The Highs & Lows of Thermal Management
•
0 likes•824 views
One part epoxy, Supreme 18TC, contains a blend of special thermally conductive fillers allowing it to maintain outstanding heat transfer capabilities. This smooth paste system can be applied in bond lines as thin as 10-15 microns. Supreme 18TC features ultra low thermal resistance and meets NASA low outgassing specifications.
Report
Share
Report
Share
Download to read offline
Recommended
Low Outgassing Silicone Adhesives
This infographic highlights one and two component silicone systems that pass ASTM E595 testing for NASA low outgassing. These compounds offer a variety of viscosities and boast high physical, thermal and electrical performance properties.
Ideal for Large Castings Master Bond EP29LPAO
This document describes the features and properties of Masterbond's EP29LPAO epoxy, including its long pot life of 7-9 hours at 75°F, high thermal conductivity of 9-10 BTU-in/ft2-hr-°F, and excellent electrical insulation with a volume resistivity over 1015 ohm-cm. It also highlights characteristics such as superb physical strength with tensile modulus between 450,000-500,000 psi and compressive strength of 24,000-26,000 psi, as well as low viscosity and good flow for large castings.
Low Outgassing Approved Adhesives Systems
This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more. Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
Free Flowing Encapsulant meets NASA Low Outgassing Specifications
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Low Viscosity Coating Features Superior Acid Resistance
This document describes the features and specifications of an epoxy coating called EP21ARLV. It has superior acid resistance and was tested in several acids for over 14 months with no failures. It is a low viscosity, two component epoxy that is ideal for small potting and encapsulation applications. It provides reliable electrical insulation and bonds well to many substrates including composites, plastics, ceramics, metals and rubbers.
Silver Filled Epoxy for Bonding & Die Attach Applications
Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.
For Long Lasting, Stable Connections
View this infographic to learn about MasterSil 973S-LO, a two part silicone ideal for use in vacuum environments. This NASA low outgassing approved, silver filled system features low volume resistivity and high flexibility. Scroll through to learn more!
One Component, Silver Filled Epoxy System
EP3HTS-LO is a fast curing, electrically conductive epoxy adhesive that is NASA low outgassing approved. It doesn’t require mixing, features an “unlimited” working life at room temperature and has a smooth thixotropic paste viscosity. This infographic clearly presents all the product property details at a glance, including its amazingly low volume resistivity and high thermal conductivity.
Recommended
Low Outgassing Silicone Adhesives
This infographic highlights one and two component silicone systems that pass ASTM E595 testing for NASA low outgassing. These compounds offer a variety of viscosities and boast high physical, thermal and electrical performance properties.
Ideal for Large Castings Master Bond EP29LPAO
This document describes the features and properties of Masterbond's EP29LPAO epoxy, including its long pot life of 7-9 hours at 75°F, high thermal conductivity of 9-10 BTU-in/ft2-hr-°F, and excellent electrical insulation with a volume resistivity over 1015 ohm-cm. It also highlights characteristics such as superb physical strength with tensile modulus between 450,000-500,000 psi and compressive strength of 24,000-26,000 psi, as well as low viscosity and good flow for large castings.
Low Outgassing Approved Adhesives Systems
This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more. Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
Free Flowing Encapsulant meets NASA Low Outgassing Specifications
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Low Viscosity Coating Features Superior Acid Resistance
This document describes the features and specifications of an epoxy coating called EP21ARLV. It has superior acid resistance and was tested in several acids for over 14 months with no failures. It is a low viscosity, two component epoxy that is ideal for small potting and encapsulation applications. It provides reliable electrical insulation and bonds well to many substrates including composites, plastics, ceramics, metals and rubbers.
Silver Filled Epoxy for Bonding & Die Attach Applications
Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.
For Long Lasting, Stable Connections
View this infographic to learn about MasterSil 973S-LO, a two part silicone ideal for use in vacuum environments. This NASA low outgassing approved, silver filled system features low volume resistivity and high flexibility. Scroll through to learn more!
One Component, Silver Filled Epoxy System
EP3HTS-LO is a fast curing, electrically conductive epoxy adhesive that is NASA low outgassing approved. It doesn’t require mixing, features an “unlimited” working life at room temperature and has a smooth thixotropic paste viscosity. This infographic clearly presents all the product property details at a glance, including its amazingly low volume resistivity and high thermal conductivity.
Underfill Epoxy Offers Thermal Conductivity & Electrical Insulation
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion. EP29LPTCHT also offers high thermal conductivity, electrical insulation and a high tensile modulus. Scroll through our infographic to learn more.
Adhesives for Sensor Applications
Choosing the most effective adhesive for an electronic application involving sensors is critical. Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Super Toughened Epoxy Resists High Temperatures & Chemicals
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties. This adhesive offers excellent flow properties and a long working life over a wide service temperature range. Scroll through this infographic to learn more!
Epoxy Adhesive Offers Thermal Conductivity and Chemical Resistance
Master Bond two part epoxy EP62-1AO resists acids, bases and solvents while maintaining excellent strength properties. Its long working life makes it ideal for large scale bonding and sealing applications. Browse this infographic to learn more.
Can Your Epoxy Adhesive Go Low?
Masterbond's EP42HT-2LTE epoxy adhesive has an ultra-low coefficient of thermal expansion between 9-12 x 10-6 in/in/°C, low shrinkage upon cure of less than 0.01% linear and 0.1% volumetric with an elongation of less than 5%, and high dimensional stability from -60 to 300°F with a hardness of over 85 Shore D and tensile modulus of 400,000-500,000 psi, making it suitable for applications requiring stability over a wide range of temperatures.
An Epoxy That Thinks of Everything
Ideal for die attach applications, Supreme 3HTND-2DA is a single component epoxy that doesn’t require mixing or freezing. This toughened system has outstanding adhesion, physical strength and electrical insulation properties. It also passes NASA low outgassing tests.
Approved for Critical Bonding Applications by LIGO
This document describes the properties of Masterbond EP30-2 epoxy adhesive. It has low outgassing rates making it suitable for vacuum applications. It was tested and approved by LIGO for critical bonding applications. The adhesive is optically clear, has high physical strength with tensile lap shear of 3000-3200 psi on aluminum, is cryogenically serviceable from 4K to 300°F, and is dimensionally stable.
Htr india-products-wire-wound-resistors-symmetry-resistors-hsr-english.pdf
This document provides information on HSR and HSRC series wire wound resistors from HTR including:
- Physical configuration details for coated and ceramic encased styles with dimensions, power ratings, and temperature specifications.
- Electrical and environmental characteristics including resistance tolerances, voltage ratings, temperature coefficients, and testing requirements.
- Typical applications involving voltage balancing and discharge of capacitors in high voltage circuits.
- Ordering information is given for resistance values and pack types.
Shrinktek SPTW Heat Shrink Tubing - Ultra Thin Wall Heat Shrink Tubing
Shrinktek SPTW Heat Shrink Tubing - Ultra Thin Wall Heat Shrink TubingThorne & Derrick International
This document provides specifications and ordering information for an ultra thin wall heat shrinkable polyolefin tubing. The tubing has a shrink ratio of 2:1, shrinks at 100°C, and has an operating temperature range of -55°C to 125°C. It lists properties such as tensile strength, heat shock resistance, and electric strength. Standard sizes range from 3/64 inch to 1 inch in diameter, and it is supplied on reels in lengths from 50 to 656 feet. Contact information is given for the manufacturer.HTR India - Products - Current Sense Resistors - Electron Beam Welded - HSE (...
This product is a type of Electron Beam Welded, which is a type of Current Sense Resistors.
For more information of this product, please copy & paste the url given below:
http://htr-india.com/product/hse/
Refractory glue
SCHAMOTTKLEBER HT 1100 has good adhesiveness on
fibrous products, on metals, fireclay brick and on all kinds
of construction materials.
It can be used for the following purposes:
- Fastening of thick string, glass fibre or ceramic fibre
tresses.
- Fastening of fireclay materials to metal parts exposed
to intense heat.
- Gluing of jacket tubes, sleeves and other fireclay parts
- designed to adhere insulating board
- Setting of fireclay bricks in stoves and heating units
Refractory Glue for Insulation Cladding in Power Plants, India ProjectSalesCo...
AREAS OF APPLICATION
SCHAMOTTKLEBER HT 1100 has good adhesiveness on
fibrous products, on metals, fireclay brick and on all kinds
of construction materials.
It can be used for the following purposes:
- Fastening of thick string, glass fibre or ceramic fibre
tresses.
- Fastening of fireclay materials to metal parts exposed
to intense heat.
- Gluing of jacket tubes, sleeves and other fireclay parts
- designed to adhere insulating board
- Setting of fireclay bricks in stoves and heating units
Heatfast HF1230 Heat Tracing Cable - Spec Sheet
The Heatfast HF1230 is a self-regulating trace heating cable that can be used for frost protection of exposed pipework and temperature maintenance applications. It has parallel bus wires that apply voltage along its entire length and a conductive core that allows it to be cut to any length on site. As the core temperature increases, the number of conductive paths decreases, lowering the heat output in a self-regulating manner along the entire length of the cable.
ALD ATO nanolaminates with adjustable electrical properties, poster published...
R. L. Puurunen, H. Kattelus, ALD ATO nanolaminates with adjustable electrical properties, 9th International Conference on Atomic Layer Deposition “ALD 2009”, Monterey, California, July 19-22, 2009. Poster presentation.
Acknowledgement (from the Abstract):
Acknowledgements: The authors are grateful to Ari Häärä for making the electrical measurements and to Sari Sirviö for supervising part of the sample fabrication and for initial interpretations of the results of the electrical measurements. This work was performed within the “ALDKOMP” project funded by Tekes (Finnish Funding Agency for Technology and Innovation).
3M Scotchcast Resin - No. 2123 Re-enterable Electrical Insulating Resin
3M Scotchcast Resin - No. 2123 Re-enterable Electrical Insulating ResinThorne & Derrick International
3M Scotchcast 2123 Reenterable Electrical Insulating Resin is a soft, two-part polybutadiene resin encapsulant designed especially for reeterable cable splice or cable joint protection and for filling cable boxes. 3M Scotchcast 2123 bonds to most cable jackets and provides an excellent multi-purpose moisture sealing resin.
3M Scotchcast Reenterable 2123 Resin Applications
* replace or repair cable jacket on single and multicore power cables
* sealing cable crotch or cable sheath when terminating power cablesThe Hotfoil-EHS Fusion45 Induction Heater
Induction heating can improve your bottom line by decreasing weld failures, and decreasing setup and tear down times. The technology allows for accurate temp control, without heavy electrical service or complicated controls. The portability and ease of use will allow you to heat more welds faster.
Denso 80 ehss
The document provides application instructions for Denso 80 Epoxy Heat Shrink Sleeve, a coating system for corrosion protection of field joints on pipelines operating at temperatures up to 80°C. The instructions describe 15 steps for surface preparation including beveling, cleaning, heating and abrasive blasting the joint area, applying a Denso epoxy primer, positioning and wrapping the heat shrink sleeve, shrinking and rolling the sleeve, and inspecting the final installation. Safety equipment and storage instructions are also provided.
Epoxy electrical resistivity
This document summarizes the properties and specifications of the 40-3900 silver filled epoxy resin adhesive. It is a two-part epoxy with silver powder dispersed in both the resin and hardener for excellent electrical conductivity. It has a resistivity value less than 1x10-4 ohm-cm and operates in a wide temperature range from -50 to +170°C. The 40-3900 adhesive is designed for bonding in microelectronics and is also used for applications like EMI shielding and circuit repairs due to its conductivity and bond strength. It has a 1:1 mix ratio by weight and cures at room temperature or with brief heating.
Top Adhesives for Cryogenic Applications and How They Have Been Used
See below how Master Bond’s cryogenic adhesives have been utilized in various commercial and research applications worldwide.
From Field to Factory, Adhesives for Food Processing Equipment
Master Bond's line of adhesive compounds for the food processing industry conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. These systems can be used in a variety of applications from storage tanks to containment vessels.
Medical Grade, UV Curable Adhesives Systems
Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Tough Epoxy Polysulfide System Resists up to 350˚F
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems. Scroll through this infographic to learn more about this new chemically resistant, flexible system.
More Related Content
What's hot
Underfill Epoxy Offers Thermal Conductivity & Electrical Insulation
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion. EP29LPTCHT also offers high thermal conductivity, electrical insulation and a high tensile modulus. Scroll through our infographic to learn more.
Adhesives for Sensor Applications
Choosing the most effective adhesive for an electronic application involving sensors is critical. Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Super Toughened Epoxy Resists High Temperatures & Chemicals
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties. This adhesive offers excellent flow properties and a long working life over a wide service temperature range. Scroll through this infographic to learn more!
Epoxy Adhesive Offers Thermal Conductivity and Chemical Resistance
Master Bond two part epoxy EP62-1AO resists acids, bases and solvents while maintaining excellent strength properties. Its long working life makes it ideal for large scale bonding and sealing applications. Browse this infographic to learn more.
Can Your Epoxy Adhesive Go Low?
Masterbond's EP42HT-2LTE epoxy adhesive has an ultra-low coefficient of thermal expansion between 9-12 x 10-6 in/in/°C, low shrinkage upon cure of less than 0.01% linear and 0.1% volumetric with an elongation of less than 5%, and high dimensional stability from -60 to 300°F with a hardness of over 85 Shore D and tensile modulus of 400,000-500,000 psi, making it suitable for applications requiring stability over a wide range of temperatures.
An Epoxy That Thinks of Everything
Ideal for die attach applications, Supreme 3HTND-2DA is a single component epoxy that doesn’t require mixing or freezing. This toughened system has outstanding adhesion, physical strength and electrical insulation properties. It also passes NASA low outgassing tests.
Approved for Critical Bonding Applications by LIGO
This document describes the properties of Masterbond EP30-2 epoxy adhesive. It has low outgassing rates making it suitable for vacuum applications. It was tested and approved by LIGO for critical bonding applications. The adhesive is optically clear, has high physical strength with tensile lap shear of 3000-3200 psi on aluminum, is cryogenically serviceable from 4K to 300°F, and is dimensionally stable.
Htr india-products-wire-wound-resistors-symmetry-resistors-hsr-english.pdf
This document provides information on HSR and HSRC series wire wound resistors from HTR including:
- Physical configuration details for coated and ceramic encased styles with dimensions, power ratings, and temperature specifications.
- Electrical and environmental characteristics including resistance tolerances, voltage ratings, temperature coefficients, and testing requirements.
- Typical applications involving voltage balancing and discharge of capacitors in high voltage circuits.
- Ordering information is given for resistance values and pack types.
Shrinktek SPTW Heat Shrink Tubing - Ultra Thin Wall Heat Shrink Tubing
Shrinktek SPTW Heat Shrink Tubing - Ultra Thin Wall Heat Shrink TubingThorne & Derrick International
This document provides specifications and ordering information for an ultra thin wall heat shrinkable polyolefin tubing. The tubing has a shrink ratio of 2:1, shrinks at 100°C, and has an operating temperature range of -55°C to 125°C. It lists properties such as tensile strength, heat shock resistance, and electric strength. Standard sizes range from 3/64 inch to 1 inch in diameter, and it is supplied on reels in lengths from 50 to 656 feet. Contact information is given for the manufacturer.HTR India - Products - Current Sense Resistors - Electron Beam Welded - HSE (...
This product is a type of Electron Beam Welded, which is a type of Current Sense Resistors.
For more information of this product, please copy & paste the url given below:
http://htr-india.com/product/hse/
Refractory glue
SCHAMOTTKLEBER HT 1100 has good adhesiveness on
fibrous products, on metals, fireclay brick and on all kinds
of construction materials.
It can be used for the following purposes:
- Fastening of thick string, glass fibre or ceramic fibre
tresses.
- Fastening of fireclay materials to metal parts exposed
to intense heat.
- Gluing of jacket tubes, sleeves and other fireclay parts
- designed to adhere insulating board
- Setting of fireclay bricks in stoves and heating units
Refractory Glue for Insulation Cladding in Power Plants, India ProjectSalesCo...
AREAS OF APPLICATION
SCHAMOTTKLEBER HT 1100 has good adhesiveness on
fibrous products, on metals, fireclay brick and on all kinds
of construction materials.
It can be used for the following purposes:
- Fastening of thick string, glass fibre or ceramic fibre
tresses.
- Fastening of fireclay materials to metal parts exposed
to intense heat.
- Gluing of jacket tubes, sleeves and other fireclay parts
- designed to adhere insulating board
- Setting of fireclay bricks in stoves and heating units
Heatfast HF1230 Heat Tracing Cable - Spec Sheet
The Heatfast HF1230 is a self-regulating trace heating cable that can be used for frost protection of exposed pipework and temperature maintenance applications. It has parallel bus wires that apply voltage along its entire length and a conductive core that allows it to be cut to any length on site. As the core temperature increases, the number of conductive paths decreases, lowering the heat output in a self-regulating manner along the entire length of the cable.
ALD ATO nanolaminates with adjustable electrical properties, poster published...
R. L. Puurunen, H. Kattelus, ALD ATO nanolaminates with adjustable electrical properties, 9th International Conference on Atomic Layer Deposition “ALD 2009”, Monterey, California, July 19-22, 2009. Poster presentation.
Acknowledgement (from the Abstract):
Acknowledgements: The authors are grateful to Ari Häärä for making the electrical measurements and to Sari Sirviö for supervising part of the sample fabrication and for initial interpretations of the results of the electrical measurements. This work was performed within the “ALDKOMP” project funded by Tekes (Finnish Funding Agency for Technology and Innovation).
3M Scotchcast Resin - No. 2123 Re-enterable Electrical Insulating Resin
3M Scotchcast Resin - No. 2123 Re-enterable Electrical Insulating ResinThorne & Derrick International
3M Scotchcast 2123 Reenterable Electrical Insulating Resin is a soft, two-part polybutadiene resin encapsulant designed especially for reeterable cable splice or cable joint protection and for filling cable boxes. 3M Scotchcast 2123 bonds to most cable jackets and provides an excellent multi-purpose moisture sealing resin.
3M Scotchcast Reenterable 2123 Resin Applications
* replace or repair cable jacket on single and multicore power cables
* sealing cable crotch or cable sheath when terminating power cablesThe Hotfoil-EHS Fusion45 Induction Heater
Induction heating can improve your bottom line by decreasing weld failures, and decreasing setup and tear down times. The technology allows for accurate temp control, without heavy electrical service or complicated controls. The portability and ease of use will allow you to heat more welds faster.
Denso 80 ehss
The document provides application instructions for Denso 80 Epoxy Heat Shrink Sleeve, a coating system for corrosion protection of field joints on pipelines operating at temperatures up to 80°C. The instructions describe 15 steps for surface preparation including beveling, cleaning, heating and abrasive blasting the joint area, applying a Denso epoxy primer, positioning and wrapping the heat shrink sleeve, shrinking and rolling the sleeve, and inspecting the final installation. Safety equipment and storage instructions are also provided.
Epoxy electrical resistivity
This document summarizes the properties and specifications of the 40-3900 silver filled epoxy resin adhesive. It is a two-part epoxy with silver powder dispersed in both the resin and hardener for excellent electrical conductivity. It has a resistivity value less than 1x10-4 ohm-cm and operates in a wide temperature range from -50 to +170°C. The 40-3900 adhesive is designed for bonding in microelectronics and is also used for applications like EMI shielding and circuit repairs due to its conductivity and bond strength. It has a 1:1 mix ratio by weight and cures at room temperature or with brief heating.
What's hot (18)
Underfill Epoxy Offers Thermal Conductivity & Electrical Insulation
Underfill Epoxy Offers Thermal Conductivity & Electrical Insulation
Super Toughened Epoxy Resists High Temperatures & Chemicals
Super Toughened Epoxy Resists High Temperatures & Chemicals
Epoxy Adhesive Offers Thermal Conductivity and Chemical Resistance
Epoxy Adhesive Offers Thermal Conductivity and Chemical Resistance
Approved for Critical Bonding Applications by LIGO
Approved for Critical Bonding Applications by LIGO
Htr india-products-wire-wound-resistors-symmetry-resistors-hsr-english.pdf
Htr india-products-wire-wound-resistors-symmetry-resistors-hsr-english.pdf
Shrinktek SPTW Heat Shrink Tubing - Ultra Thin Wall Heat Shrink Tubing
Shrinktek SPTW Heat Shrink Tubing - Ultra Thin Wall Heat Shrink Tubing
HTR India - Products - Current Sense Resistors - Electron Beam Welded - HSE (...
HTR India - Products - Current Sense Resistors - Electron Beam Welded - HSE (...
Refractory Glue for Insulation Cladding in Power Plants, India ProjectSalesCo...
Refractory Glue for Insulation Cladding in Power Plants, India ProjectSalesCo...
ALD ATO nanolaminates with adjustable electrical properties, poster published...
ALD ATO nanolaminates with adjustable electrical properties, poster published...
3M Scotchcast Resin - No. 2123 Re-enterable Electrical Insulating Resin
3M Scotchcast Resin - No. 2123 Re-enterable Electrical Insulating Resin
More from Master Bond
Top Adhesives for Cryogenic Applications and How They Have Been Used
See below how Master Bond’s cryogenic adhesives have been utilized in various commercial and research applications worldwide.
From Field to Factory, Adhesives for Food Processing Equipment
Master Bond's line of adhesive compounds for the food processing industry conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. These systems can be used in a variety of applications from storage tanks to containment vessels.
Medical Grade, UV Curable Adhesives Systems
Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Tough Epoxy Polysulfide System Resists up to 350˚F
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems. Scroll through this infographic to learn more about this new chemically resistant, flexible system.
Master Bond Company Capabilities
Master Bond was founded in 1976 and formulates over 3,000 grades of adhesives, sealants, coatings, potting and encapsulation compounds that are certified for use across industries. They supply their compounds to top research universities and technology manufacturing companies in the world, with the compounds being applied in a variety of applications including optical assemblies, lasers, e-textiles, packaging, confocal microscopes, prosthetic devices, capacitors, aircraft, medical devices, and plasma physics research. Master Bond offers technical support throughout the design and manufacturing process to help engineers find the most suitable product.
Tough Enough for Harsh Chemicals
Master Bond EP21TP-2NV features superior thermal shock and chemical resistance while maintaining durable bonds to similar and dissimilar substrates. This tough compound is noted for its ability to withstand prolonged exposure to fuel and oils. EP21TP-2NV cures at ambient temperatures or more rapidly at elevated temperatures and can be applied without sagging.
Low CTE Epoxy for Precise Alignment
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Scroll through to learn more.
It's What's Inside That Counts - Nanosilica Filled Adhesives
Learn about Master Bond’s nanosilica filled systems offering enhanced abrasion resistance and dimensional stability.
These specialty formulations feature superior physical properties as well as low shrinkage upon curing. View to learn more!
One Component, Non-Drip Adhesive for Structural Bonding
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,000 psi, 3,000 psi and 18,000 psi, respectively. It also offers superb dimensional stability and chemical resistance.
Toughened, Two Component, Room Temperature Curing Epoxy
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time. Browse through this infographic to learn more.
Electrically Conductive Epoxy Charges Ahead
Nickel filled epoxy system EP21TDCN-LO meets NASA low outgassing specifications and features excellent electrical conductivity. This adhesive and sealant is ideal for use grounding, shielding and static dissipation applications. Scroll through to learn more!
Adhesive Keeps Out UV Light & Lets Light In
Master Bond EP30-2LB epoxy system blocks UV light while allowing the transmission of visible light. This two part, optically clear compound meets NASA low outgassing specifications and features high optical clarity with a refractive index of 1.55.
In the Clear: Epoxy System EP112LS
Master Bond EP112LS is a two part, optically clear system for impregnation, potting, encapsulation, sealing and coating applications. This compound features reliable non-yellowing properties and a refractive index of 1.55. It is ideal for use in aerospace and optoelectronics industries.
Newly Developed Products 2017 - Part 1
Browse though Master Bond's product highlights of 2017! These adhesives, sealants, coatings and encapsulation systems feature unique performance properties and many meet stringent industrial specifications.
Newly Developed Products 2017 - Part 2
Check out Master Bond's innovative product developments of 2017! Browse through our highlighted adhesive, sealant, coating and encapsulation compounds from this year.
One Part Epoxy Has Low CTE
Master Bond EP13LTE is a one part epoxy featuring a low coefficient of thermal expansion and high temperature resistance. This system is ideal for structural bonding applications where precise alignment is necessary. The following infographic highlights the exemplary properties of EP13LTE.
Newly Developed Products 2016 - Part 3
This document introduces several newly developed products from 2016, including a supreme-grade epoxy with chemical, abrasion and heat resistance, a nickel-conductive epoxy that meets NASA outgassing specifications, a UV-curable system with abrasion resistance and flexibility, a silver-filled silicone that meets NASA outgassing specifications, and a chemical-resistant epoxy with a high glass transition temperature. Contact information is provided at the end.
Newly Developed Products 2016 - Part 2
2016 was a standout year for developing new and innovative products. Let’s take a look back on some adhesives, sealants, coating and encapsulation compounds that were released in this past year.
Newly Developed Products 2016 - Part 1
With 2017 on the horizon, it is the perfect time to reflect on what our most outstanding accomplishments were this past year. Here are some of the breakthrough epoxies, silicones and UV curable products that were developed in 2016 at a glance.
More from Master Bond (20)
Top Adhesives for Cryogenic Applications and How They Have Been Used
Top Adhesives for Cryogenic Applications and How They Have Been Used
From Field to Factory, Adhesives for Food Processing Equipment
From Field to Factory, Adhesives for Food Processing Equipment
Tough Epoxy Polysulfide System Resists up to 350˚F
Tough Epoxy Polysulfide System Resists up to 350˚F
It's What's Inside That Counts - Nanosilica Filled Adhesives
It's What's Inside That Counts - Nanosilica Filled Adhesives
One Component, Non-Drip Adhesive for Structural Bonding
One Component, Non-Drip Adhesive for Structural Bonding
Toughened, Two Component, Room Temperature Curing Epoxy
Toughened, Two Component, Room Temperature Curing Epoxy
Recently uploaded
Lee Barnes - Path to Becoming an Effective Test Automation Engineer.pdf
So… you want to become a Test Automation Engineer (or hire and develop one)? While there’s quite a bit of information available about important technical and tool skills to master, there’s not enough discussion around the path to becoming an effective Test Automation Engineer that knows how to add VALUE. In my experience this had led to a proliferation of engineers who are proficient with tools and building frameworks but have skill and knowledge gaps, especially in software testing, that reduce the value they deliver with test automation.
In this talk, Lee will share his lessons learned from over 30 years of working with, and mentoring, hundreds of Test Automation Engineers. Whether you’re looking to get started in test automation or just want to improve your trade, this talk will give you a solid foundation and roadmap for ensuring your test automation efforts continuously add value. This talk is equally valuable for both aspiring Test Automation Engineers and those managing them! All attendees will take away a set of key foundational knowledge and a high-level learning path for leveling up test automation skills and ensuring they add value to their organizations.
"Scaling RAG Applications to serve millions of users", Kevin Goedecke
How we managed to grow and scale a RAG application from zero to thousands of users in 7 months. Lessons from technical challenges around managing high load for LLMs, RAGs and Vector databases.
Astute Business Solutions | Oracle Cloud Partner |
Your goto partner for Oracle Cloud, PeopleSoft, E-Business Suite, and Ellucian Banner. We are a firm specialized in managed services and consulting.
AWS Certified Solutions Architect Associate (SAA-C03)
AWS Certified Solutions Architect Associate (SAA-C03)
JavaLand 2024: Application Development Green Masterplan
My presentation slides I used at JavaLand 2024
Must Know Postgres Extension for DBA and Developer during Migration
Mydbops Opensource Database Meetup 16
Topic: Must-Know PostgreSQL Extensions for Developers and DBAs During Migration
Speaker: Deepak Mahto, Founder of DataCloudGaze Consulting
Date & Time: 8th June | 10 AM - 1 PM IST
Venue: Bangalore International Centre, Bangalore
Abstract: Discover how PostgreSQL extensions can be your secret weapon! This talk explores how key extensions enhance database capabilities and streamline the migration process for users moving from other relational databases like Oracle.
Key Takeaways:
* Learn about crucial extensions like oracle_fdw, pgtt, and pg_audit that ease migration complexities.
* Gain valuable strategies for implementing these extensions in PostgreSQL to achieve license freedom.
* Discover how these key extensions can empower both developers and DBAs during the migration process.
* Don't miss this chance to gain practical knowledge from an industry expert and stay updated on the latest open-source database trends.
Mydbops Managed Services specializes in taking the pain out of database management while optimizing performance. Since 2015, we have been providing top-notch support and assistance for the top three open-source databases: MySQL, MongoDB, and PostgreSQL.
Our team offers a wide range of services, including assistance, support, consulting, 24/7 operations, and expertise in all relevant technologies. We help organizations improve their database's performance, scalability, efficiency, and availability.
Contact us: info@mydbops.com
Visit: https://www.mydbops.com/
Follow us on LinkedIn: https://in.linkedin.com/company/mydbops
For more details and updates, please follow up the below links.
Meetup Page : https://www.meetup.com/mydbops-databa...
Twitter: https://twitter.com/mydbopsofficial
Blogs: https://www.mydbops.com/blog/
Facebook(Meta): https://www.facebook.com/mydbops/
AppSec PNW: Android and iOS Application Security with MobSF
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
Essentials of Automations: Exploring Attributes & Automation Parameters
Building automations in FME Flow can save time, money, and help businesses scale by eliminating data silos and providing data to stakeholders in real-time. One essential component to orchestrating complex automations is the use of attributes & automation parameters (both formerly known as “keys”). In fact, it’s unlikely you’ll ever build an Automation without using these components, but what exactly are they?
Attributes & automation parameters enable the automation author to pass data values from one automation component to the next. During this webinar, our FME Flow Specialists will cover leveraging the three types of these output attributes & parameters in FME Flow: Event, Custom, and Automation. As a bonus, they’ll also be making use of the Split-Merge Block functionality.
You’ll leave this webinar with a better understanding of how to maximize the potential of automations by making use of attributes & automation parameters, with the ultimate goal of setting your enterprise integration workflows up on autopilot.
Call Girls Chandigarh🔥7023059433🔥Agency Profile Escorts in Chandigarh Availab...
Call Girls Chandigarh🔥7023059433🔥Agency Profile Escorts in Chandigarh Available 24/7
GlobalLogic Java Community Webinar #18 “How to Improve Web Application Perfor...
Під час доповіді відповімо на питання, навіщо потрібно підвищувати продуктивність аплікації і які є найефективніші способи для цього. А також поговоримо про те, що таке кеш, які його види бувають та, основне — як знайти performance bottleneck?
Відео та деталі заходу: https://bit.ly/45tILxj
MySQL InnoDB Storage Engine: Deep Dive - Mydbops
This presentation, titled "MySQL - InnoDB" and delivered by Mayank Prasad at the Mydbops Open Source Database Meetup 16 on June 8th, 2024, covers dynamic configuration of REDO logs and instant ADD/DROP columns in InnoDB.
This presentation dives deep into the world of InnoDB, exploring two ground-breaking features introduced in MySQL 8.0:
• Dynamic Configuration of REDO Logs: Enhance your database's performance and flexibility with on-the-fly adjustments to REDO log capacity. Unleash the power of the snake metaphor to visualize how InnoDB manages REDO log files.
• Instant ADD/DROP Columns: Say goodbye to costly table rebuilds! This presentation unveils how InnoDB now enables seamless addition and removal of columns without compromising data integrity or incurring downtime.
Key Learnings:
• Grasp the concept of REDO logs and their significance in InnoDB's transaction management.
• Discover the advantages of dynamic REDO log configuration and how to leverage it for optimal performance.
• Understand the inner workings of instant ADD/DROP columns and their impact on database operations.
• Gain valuable insights into the row versioning mechanism that empowers instant column modifications.
Session 1 - Intro to Robotic Process Automation.pdf
👉 Check out our full 'Africa Series - Automation Student Developers (EN)' page to register for the full program:
https://bit.ly/Automation_Student_Kickstart
In this session, we shall introduce you to the world of automation, the UiPath Platform, and guide you on how to install and setup UiPath Studio on your Windows PC.
📕 Detailed agenda:
What is RPA? Benefits of RPA?
RPA Applications
The UiPath End-to-End Automation Platform
UiPath Studio CE Installation and Setup
💻 Extra training through UiPath Academy:
Introduction to Automation
UiPath Business Automation Platform
Explore automation development with UiPath Studio
👉 Register here for our upcoming Session 2 on June 20: Introduction to UiPath Studio Fundamentals: https://community.uipath.com/events/details/uipath-lagos-presents-session-2-introduction-to-uipath-studio-fundamentals/
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...
The typical problem in product engineering is not bad strategy, so much as “no strategy”. This leads to confusion, lack of motivation, and incoherent action. The next time you look for a strategy and find an empty space, instead of waiting for it to be filled, I will show you how to fill it in yourself. If you’re wrong, it forces a correction. If you’re right, it helps create focus. I’ll share how I’ve approached this in the past, both what works and lessons for what didn’t work so well.
Demystifying Knowledge Management through Storytelling
The Department of Veteran Affairs (VA) invited Taylor Paschal, Knowledge & Information Management Consultant at Enterprise Knowledge, to speak at a Knowledge Management Lunch and Learn hosted on June 12, 2024. All Office of Administration staff were invited to attend and received professional development credit for participating in the voluntary event.
The objectives of the Lunch and Learn presentation were to:
- Review what KM ‘is’ and ‘isn’t’
- Understand the value of KM and the benefits of engaging
- Define and reflect on your “what’s in it for me?”
- Share actionable ways you can participate in Knowledge - - Capture & Transfer
ScyllaDB Tablets: Rethinking Replication
ScyllaDB is making a major architecture shift. We’re moving from vNode replication to tablets – fragments of tables that are distributed independently, enabling dynamic data distribution and extreme elasticity. In this keynote, ScyllaDB co-founder and CTO Avi Kivity explains the reason for this shift, provides a look at the implementation and roadmap, and shares how this shift benefits ScyllaDB users.
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...
This LF Energy webinar took place June 20, 2024. It featured:
-Alex Thornton, LF Energy
-Hallie Cramer, Google
-Daniel Roesler, UtilityAPI
-Henry Richardson, WattTime
In response to the urgency and scale required to effectively address climate change, open source solutions offer significant potential for driving innovation and progress. Currently, there is a growing demand for standardization and interoperability in energy data and modeling. Open source standards and specifications within the energy sector can also alleviate challenges associated with data fragmentation, transparency, and accessibility. At the same time, it is crucial to consider privacy and security concerns throughout the development of open source platforms.
This webinar will delve into the motivations behind establishing LF Energy’s Carbon Data Specification Consortium. It will provide an overview of the draft specifications and the ongoing progress made by the respective working groups.
Three primary specifications will be discussed:
-Discovery and client registration, emphasizing transparent processes and secure and private access
-Customer data, centering around customer tariffs, bills, energy usage, and full consumption disclosure
-Power systems data, focusing on grid data, inclusive of transmission and distribution networks, generation, intergrid power flows, and market settlement data
Biomedical Knowledge Graphs for Data Scientists and Bioinformaticians
Dmitrii Kamaev, PhD
Senior Product Owner - QIAGEN
Introducing BoxLang : A new JVM language for productivity and modularity!
Just like life, our code must adapt to the ever changing world we live in. From one day coding for the web, to the next for our tablets or APIs or for running serverless applications. Multi-runtime development is the future of coding, the future is to be dynamic. Let us introduce you to BoxLang.
Dynamic. Modular. Productive.
BoxLang redefines development with its dynamic nature, empowering developers to craft expressive and functional code effortlessly. Its modular architecture prioritizes flexibility, allowing for seamless integration into existing ecosystems.
Interoperability at its Core
With 100% interoperability with Java, BoxLang seamlessly bridges the gap between traditional and modern development paradigms, unlocking new possibilities for innovation and collaboration.
Multi-Runtime
From the tiny 2m operating system binary to running on our pure Java web server, CommandBox, Jakarta EE, AWS Lambda, Microsoft Functions, Web Assembly, Android and more. BoxLang has been designed to enhance and adapt according to it's runnable runtime.
The Fusion of Modernity and Tradition
Experience the fusion of modern features inspired by CFML, Node, Ruby, Kotlin, Java, and Clojure, combined with the familiarity of Java bytecode compilation, making BoxLang a language of choice for forward-thinking developers.
Empowering Transition with Transpiler Support
Transitioning from CFML to BoxLang is seamless with our JIT transpiler, facilitating smooth migration and preserving existing code investments.
Unlocking Creativity with IDE Tools
Unleash your creativity with powerful IDE tools tailored for BoxLang, providing an intuitive development experience and streamlining your workflow. Join us as we embark on a journey to redefine JVM development. Welcome to the era of BoxLang.
inQuba Webinar Mastering Customer Journey Management with Dr Graham Hill
HERE IS YOUR WEBINAR CONTENT! 'Mastering Customer Journey Management with Dr. Graham Hill'. We hope you find the webinar recording both insightful and enjoyable.
In this webinar, we explored essential aspects of Customer Journey Management and personalization. Here’s a summary of the key insights and topics discussed:
Key Takeaways:
Understanding the Customer Journey: Dr. Hill emphasized the importance of mapping and understanding the complete customer journey to identify touchpoints and opportunities for improvement.
Personalization Strategies: We discussed how to leverage data and insights to create personalized experiences that resonate with customers.
Technology Integration: Insights were shared on how inQuba’s advanced technology can streamline customer interactions and drive operational efficiency.
Recently uploaded (20)
Lee Barnes - Path to Becoming an Effective Test Automation Engineer.pdf
Lee Barnes - Path to Becoming an Effective Test Automation Engineer.pdf
"Scaling RAG Applications to serve millions of users", Kevin Goedecke
"Scaling RAG Applications to serve millions of users", Kevin Goedecke
Astute Business Solutions | Oracle Cloud Partner |
Astute Business Solutions | Oracle Cloud Partner |
AWS Certified Solutions Architect Associate (SAA-C03)
AWS Certified Solutions Architect Associate (SAA-C03)
JavaLand 2024: Application Development Green Masterplan
JavaLand 2024: Application Development Green Masterplan
Must Know Postgres Extension for DBA and Developer during Migration
Must Know Postgres Extension for DBA and Developer during Migration
AppSec PNW: Android and iOS Application Security with MobSF
AppSec PNW: Android and iOS Application Security with MobSF
Essentials of Automations: Exploring Attributes & Automation Parameters
Essentials of Automations: Exploring Attributes & Automation Parameters
Call Girls Chandigarh🔥7023059433🔥Agency Profile Escorts in Chandigarh Availab...
Call Girls Chandigarh🔥7023059433🔥Agency Profile Escorts in Chandigarh Availab...
GlobalLogic Java Community Webinar #18 “How to Improve Web Application Perfor...
GlobalLogic Java Community Webinar #18 “How to Improve Web Application Perfor...
Session 1 - Intro to Robotic Process Automation.pdf
Session 1 - Intro to Robotic Process Automation.pdf
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...
Demystifying Knowledge Management through Storytelling
Demystifying Knowledge Management through Storytelling
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...
Biomedical Knowledge Graphs for Data Scientists and Bioinformaticians
Biomedical Knowledge Graphs for Data Scientists and Bioinformaticians
Introducing BoxLang : A new JVM language for productivity and modularity!
Introducing BoxLang : A new JVM language for productivity and modularity!
inQuba Webinar Mastering Customer Journey Management with Dr Graham Hill
inQuba Webinar Mastering Customer Journey Management with Dr Graham Hill
The Highs & Lows of Thermal Management
- 1. The of thermal management HIGHS &LOWS Thermal resistance, 75°F 5-7 x 10-6 K•m2/W Thermal conductivity, 75°F 3.17-3.61 W/(m•K) Forms bond lines as thin as 10-15 microns One Part Epoxy Features Very Low ThermalResistance Supreme 18TC Meets low outgassing requirements Service temperature range 4K to +400°F Supreme 18TC features a thermallyconductive filler and can be applied in bond lines asthinas10-15micronswhich leads to Lower thermal resistance Higher thermal conductivity and R = t/K BASEDONTHEEQUATION R = thermalresistance Where t = thickness K = thermalconductivity LOWLOW HIGHHIGH THINTHIN NASANASA WIDEWIDE 154 Hobart Street, Hackensack, NJ 07601, USA +1.201.343.8983 ∙ main@masterbond.com www.masterbond.com