The document describes a project to design a liquid cooling retrofit mechanism for data center server components. It provides background on data centers and their large energy usage. The project's goal was to demonstrate the feasibility of retrofitting an existing air-cooled data center with a universal liquid cooling solution. The design developed microchannel heat sinks to cool the CPU, south bridge, and north bridge. Testing showed the design provided insufficient cooling for the CPU and south bridge components. Future work could redesign the system for fewer parts, improve the mounting mechanism, and conduct additional testing.
ENERGY SAVINGS IN DOMESTIC REFRIGERATOR USING TWO THERMOELECTRIC MODULES& WAT...ijiert bestjournal
The study deals with hybrid refrigerator that combi nes thermoelectric (TER) and vapor compression refrigeration (VCR) and also entail exp erimental details of combined VCR & TER system. Objective is to configure hybrid refrig erator by introducing two Peltier modules (TER) in domestic refrigerator and to analyze compr essor cycles of conventional refrigerator with TER to increase energy efficiency of vapor com pression cycle. For this comparison of standalone VCR and Hybrid VCR+TER system is carried out. A Peltier module of size 4cm � 4cm � .4cm is introduced in the refrigerator cabinet & t he effect on energy efficiency in terms of trip time of compressor is recorded. The e ffect of Air cooled & Water cooled condenser with TER in different structures is also investigated. It is observed that by introducing thermoelectric effect,energy consumpti on of VCR is reduced by almost 10.92% annually,which accounts for 80 units per year. Thu s ultimately improving COP of the hybrid system with better control on temperature over the total run time.
First available NET ZERO capable cooling tower. With the use of EC fans and solar power panels EVAPCO's new SUN tower cooling tower can meet the demand of HVAC cooling and a minimal to zero financial cost. Other uses of the SUN tower are value engineering geothermal projects, assisting in overheated geothermal fields, and complimenting hybrid designs.
ENERGY SAVINGS IN DOMESTIC REFRIGERATOR USING TWO THERMOELECTRIC MODULES& WAT...ijiert bestjournal
The study deals with hybrid refrigerator that combi nes thermoelectric (TER) and vapor compression refrigeration (VCR) and also entail exp erimental details of combined VCR & TER system. Objective is to configure hybrid refrig erator by introducing two Peltier modules (TER) in domestic refrigerator and to analyze compr essor cycles of conventional refrigerator with TER to increase energy efficiency of vapor com pression cycle. For this comparison of standalone VCR and Hybrid VCR+TER system is carried out. A Peltier module of size 4cm � 4cm � .4cm is introduced in the refrigerator cabinet & t he effect on energy efficiency in terms of trip time of compressor is recorded. The e ffect of Air cooled & Water cooled condenser with TER in different structures is also investigated. It is observed that by introducing thermoelectric effect,energy consumpti on of VCR is reduced by almost 10.92% annually,which accounts for 80 units per year. Thu s ultimately improving COP of the hybrid system with better control on temperature over the total run time.
First available NET ZERO capable cooling tower. With the use of EC fans and solar power panels EVAPCO's new SUN tower cooling tower can meet the demand of HVAC cooling and a minimal to zero financial cost. Other uses of the SUN tower are value engineering geothermal projects, assisting in overheated geothermal fields, and complimenting hybrid designs.
Increasing Inductor Lifetime by Predicting Coil Copper Temperatures PaperFluxtrol Inc.
In recent years, there has been a significant increase in the customer demands for improved induction coil lifetime. This has led to several publications in recent years by induction tooling manufacturers [1-4]. The main conclusion in these papers is that besides mechanical crashes the cause of most induction coil failures is localized overheating of the coil copper due to insufficient cooling.
What is lacking from these publications is any way to determine what is sufficient cooling. In this paper, a scientific method for determining local copper temperatures will be presented. This will include evaluations of heat transfer coefficients for different sections of a multi-component inductor, dependence of heat transfer coefficient on water pressure and water passage cross-section, non-uniform power density distributions in various 2-D cross-sections and the resulting temperature distribution in the copper winding. The effects of duty cycle on optimal design will also be considered.
Thermal analysis of cpu with variable baseplate heat sink using cfdeSAT Publishing House
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
Application of induction heating technology in high-performance spring manufacturing.
It is a customized induction heat treatment production line used in the spring hot coil production.
For videos and pictures please contact Elinwang
ketchanheater@gmail.com
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Increasing Inductor Lifetime by Predicting Coil Copper Temperatures PaperFluxtrol Inc.
In recent years, there has been a significant increase in the customer demands for improved induction coil lifetime. This has led to several publications in recent years by induction tooling manufacturers [1-4]. The main conclusion in these papers is that besides mechanical crashes the cause of most induction coil failures is localized overheating of the coil copper due to insufficient cooling.
What is lacking from these publications is any way to determine what is sufficient cooling. In this paper, a scientific method for determining local copper temperatures will be presented. This will include evaluations of heat transfer coefficients for different sections of a multi-component inductor, dependence of heat transfer coefficient on water pressure and water passage cross-section, non-uniform power density distributions in various 2-D cross-sections and the resulting temperature distribution in the copper winding. The effects of duty cycle on optimal design will also be considered.
Thermal analysis of cpu with variable baseplate heat sink using cfdeSAT Publishing House
IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
Application of induction heating technology in high-performance spring manufacturing.
It is a customized induction heat treatment production line used in the spring hot coil production.
For videos and pictures please contact Elinwang
ketchanheater@gmail.com
Accelerated life testing plans are designed under multiple objective consideration, with the resulting Pareto optimal solutions classified and reduced using neural network and data envelopement analysis, respectively.
THERMAL ANALYSIS OF A HEAT SINK FOR ELECTRONICS COOLINGIAEME Publication
Heat transfer is a discipline of thermal engineering that concern the generation, use, conversion and exchange of thermal energy, heat between physical systems. Heat transfer is classified in to various mechanisms such as heat conduction, convection, thermal radiation & transfer of energy by phase change. Most of the electronic equipment are low power and produce negligible amount of heat in their operation. Some devices, such as power transistors, CPU's, & power diodes produce a significant amount of heat. so sufficient measures are need to be taken so as to prolong their working life and reliability.
Analysis and Design Methodology for Thermoelectric Power Generation System fr...Omkar Kamodkar
This paper combines heat transfer and
thermoelectric conversion techniques to create a
thermoelectric generator device for a single-cylinder, fourstroke petrol engine. The system is made up of heat absorbers,
thermoelectric generator, Thermoelectric Generator (TEG)
modules, and an external heat sink. To achieve the goal of
absorbing heat and increasing thermoelectric conversion
efficiently, the heat exchanger surface area and heat-exchange
time could be increased. Thermoelectric generators convert
waste heat into energy directly. This technology will also help
energy conversion systems work better overall. Despite the
fact that TEG production is limited by available technologies,
feasible electricity generation is possible from waste heat
generated by automobiles. The effect of using passive heat
sinks and heat absorbers made of a flat plate with fins of
various cross-sectional areas and materials with forced
convection heat transfer, as well as how current, voltage, and
power are varied, is investigated and presented in tabular
format in the current numerical analysis. By plotting the
results of the analytical and numerical method on relevant
graph, the results of both methods were compared
This presentation is about my academic project on generating electricity using thermoelectric generator (TEG), to harvest the thermal energy dissipated by combustion gases. The current project discusses the optimal design of the thermoelectric generator (TEG) and the design is conducted analytically based on the idea of air cooled TEG system using fins and an experimental system is fabricated and tested by attaching to exhaust pipe of a two wheeler IC engine for the heat source to verify the validity of the proposed system.
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IJRET : International Journal of Research in Engineering and Technology is an international peer reviewed, online journal published by eSAT Publishing House for the enhancement of research in various disciplines of Engineering and Technology. The aim and scope of the journal is to provide an academic medium and an important reference for the advancement and dissemination of research results that support high-level learning, teaching and research in the fields of Engineering and Technology. We bring together Scientists, Academician, Field Engineers, Scholars and Students of related fields of Engineering and Technology.
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Water-cooled chiller systems have typically been designed around entering condenser water temperatures of 85°F with a Optimization of Water - Cooled Chiller – Cooling Tower Combinations The warm water leaving the chilled water coils is pumped to the evaporator of the chiller, where the unwanted heat from the building is transferred by the latent heat of vaporization of the refrigerant. The compressor of the chiller then compresses the refrigerant to a higher pressure, adding the heat of compression in the process. The high pressure refrigerant then moves to the economical condenser water flow of 3.0 USGPM/ton and a 10°F denser, where the unwanted heat is rerange. In recent years, there has been considerable debate on the merits of designing around lower condenser water flow rates with a higher range in order to improve system lifecycle costs. However, two other parameters must also be considered in any analysis - approach and design wet bulb. The question to be answered is: What nominal condenser water flow rate and approach is best from a first cost standpoint as well as from a full load energy standpoint at any given wet bulb.
Fast & Easy Electronics Thermal ManagementSimScale
Cloud-based simulation offers engineers a powerful CFD tool to assess the key variables that influence cooling, airflow, and thermal efficiency for optimizing the thermal and energy performance of electronics components. Forwiz System. Co., Ltd. is a South Korean company specialized in the field of SDN (Software Defined Networks) and electronics cooling. This webinar showcases how Forwiz uses SimScale to optimize their designs, enabling quick and accurate early-stage simulation and electronics cooling analyses.
More SimScale resources on electronics cooling:
What Is Heat Transfer?: https://bit.ly/3tARTwa
What is CFD | Computational Fluid Dynamics?: https://bit.ly/3lwhrrj
What Are the Navier-Stokes Equations?: https://bit.ly/3qYSKVz
How To Calculate Heat Dissipation In Watts?: https://bit.ly/3s4cLeG
Evaluating the Thermal Performance of Lighting Solutions With Cloud-Based CFDSimScale
Cloud-based simulation enables electronic engineers to test and evaluate how well their designs dissipate heat. Using LEDs as a test case, this presentation demonstrates how effective heatsink design improves cooling performance, ultimately mitigating gradual light loss and providing a longer product lifespan for lighting devices. SimScale, with its high performing conjugate heat transfer solver, accurately calculates how effectively heat generated by spotlight diodes is dissipated by multiple designs, even simultaneously.
Watch the webinar recording here: https://www.youtube.com/watch?v=69LfxAxDoE0
AN EXPERIMENTAL DESIGN & ANALYSIS OF PORTABLE USB POWERED THERMO ELECTRIC COOLERPranavNavathe
Refrigerators are energy consuming home appliances and for this reason researchers are performed to enhance performance work of the refrigeration systems. Most of research work done so far deals with an objective of low energy consumption and refrigeration enchantment. Thermoelectric refrigeration is one of the techniques to produce refrigeration effect. This project demonstrates how far thermoelectric refrigeration can be modified to produce refrigeration effect with low power input and high cooling effect.
In this project a portable thermoelectric (Peltier) cooler is designed and fabricated for multipurpose use (Like beverage cooling, water cooling, and milk storage). It is operated on USB with low power, portable in nature and compact in seize. This project carries out cooling effect analysis, steady state heat transfer finite element analysis on different water bottle materials with different heat transfer plates, thermal insulation jacket in ANSYS R19 workbench. Power consumption of this device and its performance is experimented and calculated with practical model on DC-DC to boost converter, also TEC inter components CFD analysis done in ANSYS Fluent.
Keywords: Peltier Module, USB, DC-DC Boost Converter, Heat Transfer Plates, Thermal insulation Jacket, Steady State Heat Transfer Finite Element Analysis, CFD Analysis, ANSYS Fluent.
3. DATA CENTER BACKGROUND
• Data Centers house server trays for computer
systems and other supporting infrastructure
4. GLOBAL IMPACT
61 billion kilowatt-hours annually
Similar to amount of electricity consumed by 5.8
million average U.S. households
1.5 percent of the country's entire electricity
consumption.
4
5. SCOPE OF PROJECT
Demonstrate feasibility of retrofitting a data center
with liquid-cooled thermal management solution 5
Factory Installed Air-Cooled
Solution
Liquid-Cooled Retrofit
6. SERVER BOARD LAYOUT
Foxconn G41MXE Series
Motherboard
1. Core 2 Duo Processor
Max temp. = 72°C
TDP = 65 W
2. South Bridge Intel ICH7
Max temp. = 99°C
TDP = 3.3 W
3. North Bridge Intel G41
Max temp. = 102°C
TDP = 25 W
*TDP= Thermal Design Power
1
2
3
7. 𝐻
𝑊𝑐ℎ
𝐻𝑐ℎ
𝑊𝑓 𝑇𝑐ℎ
𝑇𝑗
L
W
t
MICROCHANNEL HEAT SINK
Arrangement of channels
and fins which are used
to increase the area
available for heat transfer
from the component to
the fluid
Assuming:
• Hydro-dynamically Fully Developed
• Thermally Fully Developed
• Fin efficiency = 100%
• All heat is conducted through channel
base and fins
8. OPTIMIZATION
The best heat transfer performance requires the
smallest hydraulic diameter
A smaller hydraulic diameter increases the pressure
drop and pumping power
This competition will yield an optimal value
10. JUNCTION TEMPERATURE CALCULATION
• Convert 𝑉 to 𝑚 and substitute 𝑚 into equation below
𝑇𝑗 𝑖
=
𝑇𝐷𝑃𝑖
𝑇𝐷𝑃𝑖 ∗ 𝑁𝑠𝑡𝑎𝑟_𝑡𝑜𝑡𝑎𝑙 ∗ ℎ𝑖 ∗ 𝐴 𝑤𝑒𝑡𝑡𝑒𝑑 𝑖
+
𝑇𝐷𝑃𝑖 ∗ 𝑡
𝑘 ∗ 𝐴 𝑐
+
𝑇𝐷𝑃𝑖
𝑚 ∗ 𝑐 𝑝
+ 𝑇 𝑤𝑎𝑡𝑒𝑟 𝑖𝑛
Where,
𝑇𝑗 𝑖
= Junction Temperature of chip i
𝑇𝐷𝑃𝑖 = Thermal Design Power of chip i
𝑁𝑠𝑡𝑎𝑟_𝑡𝑜𝑡𝑎𝑙 = Expression relating number of channels to TDP
ℎ𝑖 = Convective heat transfer coefficient for water through heat sink i
𝐴 𝑤𝑒𝑡𝑡𝑒𝑑𝑖
= Wetted area of a channel in heat sink i
𝑡 = Thickness of copper base
𝑘 = Thermal conductivity of copper
𝐴 𝑐 = Area of component i
𝑚 = Total mass flow rate through all heat sinks
𝑐 𝑝 = Specific heat of water
𝑇 𝑤𝑎𝑡𝑒𝑟 𝑖𝑛
= Temperature of water entering heat sink i
11. DETERMINING RATIO OF CHANNEL NUMBER
TO THERMAL DESIGN POWER
• Plot 𝑇𝑗1
, 𝑇𝑗2
, 𝑇𝑗3
vs. Nstar_total
• Find Nstar_total that corresponds to hottest of the minimum
junction temperatures
0.41
0.45
0.40
13. DESIGN CONSIDERATIONS
Challenge: This product is intended to be a retrofit so it must be
designed around existing server boards.
Assumption: We based our design around a server board accessible
to us, but it should still fit others.
14. FUNCTIONAL REQUIREMENTS
Must dissipate required heat and keep junction
temperature below limit for all components requiring
cooling
Must be universal for any server board
Must apply required static load
Must fit in confined space
Must be waterproof
16. USING 𝑖PARTS AND 𝑖ASSEMBLIES
Through the use of parametric tables, iParts
and iAssemblies allow quick modifications to
parts and assemblies. Each row in the table will
correspond to a new part with its own part
number and altered features.
17. METHOD OF FABRICATION
Part: Microchannel Base
Material: Machinable
Copper
Method: CNC Machine
Notes: purchased a .026”
bit to machine
microchannels
Part: Headers, Lid, and
Bracket
Material: Acrylic
Method: CNC Machine
18. ASSEMBLY
2-56 UNC bolts are used to mount the
lid and headers to the micro channel
base
Silicon is used to seal the mating faces
Teflon tape is used on the fitting
threads to keep it sealed
Dowel pins were press fitted into the
locator bracket plate
Challenge: Sealing the cooling block.
19. BILL OF MATERIALS
Part Description Part # Vendor Unit Price
($)
QTY
6" X 6" ultra-conductive Copper 89675K15 McMaster 62.94 1
Clear Cast Acrylic Slat 8560K191 McMaster 7.04 1
.026" End Mill, square end, long flute 8915A28 McMaster 23.61 3
302 SS precision Compression Spring 9435K82 McMaster 7.36 1 pack (5)
10-32 UNF thread elbow barb fitting KL230-1 Value
Plastics
Sample 2 packs
(5)
Corrosion Resistant Dowel Pin, type
316 SS
97395A453 McMaster 4.77 2 packs
(5)
Flexible PVC tubing 1/8" inner
diameter
5233K52 McMaster 0.25 1ft
General Purpose double sided Tape 77185A21 McMaster 15.44 1
Adapter fitting, Tube to male threaded
pipe
2974k124 McMaster 5.26 1 pack
(10)
Threading Adapter, NPT 1/8 M to G 1/4
F
ADT-N18M-
G14F
Koolance 2.17 5
TOTAL: $195.51
23. CONCLUSIONS
Goal: Design a mechanism that enables a retrofit
for cooling of data center components
The design was successful in that it provided a
solution for retrofitting current air cooled server
boards with a universal water cooled mechanism.
Testing of the cooling blocks yielded insufficient
results.
North Bridge cooling block not tested
Thermal Resistance too high for tested cooling blocks
24. RECOMMENDATIONS FOR FUTURE WORK
Redesign to allow for less parts/mating faces in the
assembly
Less hardware
Less machining time
Creates a more effective seal
Improvement for mounting mechanism
More sophisticated GUI
Link between GUI results and Solid Model
Additional testing to evaluate cooling block
performance
25. REFERENCES
Scheihing, DOE Data Center Efficiency Program, 2008.
Intel® I/O Controller Hub 7 (ICH7) Datasheet. Thermal Design Guidelines. Document 307015-001. Initial Release. April 2005.
Intel. 4 April 2012. http://www.intel.com/content/www/us/en/io/intel-io-controller-hub-7-guide.html
Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor
Q6000Δ Sequence Datasheet. Document 315592-005. Rev. 5. August 2007. Intel. 4 April 2012.
http://download.intel.com/design/processor/datashts/31559205.pdf
Intel® G45, G41, Q45, Q35 and Q965 Chipsets for Embedded Applications Datasheet. Thermal Design Guide. Document
415360. Revision 1.5. February 2009. Intel. 4 April 2012. http://download.intel.com/embedded/chipsets/designgd/415360.pdf
Incropera, Frank P. Fundamentals of Heat and Mass Transfer / Frank P. Incropera ... [et Al.]. Hoboken, NJ: John Wiley, 2007.
Print.
"Pump, PMP-300 [no Nozzles] - Water Cooling Systems, Pc Liquid Cooling Kit, Cpu, Video Card, Hard Drive." Koolance.com.
Web. 02 Apr. 2012. <http://www.koolance.com/water-cooling/product_info.php?product_id=950>.
42u Data Center Cooling. N.p., n.d. Web. 24 Jan. 2012. <http://www.42u.com/42u-rack-cooling.htm>.
Pingdom Blog. Pingdom AB, 25 July 2008. Web. 24 Jan. 2012. <http://royal.pingdom.com/2008/07/25/us-data-centers-
consuming-as-much-power-as-5-million-houses/>.
Graybar: works to your advantage. N.p., 2012. Web. 9 Apr. 2012. <http://www.graybar.com/applications/data-centers>.
26. THANK YOU FOR YOUR TIME!
Special thanks to Dr. Kimber, Ricardo Riviera, and
Andy Holmes & his machine shop crew
Questions?
Editor's Notes
Add picture or animation here
Data storage systems
Telecommunications
Data connectivity
Equipment housing and support
Electrical power distribution
Backup power systems
Environmental systems
Fire suppression systems
Security Systems
Point out the server trays in the picture 1 and explain what's going on in picture 2
Explain the figure
Increasing computing capabilities and demand is resulting in increases in rack and room power densities (intel)
Today’s IT equipment can push data centers to 750 Watts per square inch compared to 75-100 Watts in the past (intel)
As much as 40% of a data center’s energy bill comes from cooling equipment (42u)
Failure to adequately cool components could result in irreversible damage to the components
Liquid cooled-Holds the potential for higher heat dissipations and is more efficient
Explain why retrofit is the best alternative
Instead of scratching current server room, just replace current servers with water cooling
Scope of the project
Focus on Cooling Blocks
Universal mount for cooling blocks
Testing of the cooling blocks
Not within scope of project
Extra components
Pump
Water Chiller
Manifold
Objective: Ensure that the temperatures of all components in the system are maintained within functional limits
The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements.
Thermal Design Power (TDP) is specified as the highest sustainable power level of most or all of the real applications expected to be run on the given product
Operation outside the functional limit can cause logic errors, lower system performance or cause component and system damage.
Attached to the component of the server tray via a thermal paste.
Heat is conducted up from the component through the base of the heat sink and up through the fins.
Convection from forced fluid flow in the channels removes heat
Tjmax= The maximum junction temperature. Temperature at the junction of the heat generating component and the bottom of the heat sink
Objective: Minimize Tjunction so that the thermal resistance through the heat sink is minimized
Thermal solutions should be designed to dissipate this target power level
Goal: Determine the width of a channel, number of channels, and the overall flow rate for the heat sinks that yield the lowest total thermal resistance. The lower the total thermal resistance, the better heat transfer performance you get
Accomplished by varying the number of channels in each heat sink until the optimal number of channels is found
Po = y intercept of pump curve (meters of head), Vo=x intercept of pump curve (flow rate in liters/min).
Vdot=overall volumetric flow rate (liters/min), h=height of channel (constant for all heat sinks), u=dynamic viscosity, L=length of chip(heat sink),
W=width of channel for heat sink, d=hydraulic diameter of channel
W (width of channel) were iterated and calculated based on the nstartotal vector. So all other variables are a function of nstartotal since they are calculated based on W
Intersections of Pump Curve and System Curve yield volumetric flow rates ( 𝑉 ) that can be used for the system
Supplies the necessary head to overcome the pressure losses in the channels
Nstartotal is a ratio of the number of channels to the TDP for each heat sink
Where each variable in the equation is expressed in terms of nstartotal
Nstar(i)=N(i)/Q(i)
This minimum must be chosen because if for example, minimum of component 2 was chosen (0.40), then at n_startotal=0.40 for component 3, the corresponding junction temperature at this point may be above the max operating temperature for this chip
Use this value of Nstar_total to calculate the number of channels for each heat sink
This forces the heat dissipated through each channel of each chip to be the same
Earlier we defined Nstar_total as a function of 𝑁 𝑠𝑡𝑎𝑟 𝑖 , and 𝑁 𝑠𝑡𝑎𝑟 𝑖 was defined as 𝑁 𝑖 𝑇𝐷𝑃 𝑖
Once number of channels for each heat sink is known, the width of each channel for each heat sink can be found
MATLAB Graphical User Interface (GUI)
Allows user to enter data for up to 3 components that need cooled
Program determines optimal dimensions of the heat sink for each component and the overall flow rate required
Explain user enters the dimensions of the chip (length, width), TDP, and Max Case Temperature (which are all given in product data sheet)
Calculates length, width, height of channel, thickness of fin, number of channels, total flow rate, overall pressure drop, and case temperature for each chip
Constraints:
Limited Space inside Server Board
1.2” height clearance from processor to lid
Numerous Server Board Layouts
Water Sensitive environment
Electrical equipment require specifications vary
Number of components that require cooling
Static Pressure
Heat Load
Size
Attempted Designs
Design 1: Install linear tracks to determine position inside server board
Problem: No head space above server board components, can’t raise lid because server trays are stacked directly on top of each other
Design 2: Mount the cooling block to drilled hole patterns in the lid.
Problem: Must alter the lid, no space above lid for hardware.
Design 3: Attached cooling block to lids with magnets
Problem: Its recommended to not have magnets near electrical equipment
Cooling block will be held in place by using a locator bracket
Locator bracket will be mounted to the lid with adhesive
Spring will apply pressure to the lid
Microchannels will run through a copper block
Lid will mate with the locator bracket and bolt on to the microchannel base
Headers will be bolted to both ends of the microchannel base
Benefits: No need to modify lid or server board. Doesn’t depend on mounting features provided in the board.
The output of the thermal analysis GUI (dimensions of the fins, the number of channels, and the size of the chip) will be entered into the parametric tables.
Through the use of equations instead of dimensions in the parts the model will automatically reconfigure itself.
Goal: Determine junction temperature and inlet and outlet water temperatures at the cooling block for some flow rate. Use these values to calculate the convection heat transfer coefficient and the total thermal resistance of each heat sink. Compare these values to the theoretical calculated vales.
The convection coefficients were an order of magnitude less than the predicted values. The convection coefficient (h) should have been bigger for the CPU than for the south bridge chip. This is because the hydraulic diameter for the CPU microchannels is smaller than the hydraulic diameter for the north bridge microchannels. A possible explanation is that not all the channels in the CPU cooling block were filled with water (since there were 30 some channels). The south bridge cooling block only had one channel so odds are it was completely filled with water.
The total thermal resistance was much higher than was predicted (which is not a good thing). This is probably because the convection coefficients were much smaller than predicted. Resistance due to convection accounts for nearly 90% of total thermal resistance
The pump flow rate fluctuated and was too low in both tests were performed so this may have thrown off our results. A higher pump flow rate would decrease the thermal resistance.