This document summarizes a study on disassembling electronic components from printed circuit boards. The study aimed to detach components from both sides of boards while minimizing powder generation. An apparatus using infrared heating and horizontal impact was tested. Testing showed 93.92% removal efficiency at 250°C and 1 RPM. Components were effectively removed from both sides of boards. Processing 5 boards took an average of 57.75 seconds, indicating potential for continuous, large-scale processing. The study demonstrates an effective method for disassembling circuit boards with minimal damage.
The document provides an overview of semiconductor technology and industry. It discusses the history and evolution of transistor technology from the point contact transistor to today's nanowire transistors. It describes Moore's law and how transistor counts have increased exponentially over time due to scaling. The document also outlines the semiconductor manufacturing process and describes the infrastructure required for wafer fabrication facilities. It analyzes cost structures, yield optimization, and industry consolidation trends. Finally, it discusses future opportunities around applications like 5G, AI, and big data driving demand rather than technology alone.
Every Media Works [www.everymediaworks.com] is a Creative Design Agency, that Creates State of the Art Business Presentation and other Multimedia Creative Content for its Clients. Here is one of the Business Presentation that we have Created for SandFits Foundries Pvt. Ltd. Disclaimer : This is for Demonstrative Purposes and not to be used for Commercial Purposes. The Content is Copyrighted to SandFits Foundries Pvt. Ltd. and the usage of Contents can solely be done with discretion of the Content Owner and SandFits Foundries Pvt. Ltd..
The document discusses the Intel Xeon Processor E5-2600 v3 product family. It provides significant performance improvements over previous generations through additions like 50% more cores and cache as well as hardware enhancements. These improvements help address growing demands on data center infrastructure. The new processors also provide benefits like improved security, virtualization, efficiency and a lower total cost of ownership.
Dokumen ini membahas tentang besaran dan satuan dalam fisika, dijelaskan bahwa besaran adalah sesuatu yang memiliki ukuran dan nilai sedangkan satuan adalah pembanding dalam pengukuran. Besaran dibagi menjadi besaran pokok yang tidak dapat dibagi lagi dan besaran turunan yang masih dapat berubah-ubah. Dimensi adalah cara menyusun besaran dari besaran pokok.
This document discusses the results of a rocket experiment conducted by a group of students. They tested rockets made with varying amounts of clay and water to achieve the highest level of accuracy. Their rockets achieved an accuracy rate of 99.6% after testing different clay weights and water volumes.
This document summarizes research aiming to develop methods to quantify dispersion and mixing of contaminants in vegetated ponds and wetlands. The research uses laser-induced fluorometry to capture high-resolution concentration data from dye tracer injections, allowing characterization of mixing in heterogeneous vegetated flows. Preliminary laser-induced fluorometry images show promise. Field studies also examine how vegetation alters residence times and can cause short-circuiting. The research seeks to understand how vegetation density, growth, and discharge influence mixing to improve designs of natural infrastructure using wetlands for pollution remediation.
The document provides an overview of semiconductor technology and industry. It discusses the history and evolution of transistor technology from the point contact transistor to today's nanowire transistors. It describes Moore's law and how transistor counts have increased exponentially over time due to scaling. The document also outlines the semiconductor manufacturing process and describes the infrastructure required for wafer fabrication facilities. It analyzes cost structures, yield optimization, and industry consolidation trends. Finally, it discusses future opportunities around applications like 5G, AI, and big data driving demand rather than technology alone.
Every Media Works [www.everymediaworks.com] is a Creative Design Agency, that Creates State of the Art Business Presentation and other Multimedia Creative Content for its Clients. Here is one of the Business Presentation that we have Created for SandFits Foundries Pvt. Ltd. Disclaimer : This is for Demonstrative Purposes and not to be used for Commercial Purposes. The Content is Copyrighted to SandFits Foundries Pvt. Ltd. and the usage of Contents can solely be done with discretion of the Content Owner and SandFits Foundries Pvt. Ltd..
The document discusses the Intel Xeon Processor E5-2600 v3 product family. It provides significant performance improvements over previous generations through additions like 50% more cores and cache as well as hardware enhancements. These improvements help address growing demands on data center infrastructure. The new processors also provide benefits like improved security, virtualization, efficiency and a lower total cost of ownership.
Dokumen ini membahas tentang besaran dan satuan dalam fisika, dijelaskan bahwa besaran adalah sesuatu yang memiliki ukuran dan nilai sedangkan satuan adalah pembanding dalam pengukuran. Besaran dibagi menjadi besaran pokok yang tidak dapat dibagi lagi dan besaran turunan yang masih dapat berubah-ubah. Dimensi adalah cara menyusun besaran dari besaran pokok.
This document discusses the results of a rocket experiment conducted by a group of students. They tested rockets made with varying amounts of clay and water to achieve the highest level of accuracy. Their rockets achieved an accuracy rate of 99.6% after testing different clay weights and water volumes.
This document summarizes research aiming to develop methods to quantify dispersion and mixing of contaminants in vegetated ponds and wetlands. The research uses laser-induced fluorometry to capture high-resolution concentration data from dye tracer injections, allowing characterization of mixing in heterogeneous vegetated flows. Preliminary laser-induced fluorometry images show promise. Field studies also examine how vegetation alters residence times and can cause short-circuiting. The research seeks to understand how vegetation density, growth, and discharge influence mixing to improve designs of natural infrastructure using wetlands for pollution remediation.
HD-Casting is a leading Chinese manufacturer and supplier of abrasion resistant replacement castings for various industries. They have been operating since 1999 and specialize in high chrome, ni-hard, and mn-steel grades. HD-Casting produces wear parts for concrete batching plants, asphalt mixing plants, asphalt pavers, and crushers. They aim to become a famous global brand known for their quality, service, and prices.
Anthony Harrelson: Committed to His Career in Biopharmaceuticalswilliams304
Anthony Harrelson is an entrepreneur, a business professional, and a medical professional. The most important work he conducts is within the biopharmaceutical industry. He is currently the CEO and Founder of White Oak Industries Inc., a company that strives to rid the world of infectious diseases through biotechnology. His company regularly works with diseases like HIV, Ebola, Bird Flu, and a variety of others. He is dedicated to stopping Ebola, and other diseases through out the world.
The document summarizes the financial results of Reckon Group for the half year ended June 30, 2015. It reported 6% revenue growth to $54 million, 5% EBITDA growth to $20.2 million, and 8% EPS growth. Key points include continued growth in subscription revenue, investment in new products and markets, and 10% growth in accounting practice management seats. Ongoing opportunities mentioned are expanding into new sectors, further subscription pricing increases, and launching products internationally.
AI is penetrated among technology driven business. Exponential data would be encrypted on world wide web transparency. Separate the industries, Internet driven and physical manufacturing, unified it forwarding the holistic futures. In the beginning of developed circumstances, few people follows it and early adapting with new innovation. Regarding with automatic cutting edge, would occupy the market.
The document summarizes the development of an apparatus to disassemble electronic components from printed circuit boards. It describes a lab-scale apparatus that achieved a maximum 82.6% disassembly ratio. Based on results, a bench-scale apparatus was developed that incorporated improvements like a feeding/crushing rod. Testing showed this apparatus achieved a 94% disassembly ratio and could process 15 kg/hr of printed circuit boards. The apparatus provides an effective way to recover valuable metals from electronic waste through separation of components.
This document provides an overview of printed circuit boards (PCBs), including what they are, common materials, types, parts, pros and cons, layout issues, electromagnetic interference (EMI), and design process. PCBs electrically connect electronic components using conductive tracks laminated onto a non-conductive substrate. Key topics covered include signal routing, component placement, layer stacking, and techniques to reduce EMI such as ground plane segmentation and trace spacing. The conclusion emphasizes minimizing inductance to reduce emissions through optimal component placement and shortest possible high-speed signal routes.
This document is a seminar report on PCB design submitted by Sadguru Kishor Lonari to the Department of Electronics and Telecommunication Engineering at Government College of Engineering, Yavatmal. The report provides an overview of printed circuit boards, including their history and development, common types of PCB layers, components required for manufacturing, and the basic steps involved in the PCB design and manufacturing process. It discusses applications of PCBs and analyzes their advantages and disadvantages. The conclusion discusses potential future enhancements to PCB design technologies.
IRJET- A Review Study of Thermal Electrical Model using ANSYS SoftwareIRJET Journal
This document summarizes a research study that used ANSYS software to design a thermal-electrical model for sparks generated during electrical discharge machining (EDM) and determine temperature distribution. The study aimed to model the EDM process, predict maximum temperature, and estimate material removal rate from the workpiece. Experiments were conducted using different pulse on-times and currents on an EN-19 workpiece. Results showed that material removal rate increased with higher current and pulse on-time, and was in agreement with finite element analysis results. The temperature distribution curve was also able to estimate the maximum material removal rate.
Multi-Objective Optimization of EDM process parameters using Taguchi-Grey Rel...IRJET Journal
This document presents a study that uses Taguchi-Grey Relational Analysis to optimize the EDM process parameters for aluminum work material with a copper electrode. The objectives are to maximize the material removal rate and minimize the tool wear rate and surface roughness. Experiments are conducted with four machining parameters (discharge current, pulse on time, flushing pressure, and polarity) each at two levels. Response data is analyzed using Grey Relational Analysis to determine the optimal parameter combination and ranking. The optimal levels found are discharge current of 16A, pulse on time of 1010 μs, flushing pressure of 5kgf/cm2, and normal polarity. Analysis of variance indicates that discharge current has the most significant influence on the output responses
Optimization of MRR in EDM Process with Different Job Material i.e Stainless ...IJERA Editor
Electro discharge machining (EDM) has been recognized as an efficient method of producing dies and machining of hard material such as ceramics and high strength metal matrix composites for the modern metal industry (1). In this process the metal are remove through melting or vaporization of job metal by high frequency spark discharge. Although in this process the metal removal rate is lower than the other non-conventional machining process. But the dimensional accuracy is higher than the other process and more complex shape can be produce generally composite material are fascinated as thy exhibit exceptional mechanical and physical properties such as high strength, high hardness, and high density at elevated temperature. For this extra ordinary behavior it has wide range of application on the metal industries like aerospace, dies or mould making industries, automobiles industries etc. The metal removal rate (M.R.R.) and surface smoothness not only depend on the selection of tool material also depend on the number of input parameter (such-input current, voltage, spindle speed, duty factor, dielectric medium), job metal property (conductivity ,hardness, strength, density etc.),machine condition and machining condition(machine performances, temperature, depth of cut or area of cut etc.). It is most difficult to select machining condition for optimal performances due to large number of parameters and inherent complexity of material removal mechanism taking place in EDM process. In the present work, the experiments were conducted using Taguchi L9 orthogonal approach, to ascertain the effect of EDM process parameters on material removal rate (MRR) of stain less steel and cast iron by using tool material such copper and graphite.
High Capacity Planar Supercapacitors and Lithium-Ion Batteries byModular Man...Bing Hsieh
High Capacity Planar Supercapacitors and Lithium Ion Batteries by Modular Manufacturing
Novel planar supercapacitors (SC) and lithium ion batteries (LIB) having interdigitated electrodes for large format applications will be presented. We will discuss the design principles of the new planar structures, their potential to give > 5X improvement in capacity over current supercapacitors, their pack designs, as well as low cost fabrication by modular manufacturing. The drawings given in the following link depict the plan view (top) and the cross-sectional view (bottom) of a planar LIB, wherein the dotted and the hatched areas are the positive and the negative electrodes respectively; the gray areas are the current collectors and the gray lines are the grid lines. Unlike the known interdigitated thin film microsupercapacitor design where the current collectors are situated on the top or bottom surfaces of the electrodes and paralleled to the plane of the substrate and can only exert limited weak fringe fields, the current collectors in our new design are running along the sidewalls of the electrodes and are perpendicular to the substrate and can thus provide strong direct fields, as indicated by the purple arrow, to promote facile ion movement across the entire thickness of the electrodes (20-100 µm). In addition, the relatively narrow inter-spaces between two opposite electrodes (20-100 µm) may allow much higher power densities than ever. Due to their scalability and low cost modular manufacturing processes by printing, the new planar SC/LIB may be designed for a wide range of applications such as mobile devices, transportation, and grid and distributed energy storage.
https://drive.google.com/file/d/0B7fDeNQTYRc9VDdOTTVYRmh2QWc/view?usp=sharing
Optimization of process parameters on edm of ti 6 al-4v- materials today paperDr. Bhiksha Gugulothu
This document discusses optimizing process parameters for electrical discharge machining (EDM) of titanium alloy Ti-6Al-4V. Experiments were conducted using Taguchi's L27 orthogonal array to investigate the effects of discharge current, pulse on time, pulse off time, and dielectric fluid on material removal rate and surface roughness. Drinking water provided the highest material removal rate and lowest surface roughness. Analysis of variance showed that discharge current had the greatest influence on material removal rate, followed by pulse on time, while dielectric fluid and discharge current most influenced surface roughness. The maximum material removal rate and minimum surface roughness obtained were 5.46 mm3/min and 2.53 μm respectively using optimized parameters.
Numerically and CFD studies on shell and tube heat exchangersIRJET Journal
1) The document discusses numerically and CFD studies on shell and tube heat exchangers with different baffle layouts.
2) Kern's theoretical approach and ASPEN simulation software were used to model and analyze a shell and tube heat exchanger.
3) Simulation results showed that a single segmental baffle exhibits the best heat transfer rate and mass cost on the shell side, while helical baffles result in less fouling and longer operating lifetime due to less flow-induced vibration.
Electrochemical machining (ECM) is a non-traditional machining process where material is removed from a conductive workpiece through an electrochemical process. In ECM, the workpiece acts as an anode in an electrolyte solution and is dissolved at a controlled rate when a direct current is passed between the workpiece and a cathode tool. ECM can machine very hard materials and achieve a high material removal rate and excellent surface finish without leaving any machine marks. Common applications of ECM include machining gas turbine blades, dies, and complex internal profiles and contours.
Electronics system thermal management optimization using finite element and N...TELKOMNIKA JOURNAL
This document summarizes the optimization of electronics system thermal management using finite element analysis and the Nelder-Mead optimization method. A test sample with 3 components was modeled and optimized to minimize average temperature and area of the printed circuit board (PCB). The results showed temperature reductions of up to 4-8% and a 34% reduction in PCB area. Comparative analyses were also performed on samples from other studies, achieving temperature reductions of up to 23% and area reductions of up to 26%. Overall, the optimization approach significantly improved thermal management and performance while reducing PCB size.
A memory stack on logic 3D IC stack was considered for comparative study of warpage response to two different process choices, namely, Die to Die (D2D) and Package to Die (P2D) assembly. Process and reliability modeling software CielMech, and Commercial Finite Element Analysis (FEA) software ANSYS Mechanical were utilized to simulate thermo-mechanical effects of sequential chip attach, underfilling and encapsulation process steps for the chosen flows. Warpage at room temperature as well as attach temperature after each attach step were compared. Results indicated that underfill, substrate, and mold compound thermal strains play important roles in warpage evolution. Significant differences in the final assembled state warpage was predicted and is attributable to path dependence of warpage evolution.
Ein 3390 chap 19 nontraditional machining fall 2011Lenie Sta Romana
This document provides an overview of non-traditional machining (NTM) processes, including chemical, electrochemical, thermal, and mechanical methods. It discusses specific NTM processes such as chemical machining, electrochemical machining, electrical discharge machining, electron beam machining, and laser beam machining. For each process, it describes the basic material removal mechanism, advantages and limitations, and design considerations. Tables provide data on material removal rates and melting temperatures for various NTM processes.
HD-Casting is a leading Chinese manufacturer and supplier of abrasion resistant replacement castings for various industries. They have been operating since 1999 and specialize in high chrome, ni-hard, and mn-steel grades. HD-Casting produces wear parts for concrete batching plants, asphalt mixing plants, asphalt pavers, and crushers. They aim to become a famous global brand known for their quality, service, and prices.
Anthony Harrelson: Committed to His Career in Biopharmaceuticalswilliams304
Anthony Harrelson is an entrepreneur, a business professional, and a medical professional. The most important work he conducts is within the biopharmaceutical industry. He is currently the CEO and Founder of White Oak Industries Inc., a company that strives to rid the world of infectious diseases through biotechnology. His company regularly works with diseases like HIV, Ebola, Bird Flu, and a variety of others. He is dedicated to stopping Ebola, and other diseases through out the world.
The document summarizes the financial results of Reckon Group for the half year ended June 30, 2015. It reported 6% revenue growth to $54 million, 5% EBITDA growth to $20.2 million, and 8% EPS growth. Key points include continued growth in subscription revenue, investment in new products and markets, and 10% growth in accounting practice management seats. Ongoing opportunities mentioned are expanding into new sectors, further subscription pricing increases, and launching products internationally.
AI is penetrated among technology driven business. Exponential data would be encrypted on world wide web transparency. Separate the industries, Internet driven and physical manufacturing, unified it forwarding the holistic futures. In the beginning of developed circumstances, few people follows it and early adapting with new innovation. Regarding with automatic cutting edge, would occupy the market.
The document summarizes the development of an apparatus to disassemble electronic components from printed circuit boards. It describes a lab-scale apparatus that achieved a maximum 82.6% disassembly ratio. Based on results, a bench-scale apparatus was developed that incorporated improvements like a feeding/crushing rod. Testing showed this apparatus achieved a 94% disassembly ratio and could process 15 kg/hr of printed circuit boards. The apparatus provides an effective way to recover valuable metals from electronic waste through separation of components.
This document provides an overview of printed circuit boards (PCBs), including what they are, common materials, types, parts, pros and cons, layout issues, electromagnetic interference (EMI), and design process. PCBs electrically connect electronic components using conductive tracks laminated onto a non-conductive substrate. Key topics covered include signal routing, component placement, layer stacking, and techniques to reduce EMI such as ground plane segmentation and trace spacing. The conclusion emphasizes minimizing inductance to reduce emissions through optimal component placement and shortest possible high-speed signal routes.
This document is a seminar report on PCB design submitted by Sadguru Kishor Lonari to the Department of Electronics and Telecommunication Engineering at Government College of Engineering, Yavatmal. The report provides an overview of printed circuit boards, including their history and development, common types of PCB layers, components required for manufacturing, and the basic steps involved in the PCB design and manufacturing process. It discusses applications of PCBs and analyzes their advantages and disadvantages. The conclusion discusses potential future enhancements to PCB design technologies.
IRJET- A Review Study of Thermal Electrical Model using ANSYS SoftwareIRJET Journal
This document summarizes a research study that used ANSYS software to design a thermal-electrical model for sparks generated during electrical discharge machining (EDM) and determine temperature distribution. The study aimed to model the EDM process, predict maximum temperature, and estimate material removal rate from the workpiece. Experiments were conducted using different pulse on-times and currents on an EN-19 workpiece. Results showed that material removal rate increased with higher current and pulse on-time, and was in agreement with finite element analysis results. The temperature distribution curve was also able to estimate the maximum material removal rate.
Multi-Objective Optimization of EDM process parameters using Taguchi-Grey Rel...IRJET Journal
This document presents a study that uses Taguchi-Grey Relational Analysis to optimize the EDM process parameters for aluminum work material with a copper electrode. The objectives are to maximize the material removal rate and minimize the tool wear rate and surface roughness. Experiments are conducted with four machining parameters (discharge current, pulse on time, flushing pressure, and polarity) each at two levels. Response data is analyzed using Grey Relational Analysis to determine the optimal parameter combination and ranking. The optimal levels found are discharge current of 16A, pulse on time of 1010 μs, flushing pressure of 5kgf/cm2, and normal polarity. Analysis of variance indicates that discharge current has the most significant influence on the output responses
Optimization of MRR in EDM Process with Different Job Material i.e Stainless ...IJERA Editor
Electro discharge machining (EDM) has been recognized as an efficient method of producing dies and machining of hard material such as ceramics and high strength metal matrix composites for the modern metal industry (1). In this process the metal are remove through melting or vaporization of job metal by high frequency spark discharge. Although in this process the metal removal rate is lower than the other non-conventional machining process. But the dimensional accuracy is higher than the other process and more complex shape can be produce generally composite material are fascinated as thy exhibit exceptional mechanical and physical properties such as high strength, high hardness, and high density at elevated temperature. For this extra ordinary behavior it has wide range of application on the metal industries like aerospace, dies or mould making industries, automobiles industries etc. The metal removal rate (M.R.R.) and surface smoothness not only depend on the selection of tool material also depend on the number of input parameter (such-input current, voltage, spindle speed, duty factor, dielectric medium), job metal property (conductivity ,hardness, strength, density etc.),machine condition and machining condition(machine performances, temperature, depth of cut or area of cut etc.). It is most difficult to select machining condition for optimal performances due to large number of parameters and inherent complexity of material removal mechanism taking place in EDM process. In the present work, the experiments were conducted using Taguchi L9 orthogonal approach, to ascertain the effect of EDM process parameters on material removal rate (MRR) of stain less steel and cast iron by using tool material such copper and graphite.
High Capacity Planar Supercapacitors and Lithium-Ion Batteries byModular Man...Bing Hsieh
High Capacity Planar Supercapacitors and Lithium Ion Batteries by Modular Manufacturing
Novel planar supercapacitors (SC) and lithium ion batteries (LIB) having interdigitated electrodes for large format applications will be presented. We will discuss the design principles of the new planar structures, their potential to give > 5X improvement in capacity over current supercapacitors, their pack designs, as well as low cost fabrication by modular manufacturing. The drawings given in the following link depict the plan view (top) and the cross-sectional view (bottom) of a planar LIB, wherein the dotted and the hatched areas are the positive and the negative electrodes respectively; the gray areas are the current collectors and the gray lines are the grid lines. Unlike the known interdigitated thin film microsupercapacitor design where the current collectors are situated on the top or bottom surfaces of the electrodes and paralleled to the plane of the substrate and can only exert limited weak fringe fields, the current collectors in our new design are running along the sidewalls of the electrodes and are perpendicular to the substrate and can thus provide strong direct fields, as indicated by the purple arrow, to promote facile ion movement across the entire thickness of the electrodes (20-100 µm). In addition, the relatively narrow inter-spaces between two opposite electrodes (20-100 µm) may allow much higher power densities than ever. Due to their scalability and low cost modular manufacturing processes by printing, the new planar SC/LIB may be designed for a wide range of applications such as mobile devices, transportation, and grid and distributed energy storage.
https://drive.google.com/file/d/0B7fDeNQTYRc9VDdOTTVYRmh2QWc/view?usp=sharing
Optimization of process parameters on edm of ti 6 al-4v- materials today paperDr. Bhiksha Gugulothu
This document discusses optimizing process parameters for electrical discharge machining (EDM) of titanium alloy Ti-6Al-4V. Experiments were conducted using Taguchi's L27 orthogonal array to investigate the effects of discharge current, pulse on time, pulse off time, and dielectric fluid on material removal rate and surface roughness. Drinking water provided the highest material removal rate and lowest surface roughness. Analysis of variance showed that discharge current had the greatest influence on material removal rate, followed by pulse on time, while dielectric fluid and discharge current most influenced surface roughness. The maximum material removal rate and minimum surface roughness obtained were 5.46 mm3/min and 2.53 μm respectively using optimized parameters.
Numerically and CFD studies on shell and tube heat exchangersIRJET Journal
1) The document discusses numerically and CFD studies on shell and tube heat exchangers with different baffle layouts.
2) Kern's theoretical approach and ASPEN simulation software were used to model and analyze a shell and tube heat exchanger.
3) Simulation results showed that a single segmental baffle exhibits the best heat transfer rate and mass cost on the shell side, while helical baffles result in less fouling and longer operating lifetime due to less flow-induced vibration.
Electrochemical machining (ECM) is a non-traditional machining process where material is removed from a conductive workpiece through an electrochemical process. In ECM, the workpiece acts as an anode in an electrolyte solution and is dissolved at a controlled rate when a direct current is passed between the workpiece and a cathode tool. ECM can machine very hard materials and achieve a high material removal rate and excellent surface finish without leaving any machine marks. Common applications of ECM include machining gas turbine blades, dies, and complex internal profiles and contours.
Electronics system thermal management optimization using finite element and N...TELKOMNIKA JOURNAL
This document summarizes the optimization of electronics system thermal management using finite element analysis and the Nelder-Mead optimization method. A test sample with 3 components was modeled and optimized to minimize average temperature and area of the printed circuit board (PCB). The results showed temperature reductions of up to 4-8% and a 34% reduction in PCB area. Comparative analyses were also performed on samples from other studies, achieving temperature reductions of up to 23% and area reductions of up to 26%. Overall, the optimization approach significantly improved thermal management and performance while reducing PCB size.
A memory stack on logic 3D IC stack was considered for comparative study of warpage response to two different process choices, namely, Die to Die (D2D) and Package to Die (P2D) assembly. Process and reliability modeling software CielMech, and Commercial Finite Element Analysis (FEA) software ANSYS Mechanical were utilized to simulate thermo-mechanical effects of sequential chip attach, underfilling and encapsulation process steps for the chosen flows. Warpage at room temperature as well as attach temperature after each attach step were compared. Results indicated that underfill, substrate, and mold compound thermal strains play important roles in warpage evolution. Significant differences in the final assembled state warpage was predicted and is attributable to path dependence of warpage evolution.
Ein 3390 chap 19 nontraditional machining fall 2011Lenie Sta Romana
This document provides an overview of non-traditional machining (NTM) processes, including chemical, electrochemical, thermal, and mechanical methods. It discusses specific NTM processes such as chemical machining, electrochemical machining, electrical discharge machining, electron beam machining, and laser beam machining. For each process, it describes the basic material removal mechanism, advantages and limitations, and design considerations. Tables provide data on material removal rates and melting temperatures for various NTM processes.
The document discusses a study on the effect of electrical discharge machining (EDM) parameters on high carbon-chromium steel. Central composite design was used to conduct experiments varying pulse on time, duty cycle, current, voltage gap, and pressure. Response variables of material removal rate, electrode wear rate, and surface roughness were analyzed. For material removal rate, the linear model best fit the data. Interaction effects best modeled electrode wear rate, with some parameters having high impact. The interaction model also best fit surface roughness data. Overall, the study used statistical methods to develop models relating EDM parameters to response variables for high carbon-chromium steel EDM.
International Journal of Engineering Research and DevelopmentIJERD Editor
Electrical, Electronics and Computer Engineering,
Information Engineering and Technology,
Mechanical, Industrial and Manufacturing Engineering,
Automation and Mechatronics Engineering,
Material and Chemical Engineering,
Civil and Architecture Engineering,
Biotechnology and Bio Engineering,
Environmental Engineering,
Petroleum and Mining Engineering,
Marine and Agriculture engineering,
Aerospace Engineering.
This document discusses hybrid electrochemical machining processes that combine electrochemical dissolution with mechanical or thermal processes to improve material removal rates and surface finish. Specifically, it describes electrochemical grinding, which uses an abrasive grinding wheel to mechanically assist electrochemical dissolution; electrochemical honing, which combines honing stones with electrochemical dissolution; and electrochemical super finishing, laser-assisted electrochemical machining, ultrasonic-assisted electrochemical machining, and electrochemical buffing, all of which add other processes to further enhance electrochemical dissolution and finishing of metal parts. The hybrid processes are able to more efficiently machine difficult materials like alloys while achieving high-quality surfaces.
Panasonic SA-AK450P SA-AK450PC - Manual de servicioAnonimo Goncen
This document summarizes the specifications of an audio system including:
1) Amplifier section with FTC output power up to 380W and RMS output power up to 460W.
2) Tuner section with 20 FM and 15 AM presets, FM sensitivity of 4.0uV, and AM sensitivity of 560uV/m.
3) Cassette deck section with a 4 track, 2 channel design and frequency response of 35Hz to 14kHz.
Sand casting and die casting were identified as potential processes for manufacturing a connector rod. Die casting has higher tooling and capital costs but can produce parts at a faster rate. For small batch sizes, the cost per part is dominated by fixed capital and tooling costs, making sand casting cheaper. However, as batch size increases, die casting becomes more economical due to its higher production rate reducing the impact of fixed costs per part. An analysis is needed to determine the optimal process based on the specific production volumes required.
This document discusses using Grey relational analysis to optimize the parameters in rotary electrical discharge machining (EDM) of P20 steel. Experiments were conducted using an L18 orthogonal array to investigate the effects of workpiece polarity, discharge current, pulse on and off times, and tool rotational speed on material removal rate, tool wear rate, and surface roughness. Response tables and graphs were analyzed to determine the optimal parameter levels that maximize material removal rate while minimizing tool wear rate and surface roughness. Confirmation experiments validated the optimal results, demonstrating that Grey relational analysis is an effective technique for optimizing EDM process parameters.
Experimental Investigations to Study the Impact of Machining Parameters on Mi...IJERA Editor
Plasma arc cutting is extensively used to cut steels and aluminum. Plasma arc cutting was invented in 1950‟s and since then, it became commercial on its advent into the industry. The purpose of this research is to ascertain the influence of various parameters on plasma arc cutting process while machining mild steel. The experiments were conducted using Taguchi L16 orthogonal array with current, voltage, speed, plate thickness as the control parameters and surface roughness, kerf as the response variables. The optimal parameter setting for the machining process is determined by conducting a Grey-Taguchi method. Orthogonal array L16 (4 power 4) of Taguchi, Signal to Noise ratio, the Analysis of Variance(ANOVA) are employed to find the optimal levels and to analyze the optimum levels and to analyze the impact of current, voltage, speed, plate thickness on kerf and surface roughness.
3. Waste electronic appliances
A large amount of waste electronic devices is disposed as life cycle of the
products is growing shorter.
Printed circuit boards assembly(PCBA) has various valuable metals so they are
becoming driving force as key resources of recycling industry.
Necessity of PCBAs recycling
Economic reason: ECs consist of novel metals such as Au and Ag, rare metals
such as Se, Ge and Te,
Environmental reason: they contain toxic metals like Pb and As
For both economic and environmental reasons, ECs disassembly should be
followed prior to printed circuit board recycling
Background
3/25
4. Concept of PCBA disassembly
Background
PCBA
Refining
Metal
PCBs ECs
SeparationGrinding/separation
Metal Metal
Disassembly
Non-metal
4/25
5. “Look and picks” Principle
The components on the boards are
identified by powerful real-time
recognition system, and disassembled
step by step according to their
connection or components types.
The components can be recovered
without damage on them enough to be
reused, the principle itself needs very
high technology system that inevitably
leads to high cost, as well as the
processing speed is too slow to applied
for mass production
Previous studies
PCBA
PCB
“Look and picks”
IC Chip
Capacitors
MLCC
CPU
5/25
6. Previous studies
PCB ECs
“Evacuate and sort”
MLCCCapacitorCPUIC chip
“Evacuate and sort” Principle
regardless of the components type, the
components are simultaneously wiped off,
and subsequent separations, such as
magnetic separation, electrostatic
separation are followed for sorting the
components
possibly can harm the components.
the facility is simpler and more applicable
to large scale.
PCBA
6/25
7. Disassembly apparatus
Previous studies
Fig. 1. Various types of disassembly apparatus in previous studies
(a) S. Yokoyama et al., 『Recycling of Printed Wiring Boards Mounted Electronic Components』, 1997
(b) Huang Haihong et al., 『Study on Disassembling Approaches of Electronic Components Mounted on PCBs』, 2007
(c) Lee et al., 『Disassembly and physical separation of electric electronic components layered in printed circuit boards (PCB)』, 2012
PCBs type Principal points
Detach ECs
on both sides
Regardless of
connection
type
Less powder
and loss
Continuous
process
PCBs from personal computers IR heater, impact/shearing propeller O X O X
- Liquid heating and ultrasonic O O O X
PCBs from VCR To grind solder and displace ECs X O X X
Table 1. Comparison of previous studies about PCBA disassembly
7/25
(a) (b) (c)
8. Four main objectives
to detach the components on both sides of PCB
to detach ECs regardless of their connection types
to minimize generation of powder and loss
to be applied for continuous process
Principal mechanism
‘Evacuate and sort’ type apparatus
chose infrared heater to melt solder to disassemble ECs from boards
the apparatus is designed to employ the horizontal impact force mainly.
Objectives
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9. Experiment
Fig. 2. Printed Circuit Board Assembly used in this study
Waste printed circuit board assembly
Laptop printed circuit board assemblies made by various manufacturers
manually separated from the laptop
populated with many different electronic components
72 pieces of those board assemblies were used.
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10. M M
2
1
4
3
57
8
10 11
12
9
PCBA in
6
13
15
16
17
18
14
PCBA in
(a) (b)
Fig. 3. Electronic components disassembly apparatus used in this study (patent pending, the application number : KR10-2012-0065933): (a)
Structure of disassembly apparatus, 1. Control Panel (controllable factors: rotating speed of feeding rod, rotating speed of steel brush,
heating temperature), 2. PCBA, 3. Feed hopper, 4. Feeding rod, 5. Steel brush, 6. IR heater, 7, 8. Trapezoidal change gear, 9. Product
hopper, 10. Basket, 11, 12. Motors. (b) detailed diagram of disassembly module. 13. PCBA, 14. Feed hopper, 15. Feeding rod, 16. Steel
brush, 17. IR heater, 18. Product hopper.
Experiment
Disassembly apparatus
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11. Experiment
Disassembly evaluation
the heating temperature of IR heater was varied from 200°C to 275°C
rotating speed of feeding rod was varied from 1RPM to 9RPM
6 PCBs were tested at each condition and arithmetic mean of disassembly
efficiency was calculated
ECs removal efficiency (%) =
𝑊1−𝑊2
𝑊1−𝑊3
× 100
Where, W1: weight of PCB with ECs populated
W2: weight of PCB after the processed by the apparatus
W3: weight of PCB without any ECs
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12. Disassembly time
The disassembly time is defined as followed:
𝑡0: the time when a PCBA is fed into the module
𝑡𝑓: the time when a PCBA is removed from the
module
Disassembly time ∆𝑡 = 𝑡𝑓 − 𝑡0
Disassembly time was measured varying the
number of processed PCBAs
The regression equation of disassembly time under
the optimum condition was calculated
Experiment
𝑡 = 𝑡0
𝑡 = 𝑡𝑓
∆𝑡=𝑡𝑓−𝑡0
Disassembly
Module
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13. Connection Electronic components and their frequencies1
Type Figure CPU/GPU IC chip Oscillator
Copper
coil
Capacitor Card slot Ports
Cooling
Fan
Sub
PCB
SMT ++ +++ ++ ++ +++ ++ - - -
TMT - - - - + - ++ - -
Screw
joint
- - - - - + - + -
Rivet - - - - - - + - -
Socket
pedestal
- - - - - + - - +
1+++: Very frequently appeared, more than several tens per board and/or always expected to be appeared
++: Usually appeared, more or less than ten per board and/or always expected to be appeared
+: Rarely appeared, less than five per board and/or usually not appeared
-: Seldom appeared
Table 2. Various types of ECs on laptop PCBA and their frequencies based on connection types
Results and discussion
Laptop PCBA and their ECs
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14. Results and discussion
Laptop PCBA and their ECs
As the electronic devices need higher packaging density, the ECs are getting
smaller and SMT (surface mounting technology) is replacing THT (through-hole
technology)
The SMT makes it possible to mount ECs on both sides of PCB
It is important to scrape both sides of PCBs spontaneously for time efficiency.
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15. Results and discussion
Fig. 4. Electronic component removal efficiency under different
feeder rotating speeds and heating temperatures: (a)
1RPM, (b) 3RPM, (c) 6RPM and (d) 9RPM. Error bars at
each bar indicate standard deviations of measured
removal efficiency (unit: %). At feeder rotating speed of
1RPM, the highest ECs removal efficiency was
accomplished due to sufficient time to melt the solder.
The temperature of 250℃ was high enough to achieve
removal efficiency of 90%
Electronic component removal efficiency under different
conditions
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16. Results and discussion
Electronic component removal efficiency under different
conditions
At the rotating speed faster than 6RPM, the removal efficiency was less than
20 %, As the rotating speed slower than 3RPM, the efficiency becomes
significantly higher.
At the rotating speed of 1RPM and temperature of 250°C, the efficiency is
maximized at 93.92%.
The most common kinds of solder used in electronic appliances are Sn-Pb solder
and Sn-Ag-Cu solder (lead free).
Their melting points rage are around 180-190°C and 170-180°C, respectively,
though they vary with chemical proportion of solder
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17. Results and discussion
PCBAs before and after the process
Fig. 5. Printed circuit board before and after the process (front side)
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18. Results and discussion
PCBAs before and after the process
Fig. 6. Printed circuit board before and after the process (back side)
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19. Results and discussion
PCBAs before and after the process
Fig. 7. A sample of laptop printed circuit boards and electronic components before and after the disassembly process(feeder rotating speed:
1RPM, temperature: 250 oC). (a) slot (SMT), (b) IC chips and condensers (SMT), (c) copper coil and condensers (SMT), (d) ports (THT)
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20. Results and discussion
PCBAs before and after the process
When the temperature rises above the melting point of solder, the components are
easy to be detached from boards
All SMT components are completely removed from the board.
most of the connection between boards and components(CPU/GPU, IC chip,
oscillator, etc.) are SMT
These components have vast majority of valuable metals, so it is necessary to
disassemble these kinds of components effectively
Components connected with other types are also removed well
The crushing (and also feeding) rods do such function that they loosen the
connection between board and the component attached by rivet or screw joint
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21. Weight and weight percentage of disassembly process
products
weight and weight fraction of PCBA and disassembled PCBA parts under the
optimum condition
sample number was 12 EA
generation of loss and abrasion powder is less than 5% which is three times lower
than precedent research of 15%
Results and discussion
PCBA PCB ECs Powder loss
Weight (g) 193.65 87.73 99.5 4.29 2.13
wt.% 100 45.30 51.38 2.22 1.10
Table 3. Weight and weight fraction of disassembly process products
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22. Results and discussion
Fig. 8. Electronic components disassembly time (feeding road
rotating speed: 1RPM). Red line indicates the total removal
time and blue line indicates the average removal time to
process number of boards.
Electronic component dissembly time
𝑡 = 57.75 +
76.38
𝑛
where,
t: average removal time(sec)
n: number of boards
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23. Results and discussion
Electronic component dissembly time
The time was measured in seconds by measuring PCB passing time in the
apparatus and calculating the arithmetic mean of 3 results.
Because it is designed to be continuous process, the next PCB can be put into the
apparatus before the first PCB comes out
the more PCBs are put in, the shorter is the average removal time
This significantly shortens the processing time and is a great advantage to be
applied to massive scale
In about 130 seconds, 1 PCB completely passed the apparatus. For 5 PCBs, the
average removal time was about 70 seconds
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24. Conclusion
The PCB disassembly apparatus was developed and its
performance test was carried out.
The ECs on both sides of Notebook PCBs were scraped regardless their
connection type
The disassembly efficiency of higher than 93% was achieved.
(feeder speed: 1RPM, temperature: 250°C)
The average disassembly time was up to 70 seconds at the feeder’s rotating speed
of 1RPM.
The following further studies are needed:
1) Application on other types of PCBAs (mobile phone, PC, etc.)
2) Application on larger scale capacity
3) Economic analysis of PCB disassembly
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27. Previous studies
K. Feldmann, et al., 『Disassembly of electronic products』, 1994
Presented a significant overview of disassembly technology of printed circuit
board assemblies in waste electronic product.
provided the clear types of connections on boards such as SMT, TMT, screw joint,
etc. as well as comparison of transmission methods for desoldering.
classified the disassembly principles into “Look and picks” and “Evacuate and
sort”
Jianzhi, Li, et al., 『Printed Circuit Board Recycling: A State-of-the-Art
Survey』, 2004
gave an excellent overview of principles and case studies of disassembly
processes
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