Master Bond EP30-2LB epoxy system blocks UV light while allowing the transmission of visible light. This two part, optically clear compound meets NASA low outgassing specifications and features high optical clarity with a refractive index of 1.55.
This document provides technical specifications for an electrical system including an EMC unit rated for 400 Volts/50 Hertz/50 kVA, a 750 Volt DC system, and 550 meters of DC cable and 280 meters of AC cable used in an island grid system with a 20/0.4 kV rating.
Silver Filled Epoxy for Bonding & Die Attach ApplicationsMaster Bond
Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.
This infographic highlights one and two component silicone systems that pass ASTM E595 testing for NASA low outgassing. These compounds offer a variety of viscosities and boast high physical, thermal and electrical performance properties.
From Field to Factory, Adhesives for Food Processing EquipmentMaster Bond
Master Bond's line of adhesive compounds for the food processing industry conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. These systems can be used in a variety of applications from storage tanks to containment vessels.
Low Outgassing Approved Adhesives SystemsMaster Bond
This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more. Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
Choosing the most effective adhesive for an electronic application involving sensors is critical. Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Low Viscosity Coating Features Superior Acid ResistanceMaster Bond
This document describes the features and specifications of an epoxy coating called EP21ARLV. It has superior acid resistance and was tested in several acids for over 14 months with no failures. It is a low viscosity, two component epoxy that is ideal for small potting and encapsulation applications. It provides reliable electrical insulation and bonds well to many substrates including composites, plastics, ceramics, metals and rubbers.
This document provides technical specifications for an electrical system including an EMC unit rated for 400 Volts/50 Hertz/50 kVA, a 750 Volt DC system, and 550 meters of DC cable and 280 meters of AC cable used in an island grid system with a 20/0.4 kV rating.
Silver Filled Epoxy for Bonding & Die Attach ApplicationsMaster Bond
Master Bond EP3HTS-TC is a super unique epoxy utilizing a non-sintering silver technology to provide ultra high heat transfer capability. This one part system does not require mixing and features an array of impressive performance properties ideal for die attach and specialty bonding applications. Browse this infographic to learn more.
This infographic highlights one and two component silicone systems that pass ASTM E595 testing for NASA low outgassing. These compounds offer a variety of viscosities and boast high physical, thermal and electrical performance properties.
From Field to Factory, Adhesives for Food Processing EquipmentMaster Bond
Master Bond's line of adhesive compounds for the food processing industry conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. These systems can be used in a variety of applications from storage tanks to containment vessels.
Low Outgassing Approved Adhesives SystemsMaster Bond
This wide range of adhesive compounds meet NASA low outgassing specifications and feature their own unique set of high performance properties such as optical clarity, thermal conductivity, cryogenic serviceability and more. Browse through this infographic to learn about our top performing NASA low outgassing approved systems.
Choosing the most effective adhesive for an electronic application involving sensors is critical. Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information. Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Low Viscosity Coating Features Superior Acid ResistanceMaster Bond
This document describes the features and specifications of an epoxy coating called EP21ARLV. It has superior acid resistance and was tested in several acids for over 14 months with no failures. It is a low viscosity, two component epoxy that is ideal for small potting and encapsulation applications. It provides reliable electrical insulation and bonds well to many substrates including composites, plastics, ceramics, metals and rubbers.
Medical Grade, UV Curable Adhesives SystemsMaster Bond
Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Underfill Epoxy Offers Thermal Conductivity & Electrical InsulationMaster Bond
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion. EP29LPTCHT also offers high thermal conductivity, electrical insulation and a high tensile modulus. Scroll through our infographic to learn more.
Tough Epoxy Polysulfide System Resists up to 350˚FMaster Bond
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems. Scroll through this infographic to learn more about this new chemically resistant, flexible system.
Free Flowing Encapsulant meets NASA Low Outgassing SpecificationsMaster Bond
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Master Bond was founded in 1976 and formulates over 3,000 grades of adhesives, sealants, coatings, potting and encapsulation compounds that are certified for use across industries. They supply their compounds to top research universities and technology manufacturing companies in the world, with the compounds being applied in a variety of applications including optical assemblies, lasers, e-textiles, packaging, confocal microscopes, prosthetic devices, capacitors, aircraft, medical devices, and plasma physics research. Master Bond offers technical support throughout the design and manufacturing process to help engineers find the most suitable product.
Master Bond EP21TP-2NV features superior thermal shock and chemical resistance while maintaining durable bonds to similar and dissimilar substrates. This tough compound is noted for its ability to withstand prolonged exposure to fuel and oils. EP21TP-2NV cures at ambient temperatures or more rapidly at elevated temperatures and can be applied without sagging.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Scroll through to learn more.
It's What's Inside That Counts - Nanosilica Filled AdhesivesMaster Bond
Learn about Master Bond’s nanosilica filled systems offering enhanced abrasion resistance and dimensional stability.
These specialty formulations feature superior physical properties as well as low shrinkage upon curing. View to learn more!
One Component, Non-Drip Adhesive for Structural Bonding Master Bond
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,000 psi, 3,000 psi and 18,000 psi, respectively. It also offers superb dimensional stability and chemical resistance.
Toughened, Two Component, Room Temperature Curing EpoxyMaster Bond
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time. Browse through this infographic to learn more.
View this infographic to learn about MasterSil 973S-LO, a two part silicone ideal for use in vacuum environments. This NASA low outgassing approved, silver filled system features low volume resistivity and high flexibility. Scroll through to learn more!
Electrically Conductive Epoxy Charges AheadMaster Bond
Nickel filled epoxy system EP21TDCN-LO meets NASA low outgassing specifications and features excellent electrical conductivity. This adhesive and sealant is ideal for use grounding, shielding and static dissipation applications. Scroll through to learn more!
One part epoxy, Supreme 18TC, contains a blend of special thermally conductive fillers allowing it to maintain outstanding heat transfer capabilities. This smooth paste system can be applied in bond lines as thin as 10-15 microns. Supreme 18TC features ultra low thermal resistance and meets NASA low outgassing specifications.
Master Bond EP112LS is a two part, optically clear system for impregnation, potting, encapsulation, sealing and coating applications. This compound features reliable non-yellowing properties and a refractive index of 1.55. It is ideal for use in aerospace and optoelectronics industries.
Super Toughened Epoxy Resists High Temperatures & ChemicalsMaster Bond
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties. This adhesive offers excellent flow properties and a long working life over a wide service temperature range. Scroll through this infographic to learn more!
Browse though Master Bond's product highlights of 2017! These adhesives, sealants, coatings and encapsulation systems feature unique performance properties and many meet stringent industrial specifications.
Check out Master Bond's innovative product developments of 2017! Browse through our highlighted adhesive, sealant, coating and encapsulation compounds from this year.
Master Bond EP13LTE is a one part epoxy featuring a low coefficient of thermal expansion and high temperature resistance. This system is ideal for structural bonding applications where precise alignment is necessary. The following infographic highlights the exemplary properties of EP13LTE.
This document introduces several newly developed products from 2016, including a supreme-grade epoxy with chemical, abrasion and heat resistance, a nickel-conductive epoxy that meets NASA outgassing specifications, a UV-curable system with abrasion resistance and flexibility, a silver-filled silicone that meets NASA outgassing specifications, and a chemical-resistant epoxy with a high glass transition temperature. Contact information is provided at the end.
"$10 thousand per minute of downtime: architecture, queues, streaming and fin...Fwdays
Direct losses from downtime in 1 minute = $5-$10 thousand dollars. Reputation is priceless.
As part of the talk, we will consider the architectural strategies necessary for the development of highly loaded fintech solutions. We will focus on using queues and streaming to efficiently work and manage large amounts of data in real-time and to minimize latency.
We will focus special attention on the architectural patterns used in the design of the fintech system, microservices and event-driven architecture, which ensure scalability, fault tolerance, and consistency of the entire system.
Medical Grade, UV Curable Adhesives SystemsMaster Bond
Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Underfill Epoxy Offers Thermal Conductivity & Electrical InsulationMaster Bond
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion. EP29LPTCHT also offers high thermal conductivity, electrical insulation and a high tensile modulus. Scroll through our infographic to learn more.
Tough Epoxy Polysulfide System Resists up to 350˚FMaster Bond
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems. Scroll through this infographic to learn more about this new chemically resistant, flexible system.
Free Flowing Encapsulant meets NASA Low Outgassing SpecificationsMaster Bond
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Master Bond was founded in 1976 and formulates over 3,000 grades of adhesives, sealants, coatings, potting and encapsulation compounds that are certified for use across industries. They supply their compounds to top research universities and technology manufacturing companies in the world, with the compounds being applied in a variety of applications including optical assemblies, lasers, e-textiles, packaging, confocal microscopes, prosthetic devices, capacitors, aircraft, medical devices, and plasma physics research. Master Bond offers technical support throughout the design and manufacturing process to help engineers find the most suitable product.
Master Bond EP21TP-2NV features superior thermal shock and chemical resistance while maintaining durable bonds to similar and dissimilar substrates. This tough compound is noted for its ability to withstand prolonged exposure to fuel and oils. EP21TP-2NV cures at ambient temperatures or more rapidly at elevated temperatures and can be applied without sagging.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. Scroll through to learn more.
It's What's Inside That Counts - Nanosilica Filled AdhesivesMaster Bond
Learn about Master Bond’s nanosilica filled systems offering enhanced abrasion resistance and dimensional stability.
These specialty formulations feature superior physical properties as well as low shrinkage upon curing. View to learn more!
One Component, Non-Drip Adhesive for Structural Bonding Master Bond
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,000 psi, 3,000 psi and 18,000 psi, respectively. It also offers superb dimensional stability and chemical resistance.
Toughened, Two Component, Room Temperature Curing EpoxyMaster Bond
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time. Browse through this infographic to learn more.
View this infographic to learn about MasterSil 973S-LO, a two part silicone ideal for use in vacuum environments. This NASA low outgassing approved, silver filled system features low volume resistivity and high flexibility. Scroll through to learn more!
Electrically Conductive Epoxy Charges AheadMaster Bond
Nickel filled epoxy system EP21TDCN-LO meets NASA low outgassing specifications and features excellent electrical conductivity. This adhesive and sealant is ideal for use grounding, shielding and static dissipation applications. Scroll through to learn more!
One part epoxy, Supreme 18TC, contains a blend of special thermally conductive fillers allowing it to maintain outstanding heat transfer capabilities. This smooth paste system can be applied in bond lines as thin as 10-15 microns. Supreme 18TC features ultra low thermal resistance and meets NASA low outgassing specifications.
Master Bond EP112LS is a two part, optically clear system for impregnation, potting, encapsulation, sealing and coating applications. This compound features reliable non-yellowing properties and a refractive index of 1.55. It is ideal for use in aerospace and optoelectronics industries.
Super Toughened Epoxy Resists High Temperatures & ChemicalsMaster Bond
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties. This adhesive offers excellent flow properties and a long working life over a wide service temperature range. Scroll through this infographic to learn more!
Browse though Master Bond's product highlights of 2017! These adhesives, sealants, coatings and encapsulation systems feature unique performance properties and many meet stringent industrial specifications.
Check out Master Bond's innovative product developments of 2017! Browse through our highlighted adhesive, sealant, coating and encapsulation compounds from this year.
Master Bond EP13LTE is a one part epoxy featuring a low coefficient of thermal expansion and high temperature resistance. This system is ideal for structural bonding applications where precise alignment is necessary. The following infographic highlights the exemplary properties of EP13LTE.
This document introduces several newly developed products from 2016, including a supreme-grade epoxy with chemical, abrasion and heat resistance, a nickel-conductive epoxy that meets NASA outgassing specifications, a UV-curable system with abrasion resistance and flexibility, a silver-filled silicone that meets NASA outgassing specifications, and a chemical-resistant epoxy with a high glass transition temperature. Contact information is provided at the end.
"$10 thousand per minute of downtime: architecture, queues, streaming and fin...Fwdays
Direct losses from downtime in 1 minute = $5-$10 thousand dollars. Reputation is priceless.
As part of the talk, we will consider the architectural strategies necessary for the development of highly loaded fintech solutions. We will focus on using queues and streaming to efficiently work and manage large amounts of data in real-time and to minimize latency.
We will focus special attention on the architectural patterns used in the design of the fintech system, microservices and event-driven architecture, which ensure scalability, fault tolerance, and consistency of the entire system.
In our second session, we shall learn all about the main features and fundamentals of UiPath Studio that enable us to use the building blocks for any automation project.
📕 Detailed agenda:
Variables and Datatypes
Workflow Layouts
Arguments
Control Flows and Loops
Conditional Statements
💻 Extra training through UiPath Academy:
Variables, Constants, and Arguments in Studio
Control Flow in Studio
QA or the Highway - Component Testing: Bridging the gap between frontend appl...zjhamm304
These are the slides for the presentation, "Component Testing: Bridging the gap between frontend applications" that was presented at QA or the Highway 2024 in Columbus, OH by Zachary Hamm.
AI in the Workplace Reskilling, Upskilling, and Future Work.pptxSunil Jagani
Discover how AI is transforming the workplace and learn strategies for reskilling and upskilling employees to stay ahead. This comprehensive guide covers the impact of AI on jobs, essential skills for the future, and successful case studies from industry leaders. Embrace AI-driven changes, foster continuous learning, and build a future-ready workforce.
Read More - https://bit.ly/3VKly70
This talk will cover ScyllaDB Architecture from the cluster-level view and zoom in on data distribution and internal node architecture. In the process, we will learn the secret sauce used to get ScyllaDB's high availability and superior performance. We will also touch on the upcoming changes to ScyllaDB architecture, moving to strongly consistent metadata and tablets.
What is an RPA CoE? Session 1 – CoE VisionDianaGray10
In the first session, we will review the organization's vision and how this has an impact on the COE Structure.
Topics covered:
• The role of a steering committee
• How do the organization’s priorities determine CoE Structure?
Speaker:
Chris Bolin, Senior Intelligent Automation Architect Anika Systems
Essentials of Automations: Exploring Attributes & Automation ParametersSafe Software
Building automations in FME Flow can save time, money, and help businesses scale by eliminating data silos and providing data to stakeholders in real-time. One essential component to orchestrating complex automations is the use of attributes & automation parameters (both formerly known as “keys”). In fact, it’s unlikely you’ll ever build an Automation without using these components, but what exactly are they?
Attributes & automation parameters enable the automation author to pass data values from one automation component to the next. During this webinar, our FME Flow Specialists will cover leveraging the three types of these output attributes & parameters in FME Flow: Event, Custom, and Automation. As a bonus, they’ll also be making use of the Split-Merge Block functionality.
You’ll leave this webinar with a better understanding of how to maximize the potential of automations by making use of attributes & automation parameters, with the ultimate goal of setting your enterprise integration workflows up on autopilot.
[OReilly Superstream] Occupy the Space: A grassroots guide to engineering (an...Jason Yip
The typical problem in product engineering is not bad strategy, so much as “no strategy”. This leads to confusion, lack of motivation, and incoherent action. The next time you look for a strategy and find an empty space, instead of waiting for it to be filled, I will show you how to fill it in yourself. If you’re wrong, it forces a correction. If you’re right, it helps create focus. I’ll share how I’ve approached this in the past, both what works and lessons for what didn’t work so well.
GlobalLogic Java Community Webinar #18 “How to Improve Web Application Perfor...GlobalLogic Ukraine
Під час доповіді відповімо на питання, навіщо потрібно підвищувати продуктивність аплікації і які є найефективніші способи для цього. А також поговоримо про те, що таке кеш, які його види бувають та, основне — як знайти performance bottleneck?
Відео та деталі заходу: https://bit.ly/45tILxj
MySQL InnoDB Storage Engine: Deep Dive - MydbopsMydbops
This presentation, titled "MySQL - InnoDB" and delivered by Mayank Prasad at the Mydbops Open Source Database Meetup 16 on June 8th, 2024, covers dynamic configuration of REDO logs and instant ADD/DROP columns in InnoDB.
This presentation dives deep into the world of InnoDB, exploring two ground-breaking features introduced in MySQL 8.0:
• Dynamic Configuration of REDO Logs: Enhance your database's performance and flexibility with on-the-fly adjustments to REDO log capacity. Unleash the power of the snake metaphor to visualize how InnoDB manages REDO log files.
• Instant ADD/DROP Columns: Say goodbye to costly table rebuilds! This presentation unveils how InnoDB now enables seamless addition and removal of columns without compromising data integrity or incurring downtime.
Key Learnings:
• Grasp the concept of REDO logs and their significance in InnoDB's transaction management.
• Discover the advantages of dynamic REDO log configuration and how to leverage it for optimal performance.
• Understand the inner workings of instant ADD/DROP columns and their impact on database operations.
• Gain valuable insights into the row versioning mechanism that empowers instant column modifications.
As AI technology is pushing into IT I was wondering myself, as an “infrastructure container kubernetes guy”, how get this fancy AI technology get managed from an infrastructure operational view? Is it possible to apply our lovely cloud native principals as well? What benefit’s both technologies could bring to each other?
Let me take this questions and provide you a short journey through existing deployment models and use cases for AI software. On practical examples, we discuss what cloud/on-premise strategy we may need for applying it to our own infrastructure to get it to work from an enterprise perspective. I want to give an overview about infrastructure requirements and technologies, what could be beneficial or limiting your AI use cases in an enterprise environment. An interactive Demo will give you some insides, what approaches I got already working for real.
Keywords: AI, Containeres, Kubernetes, Cloud Native
Event Link: https://meine.doag.org/events/cloudland/2024/agenda/#agendaId.4211
Conversational agents, or chatbots, are increasingly used to access all sorts of services using natural language. While open-domain chatbots - like ChatGPT - can converse on any topic, task-oriented chatbots - the focus of this paper - are designed for specific tasks, like booking a flight, obtaining customer support, or setting an appointment. Like any other software, task-oriented chatbots need to be properly tested, usually by defining and executing test scenarios (i.e., sequences of user-chatbot interactions). However, there is currently a lack of methods to quantify the completeness and strength of such test scenarios, which can lead to low-quality tests, and hence to buggy chatbots.
To fill this gap, we propose adapting mutation testing (MuT) for task-oriented chatbots. To this end, we introduce a set of mutation operators that emulate faults in chatbot designs, an architecture that enables MuT on chatbots built using heterogeneous technologies, and a practical realisation as an Eclipse plugin. Moreover, we evaluate the applicability, effectiveness and efficiency of our approach on open-source chatbots, with promising results.
"Frontline Battles with DDoS: Best practices and Lessons Learned", Igor IvaniukFwdays
At this talk we will discuss DDoS protection tools and best practices, discuss network architectures and what AWS has to offer. Also, we will look into one of the largest DDoS attacks on Ukrainian infrastructure that happened in February 2022. We'll see, what techniques helped to keep the web resources available for Ukrainians and how AWS improved DDoS protection for all customers based on Ukraine experience
The Department of Veteran Affairs (VA) invited Taylor Paschal, Knowledge & Information Management Consultant at Enterprise Knowledge, to speak at a Knowledge Management Lunch and Learn hosted on June 12, 2024. All Office of Administration staff were invited to attend and received professional development credit for participating in the voluntary event.
The objectives of the Lunch and Learn presentation were to:
- Review what KM ‘is’ and ‘isn’t’
- Understand the value of KM and the benefits of engaging
- Define and reflect on your “what’s in it for me?”
- Share actionable ways you can participate in Knowledge - - Capture & Transfer