The document discusses several challenges in integrated electronic system design: electrical over-stress (EOS) which can cause thermal damage; packaging which is susceptible to environmental factors; printed circuit board failures from process defects; and electrostatic discharge (ESD) which can cause catastrophic or latent damage. EOS occurs when devices experience currents or voltages beyond specifications. Packaging can crack from thermal/mechanical stress or corrosion. Printed circuit boards can fail through trace cracking, via cracks, or flux residues. ESD may cause melting of traces or component degradation leading to intermittent failures.