Electronics Solderability Analysis & Testing Case Study from ITRI Innovation
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This case study highlights how ITRI Innovation, a specialist electronics test laboratory, carried out an analysis of a component to determine why a solderability issue had arisen and made recommendations that resolved the issue.
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Beam Services is a provider of capital equipment and engineering services for the semiconductor industry. It has over 80 years of combined experience in semiconductor services and engineering. Beam Services develops innovative electrostatic substrate handling technology to gently handle thin wafers and complex devices for applications such as lithography, deposition, and packaging. This technology provides a contamination-free solution for handling fragile and non-standard substrates.
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Electronics Solderability Analysis & Testing Case Study from ITRI Innovation
- 1. RESOLUTION OF A SOLDERABILITY ISSUE How a component finish on a critical component was modified to enable improved solderability and long term reliability
- 2. The Client The client is a major supplier of electronic parts for the military sector.
- 3. The challenge Certain critical components were detaching from the solder on a printed circuit board
- 4. The problem Without the critical component, the circuit board would fail. Without the PCB, the entire module for this component of a military vehicle would be rendered ineffective
- 5. The Solution ITRI Innovation performed a series of analyses to characterise the solderable finish of the coating. As the substrate of the component terminations were a brass alloy, the solderability issues were found to be due to zinc migration. The introduction of an extra interlay in the coating was suggested to restrict the migration of zinc in order to ensure that the solderability would not be affected.
- 6. The Outcome With the introduction of the interlay in the termination finish, the solderability issues were eliminated overnight A series of quality checks were carried out to ensure that the new finish was being consistently applied. The soldering performance of this new finish was then assessed using the wetting balance method. Finally, the solder joints produced were evaluated by cross- sectioning and microscopy to ensure they were of an acceptable standard. The improved solderable finish, and solder joints, are now being used on live hardware with zero field returns to date.