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[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],About Mentor Graphics®
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],About the Mechanical Analysis Division (formerly Flomerics)
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Who are Mentor Graphics – Mechanical Analysis Division?
R&D Centers Mechanical Analysis Group Dedicated Global Sales & Support
Customer Satisfaction ,[object Object],[object Object],Strongly recommend 60% Recommend 38% Not recommend 2%
[object Object],[object Object],[object Object],[object Object],Our Mission
Customers: ~7,500 users at ~2,500 sites
Typical Applications FloEFD & FloTHERM
Ingersoll Rand Energy Systems Improves Microturbine Using FloEFD ,[object Object],With EFD software, we were able to evaluate 15 different alternatives very quickly and without cutting any metal.  The new design improves assembly and serviceability by reducing installation time from 1 hour to 10 minutes.  This was put into production only months after starting the evaluations. Toni Stamenov, Design Engineer, Ingersoll Rand Energy Systems
FloTHERM Thermal Design of Electronics Equipment ,[object Object]
Bronswerk Heat Transfer BV Develop Groundbreaking Air-Cooled Coolers and Innovative Fans with Massive Environmental Impact ,[object Object],“ FloEFD is a natural extension of traditional CFD that is easier to use and more intuitive for Mechanical Engineers.  The information generated with FloEFD is far beyond data obtainable through experimentation and or measurement.  We would not have been able to solve this challenge without FloEFD” Guus Bertels, Senior Engineer, Bronswerk Heat Transfer BV
The only way a company like Linn can prosper in a cut-throat marketplace is through a faster design process which delivers products that are demonstrably superior. FloTHERM   helps us achieve this goal Martin Dalgleish Head of Commercial Affairs, Linn ‘‘ ’’ Linn  is an independent precision engineering company specialising in high-quality sound reproduction. Their entertainment systems can be found throughout the world in royal residences, luxury homes and in Aston Martin motorcars. Linn are the leading supplier of multi-zone entertainment systems to the Superyacht industry, where Linn systems have been proven in the harsh maritime environment for over a decade. Linn use FloTHERM software in the design of their power amplifiers, where rapid and efficient dissipation of heat is an essential factor in the ultimate performance of the system. FloTHERM enables their mechanical engineers to optimize the performance of critical heatsink designs to ensure that Linn’s products are compact and reliable.
Saipem UK Uses FloEFD for Naval Architecture Analysis ,[object Object],“ We have been using traditional Computational Fluid Dynamics (CFD) software to analyze our Autodesk Inventor solid models for the last couple of years. But we found the analysis process too time consuming because our software was unable to meet the rigorous demands of our development timescale. FloEFD on the other hand matches our needs for shortened design time and ease-of-use” Dr. Zafer Ayaz, Naval Architect, Saipem UK
Combining FloTHERM PCB   and FloTHERM   has helped to reduce the number of engineering prototypes  we require, reducing cost and time to market Wei-Pin Wu, Principal Engineer Johnson Controls ‘‘ ’’ Johnson Controls  is a designer and manufacturer of in-car electronics including instrument panels and overhead systems. They develop both the printed circuit boards and the electronics housing. FloTHERM PCB  is used to model the performance of the printed circuit board, and FloTHERM to review how heat is controlled in the final product. The synchronization of these applications allows Johnson Controls to create a computer model of the entire product testing environment. Automotive electronics conform to strict performance standards - twice as demanding as those in the domestic environment. Our technology has helped Johnson Controls to meet these standards while they speed up the product development cycle. The future goal is to eliminate the need for engineering prototypes altogether.
Optimizing Sail Design for the 2008 Olympics Using 3D Airflow Simulation ,[object Object],[object Object],Fredrik Lööf & Anders Ekström are Swedish medal hopefuls in the Star class in Beijing. This 3D air flow analysis using FloEFD reveals massive flow separation behind the Star jib sail at angles near stall.
To reliably measure the interface resistance we needed a transient measuring method. We chose the  T3Ster ®   because of its compactness and ease of use, allowing us to improve data acquisition and processing of the transient thermal data. We were able to improve the accuracy of TIM measurements and measure the contribution of the different components – the heater chip, thermal interface, cooling cap, second interface, and heat sink Dr. Bruno Michel  Advanced Thermal Packaging Manager IBM Zurich Research Laboratory, Switzerland ‘‘ ’’ The performance of Thermal Interface Materials (TIMs) has become a thermal “bottleneck” between a high performance chip package and its heat sink. Bruno Michel and his Advanced Thermal Packaging team at the  IBM  Zurich Research Laboratory speculated that voiding within TIMs   produced with thermal pastes could be reduced by minimizing pressure gradients in the paste during thermal cycling. The idea the team hit on was to develop a novel type of interface structure using Hierarchically Nested   Channels (HNCs) that would allow   the paste to flow more easily during thermal cycling. Naturally, the researchers wanted to test their hypothesis under conditions that closely mimic an actual processor, interface and heat sink. Having built a suitable experimental setup, the team chose MicReD’s  T3Ster®  equipment to perform the thermal measurements with successful results .
 

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  • 13. The only way a company like Linn can prosper in a cut-throat marketplace is through a faster design process which delivers products that are demonstrably superior. FloTHERM helps us achieve this goal Martin Dalgleish Head of Commercial Affairs, Linn ‘‘ ’’ Linn is an independent precision engineering company specialising in high-quality sound reproduction. Their entertainment systems can be found throughout the world in royal residences, luxury homes and in Aston Martin motorcars. Linn are the leading supplier of multi-zone entertainment systems to the Superyacht industry, where Linn systems have been proven in the harsh maritime environment for over a decade. Linn use FloTHERM software in the design of their power amplifiers, where rapid and efficient dissipation of heat is an essential factor in the ultimate performance of the system. FloTHERM enables their mechanical engineers to optimize the performance of critical heatsink designs to ensure that Linn’s products are compact and reliable.
  • 14.
  • 15. Combining FloTHERM PCB and FloTHERM has helped to reduce the number of engineering prototypes we require, reducing cost and time to market Wei-Pin Wu, Principal Engineer Johnson Controls ‘‘ ’’ Johnson Controls is a designer and manufacturer of in-car electronics including instrument panels and overhead systems. They develop both the printed circuit boards and the electronics housing. FloTHERM PCB is used to model the performance of the printed circuit board, and FloTHERM to review how heat is controlled in the final product. The synchronization of these applications allows Johnson Controls to create a computer model of the entire product testing environment. Automotive electronics conform to strict performance standards - twice as demanding as those in the domestic environment. Our technology has helped Johnson Controls to meet these standards while they speed up the product development cycle. The future goal is to eliminate the need for engineering prototypes altogether.
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  • 17. To reliably measure the interface resistance we needed a transient measuring method. We chose the T3Ster ® because of its compactness and ease of use, allowing us to improve data acquisition and processing of the transient thermal data. We were able to improve the accuracy of TIM measurements and measure the contribution of the different components – the heater chip, thermal interface, cooling cap, second interface, and heat sink Dr. Bruno Michel Advanced Thermal Packaging Manager IBM Zurich Research Laboratory, Switzerland ‘‘ ’’ The performance of Thermal Interface Materials (TIMs) has become a thermal “bottleneck” between a high performance chip package and its heat sink. Bruno Michel and his Advanced Thermal Packaging team at the IBM Zurich Research Laboratory speculated that voiding within TIMs produced with thermal pastes could be reduced by minimizing pressure gradients in the paste during thermal cycling. The idea the team hit on was to develop a novel type of interface structure using Hierarchically Nested Channels (HNCs) that would allow the paste to flow more easily during thermal cycling. Naturally, the researchers wanted to test their hypothesis under conditions that closely mimic an actual processor, interface and heat sink. Having built a suitable experimental setup, the team chose MicReD’s T3Ster® equipment to perform the thermal measurements with successful results .
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Editor's Notes

  1. I think this would be a good time to take a look at the software. At this point, I would like to hand the meeting to my colleague…