This document provides details about an upcoming webinar from Cielution on assembly process modeling, including registration links, an overview of the process modeling steps in ANSYS like defining stack up and interconnects, packaging options, substrate build up, and process sequencing, and how CielMech can automatically set up meshing and solving in ANSYS to evaluate and optimize designs. Attendees can learn more by attending the webinar on June 3rd and 4th or contacting Kamal Karimanal or Cielution for additional information.

1. Kamal Karimanal
Cielution LLC
Assembly Process Modeling
Webinar Sneak Peak

2. Webinar Details
This is a Sneak Peak to Cielution Webinar on
June 3rd and 4th
Registration Link:
• https://global.gotowebinar.com/webinars.tmpl#we
binar-3464645060432088577_tip

3. Define Stack up

4. Define Interconnects

5. Packaging Options

6. Substrate Build up

7. Define Process Sequence in ANSYS
Step 1 RDL
Deposition
Step 2 Interposer
Substrate Attach
Step 3 Estimate
Warpage
Step 4 Chip
Attach
Step 5 Estimate
Warpage
Step 6 Lid Attach

8. Automatic & Intelligent Meshing &
Problem set up by CielMech &
Solution using ANSYS
Evaluate Results

9. Evaluate & Optimize Design/Process

10. More Details
CielMech is Available to Customers
Attend Webinar or Contact Cielution For
More details
• Kamal Karimanal
• 408 898 2435
• info@cielution.com