This document provides specifications for HOS series low ohm power resistors including:
- Physical dimensions and construction details for different models ranging from 2W to 5W ratings.
- Electrical characteristics including tolerance, temperature coefficient, and environmental test results.
- Mounting and derating guidelines including temperature rise curves for different resistance values.
- Packaging and storage requirements for bulk and reel packaging configurations.
JMeter webinar - integration with InfluxDB and GrafanaRTTS
Watch this recorded webinar about real-time monitoring of application performance. See how to integrate Apache JMeter, the open-source leader in performance testing, with InfluxDB, the open-source time-series database, and Grafana, the open-source analytics and visualization application.
In this webinar, we will review the benefits of leveraging InfluxDB and Grafana when executing load tests and demonstrate how these tools are used to visualize performance metrics.
Length: 30 minutes
Session Overview
-------------------------------------------
During this webinar, we will cover the following topics while demonstrating the integrations of JMeter, InfluxDB and Grafana:
- What out-of-the-box solutions are available for real-time monitoring JMeter tests?
- What are the benefits of integrating InfluxDB and Grafana into the load testing stack?
- Which features are provided by Grafana?
- Demonstration of InfluxDB and Grafana using a practice web application
To view the webinar recording, go to:
https://www.rttsweb.com/jmeter-integration-webinar
Search and Society: Reimagining Information Access for Radical FuturesBhaskar Mitra
The field of Information retrieval (IR) is currently undergoing a transformative shift, at least partly due to the emerging applications of generative AI to information access. In this talk, we will deliberate on the sociotechnical implications of generative AI for information access. We will argue that there is both a critical necessity and an exciting opportunity for the IR community to re-center our research agendas on societal needs while dismantling the artificial separation between the work on fairness, accountability, transparency, and ethics in IR and the rest of IR research. Instead of adopting a reactionary strategy of trying to mitigate potential social harms from emerging technologies, the community should aim to proactively set the research agenda for the kinds of systems we should build inspired by diverse explicitly stated sociotechnical imaginaries. The sociotechnical imaginaries that underpin the design and development of information access technologies needs to be explicitly articulated, and we need to develop theories of change in context of these diverse perspectives. Our guiding future imaginaries must be informed by other academic fields, such as democratic theory and critical theory, and should be co-developed with social science scholars, legal scholars, civil rights and social justice activists, and artists, among others.
UiPath Test Automation using UiPath Test Suite series, part 4DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 4. In this session, we will cover Test Manager overview along with SAP heatmap.
The UiPath Test Manager overview with SAP heatmap webinar offers a concise yet comprehensive exploration of the role of a Test Manager within SAP environments, coupled with the utilization of heatmaps for effective testing strategies.
Participants will gain insights into the responsibilities, challenges, and best practices associated with test management in SAP projects. Additionally, the webinar delves into the significance of heatmaps as a visual aid for identifying testing priorities, areas of risk, and resource allocation within SAP landscapes. Through this session, attendees can expect to enhance their understanding of test management principles while learning practical approaches to optimize testing processes in SAP environments using heatmap visualization techniques
What will you get from this session?
1. Insights into SAP testing best practices
2. Heatmap utilization for testing
3. Optimization of testing processes
4. Demo
Topics covered:
Execution from the test manager
Orchestrator execution result
Defect reporting
SAP heatmap example with demo
Speaker:
Deepak Rai, Automation Practice Lead, Boundaryless Group and UiPath MVP
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Transcript: Selling digital books in 2024: Insights from industry leaders - T...BookNet Canada
The publishing industry has been selling digital audiobooks and ebooks for over a decade and has found its groove. What’s changed? What has stayed the same? Where do we go from here? Join a group of leading sales peers from across the industry for a conversation about the lessons learned since the popularization of digital books, best practices, digital book supply chain management, and more.
Link to video recording: https://bnctechforum.ca/sessions/selling-digital-books-in-2024-insights-from-industry-leaders/
Presented by BookNet Canada on May 28, 2024, with support from the Department of Canadian Heritage.
Dev Dives: Train smarter, not harder – active learning and UiPath LLMs for do...UiPathCommunity
💥 Speed, accuracy, and scaling – discover the superpowers of GenAI in action with UiPath Document Understanding and Communications Mining™:
See how to accelerate model training and optimize model performance with active learning
Learn about the latest enhancements to out-of-the-box document processing – with little to no training required
Get an exclusive demo of the new family of UiPath LLMs – GenAI models specialized for processing different types of documents and messages
This is a hands-on session specifically designed for automation developers and AI enthusiasts seeking to enhance their knowledge in leveraging the latest intelligent document processing capabilities offered by UiPath.
Speakers:
👨🏫 Andras Palfi, Senior Product Manager, UiPath
👩🏫 Lenka Dulovicova, Product Program Manager, UiPath
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
Join us to learn more about this new, human-in-the-loop capability, brought to you by Integration Service connectors.
And...
Speakers:
Akshay Agnihotri, Product Manager
Charlie Greenberg, Host
Neuro-symbolic is not enough, we need neuro-*semantic*Frank van Harmelen
Neuro-symbolic (NeSy) AI is on the rise. However, simply machine learning on just any symbolic structure is not sufficient to really harvest the gains of NeSy. These will only be gained when the symbolic structures have an actual semantics. I give an operational definition of semantics as “predictable inference”.
All of this illustrated with link prediction over knowledge graphs, but the argument is general.
PHP Frameworks: I want to break free (IPC Berlin 2024)Ralf Eggert
In this presentation, we examine the challenges and limitations of relying too heavily on PHP frameworks in web development. We discuss the history of PHP and its frameworks to understand how this dependence has evolved. The focus will be on providing concrete tips and strategies to reduce reliance on these frameworks, based on real-world examples and practical considerations. The goal is to equip developers with the skills and knowledge to create more flexible and future-proof web applications. We'll explore the importance of maintaining autonomy in a rapidly changing tech landscape and how to make informed decisions in PHP development.
This talk is aimed at encouraging a more independent approach to using PHP frameworks, moving towards a more flexible and future-proof approach to PHP development.
Let's dive deeper into the world of ODC! Ricardo Alves (OutSystems) will join us to tell all about the new Data Fabric. After that, Sezen de Bruijn (OutSystems) will get into the details on how to best design a sturdy architecture within ODC.
GraphRAG is All You need? LLM & Knowledge GraphGuy Korland
Guy Korland, CEO and Co-founder of FalkorDB, will review two articles on the integration of language models with knowledge graphs.
1. Unifying Large Language Models and Knowledge Graphs: A Roadmap.
https://arxiv.org/abs/2306.08302
2. Microsoft Research's GraphRAG paper and a review paper on various uses of knowledge graphs:
https://www.microsoft.com/en-us/research/blog/graphrag-unlocking-llm-discovery-on-narrative-private-data/
State of ICS and IoT Cyber Threat Landscape Report 2024 previewPrayukth K V
The IoT and OT threat landscape report has been prepared by the Threat Research Team at Sectrio using data from Sectrio, cyber threat intelligence farming facilities spread across over 85 cities around the world. In addition, Sectrio also runs AI-based advanced threat and payload engagement facilities that serve as sinks to attract and engage sophisticated threat actors, and newer malware including new variants and latent threats that are at an earlier stage of development.
The latest edition of the OT/ICS and IoT security Threat Landscape Report 2024 also covers:
State of global ICS asset and network exposure
Sectoral targets and attacks as well as the cost of ransom
Global APT activity, AI usage, actor and tactic profiles, and implications
Rise in volumes of AI-powered cyberattacks
Major cyber events in 2024
Malware and malicious payload trends
Cyberattack types and targets
Vulnerability exploit attempts on CVEs
Attacks on counties – USA
Expansion of bot farms – how, where, and why
In-depth analysis of the cyber threat landscape across North America, South America, Europe, APAC, and the Middle East
Why are attacks on smart factories rising?
Cyber risk predictions
Axis of attacks – Europe
Systemic attacks in the Middle East
Download the full report from here:
https://sectrio.com/resources/ot-threat-landscape-reports/sectrio-releases-ot-ics-and-iot-security-threat-landscape-report-2024/
1. • Open frame strip type.
• 2W to 5W.
• R001 to R05.
LOW OHM
POWER RESISTORS
HOS
SERIES
Size 4512
e : info@htr-india.com
www.htr-india.com
Rev Date : 24/11/2020
AEC-Q200Qualified
3. LOW OHM
POWER
RESISTORS
HOS
Size 4512
e : info@htr-india.com
www.htr-india.com
Rev Date : 24/11/2020
Note :
Temperature rise data
are given here for typical
mounting conditions. Ac-
tual figures depend on PCB
copper weight, mounting
pad size, track width and
substrate type. Also, the
open air format responds
better to forced air cooling
than chip format resistors.
For values below 5 mil-
liohms allowance should
be made for heat generated
in the copper tracks them-
selves. Application-specific
guidance is available on re-
quest from our application
laboratory.
Hot Spot Temperature Rise
Mounting data : 7.6mm X 7.6mm pads, 2 oz copper on FR4, still air
25%
0
50
100
150
200
250
300
50% 75% 100%
TemperatureRise(K)
Percentage of Rated Power
Resistance Value
in milliohms
HOS 2W / 3W & 5W
50 / 25
30 /15
10 / 5
5 / -
Solder Joint Temperature Rise
Mounting data : 7.6mm X 7.6mm pads, 2 oz copper on FR4, still air
25%
0
20
40
60
80
100
50% 75% 100%
TemperatureRise(K)
Percentage of Rated Power
Resistance Value
in milliohms
HOS 2W / 3W & 5W
5 / -
10 / 5
30 / 15
50 / 25
0
20
40
60
80
100
50 100 150 200 250
RatedDissipation(%)
Ambient Temperature (ºC)
Temperature Derating
Resistance Value in milliohms
Pulse Energy Rating
NOTE : This graph relates to single pulses of short duration (≤ 100ms).
Higher energy limits apply for longer pulses and overloads.
HOS 2W / HOS 3W HOS 5W
0
1
20
40
60
80
100
120
10 100
Energy(J)
4. e : info@htr-india.com
www.htr-india.com
ELECTRICAL AND ENVIRONMENTAL CHARACTERISTICS
Power Rating (Rated Ambient Temperature ) Full power dissipation at 70° C and linearly
de-rated to zero at + 225° C
Insulation Not Insulated
Resistance Tolerance ± 5% (Available up to ± 1%)
Inductance < 10 nH
Operating Temperature Range - 55° C to +160° C
Voltage Rating / Limiting Voltage / Max. Working Voltage P x R
subject to max. terminal temperature + 120° C
For – HOS2W & HOS3W
240ppm – For Resistance value < R004.
40ppm – For Resistance value R004 to R015
40ppm – For Resistance value > R015.
Temperature Co-efficient of Resistance For – HOS5W
[Measured from 0°C to +125°C] 240ppm – For Resistance value < R002.
40ppm – For Resistance value R002 to R007.
40ppm – For Resistance value > R007.
Thermal Shock ∆R ± [ 0.75 ] – Average
For – HOS2W HOS3W
∆R ± [ 1.0 % ] – For Resistance value R004.
∆R ± [ 1.0 % ] – For Resistance value R004 to R015.
Temperature Cycling ∆R ± [ 0.75 % ] – For Resistance value R015.
[Room temperature -55°C Room temperature 125°C For – HOS5W
Room temperature for 5 cycles] ∆R ± [ 1.0 % ] – For Resistance value R002.
∆R ± [ 1.0 % ] – For Resistance value R002 to R007.
∆R ± [ 0.75 % ] – For Resistance value R007.
For – HOS2W HOS3W
∆R ± [ 1.75 % ] – For Resistance value R004.
∆R ± [ 0.5 % ] – For Resistance value R004 to R015.
∆R ± [ 1.0 % ] – For Resistance value R015.
High Temp. Exposure ( 125°C- For 2 Hrs.) For – HOS5W
∆R ± [ 1.75 % ] – For Resistance value R002.
∆R ± [ 0.5 % ] – For Resistance value R002 to R007.
∆R ± [ 1.0 % ] – For Resistance value R007.
Damp Heat ( Steady State ) ∆R ± [ 0.5 % ] – Average
( 40°C at 93 % R.H. for 1000 Hrs. – no load applied )
For – HOS2W HOS3W
∆R ± [ 2.0 % ] – For Resistance value R004.
∆R ± [ 1.0 % ] – For Resistance value R004 to R015.
Endurance – Load Life ∆R ± [ 1.0 % ] – For Resistance value R015.
[ 70°C with limiting voltage – For – HOS5W
with temperature limitation on terminal kept at 120°C ∆R ± [ 2.0 % ] – For Resistance value R002.
1.5 hours on / 0.5 hours off for 1000 hours] ∆R ± [ 1.0 % ] – For Resistance value R002 to R007.
∆R ± [ 1.0 % ] – For Resistance value R007.
Bias Humidity [+85° C, 85% RH, 1000h] ∆R ± 0.5% -Typical
Mechanical Shock [100 g. 6 ms half sine] ∆R ± 0.5% -Typical
Vibration, High Frequency [20 g. 10-2000 Hz] ∆R ± 0.5% -Typical
LowTemperature Storage and Operation [-65° C for 24 h] ∆R ± 0.2% -Typical
Moisture Resistance [MIL-STD-202 method106] ∆R ± 0.2% -Typical
PARAMETER / PERFORMANCE TEST TEST METHOD PERFORMANCE REQUIREMENTS
HOT SPOT TEMPERATURE RISE (IN STILL AIR) -
From 180 °C to 280 °C at 100% power depending on the resistance value, pad and PCB thickness. Due to the nature of it’s construc-
tion, the HOS resistor keeps the hot spot from a thermal point of view from the solder joints and reduces the possibility of transfer
of high temperature on to the PCB in contrast to the flat chip format.
SOLDER JOINT TEMPERATURE RISE (IN STILL AIR) -
From 60 °C to 85 °C at 100% power depending upon resistance value, pad and PCB thickness.
CONSTRUCTION :
The copper terminals are electron beam welded to the requisite alloy strip and then formed. Value variations are possible by varia-
tions of width without traditional abrasion / notch trimming.
Rev Date : 24/11/2020
LOW OHM
POWER
RESISTORS
HOS
Size 4512
5. www.htr-india.com
e : info@htr-india.com
PACKAGING
A. BULK
1000 resistors are packed in sealed plastic packets with silica gel pouch and place in small cardboard carton (Type ‘I’ box) approx size
70 x 70 x 70 mm and 4 such boxes can be packed in Type ‘A’ box approx size 200 x 150 x 70mm. 36 boxes (36000 pieces) of Type ‘’I’ or 6
boxes (24000 pieces) of Type‘A’can be packed in master carton of approx size 320 x 245 x 245mm.
B. TAPE REEL PACKING
Storage Condition (Packed) : Temp 25°C to 35°C, Humidity 30 to 80% RH, Shelf life-12 months
Floor Life (Unpacked) : Temp 25°C to 35°C, Humidity 30 to 80% RH, Floor life-15 days
+_
DIMENSIONAL TABLE
Sr No. HTR TYPE A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm) H(mm) PCS/Reel
1 HOS2W HOS3W ≥ R003 4.32±0.1 11.7±0.1 24±0.3 11.5±0.1 1.75±0.1 8.0±0.1 4.0±0.1 4.5±0.1 2000 pcs.
2 HOS2W HOS3W R002 4.32±0.1 12.1±0.1 24±0.3 11.5±0.1 1.75±0.1 8.0±0.1 4.0±0.1 4.5±0.1 1750 pcs.
3 HOS5W R001 to R025 7.21±0.1 12.1±0.1 24±0.3 11.5±0.1 1.75±0.1 12.0±0.1 4.0±0.1 4.5±0.1 1250 pcs.
Rev Date : 24/11/2020
RECOMMENDED SOLDER PROFILE
Reflow, IR - and wave soldering
Temperature (°C) 260 255 217
Time (Sec) Peak 40 90
LOW OHM
POWER
RESISTORS
HOS
Size 4512
MECHANICAL SPECIFICATIONS
Resistance to Soldering heat - (350° C for 30 Secs) ∆ R ± [ 0.2 % ] – Typical
Solderabillity (Meets J-STD-002 Method B) Must meet the requirements laid down
Solvent Resistance (Meets MIL-STD-002 Method 215) Must meet the requirements laid down
PARAMETER / PERFORMANCE TEST TEST METHOD PERFORMANCE REQUIREMENTS
