The document proposes two out-of-the-box innovations for integrated circuit fabrication facilities to address the deficiencies of conventional facilities and meet new market demands: 1. A modular facility architecture that breaks facilities into rapidly connected processing modules to increase flexibility and reduce costs and cycle times. 2. A new business model where equipment is leased rather than purchased, suppliers provide on-site maintenance, and facilities have increased outsourcing, all to lower capital expenses and increase flexibility. A 1998 prototype on an ITRI campus demonstrated the potential of the new modular architecture to successfully provide a more agile and cost-effective approach to integrated circuit manufacturing.

1. A New Integrated Circuit Fabricator Design to meet New Market Demands Bevan Wu BW & Associates 2490 Cowper St, Palo Alto, CA 94301 USA [email_address]

2. Alternate New Fab Design

10. Deficiencies of 300mm IC Fab per ISMI

13. New IC Fab Layout

15. New IC Fab Layout with Facility Supply Systems

17. Rapid AMHS Monorail and FOUP Bus Details

19. Successful Operational Module Prototype on ITRI Campus -1998