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Ciel spot june2014_webinarpresentation
- 1. Kamal Karimanal Cielution LLC CollaborativePackage Thermal Co-Simulation Using CielSpot
- 2. Agenda About Cielution Cielution productsoverview & roadmap Need for collaborative thermal modeling Thermal modeling at package level using CielSpot • Detailed package thermal model • Compact thermal model generation • End use of CielSpot CTM Conclusion Q&A
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- 5. Cielution Services Expertise Areas •Thermal and Mechanical Simulation • Chip, Package Board and System Level Engineering. Tools Expertise • ANSYS, Icepak, Fluent, CFX, Flotherm Business Model • Fixed Cost Fixed Time Projects • Best suited for when a clearly defined problem statement exists • Suited for Scripting and Automation Projects • ANSYS APDL, Fluent UDF, Icepak Macro, Desktop & Web based UI development. • Contract Services • Suited to situations when the problem statement is likely to evolve. • For temporary resource crunch situations • Open to On & Off customer site options © Cielution
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- 7. Product Deployment Strategy Cielutionproducts are offered as Software As A Service (SaaS) via web based interface. • Customers require in-house ANSYS software • Solution and results evaluation happen on customers local computer. o Except for CielSpot CTM which does not require 3rd party software. © Cielution Confidential
- 8. Why SaaS? SaaS isan effective way of engaging with new customers at a low cost of entry. Using Cielution products in SaaS mode helps our customers quickly establish value within their organization. • Upon which we are open to deploying our solutions locally within customer organization. o If capabilities beyond off the shelf features are needed. o If data exchange over cloud is not a preferable option. o If the intranet equivalent of our supply chain solutions are needed to interface within organization
- 9. Cielution Product Pipeline CielSpot™ •Package Thermal Modeling • Package Compact Model Generation CielSpot-CTM™ • Thermally Aware IC Layout o Traditional Packages o 3D Stacked Assemblies CielMech™ • Thermo-Mechanical Analysis of Assembly o Warpage Mitigation o Packaging Yield Enhancement o Interconnect Reliability
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- 11. System - PackageThermal Co- Design/Choices Overmolded Package Lidded Package Traditional TIM I Solder TIM I Interface Thermal resistance map? Server Applications Mobile/Handheld/Board-Sinked Applications • TIM II Choice(Thermal Grease?, PCM?, Indium?) • Mounting Pressure? • Tim II R Map?
- 12. Chip Package ThermalCo- Design/Choices Overmolded Monolithic Package Lidded Monolithic Package 3D SOC Traditional SOC Layout Vs. Power Map Vs. Spreading Requirements SOC Layout Vs. Chip to Chip Thermal Interaction Technological Feasibility & Thermal Path finding
- 13. Introduction to CielSpotand CielSpot CTM
- 14. CielSpot: High LevelWorkflow © Cielution LLC CielSpot™ Stack Info Package Info Material Properties Solve in ANSYS Mechanical Access to Model in the ANSYS Mechanical native format Automated Geometry, Meshing & Problem Setup Intelligent Solver Controls Automated Thermal Snapshots & Temperature data Compact Thermal Model SaaS On Client Computer
- 15. CielSpot CTM: Quick,Accurate, Highly Granular and Collaboration Friendly Software as a Service © Cielution LLC Input Data: CTM CielSpot CTM Pmap for Chip 1 Pmap for Chip 2 Pmap for Chip 2 … Etc… Automated Thermal Snapshots & Temperature data
- 16. Collaborative Thermal Modelingusing CielSpot™ © Cielution LLC CielSpot Packaging Org. Compact Model Library Package Details & Typical Heatsinking Scenarios Fabless Customer Power Map for Each Chip Package A Package B Package C CielSpot CTM™ OSAT Proprietary Details. Need Third Party Solver Application Proprietary Details. Don’t Need Third Party Solver Data Cannot be Reverse Engineered
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- 19. Kamal Karimanal kamal@cielution.com 408 8982435 Thank You!