This document discusses thermally conductive adhesives and composites developed by Themistry for high-performance applications. It provides an overview of several products including:
- Epoxy-based composites for die attachment and underfill applications in electronics.
- Polyurethane and epoxy resins supporting formulators and accelerators for pressure vessel impregnation.
- Benzoxazine thermoset resins for high ICT performance.
Themistry can support customers with advice and practical recommendations on how to optimize the use of their products in various manufacturing processes.