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ESCCON 2011
European Components Initiative
Part 1: ESA
M. Nikulainen, L. Marchand
16th of March 2011
European Components Initiative
Introduction
ECI started in 2004
– Combined effort of the Agency supported and complemented by National
Initiatives by the Member states, most notably CNES (F) and DLR (D).
– ECI Phase 1 (2004-2010)
–
Reduce the dependence on the supply of EEE components from sources
subject to export restrictions
–
Target was “Pin to Pin” compatible replacements for US ITAR devices.
–
Key developments: Power Mosfets, Fuses, Relays , MMICs, Mixers, PLL,
1553.
– ECI Phase 2 (2009-2011)
–
Competitive alternatives (cost and time to market) in Europe.
–
Key developments: MMICs, PLL(s), Capacitors, Fuses, Optical connectors.
FPGA(s).
– ECI Phase 3 (2011-2014) (To be approved)
–
Access to strategic components and technologies
–
Key developments: DSM, large FPGA, High Pin Count assembly
Technologies.
For full listing of components developed or in development through the
European Components Initiative see:
……https://spacecomponents.org/public/eci/
Typical Strategic New Component Technology
Timeline from R&D to Commercialization
Investment must be timed carefully in order to meet the
time-to-market requirements of the customers.
Typ 2-3 years

R&D
Phase

Up to 2-3 years
Extended
Development/
contingencies

Typ 1-2 y

Evaluation /
Qualification

Typ 5 -10 years

Product
Commercialisation

ECI
Typically 10 years !
Initial Investment

Return on
Investment
Expected impact of ECI on the availability of
European Qualified Components

Start of
ECI 1

Start of
ECI 2

Proposed Start of ECI 3

Qualified
Certificates

Qualified
manufacturers

2015

2014

2013

2012

2011

2010

2009

2008

2007

2006

Forecast data

2005

140
130
120
110
100
90
80
70
60
50
40
30
20

2004

Number listed in QPL/QML

European Space Qualified Components
European Component Initiative

Between 2000 and 2006 the number of European components used in European
satellites had steadily declined
Today the Trend is turning: e.g. European (47%) to non-European (53%) EEE parts
used on the ESA SWARM project.
100
90

% Eu ro p ean p arts

80
70

METOP

Herschel Planck
SWARM

60
JWST

50
40
30
20
10
0
1994

Number of parts
Value of parts

1996

1998

2000

2002

2004

2006

2008

2010

2012

Challenge to commit end-users for ECI Parts !
ECI: Market Success Stories

•

ATMEL (F) : AT697(E&F) microprocessor
• Rapidly increasing world-wide sales

•

Schurter (CH): MGA-S Fuses (PCB,SMT Mount)
• 27000+ Fuses (Spain, GB, Germany, France, Italy, USA, India, Israel,
Russia).

•

Peregrine (F): ITAR free PLL (3.5 Ghz factional N ):
• TAS-F, NT space, TESAT, TOPREL, Spur, Astrium.

•

UMS (F) : European Schottky diode BES Process
• 100+ wafers manufactured

•

CTM (F): Hybrid Mixers (MXF-01, MXF-02, MXF-03)
• TAS, TESAT, Mier, CNRS,Sentinel 3, Galileo, Exomars

•

OMMIC(F) : MMIC Mixers ( CGY2180, CGY2182, CGY2183)
ECI Phase : Lessons Learnt
(….and taken into account for ECI Phase II and Beyond)
•

“Pin to Pin” replacements difficult to sell to existing designs.

•

The pace of terrestrial component developments is accelerating and
consequently product life cycles are getting shorter, leading to obsolescence
issues. Need to intensify dialogue with technology providers for terrestrial
applications.

•

Need to streamline the governance to get ECI activities kicked off earlier and
have products available when required by the market, active dialogue with
member states.

•

Need to continue working together with other Agencies, Industry and Global
partners, to maximise our resources and budget available.

•

Need to invest time and money into investigating the potential and testing
commercial technologies.

•

Need for balanced investment across the entire EEE Component supply
capabilities.
Balanced Investment - Required
Capabilities/ Competencies

e.g. ATMEL (F), STm (I), TESAT (D), Alter (ES)

e.g.
System Integrtaors
(F),(D),(I),(F),(UK)

Commercialization,
Quality control

Equipment
Suppliers
CAD
vendors

e.g.
MHS (F)
SERMA (F)

IC Design
expertise +
space reqs

Assembly,
Packaging, E2V (F), (CH)
test

Design
Houses

HCM(F)

Alter (ES)
EGGA (CZ)

IC
Manufacturing
fabs

e.g. Lfoundry (D)/(F), STm (I)/(F), XFab (UK)/(D), AMS (A)
Infineon (D),ON (B), IHP (D)
Plus start cooperation with foundries in Far East
ECI Phase 3: Process and Current Status
–

ECI 3 work-plan
–
–

Work-plan prioritised and endorsed by SCSB .

–
–

created by ESA, CNES,DLR, Component manufacturers and end
users
ESA TECNET has confirmed the importance of the highest priority items to
ESA future programmes.

Approval Process
–

2010 : IPC Information note / Informal meeting with IPC delegates, ESA,
Eurospace, System Integrators and Equipment suppliers.
–

–

The importance of the strategic EEE Components and the
need for long term stable and sustainable funding for EEEComponents has been unanimously agreed !!.

2011: Mechanism for providing short term funding (2011-2012) has been
agreed at the Administration and Finance Committee (AFC), and “Decision
paper” submitted to ESA Council for the short term funding and inviting
ESA to build up a proposal for long term stable and sustainable funding for
Ministerial Council in 2012.
–

Council meeting is TODAY !!

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European Space components initiative

  • 1. ESCCON 2011 European Components Initiative Part 1: ESA M. Nikulainen, L. Marchand 16th of March 2011
  • 2. European Components Initiative Introduction ECI started in 2004 – Combined effort of the Agency supported and complemented by National Initiatives by the Member states, most notably CNES (F) and DLR (D). – ECI Phase 1 (2004-2010) – Reduce the dependence on the supply of EEE components from sources subject to export restrictions – Target was “Pin to Pin” compatible replacements for US ITAR devices. – Key developments: Power Mosfets, Fuses, Relays , MMICs, Mixers, PLL, 1553. – ECI Phase 2 (2009-2011) – Competitive alternatives (cost and time to market) in Europe. – Key developments: MMICs, PLL(s), Capacitors, Fuses, Optical connectors. FPGA(s). – ECI Phase 3 (2011-2014) (To be approved) – Access to strategic components and technologies – Key developments: DSM, large FPGA, High Pin Count assembly Technologies. For full listing of components developed or in development through the European Components Initiative see: ……https://spacecomponents.org/public/eci/
  • 3. Typical Strategic New Component Technology Timeline from R&D to Commercialization Investment must be timed carefully in order to meet the time-to-market requirements of the customers. Typ 2-3 years R&D Phase Up to 2-3 years Extended Development/ contingencies Typ 1-2 y Evaluation / Qualification Typ 5 -10 years Product Commercialisation ECI Typically 10 years ! Initial Investment Return on Investment
  • 4. Expected impact of ECI on the availability of European Qualified Components Start of ECI 1 Start of ECI 2 Proposed Start of ECI 3 Qualified Certificates Qualified manufacturers 2015 2014 2013 2012 2011 2010 2009 2008 2007 2006 Forecast data 2005 140 130 120 110 100 90 80 70 60 50 40 30 20 2004 Number listed in QPL/QML European Space Qualified Components
  • 5. European Component Initiative Between 2000 and 2006 the number of European components used in European satellites had steadily declined Today the Trend is turning: e.g. European (47%) to non-European (53%) EEE parts used on the ESA SWARM project. 100 90 % Eu ro p ean p arts 80 70 METOP Herschel Planck SWARM 60 JWST 50 40 30 20 10 0 1994 Number of parts Value of parts 1996 1998 2000 2002 2004 2006 2008 2010 2012 Challenge to commit end-users for ECI Parts !
  • 6. ECI: Market Success Stories • ATMEL (F) : AT697(E&F) microprocessor • Rapidly increasing world-wide sales • Schurter (CH): MGA-S Fuses (PCB,SMT Mount) • 27000+ Fuses (Spain, GB, Germany, France, Italy, USA, India, Israel, Russia). • Peregrine (F): ITAR free PLL (3.5 Ghz factional N ): • TAS-F, NT space, TESAT, TOPREL, Spur, Astrium. • UMS (F) : European Schottky diode BES Process • 100+ wafers manufactured • CTM (F): Hybrid Mixers (MXF-01, MXF-02, MXF-03) • TAS, TESAT, Mier, CNRS,Sentinel 3, Galileo, Exomars • OMMIC(F) : MMIC Mixers ( CGY2180, CGY2182, CGY2183)
  • 7. ECI Phase : Lessons Learnt (….and taken into account for ECI Phase II and Beyond) • “Pin to Pin” replacements difficult to sell to existing designs. • The pace of terrestrial component developments is accelerating and consequently product life cycles are getting shorter, leading to obsolescence issues. Need to intensify dialogue with technology providers for terrestrial applications. • Need to streamline the governance to get ECI activities kicked off earlier and have products available when required by the market, active dialogue with member states. • Need to continue working together with other Agencies, Industry and Global partners, to maximise our resources and budget available. • Need to invest time and money into investigating the potential and testing commercial technologies. • Need for balanced investment across the entire EEE Component supply capabilities.
  • 8. Balanced Investment - Required Capabilities/ Competencies e.g. ATMEL (F), STm (I), TESAT (D), Alter (ES) e.g. System Integrtaors (F),(D),(I),(F),(UK) Commercialization, Quality control Equipment Suppliers CAD vendors e.g. MHS (F) SERMA (F) IC Design expertise + space reqs Assembly, Packaging, E2V (F), (CH) test Design Houses HCM(F) Alter (ES) EGGA (CZ) IC Manufacturing fabs e.g. Lfoundry (D)/(F), STm (I)/(F), XFab (UK)/(D), AMS (A) Infineon (D),ON (B), IHP (D) Plus start cooperation with foundries in Far East
  • 9. ECI Phase 3: Process and Current Status – ECI 3 work-plan – – Work-plan prioritised and endorsed by SCSB . – – created by ESA, CNES,DLR, Component manufacturers and end users ESA TECNET has confirmed the importance of the highest priority items to ESA future programmes. Approval Process – 2010 : IPC Information note / Informal meeting with IPC delegates, ESA, Eurospace, System Integrators and Equipment suppliers. – – The importance of the strategic EEE Components and the need for long term stable and sustainable funding for EEEComponents has been unanimously agreed !!. 2011: Mechanism for providing short term funding (2011-2012) has been agreed at the Administration and Finance Committee (AFC), and “Decision paper” submitted to ESA Council for the short term funding and inviting ESA to build up a proposal for long term stable and sustainable funding for Ministerial Council in 2012. – Council meeting is TODAY !!