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www.huawei.comHUAWEI TECHNOLOGIES CO., LTD.
A Fresh Look at HPC
HUAWEI TECHNOLOGIES
Francis Lam
Director, Product Management
Page 2 HUAWEI TECHNOLOGIES CO., LTD.
WORLD CLASS HPC SOLUTIONS TODAY
170+
Countries 2016 Revenue USD
16
R&D Centers
36
Joint Innovation
Centers
#3
Top Server Vendor WW
Standalone Compute
Node 1P-32P
Modular HPC
Systems
NVMe
SSD
HPC
storage
Big Data
storage
Network Fabric
Modular & Container
Data center
$74.8B
of Revenue in R&D
14.2%
Huawei FusionServer
OceanStor CloudEngine
Reduce Complexity
More Performance / $
Design for Growth
HPC Private Cloud
》》
Petascale System
Direct Liquid Cooling
Workload Optimization
Ecosystem Partnership
》》
Page 3 HUAWEI TECHNOLOGIES CO., LTD.
300+ World Records For Computing Performance
Flexible Density Optimized
Rack Mount Servers
High Performance Blades
Large Scale Deployment
SERVERS FOR HIGH PERFORMANCE COMPUTING
RH5885
RH8100
RH1288/2288
KunLun
16/32S System
RH5288
NVMe SSD card
Acceleration
GPGPU/Phi
E9000
X6800
Page 4 HUAWEI TECHNOLOGIES CO., LTD.
MAXIMIZE EFFICIENCY ACCELERATE WORKLOAD
MAXIMIZE PERFORMANCE FOR
INDIVIDUAL WORKLOAD
 Flexible, modular architecture
 Multiple innovative form factors
 Deep optimization with hardware
acceleration
 Super Fat nodes
ADAPT TO CHANGE
FUTURE PROOF
 Solve problem using emerging
hardware technologies
 Single HPC cluster and storage
system for both traditional HPC
MPI workload and Hadoop
 Leverage flexibility and
expandability of cloud technology
HUAWEI ADVANTAGES
MORE COMPUTE LESS SPACE
LOWER POWER CONSUMPTION
 End-to-end energy efficient design
 HVDC
 High Ambient Temperature ~40oC
 Direct Liquid Cooling ~ 84% coverage
 Tight integration with Huawei data
center infrastructure
SDS
Big Data
SDI
Page 5 HUAWEI TECHNOLOGIES CO., LTD.
Energy Efficient
Server Design
Bottom line of Greener
IT
Higher Temperature
Up to 8%↓ WW DC power
consumption w/ 5ºC↑
HVDC
Up to 9-15%
conversion efficiency
improvement
Free Air Cooling
Up to 20-70% cooling
saving
In-Memory
Computing
Up to 90+% less
power
consumption than
HDD-based
SSD Storage
Up to 60+% less power
consumption than
HDD-based
Air Containment
Up to 30%↑ in
cooling efficiency
Green IT Reduces Energy Bill & CO2 Emission, Extends DC Life, Lowers TCO
Hot Water
Eliminate Chiller
Free cooling
Right-sized Power
~20% better power &
cooling utilization
END-TO-END GREEN HPC DESIGN
Hardware
Acceleration
~ 2X+ Performance Per
Watt
Page 6 HUAWEI TECHNOLOGIES CO., LTD.
CPU Load XH620 V3(X6800) 1U Server
Watt
Saving Per
Node
% Power
Saving Per
Node
100% 303 313 10 3%
90% 267 283 16 6%
80% 225 235 10 4%
70% 191 206 15 7%
60% 166 183 17 9%
50% 152 164 12 7%
40% 139 151 12 8%
30% 127 138 11 8%
20% 114 125 11 9%
10% 101 112 11 10%
0% 61 73 11.5 16%
X6800
Vs.
Workload:SPECpower2008,Power Meter:WT210,Thermometer:Digi Watchport/H
1U Server
POWER EFFICIENT FORM FACTORS
Page 7 HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI FUSIONSERVER LIQUID COOLING SYSTEM
• FusionServer LCS is composed of Liquid Cooling Rack and external CDU
• CPU, Memory and VRD are cooled directly by up to 45 ℃ water
• Chiller is optional, cooling PUE < 1.1
• Industry leading serviceability
Page 8 HUAWEI TECHNOLOGIES CO., LTD.
MAXIMIZE EFFICIENCY DIRECT LIQUID COOLING
40% Energy SavingPoznan Supercomputing and Networking Center (PSNC)
513960
460572
925,128
552,686
0
100000
200000
300000
400000
500000
600000
700000
800000
900000
1000000
Air cooling (PUE=1.8) Liquid cooling (PUE=1.2)
Devices
Rooms
- 40.3%
Note: Compared with the air cooling, the liquid cooling saves
3.26 million kWh power consumption for PSNC each year.
Page 9 HUAWEI TECHNOLOGIES CO., LTD.
Scalability
I/O
Storage
Memory
bandwidth
Memory
capacity
CPU
Workload Characteristics
WORKLOAD OPTIMIZED HIGH PERFORMANCE BLADES
Maximize CPU compute density
Maximize Memory Per Core
Maximize Memory BandwidthMaximize Local Storage Per Node
Maximize I/O, Hardware Acceleration
Page 10 HUAWEI TECHNOLOGIES CO., LTD.
E9000 HIGH PERFORMANCE BLADE SYSTEMChassis
E9000 chassis
Chassis
Computenode
CH121 V3
Switchmodule
Switch module
CH220 V3CH140 V3
Half-width 2-socket
compute node
High density
Large memory
capacity
Adopts a modular design for computing, storage, switching, power supply, and cooling.
12-U-high chassis, providing 8 full-width or 16 half-width slots.
Supports next 3 generations of high-performance Intel CPUs.
Supports next-decade network technology evolution.
Compute node
CH222 V3 CH226 V3 CH242 V3
Half-width 2*2-socket twin
compute nodes
Super high density
Outstanding computing
capability
Full-width I/O
expansion compute
node
Large memory
6*PCIe slots
Full-width storage node
Large memory
15*2.5'' HDDs/SSDs
Full-width storage node
Large memory
6*3.5'' HDDs
Full-width 4-socket compute node
Outstanding computing capability
(E7 v2, E7 v3)
Superb storage and I/O expansion
capability
GE 10GE/FCoE converged Ethernet IB FDR/EDR Multi-plane switch module8G/16G FC 40GE
CX110 CX310 CX311CX116 pass-
through
CX317/CX318
pass-through
CX611 10GE+FC
CX912
CX111 CX210
8G FC
GE+FC
CX915
CX710CX220
16G FC
CH225 V3
Full-width storage node
All-flash
12*NVMe SSDs
Page 11 HUAWEI TECHNOLOGIES CO., LTD.
X6800 HIGH DENSITY RACK MOUNT SERVERS
XH628 V3
XH622 V3
XH620 V3
High Density Compute Node
Big Data Storage Node
Hardware acceleration Node
Page 12 HUAWEI TECHNOLOGIES CO., LTD.
BROAD RANGE OF NVME SSD SERVERS
4 ╳ NVMe RH1288 V3
2 ╳ NVMe XH620 V3
12 ╳ NVMe RH2288H V3
24 ╳ NVMe RH2288H V3
4 ╳ NVMe 5288 V3
4 ╳ NVMe RH2288(H) V3
NVMe SSD Disk
2 ╳ NVMe CH121 V3
12 ╳ NVMe CH225 V3
4 ╳ NVMe CH242 V3
4 ╳ NVMe RH5885(H) V3
8 ╳ NVMe RH8100 V3
Blade Server
X6800(4U8)
6 ╳ NVMe XH321 V3
High-Density Server
X6000(2U4)
E9000
Page 13 HUAWEI TECHNOLOGIES CO., LTD.
FUSIONSERVER X6000 — HIGH-DENSITY SERVER
Front View Rear View
24 NVMe SSDs or SAS/SATA HDDs
Unified
management
network port
platinum AC PSUs
(hot-swappable, 1+1
redundancy)
2 PCIe slots
LOM service port
Node management port
Universal connector port
Page 14 HUAWEI TECHNOLOGIES CO., LTD.
DEEP SYSTEM OPTIMIZATION
ACCELERATE RESERVOIR SIMULATION
1
4
16
64
256
1024
1 4 16 64 256 1024 4096
Number of cores
Acceleration
Replace hundreds of thin nodes based on typical design with 32 fat nodes
Significantly reduce costs and complexity of reservoir simulation practice
32 x Fat node
1 x Parallel
File Storage
Computing network(EDR IB)
Management network(GE)
Page 15 HUAWEI TECHNOLOGIES CO., LTD.
IN-MEMORY COMPUTING
ACCELERATE REAL-TIME ANALYTICS
SnapVX: http://snap.stanford.edu/snapvx
FusionServer RH8100 V3
12TB RAM
24TB RAM
SnapVX: http://snap.stanford.edu/snapvxKunLun 9032
Page 16 HUAWEI TECHNOLOGIES CO., LTD.
Emerging Workload
LEAP FORWARD WITH HUAWEI INNOVATIONS
Enabling HPC Cloud
Open Telekom Cloud Unified HPC and Big Data Platform
Big Data Acceleration
HPC Class Hardware
• InfiniBand Fabric
• Hardware Accelerators
• Bare Metal Compute Node
Advancing Cloud Software Stack
• HPC class storage
• Container support
• Same stack for private & public
cloud
Emerging Hardware Technology
• Big In-Memory Compute Node
• New Storage Class Memory
• FPGA and custom accelerator
Advancing Big Data Software
• Massive streaming data
• Millisecond latency
• Artificial Intelligence
Business Driven Innovation
• Team with customers to
identify new business
problems
• Creative use of new
technology such as IoT and
AI
• Partner with industry leaders
AI/ML/DL
Page 17 HUAWEI TECHNOLOGIES CO., LTD.
Manufacturing CAE/CFD Education/Research/Supercomputing
HUAWEI HPC MOMENTUM
Chip Design & Manufacturing
Oil & Gas ExplorationEnergy Production & Distribution Digital Media
Page 18 HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI HPC SOLUTIONS
MAXIMIZE ACCELERATE ADAPT

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A Fresh Look at HPC from Huawei Enterprise

  • 1. www.huawei.comHUAWEI TECHNOLOGIES CO., LTD. A Fresh Look at HPC HUAWEI TECHNOLOGIES Francis Lam Director, Product Management
  • 2. Page 2 HUAWEI TECHNOLOGIES CO., LTD. WORLD CLASS HPC SOLUTIONS TODAY 170+ Countries 2016 Revenue USD 16 R&D Centers 36 Joint Innovation Centers #3 Top Server Vendor WW Standalone Compute Node 1P-32P Modular HPC Systems NVMe SSD HPC storage Big Data storage Network Fabric Modular & Container Data center $74.8B of Revenue in R&D 14.2% Huawei FusionServer OceanStor CloudEngine Reduce Complexity More Performance / $ Design for Growth HPC Private Cloud 》》 Petascale System Direct Liquid Cooling Workload Optimization Ecosystem Partnership 》》
  • 3. Page 3 HUAWEI TECHNOLOGIES CO., LTD. 300+ World Records For Computing Performance Flexible Density Optimized Rack Mount Servers High Performance Blades Large Scale Deployment SERVERS FOR HIGH PERFORMANCE COMPUTING RH5885 RH8100 RH1288/2288 KunLun 16/32S System RH5288 NVMe SSD card Acceleration GPGPU/Phi E9000 X6800
  • 4. Page 4 HUAWEI TECHNOLOGIES CO., LTD. MAXIMIZE EFFICIENCY ACCELERATE WORKLOAD MAXIMIZE PERFORMANCE FOR INDIVIDUAL WORKLOAD  Flexible, modular architecture  Multiple innovative form factors  Deep optimization with hardware acceleration  Super Fat nodes ADAPT TO CHANGE FUTURE PROOF  Solve problem using emerging hardware technologies  Single HPC cluster and storage system for both traditional HPC MPI workload and Hadoop  Leverage flexibility and expandability of cloud technology HUAWEI ADVANTAGES MORE COMPUTE LESS SPACE LOWER POWER CONSUMPTION  End-to-end energy efficient design  HVDC  High Ambient Temperature ~40oC  Direct Liquid Cooling ~ 84% coverage  Tight integration with Huawei data center infrastructure SDS Big Data SDI
  • 5. Page 5 HUAWEI TECHNOLOGIES CO., LTD. Energy Efficient Server Design Bottom line of Greener IT Higher Temperature Up to 8%↓ WW DC power consumption w/ 5ºC↑ HVDC Up to 9-15% conversion efficiency improvement Free Air Cooling Up to 20-70% cooling saving In-Memory Computing Up to 90+% less power consumption than HDD-based SSD Storage Up to 60+% less power consumption than HDD-based Air Containment Up to 30%↑ in cooling efficiency Green IT Reduces Energy Bill & CO2 Emission, Extends DC Life, Lowers TCO Hot Water Eliminate Chiller Free cooling Right-sized Power ~20% better power & cooling utilization END-TO-END GREEN HPC DESIGN Hardware Acceleration ~ 2X+ Performance Per Watt
  • 6. Page 6 HUAWEI TECHNOLOGIES CO., LTD. CPU Load XH620 V3(X6800) 1U Server Watt Saving Per Node % Power Saving Per Node 100% 303 313 10 3% 90% 267 283 16 6% 80% 225 235 10 4% 70% 191 206 15 7% 60% 166 183 17 9% 50% 152 164 12 7% 40% 139 151 12 8% 30% 127 138 11 8% 20% 114 125 11 9% 10% 101 112 11 10% 0% 61 73 11.5 16% X6800 Vs. Workload:SPECpower2008,Power Meter:WT210,Thermometer:Digi Watchport/H 1U Server POWER EFFICIENT FORM FACTORS
  • 7. Page 7 HUAWEI TECHNOLOGIES CO., LTD. HUAWEI FUSIONSERVER LIQUID COOLING SYSTEM • FusionServer LCS is composed of Liquid Cooling Rack and external CDU • CPU, Memory and VRD are cooled directly by up to 45 ℃ water • Chiller is optional, cooling PUE < 1.1 • Industry leading serviceability
  • 8. Page 8 HUAWEI TECHNOLOGIES CO., LTD. MAXIMIZE EFFICIENCY DIRECT LIQUID COOLING 40% Energy SavingPoznan Supercomputing and Networking Center (PSNC) 513960 460572 925,128 552,686 0 100000 200000 300000 400000 500000 600000 700000 800000 900000 1000000 Air cooling (PUE=1.8) Liquid cooling (PUE=1.2) Devices Rooms - 40.3% Note: Compared with the air cooling, the liquid cooling saves 3.26 million kWh power consumption for PSNC each year.
  • 9. Page 9 HUAWEI TECHNOLOGIES CO., LTD. Scalability I/O Storage Memory bandwidth Memory capacity CPU Workload Characteristics WORKLOAD OPTIMIZED HIGH PERFORMANCE BLADES Maximize CPU compute density Maximize Memory Per Core Maximize Memory BandwidthMaximize Local Storage Per Node Maximize I/O, Hardware Acceleration
  • 10. Page 10 HUAWEI TECHNOLOGIES CO., LTD. E9000 HIGH PERFORMANCE BLADE SYSTEMChassis E9000 chassis Chassis Computenode CH121 V3 Switchmodule Switch module CH220 V3CH140 V3 Half-width 2-socket compute node High density Large memory capacity Adopts a modular design for computing, storage, switching, power supply, and cooling. 12-U-high chassis, providing 8 full-width or 16 half-width slots. Supports next 3 generations of high-performance Intel CPUs. Supports next-decade network technology evolution. Compute node CH222 V3 CH226 V3 CH242 V3 Half-width 2*2-socket twin compute nodes Super high density Outstanding computing capability Full-width I/O expansion compute node Large memory 6*PCIe slots Full-width storage node Large memory 15*2.5'' HDDs/SSDs Full-width storage node Large memory 6*3.5'' HDDs Full-width 4-socket compute node Outstanding computing capability (E7 v2, E7 v3) Superb storage and I/O expansion capability GE 10GE/FCoE converged Ethernet IB FDR/EDR Multi-plane switch module8G/16G FC 40GE CX110 CX310 CX311CX116 pass- through CX317/CX318 pass-through CX611 10GE+FC CX912 CX111 CX210 8G FC GE+FC CX915 CX710CX220 16G FC CH225 V3 Full-width storage node All-flash 12*NVMe SSDs
  • 11. Page 11 HUAWEI TECHNOLOGIES CO., LTD. X6800 HIGH DENSITY RACK MOUNT SERVERS XH628 V3 XH622 V3 XH620 V3 High Density Compute Node Big Data Storage Node Hardware acceleration Node
  • 12. Page 12 HUAWEI TECHNOLOGIES CO., LTD. BROAD RANGE OF NVME SSD SERVERS 4 ╳ NVMe RH1288 V3 2 ╳ NVMe XH620 V3 12 ╳ NVMe RH2288H V3 24 ╳ NVMe RH2288H V3 4 ╳ NVMe 5288 V3 4 ╳ NVMe RH2288(H) V3 NVMe SSD Disk 2 ╳ NVMe CH121 V3 12 ╳ NVMe CH225 V3 4 ╳ NVMe CH242 V3 4 ╳ NVMe RH5885(H) V3 8 ╳ NVMe RH8100 V3 Blade Server X6800(4U8) 6 ╳ NVMe XH321 V3 High-Density Server X6000(2U4) E9000
  • 13. Page 13 HUAWEI TECHNOLOGIES CO., LTD. FUSIONSERVER X6000 — HIGH-DENSITY SERVER Front View Rear View 24 NVMe SSDs or SAS/SATA HDDs Unified management network port platinum AC PSUs (hot-swappable, 1+1 redundancy) 2 PCIe slots LOM service port Node management port Universal connector port
  • 14. Page 14 HUAWEI TECHNOLOGIES CO., LTD. DEEP SYSTEM OPTIMIZATION ACCELERATE RESERVOIR SIMULATION 1 4 16 64 256 1024 1 4 16 64 256 1024 4096 Number of cores Acceleration Replace hundreds of thin nodes based on typical design with 32 fat nodes Significantly reduce costs and complexity of reservoir simulation practice 32 x Fat node 1 x Parallel File Storage Computing network(EDR IB) Management network(GE)
  • 15. Page 15 HUAWEI TECHNOLOGIES CO., LTD. IN-MEMORY COMPUTING ACCELERATE REAL-TIME ANALYTICS SnapVX: http://snap.stanford.edu/snapvx FusionServer RH8100 V3 12TB RAM 24TB RAM SnapVX: http://snap.stanford.edu/snapvxKunLun 9032
  • 16. Page 16 HUAWEI TECHNOLOGIES CO., LTD. Emerging Workload LEAP FORWARD WITH HUAWEI INNOVATIONS Enabling HPC Cloud Open Telekom Cloud Unified HPC and Big Data Platform Big Data Acceleration HPC Class Hardware • InfiniBand Fabric • Hardware Accelerators • Bare Metal Compute Node Advancing Cloud Software Stack • HPC class storage • Container support • Same stack for private & public cloud Emerging Hardware Technology • Big In-Memory Compute Node • New Storage Class Memory • FPGA and custom accelerator Advancing Big Data Software • Massive streaming data • Millisecond latency • Artificial Intelligence Business Driven Innovation • Team with customers to identify new business problems • Creative use of new technology such as IoT and AI • Partner with industry leaders AI/ML/DL
  • 17. Page 17 HUAWEI TECHNOLOGIES CO., LTD. Manufacturing CAE/CFD Education/Research/Supercomputing HUAWEI HPC MOMENTUM Chip Design & Manufacturing Oil & Gas ExplorationEnergy Production & Distribution Digital Media
  • 18. Page 18 HUAWEI TECHNOLOGIES CO., LTD. HUAWEI HPC SOLUTIONS MAXIMIZE ACCELERATE ADAPT