Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
The Art of the Pitch: WordPress Relationships and SalesLaura Byrne
Clients don’t know what they don’t know. What web solutions are right for them? How does WordPress come into the picture? How do you make sure you understand scope and timeline? What do you do if sometime changes?
All these questions and more will be explored as we talk about matching clients’ needs with what your agency offers without pulling teeth or pulling your hair out. Practical tips, and strategies for successful relationship building that leads to closing the deal.
Let's dive deeper into the world of ODC! Ricardo Alves (OutSystems) will join us to tell all about the new Data Fabric. After that, Sezen de Bruijn (OutSystems) will get into the details on how to best design a sturdy architecture within ODC.
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
GDG Cloud Southlake #33: Boule & Rebala: Effective AppSec in SDLC using Deplo...James Anderson
Effective Application Security in Software Delivery lifecycle using Deployment Firewall and DBOM
The modern software delivery process (or the CI/CD process) includes many tools, distributed teams, open-source code, and cloud platforms. Constant focus on speed to release software to market, along with the traditional slow and manual security checks has caused gaps in continuous security as an important piece in the software supply chain. Today organizations feel more susceptible to external and internal cyber threats due to the vast attack surface in their applications supply chain and the lack of end-to-end governance and risk management.
The software team must secure its software delivery process to avoid vulnerability and security breaches. This needs to be achieved with existing tool chains and without extensive rework of the delivery processes. This talk will present strategies and techniques for providing visibility into the true risk of the existing vulnerabilities, preventing the introduction of security issues in the software, resolving vulnerabilities in production environments quickly, and capturing the deployment bill of materials (DBOM).
Speakers:
Bob Boule
Robert Boule is a technology enthusiast with PASSION for technology and making things work along with a knack for helping others understand how things work. He comes with around 20 years of solution engineering experience in application security, software continuous delivery, and SaaS platforms. He is known for his dynamic presentations in CI/CD and application security integrated in software delivery lifecycle.
Gopinath Rebala
Gopinath Rebala is the CTO of OpsMx, where he has overall responsibility for the machine learning and data processing architectures for Secure Software Delivery. Gopi also has a strong connection with our customers, leading design and architecture for strategic implementations. Gopi is a frequent speaker and well-known leader in continuous delivery and integrating security into software delivery.
UiPath Test Automation using UiPath Test Suite series, part 3DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 3. In this session, we will cover desktop automation along with UI automation.
Topics covered:
UI automation Introduction,
UI automation Sample
Desktop automation flow
Pradeep Chinnala, Senior Consultant Automation Developer @WonderBotz and UiPath MVP
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
Accelerate your Kubernetes clusters with Varnish CachingThijs Feryn
A presentation about the usage and availability of Varnish on Kubernetes. This talk explores the capabilities of Varnish caching and shows how to use the Varnish Helm chart to deploy it to Kubernetes.
This presentation was delivered at K8SUG Singapore. See https://feryn.eu/presentations/accelerate-your-kubernetes-clusters-with-varnish-caching-k8sug-singapore-28-2024 for more details.
Essentials of Automations: Optimizing FME Workflows with ParametersSafe Software
Are you looking to streamline your workflows and boost your projects’ efficiency? Do you find yourself searching for ways to add flexibility and control over your FME workflows? If so, you’re in the right place.
Join us for an insightful dive into the world of FME parameters, a critical element in optimizing workflow efficiency. This webinar marks the beginning of our three-part “Essentials of Automation” series. This first webinar is designed to equip you with the knowledge and skills to utilize parameters effectively: enhancing the flexibility, maintainability, and user control of your FME projects.
Here’s what you’ll gain:
- Essentials of FME Parameters: Understand the pivotal role of parameters, including Reader/Writer, Transformer, User, and FME Flow categories. Discover how they are the key to unlocking automation and optimization within your workflows.
- Practical Applications in FME Form: Delve into key user parameter types including choice, connections, and file URLs. Allow users to control how a workflow runs, making your workflows more reusable. Learn to import values and deliver the best user experience for your workflows while enhancing accuracy.
- Optimization Strategies in FME Flow: Explore the creation and strategic deployment of parameters in FME Flow, including the use of deployment and geometry parameters, to maximize workflow efficiency.
- Pro Tips for Success: Gain insights on parameterizing connections and leveraging new features like Conditional Visibility for clarity and simplicity.
We’ll wrap up with a glimpse into future webinars, followed by a Q&A session to address your specific questions surrounding this topic.
Don’t miss this opportunity to elevate your FME expertise and drive your projects to new heights of efficiency.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
Software Delivery At the Speed of AI: Inflectra Invests In AI-Powered QualityInflectra
In this insightful webinar, Inflectra explores how artificial intelligence (AI) is transforming software development and testing. Discover how AI-powered tools are revolutionizing every stage of the software development lifecycle (SDLC), from design and prototyping to testing, deployment, and monitoring.
Learn about:
• The Future of Testing: How AI is shifting testing towards verification, analysis, and higher-level skills, while reducing repetitive tasks.
• Test Automation: How AI-powered test case generation, optimization, and self-healing tests are making testing more efficient and effective.
• Visual Testing: Explore the emerging capabilities of AI in visual testing and how it's set to revolutionize UI verification.
• Inflectra's AI Solutions: See demonstrations of Inflectra's cutting-edge AI tools like the ChatGPT plugin and Azure Open AI platform, designed to streamline your testing process.
Whether you're a developer, tester, or QA professional, this webinar will give you valuable insights into how AI is shaping the future of software delivery.
1. e : info@htr-india.com
www.htr-india.com
Rev Date : 11/10/2019
• Open frame electron beam
welded punched out type.
•Power Rating at 100°C - upto 7W
•Power Rating at 70°C - upto 12W
R0002 to R005
LOW OHM POWER
RESISTORS
HBE
SERIES
Size 2726
1/4
AEC-Q200Qualified
2. PHYSICAL CONFIGURATION
DIMENSIONAL TABLE
LOW OHM
POWER
RESISTORS
HBESERIES
Size 2726
e : info@htr-india.com
www.htr-india.com
APPLICATIONS
• Current sensor for power hybrid applications.
• Automotive applications that require high current capability.
• Frequency convertors.
• Power modules.
FEATURES
• 5W constant power possible in R0005.
• 4 terminal connections for exceptionally accurate measurement.
• Excellent long term stability due to nature of construction.
Rev Date : 11/10/2019
ELECTRICAL AND ENVIRONMENTAL CHARACTERISTICS
PARAMETER / PERFORMANCE TEST & TEST METHOD PERFORMANCE REQUIREMENTS
Power Rating For FeCrAl - Full power dissipation at 70° C and linearly derated to
zero at +170° C.
For Manganin (< 0.5% Improved Stability) -
Full power dissipation at 100° C & linearly derated to zero at +140° C.
For Manganin (< 1% Stability) - Full power dissipation at 130° C and
linearly derated to zero at +170° C.
Inductance < 3nH
ResistanceTolerance ± 1% (0.5% and other tolerance available on request)
Temperature Range - 55° C to +170° C (Suitably derated as per derating curve provided)
Voltage Rating / Limiting / Max.WorkingVoltage P x R
(Subject to max.TerminalTemperature of 120° C)
LowTemperature Storage and Operation [-65° C for 24 h] ∆R ± 0.1% - Average
Temperature Coefficient of Resistance From 20 ppm / K (Depending on Resistance Value)
(AmbientTemperature Range 20° C - 60° C)
Temperature Cycling -2000 cycles (-55° C to 150° C) ∆R ± 0.5% - Average
LifeTest / Operational Life - 2000 h rated power with ∆R ± 1% - Average (In covered condition)
Temperature limitation onTerminal kept at 120° C
Moisture Resistance [MIL-STD-202 method108] ∆R ± 0.1% - Average
Mechanical Shock [100 g. 6 ms half sine] ∆R ± 0.2% -Typical
Vibration, High Frequency [20 g. 10-2000 Hz] ∆R ± 0.2% -Typical
Bias Humidity [+85° C, 85% RH, 1000h] ∆R ± 0.5% -Typical
2/4
Sr HI-TECH PART WATTAGE WATTAGE D1 (mm) INTERNAL HEAT TCR Typicalwt.
No. NAME AT 100° C AT 70° C RESISTANCE (Rthi) (PPM) PER PC (Gms)
1 HBE7W R0007 F 7W 12W 0.47± 0.10 10° K/W <50 0.47
2 HBE5W R0002 F 5W 12W 1.30± 0.10 4° K/W <20 0.73
3 HBE5W R0003 F 5W 12W 0.99± 0.10 5° K/W <50 0.65
4 HBE5W R0005 F 5W 9W 0.65± 0.10 8° K/W <20 0.45
5 HBE5W R001 F 5W 7W 0.35± 0.10 15° K/W <50 0.30
6 HBE4W R002 F 4W 7W 0.50± 0.10 14° K/W <50 0.50
7 HBE3W R003 F 3W 5W 0.34± 0.10 21° K/W <50 0.31
8 HBE2W R004 F 2W 4W 0.34± 0.10 28° K/W <50 0.30
9 HBE2W R005 F 2W 3W 0.34± 0.10 33° K/W <50 0.28
1.60±0.5(2X)
1.00
0.70
1.00
0.70
2.20±0.5(2X)
4.90
Trimming Area0.2 mΩ to 4 mΩ 5 mΩ
3. RECOMMENDED PCB - LAYOUT
PACKING
A. BULK
Resistors shall be packed in plastic Box-K44 of approximate size 162X104X37mm- 1500pcs/box
& this box will be vacuum sealed with polythene of 100 micron. With enclose silica gel.
B. TAPE & REEL PACKING
Storage Condition (Packed) : Temp 25°C to 35°C, Humidity 30 to 80% RH, Shelf life-12 months.
Floor Life (Unpacked) : Temp 25°C to 35°C, Humidity 30 to 80% RH, Floor life-15 days.
SPECIFICATION TAPEWIDTH PARTS PER REEL
EIA-481-D 16mm 1500 pcs
www.htr-india.com
LOW OHM
POWER
RESISTORS
HBESERIES
Size 2726
Rev Date : 11/10/2019
I2I1
solder pods
5.6
7.3
0.8 0.8
0.8
7.8
0.9
U U1 2
2
RECOMMENDED SOLDER PROFILE
Reflow, IR soldering
Temperature (°C) 260 255 217
Time (Sec) Peak 40 90
ordering information
SERIES TYPE PACKING RESISTANCE VALUE TOLERANCE
HBE HBE5W R001 1%
e : info@htr-india.com
3/4
MARKING
HTR PART NO PRINTING
HBE7W ROOO7 F HTR
ROOO7
1% DATECODE
Part no of HBE5W, Tape and reel with resistance value R001 and 1% tolerance, HTR part no. will be HBE5WTR R001 ±1%
Bulk - HBE5W
Tape & Reel - HBE5WTR
4. www.htr-india.com
LOW OHM
POWER
RESISTORS
HBESERIES
Size 2726
Rev Date : 11/10/2019
e : info@htr-india.com
TYPICAL POWER DERATING CURVE FOR
RESISTOR WHEn full power is at 100oC & 130oC
TYPICAL POWER DERATING CURVE FOR
RESISTOR WHEn full power is at 70oC
In this graph the max. & min. curve are shown as and for all resistance values, the area between the max. & min. curve is applicable.
In case the Design Engineer requires a specific graph of a particular component it can be supplied on request.
Typical Temperature dependance of the electrical resistance
MAXIMUM PULSE ENERGY WITH RESPECT TO PULSE POWER FOR PERMANANT OPERATION
In case the Design Engineer requires a specific graph of a particular component it can be supplied on request.
•••
-40
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-20 0 20 40 60 80 100 120
Temperature [°C]
dR/R20 [%]
Limiting Curve
Typical temperature dependence of a HBE resistor
140
1
0.75
0,5
0.25
0
0 20 40 60 80 100 120 140 160 180
1.25
Terminal Temperature [°C]Stability <1.0% (in covered condition)
Stability <0.5%
P [W]/PNom
Stability <1.0% (in covered condition)
1
0.75
0,5
0.25
0
0 20 40 60 8070 100 120 140 160 180
1.25
Terminal Temperature [°C]
P [W]/PNom
10000
1000
100
10
1
1
10000 1000
10 100
0.0001
0.001
0.01
0.1
1
10
100
0.1
0.1
0.01
0.01
Pulse width [sec]
Pulseenergy[J]
Power[W]
4/4
![PHYSICAL CONFIGURATION
DIMENSIONAL TABLE
LOW OHM
POWER
RESISTORS
HBESERIES
Size 2726
e : info@htr-india.com
www.htr-india.com
APPLICATIONS
• Current sensor for power hybrid applications.
• Automotive applications that require high current capability.
• Frequency convertors.
• Power modules.
FEATURES
• 5W constant power possible in R0005.
• 4 terminal connections for exceptionally accurate measurement.
• Excellent long term stability due to nature of construction.
Rev Date : 11/10/2019
ELECTRICAL AND ENVIRONMENTAL CHARACTERISTICS
PARAMETER / PERFORMANCE TEST & TEST METHOD PERFORMANCE REQUIREMENTS
Power Rating For FeCrAl - Full power dissipation at 70° C and linearly derated to
zero at +170° C.
For Manganin (< 0.5% Improved Stability) -
Full power dissipation at 100° C & linearly derated to zero at +140° C.
For Manganin (< 1% Stability) - Full power dissipation at 130° C and
linearly derated to zero at +170° C.
Inductance < 3nH
ResistanceTolerance ± 1% (0.5% and other tolerance available on request)
Temperature Range - 55° C to +170° C (Suitably derated as per derating curve provided)
Voltage Rating / Limiting / Max.WorkingVoltage P x R
(Subject to max.TerminalTemperature of 120° C)
LowTemperature Storage and Operation [-65° C for 24 h] ∆R ± 0.1% - Average
Temperature Coefficient of Resistance From 20 ppm / K (Depending on Resistance Value)
(AmbientTemperature Range 20° C - 60° C)
Temperature Cycling -2000 cycles (-55° C to 150° C) ∆R ± 0.5% - Average
LifeTest / Operational Life - 2000 h rated power with ∆R ± 1% - Average (In covered condition)
Temperature limitation onTerminal kept at 120° C
Moisture Resistance [MIL-STD-202 method108] ∆R ± 0.1% - Average
Mechanical Shock [100 g. 6 ms half sine] ∆R ± 0.2% -Typical
Vibration, High Frequency [20 g. 10-2000 Hz] ∆R ± 0.2% -Typical
Bias Humidity [+85° C, 85% RH, 1000h] ∆R ± 0.5% -Typical
2/4
Sr HI-TECH PART WATTAGE WATTAGE D1 (mm) INTERNAL HEAT TCR Typicalwt.
No. NAME AT 100° C AT 70° C RESISTANCE (Rthi) (PPM) PER PC (Gms)
1 HBE7W R0007 F 7W 12W 0.47± 0.10 10° K/W <50 0.47
2 HBE5W R0002 F 5W 12W 1.30± 0.10 4° K/W <20 0.73
3 HBE5W R0003 F 5W 12W 0.99± 0.10 5° K/W <50 0.65
4 HBE5W R0005 F 5W 9W 0.65± 0.10 8° K/W <20 0.45
5 HBE5W R001 F 5W 7W 0.35± 0.10 15° K/W <50 0.30
6 HBE4W R002 F 4W 7W 0.50± 0.10 14° K/W <50 0.50
7 HBE3W R003 F 3W 5W 0.34± 0.10 21° K/W <50 0.31
8 HBE2W R004 F 2W 4W 0.34± 0.10 28° K/W <50 0.30
9 HBE2W R005 F 2W 3W 0.34± 0.10 33° K/W <50 0.28
1.60±0.5(2X)
1.00
0.70
1.00
0.70
2.20±0.5(2X)
4.90
Trimming Area0.2 mΩ to 4 mΩ 5 mΩ](data:image/gif;base64,R0lGODlhAQABAIAAAAAAAP///yH5BAEAAAAALAAAAAABAAEAAAIBRAA7)