybuffer AI, built on the robust SAP Business Technology Platform (SAP BTP), is the latest and most advanced version of our AI development, reaffirming our commitment to delivering top-tier AI solutions. Skybuffer AI harnesses all the innovative capabilities of the SAP BTP in the AI domain, from Conversational AI to cutting-edge Generative AI and Retrieval-Augmented Generation (RAG). It also helps SAP customers safeguard their investments into SAP Conversational AI and ensure a seamless, one-click transition to SAP Business AI.
With Skybuffer AI, various AI models can be integrated into a single communication channel such as Microsoft Teams. This integration empowers business users with insights drawn from SAP backend systems, enterprise documents, and the expansive knowledge of Generative AI. And the best part of it is that it is all managed through our intuitive no-code Action Server interface, requiring no extensive coding knowledge and making the advanced AI accessible to more users.
Presentation of the OECD Artificial Intelligence Review of Germany
Consult the full report at https://www.oecd.org/digital/oecd-artificial-intelligence-review-of-germany-609808d6-en.htm
GNSS spoofing via SDR (Criptored Talks 2024)
In the realm of cybersecurity, offensive security practices act as a critical shield. By simulating real-world attacks in a controlled environment, these techniques expose vulnerabilities before malicious actors can exploit them. This proactive approach allows manufacturers to identify and fix weaknesses, significantly enhancing system security.
This presentation delves into the development of a system designed to mimic Galileo's Open Service signal using software-defined radio (SDR) technology. We'll begin with a foundational overview of both Global Navigation Satellite Systems (GNSS) and the intricacies of digital signal processing.
The presentation culminates in a live demonstration. We'll showcase the manipulation of Galileo's Open Service pilot signal, simulating an attack on various software and hardware systems. This practical demonstration serves to highlight the potential consequences of unaddressed vulnerabilities, emphasizing the importance of offensive security practices in safeguarding critical infrastructure.
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdf
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
AWS Cloud Cost Optimization Presentation.pptx
This presentation provides valuable insights into effective cost-saving techniques on AWS. Learn how to optimize your AWS resources by rightsizing, increasing elasticity, picking the right storage class, and choosing the best pricing model. Additionally, discover essential governance mechanisms to ensure continuous cost efficiency. Whether you are new to AWS or an experienced user, this presentation provides clear and practical tips to help you reduce your cloud costs and get the most out of your budget.
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
Choosing The Best AWS Service For Your Website + API.pptx
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on integration of Salesforce with Bonterra Impact Management.
Interested in deploying an integration with Salesforce for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Fueling AI with Great Data with Airbyte Webinar
This talk will focus on how to collect data from a variety of sources, leveraging this data for RAG and other GenAI use cases, and finally charting your course to productionalization.
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-Efficiency
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
Driving Business Innovation: Latest Generative AI Advancements & Success Story
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
Building Production Ready Search Pipelines with Spark and Milvus
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
leewayhertz.com-AI in predictive maintenance Use cases technologies benefits ...
Predictive maintenance is a proactive approach that anticipates equipment failures before they happen. At the forefront of this innovative strategy is Artificial Intelligence (AI), which brings unprecedented precision and efficiency. AI in predictive maintenance is transforming industries by reducing downtime, minimizing costs, and enhancing productivity.
Programming Foundation Models with DSPy - Meetup Slides
Prompting language models is hard, while programming language models is easy. In this talk, I will discuss the state-of-the-art framework DSPy for programming foundation models with its powerful optimizers and runtime constraint system.
A Comprehensive Guide to DeFi Development Services in 2024
DeFi represents a paradigm shift in the financial industry. Instead of relying on traditional, centralized institutions like banks, DeFi leverages blockchain technology to create a decentralized network of financial services. This means that financial transactions can occur directly between parties, without intermediaries, using smart contracts on platforms like Ethereum.
In 2024, we are witnessing an explosion of new DeFi projects and protocols, each pushing the boundaries of what’s possible in finance.
In summary, DeFi in 2024 is not just a trend; it’s a revolution that democratizes finance, enhances security and transparency, and fosters continuous innovation. As we proceed through this presentation, we'll explore the various components and services of DeFi in detail, shedding light on how they are transforming the financial landscape.
At Intelisync, we specialize in providing comprehensive DeFi development services tailored to meet the unique needs of our clients. From smart contract development to dApp creation and security audits, we ensure that your DeFi project is built with innovation, security, and scalability in mind. Trust Intelisync to guide you through the intricate landscape of decentralized finance and unlock the full potential of blockchain technology.
Ready to take your DeFi project to the next level? Partner with Intelisync for expert DeFi development services today!
Generating privacy-protected synthetic data using Secludy and Milvus
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
Recently uploaded (20)
Digital Banking in the Cloud: How Citizens Bank Unlocked Their Mainframe
Digital Banking in the Cloud: How Citizens Bank Unlocked Their Mainframe
zkStudyClub - LatticeFold: A Lattice-based Folding Scheme and its Application...
zkStudyClub - LatticeFold: A Lattice-based Folding Scheme and its Application...
Skybuffer AI: Advanced Conversational and Generative AI Solution on SAP Busin...
Skybuffer AI: Advanced Conversational and Generative AI Solution on SAP Busin...
Presentation of the OECD Artificial Intelligence Review of Germany
Presentation of the OECD Artificial Intelligence Review of Germany
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdf
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdf
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
Energy Efficient Video Encoding for Cloud and Edge Computing Instances
Choosing The Best AWS Service For Your Website + API.pptx
Choosing The Best AWS Service For Your Website + API.pptx
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-Efficiency
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-Efficiency
Driving Business Innovation: Latest Generative AI Advancements & Success Story
Driving Business Innovation: Latest Generative AI Advancements & Success Story
Building Production Ready Search Pipelines with Spark and Milvus
Building Production Ready Search Pipelines with Spark and Milvus
leewayhertz.com-AI in predictive maintenance Use cases technologies benefits ...
leewayhertz.com-AI in predictive maintenance Use cases technologies benefits ...
Programming Foundation Models with DSPy - Meetup Slides
Programming Foundation Models with DSPy - Meetup Slides
Nordic Marketo Engage User Group_June 13_ 2024.pptx
Nordic Marketo Engage User Group_June 13_ 2024.pptx
A Comprehensive Guide to DeFi Development Services in 2024
A Comprehensive Guide to DeFi Development Services in 2024
Generating privacy-protected synthetic data using Secludy and Milvus
Generating privacy-protected synthetic data using Secludy and Milvus
ODSA - Power and Heat
- 1. Consume. Collaborate. Contribute.Consume. Collaborate. Contribute. Power & Heat ODSA Project Workshop March 28, 2019 Ali Husain, ON Semiconductor
- 2. Consume. Collaborate. Contribute. Topics POC 1.0 • Power Distribution • Power Conversion • Thermal Budgeting • Differential thermal expansion (reliability) FUTURE • Active Interposer • Integrate Passive Components • PMIC Chiplets
- 3. Consume. Collaborate. Contribute. Power Architecture For Intel Cores, high power input (>100A) at 1.8V On-chip regulator converts from 1.8V → 0.9V (unregulated) Digital & Analog Domains? 1.2/3.3V 1.8V 1.8V 0.9V
- 4. Consume. Collaborate. Contribute. Power Architecture – Future? • 3.3 or 5V input – local PMIC/chiplet ⎻ Use less power pins ⎻ Separate analog & digital domians ⎻ Need pins for passives ⎻ Conversion losses need to be dissipated • Active interposer ⎻ Technology ⎻ Heat Dissipation ⎻ Ground planes ⎻ Passives 5V 0.9V 1.8V1.2V PMIC 0.9V LDO 0.8V
- 5. Consume. Collaborate. Contribute. Heat • Thermal Budgeting • Temperature Sensors • Chiplet performance vs. temperature • Local Heating Effects → Power/Thermal Management Controller
- 6. Consume. Collaborate. Contribute. Chiplet Necessary Specifications • Input Voltage • Max & Typical Supply Current (workload vs. current) • Rth to interposer, case • Power limiting functionality, speed • PMBus or SVID interface?