This infographic offers the highlights of EP21LVSP6, a low viscosity epoxy system with a long working life of 3-5 hours at room temperature. This high strength compound has low exotherm making it ideal for large castings.
Master Bond Milestones Through the Decades - Part 3Master Bond
As Master Bond celebrates its 40th anniversary, we look back on the many important achievements we’ve had over the years. From custom formulating our first colored epoxy in the 1970s to the introduction of potting and encapsulation compounds that comply with UL 94V-0 flame retardant standards in the 2000s, learn more about how our company and products have evolved.
2016 was a standout year for developing new and innovative products. Let’s take a look back on some adhesives, sealants, coating and encapsulation compounds that were released in this past year.
Silver Filled Epoxy for Bonding & Die Attach ApplicationsMaster Bond
Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.
This infographic highlights one and two component silicone systems that pass ASTM E595 testing for NASA low outgassing. These compounds offer a variety of viscosities and boast high physical, thermal and electrical performance properties.
From Field to Factory, Adhesives for Food Processing EquipmentMaster Bond
Master Bond's line of adhesive compounds for the food processing industry conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. These systems can be used in a variety of applications from storage tanks to containment vessels.
Low Outgassing Approved Adhesives SystemsMaster Bond
This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more. Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
Choosing the most effective adhesive for an electronic application involving sensors is critical. Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Master Bond Milestones Through the Decades - Part 3Master Bond
As Master Bond celebrates its 40th anniversary, we look back on the many important achievements we’ve had over the years. From custom formulating our first colored epoxy in the 1970s to the introduction of potting and encapsulation compounds that comply with UL 94V-0 flame retardant standards in the 2000s, learn more about how our company and products have evolved.
2016 was a standout year for developing new and innovative products. Let’s take a look back on some adhesives, sealants, coating and encapsulation compounds that were released in this past year.
Silver Filled Epoxy for Bonding & Die Attach ApplicationsMaster Bond
Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.
This infographic highlights one and two component silicone systems that pass ASTM E595 testing for NASA low outgassing. These compounds offer a variety of viscosities and boast high physical, thermal and electrical performance properties.
From Field to Factory, Adhesives for Food Processing EquipmentMaster Bond
Master Bond's line of adhesive compounds for the food processing industry conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. These systems can be used in a variety of applications from storage tanks to containment vessels.
Low Outgassing Approved Adhesives SystemsMaster Bond
This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more. Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
Choosing the most effective adhesive for an electronic application involving sensors is critical. Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Low Viscosity Coating Features Superior Acid ResistanceMaster Bond
This document describes the features and specifications of an epoxy coating called EP21ARLV. It has superior acid resistance and was tested in several acids for over 14 months with no failures. It is a low viscosity, two component epoxy that is ideal for small potting and encapsulation applications. It provides reliable electrical insulation and bonds well to many substrates including composites, plastics, ceramics, metals and rubbers.
Medical Grade, UV Curable Adhesives SystemsMaster Bond
Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Underfill Epoxy Offers Thermal Conductivity & Electrical InsulationMaster Bond
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion. EP29LPTCHT also offers high thermal conductivity, electrical insulation and a high tensile modulus. Scroll through our infographic to learn more.
Tough Epoxy Polysulfide System Resists up to 350˚FMaster Bond
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems. Scroll through this infographic to learn more about this new chemically resistant, flexible system.
Free Flowing Encapsulant meets NASA Low Outgassing SpecificationsMaster Bond
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Master Bond was founded in 1976 and formulates over 3,000 grades of adhesives, sealants, coatings, potting and encapsulation compounds that are certified for use across industries. They supply their compounds to top research universities and technology manufacturing companies in the world, with the compounds being applied in a variety of applications including optical assemblies, lasers, e-textiles, packaging, confocal microscopes, prosthetic devices, capacitors, aircraft, medical devices, and plasma physics research. Master Bond offers technical support throughout the design and manufacturing process to help engineers find the most suitable product.
Master Bond EP21TP-2NV features superior thermal shock and chemical resistance while maintaining durable bonds to similar and dissimilar substrates. This tough compound is noted for its ability to withstand prolonged exposure to fuel and oils. EP21TP-2NV cures at ambient temperatures or more rapidly at elevated temperatures and can be applied without sagging.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Scroll through to learn more.
It's What's Inside That Counts - Nanosilica Filled AdhesivesMaster Bond
Learn about Master Bond’s nanosilica filled systems offering enhanced abrasion resistance and dimensional stability.
These specialty formulations feature superior physical properties as well as low shrinkage upon curing. View to learn more!
One Component, Non-Drip Adhesive for Structural Bonding Master Bond
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,000 psi, 3,000 psi and 18,000 psi, respectively. It also offers superb dimensional stability and chemical resistance.
Toughened, Two Component, Room Temperature Curing EpoxyMaster Bond
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time. Browse through this infographic to learn more.
View this infographic to learn about MasterSil 973S-LO, a two part silicone ideal for use in vacuum environments. This NASA low outgassing approved, silver filled system features low volume resistivity and high flexibility. Scroll through to learn more!
Electrically Conductive Epoxy Charges AheadMaster Bond
Nickel filled epoxy system EP21TDCN-LO meets NASA low outgassing specifications and features excellent electrical conductivity. This adhesive and sealant is ideal for use grounding, shielding and static dissipation applications. Scroll through to learn more!
Adhesive Keeps Out UV Light & Lets Light InMaster Bond
Master Bond EP30-2LB epoxy system blocks UV light while allowing the transmission of visible light. This two part, optically clear compound meets NASA low outgassing specifications and features high optical clarity with a refractive index of 1.55.
One part epoxy, Supreme 18TC, contains a blend of special thermally conductive fillers allowing it to maintain outstanding heat transfer capabilities. This smooth paste system can be applied in bond lines as thin as 10-15 microns. Supreme 18TC features ultra low thermal resistance and meets NASA low outgassing specifications.
Master Bond EP112LS is a two part, optically clear system for impregnation, potting, encapsulation, sealing and coating applications. This compound features reliable non-yellowing properties and a refractive index of 1.55. It is ideal for use in aerospace and optoelectronics industries.
Super Toughened Epoxy Resists High Temperatures & ChemicalsMaster Bond
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties. This adhesive offers excellent flow properties and a long working life over a wide service temperature range. Scroll through this infographic to learn more!
Browse though Master Bond's product highlights of 2017! These adhesives, sealants, coatings and encapsulation systems feature unique performance properties and many meet stringent industrial specifications.
Check out Master Bond's innovative product developments of 2017! Browse through our highlighted adhesive, sealant, coating and encapsulation compounds from this year.
Master Bond EP13LTE is a one part epoxy featuring a low coefficient of thermal expansion and high temperature resistance. This system is ideal for structural bonding applications where precise alignment is necessary. The following infographic highlights the exemplary properties of EP13LTE.
3rd International Conference on Artificial Intelligence Advances (AIAD 2024)GiselleginaGloria
3rd International Conference on Artificial Intelligence Advances (AIAD 2024) will act as a major forum for the presentation of innovative ideas, approaches, developments, and research projects in the area advanced Artificial Intelligence. It will also serve to facilitate the exchange of information between researchers and industry professionals to discuss the latest issues and advancement in the research area. Core areas of AI and advanced multi-disciplinary and its applications will be covered during the conferences.
Low Viscosity Coating Features Superior Acid ResistanceMaster Bond
This document describes the features and specifications of an epoxy coating called EP21ARLV. It has superior acid resistance and was tested in several acids for over 14 months with no failures. It is a low viscosity, two component epoxy that is ideal for small potting and encapsulation applications. It provides reliable electrical insulation and bonds well to many substrates including composites, plastics, ceramics, metals and rubbers.
Medical Grade, UV Curable Adhesives SystemsMaster Bond
Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Underfill Epoxy Offers Thermal Conductivity & Electrical InsulationMaster Bond
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion. EP29LPTCHT also offers high thermal conductivity, electrical insulation and a high tensile modulus. Scroll through our infographic to learn more.
Tough Epoxy Polysulfide System Resists up to 350˚FMaster Bond
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems. Scroll through this infographic to learn more about this new chemically resistant, flexible system.
Free Flowing Encapsulant meets NASA Low Outgassing SpecificationsMaster Bond
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Master Bond was founded in 1976 and formulates over 3,000 grades of adhesives, sealants, coatings, potting and encapsulation compounds that are certified for use across industries. They supply their compounds to top research universities and technology manufacturing companies in the world, with the compounds being applied in a variety of applications including optical assemblies, lasers, e-textiles, packaging, confocal microscopes, prosthetic devices, capacitors, aircraft, medical devices, and plasma physics research. Master Bond offers technical support throughout the design and manufacturing process to help engineers find the most suitable product.
Master Bond EP21TP-2NV features superior thermal shock and chemical resistance while maintaining durable bonds to similar and dissimilar substrates. This tough compound is noted for its ability to withstand prolonged exposure to fuel and oils. EP21TP-2NV cures at ambient temperatures or more rapidly at elevated temperatures and can be applied without sagging.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Scroll through to learn more.
It's What's Inside That Counts - Nanosilica Filled AdhesivesMaster Bond
Learn about Master Bond’s nanosilica filled systems offering enhanced abrasion resistance and dimensional stability.
These specialty formulations feature superior physical properties as well as low shrinkage upon curing. View to learn more!
One Component, Non-Drip Adhesive for Structural Bonding Master Bond
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,000 psi, 3,000 psi and 18,000 psi, respectively. It also offers superb dimensional stability and chemical resistance.
Toughened, Two Component, Room Temperature Curing EpoxyMaster Bond
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time. Browse through this infographic to learn more.
View this infographic to learn about MasterSil 973S-LO, a two part silicone ideal for use in vacuum environments. This NASA low outgassing approved, silver filled system features low volume resistivity and high flexibility. Scroll through to learn more!
Electrically Conductive Epoxy Charges AheadMaster Bond
Nickel filled epoxy system EP21TDCN-LO meets NASA low outgassing specifications and features excellent electrical conductivity. This adhesive and sealant is ideal for use grounding, shielding and static dissipation applications. Scroll through to learn more!
Adhesive Keeps Out UV Light & Lets Light InMaster Bond
Master Bond EP30-2LB epoxy system blocks UV light while allowing the transmission of visible light. This two part, optically clear compound meets NASA low outgassing specifications and features high optical clarity with a refractive index of 1.55.
One part epoxy, Supreme 18TC, contains a blend of special thermally conductive fillers allowing it to maintain outstanding heat transfer capabilities. This smooth paste system can be applied in bond lines as thin as 10-15 microns. Supreme 18TC features ultra low thermal resistance and meets NASA low outgassing specifications.
Master Bond EP112LS is a two part, optically clear system for impregnation, potting, encapsulation, sealing and coating applications. This compound features reliable non-yellowing properties and a refractive index of 1.55. It is ideal for use in aerospace and optoelectronics industries.
Super Toughened Epoxy Resists High Temperatures & ChemicalsMaster Bond
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties. This adhesive offers excellent flow properties and a long working life over a wide service temperature range. Scroll through this infographic to learn more!
Browse though Master Bond's product highlights of 2017! These adhesives, sealants, coatings and encapsulation systems feature unique performance properties and many meet stringent industrial specifications.
Check out Master Bond's innovative product developments of 2017! Browse through our highlighted adhesive, sealant, coating and encapsulation compounds from this year.
Master Bond EP13LTE is a one part epoxy featuring a low coefficient of thermal expansion and high temperature resistance. This system is ideal for structural bonding applications where precise alignment is necessary. The following infographic highlights the exemplary properties of EP13LTE.
3rd International Conference on Artificial Intelligence Advances (AIAD 2024)GiselleginaGloria
3rd International Conference on Artificial Intelligence Advances (AIAD 2024) will act as a major forum for the presentation of innovative ideas, approaches, developments, and research projects in the area advanced Artificial Intelligence. It will also serve to facilitate the exchange of information between researchers and industry professionals to discuss the latest issues and advancement in the research area. Core areas of AI and advanced multi-disciplinary and its applications will be covered during the conferences.
Build the Next Generation of Apps with the Einstein 1 Platform.
Rejoignez Philippe Ozil pour une session de workshops qui vous guidera à travers les détails de la plateforme Einstein 1, l'importance des données pour la création d'applications d'intelligence artificielle et les différents outils et technologies que Salesforce propose pour vous apporter tous les bénéfices de l'IA.
Particle Swarm Optimization–Long Short-Term Memory based Channel Estimation w...IJCNCJournal
Paper Title
Particle Swarm Optimization–Long Short-Term Memory based Channel Estimation with Hybrid Beam Forming Power Transfer in WSN-IoT Applications
Authors
Reginald Jude Sixtus J and Tamilarasi Muthu, Puducherry Technological University, India
Abstract
Non-Orthogonal Multiple Access (NOMA) helps to overcome various difficulties in future technology wireless communications. NOMA, when utilized with millimeter wave multiple-input multiple-output (MIMO) systems, channel estimation becomes extremely difficult. For reaping the benefits of the NOMA and mm-Wave combination, effective channel estimation is required. In this paper, we propose an enhanced particle swarm optimization based long short-term memory estimator network (PSOLSTMEstNet), which is a neural network model that can be employed to forecast the bandwidth required in the mm-Wave MIMO network. The prime advantage of the LSTM is that it has the capability of dynamically adapting to the functioning pattern of fluctuating channel state. The LSTM stage with adaptive coding and modulation enhances the BER.PSO algorithm is employed to optimize input weights of LSTM network. The modified algorithm splits the power by channel condition of every single user. Participants will be first sorted into distinct groups depending upon respective channel conditions, using a hybrid beamforming approach. The network characteristics are fine-estimated using PSO-LSTMEstNet after a rough approximation of channels parameters derived from the received data.
Keywords
Signal to Noise Ratio (SNR), Bit Error Rate (BER), mm-Wave, MIMO, NOMA, deep learning, optimization.
Volume URL: https://airccse.org/journal/ijc2022.html
Abstract URL:https://aircconline.com/abstract/ijcnc/v14n5/14522cnc05.html
Pdf URL: https://aircconline.com/ijcnc/V14N5/14522cnc05.pdf
#scopuspublication #scopusindexed #callforpapers #researchpapers #cfp #researchers #phdstudent #researchScholar #journalpaper #submission #journalsubmission #WBAN #requirements #tailoredtreatment #MACstrategy #enhancedefficiency #protrcal #computing #analysis #wirelessbodyareanetworks #wirelessnetworks
#adhocnetwork #VANETs #OLSRrouting #routing #MPR #nderesidualenergy #korea #cognitiveradionetworks #radionetworks #rendezvoussequence
Here's where you can reach us : ijcnc@airccse.org or ijcnc@aircconline.com
A high-Speed Communication System is based on the Design of a Bi-NoC Router, ...DharmaBanothu
The Network on Chip (NoC) has emerged as an effective
solution for intercommunication infrastructure within System on
Chip (SoC) designs, overcoming the limitations of traditional
methods that face significant bottlenecks. However, the complexity
of NoC design presents numerous challenges related to
performance metrics such as scalability, latency, power
consumption, and signal integrity. This project addresses the
issues within the router's memory unit and proposes an enhanced
memory structure. To achieve efficient data transfer, FIFO buffers
are implemented in distributed RAM and virtual channels for
FPGA-based NoC. The project introduces advanced FIFO-based
memory units within the NoC router, assessing their performance
in a Bi-directional NoC (Bi-NoC) configuration. The primary
objective is to reduce the router's workload while enhancing the
FIFO internal structure. To further improve data transfer speed,
a Bi-NoC with a self-configurable intercommunication channel is
suggested. Simulation and synthesis results demonstrate
guaranteed throughput, predictable latency, and equitable
network access, showing significant improvement over previous
designs
An In-Depth Exploration of Natural Language Processing: Evolution, Applicatio...DharmaBanothu
Natural language processing (NLP) has
recently garnered significant interest for the
computational representation and analysis of human
language. Its applications span multiple domains such
as machine translation, email spam detection,
information extraction, summarization, healthcare,
and question answering. This paper first delineates
four phases by examining various levels of NLP and
components of Natural Language Generation,
followed by a review of the history and progression of
NLP. Subsequently, we delve into the current state of
the art by presenting diverse NLP applications,
contemporary trends, and challenges. Finally, we
discuss some available datasets, models, and
evaluation metrics in NLP.
An In-Depth Exploration of Natural Language Processing: Evolution, Applicatio...
Does Your Potting Compound Go with the Flow?
1. DOES YOUR
POTTING COMPOUND
Go With the Flow?
Epoxy features long open
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EASY
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LOW
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EPOXY SYSTEM
EP21LVSP6
LOW
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SUITABLE FOR
LARGE CASTINGS
HIGH
BOND
STRENGTH
TENSILE STRENGTH
>7,000 PSI
LONG
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HOURS
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