The IGEP TM COM module is an industrial processor module featuring a DM3730 ARM Cortex A8 CPU at 1GHz with 512MB RAM and 512MB flash memory, designed for low power consumption and a temperature range of -40°C to +85°C. It supports various applications including portable data terminals, medical imaging, and audio/image processing with connectivity options like WiFi and Bluetooth. The module is compact, measuring 18mm x 69mm, and allows for easy integration into projects without the need for a baseboard.

1. IGEP™ COM MODULE
INDUSTRIAL - LONG LIFE Antenna
Temperature range -40ºC to 85ºC Micro-SD
Power management
and audio codec
USB 2.0 OTG
WiFi + Bluetooth
DM3730
Camera Interface
Pop Memory
(DDR RAM + FLASH)
overview
THE SMALLEST STAND ALONE COMPUTER
DM3730 ARM Cortex A8 CPU 1GHZ / 512 Megabytes RAM + 512 Megabytes FLASH
The IGEP™ COM MODULE is an industrial processor module. It can be used as a computer-on-module for your product
but also as a stand alone computer without the need of a baseboard. As low power consumption device, you can power
the IGEP™ COM MODULE using an USB cable and any USB port of your labtop.The IGEP™ COM MODULE provides a lot of
features in a small size. You can build your project anywhere you want.
HIGHLIGHTS advantages
• DM3730 Texas Instruments processor • Compact and powerfull core for new products
- ARM Cortex A8 1GHz • Reduce time to market
- C64+ DSP 800MHz • Low power comsumption
- 3D Accelerator SGX530 @ 200 MHz • Industrial Tempurature Range (-40 to +85 ºC)
- Camera ISP • Extended life range
• 512 Megabytes RAM / 512 Megabytes FLASH • Expansion boards available
• Wifi 802.11 b/g • FREE reference design
• Bluetooth BC4 - Class 2.0 • OPEN SOURCE software
• 1 x USB • IGEP Community
• MicroSD card reader
• 2 x expansion 70-pin connector
• Very small form factor (18mm x 69mm)
APPLICATIONS
• Portable data terminals • Medical imaging • Test and Measurement
• Navigation • Home automation • Single board computers
• Auto Infotainment • Human Interface • Audio and image processing
• Gaming • Industrial Control

2. IGEP™ COM MODULE
Block diagram
USB mini-AB POWER
LED
USB PHY PWM
PMIC TPS65950 GPIO
USB3326 MADC
AUDIO
USB HOST USB OTG Display Controller
I2C
micro-SD
MMC/SDIO PowerVR SGX Graphics
ARM Cortex-A8 Core
Accelerator
J1, J4 connectors
MCBSP
J1, J4 connectors
SPI
LED DM3730
GPIO
PWM
Memory: 512 MB IVA 2.2 video subsystem
UART Flash: 512 MB TMS320DM64x+ DSP
IrDA/CIR
Camera ISP General Purpose Memory Controller (GPMC)
WIFI 802.11b/g Bluetooth
J5
connector
Processor On-board connectors
and devices
Feature Specifications
Feature Specifications
ARM CPU Texas Instruments DM3730 (1GHz)
ARM Cortex A8 Connectors 1 x USB 2.0 OTG interface + USB mini-AB connector
NEON SIMD Coprocessor 1 x MICRO-SD socket
DMA, Interrupt controllers, Timers 2 x EXPANSION 70-pin connector (J1, J4)
DSP CPU IVA 2.2 Subsystem TMS320C64+ DSP 1 x 27 pin Hirose FH26 connector for camera
core running at rate up to 520MHz. interface (J5)
(optional) 1 x Hirose U.FL connector for
2D/3D graphics Power VR SGX GPU providing 2D/3D external antenna
acceleration graphics acceleration with OpenGL ES (optional) 1 x Keyboard (3x3) connector
1.0, OpenGL ES 2.0 and OpenVG support
Devices 1 x USB 2.0 HOST (connector not included)
Video Supporting H.264, H.263, MPEG-4, 2 x Double LED indicator
acceleration MPEG-2, JPEG, WMV9 and additional
codecs
Camera Interface Camera ISP processing capability to
connect RAW image sensor modules Power
Feature Specifications
Power from expansion Supply Voltage from 3.5 V to 4.2 V DC
connectors ±10%
Power from USB 5V DC through USB 2.0 OTG
OTG Connector (only for standalone operation)
Top side memory and Storage
Feature Specifications
RAM Memory 512 Megabytes Mobile DDR, 200 MHz,32-bit
1 cm
Storage 512 MB NAND flash On board micro-SD socket
02/12
Scale image 100% - Bottom side
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