1. SANJAY . D .
DHNDARE
29/09/15 1ME(E&TC engg.),DYPSOE,Lohegaon,Pune
2. CONTENT :
Introduction
Brief history
Need
Boundary Scan Test
Terminology used
Working
What is four wire test ?
29/09/15 2ME(E&TC engg.),DYPSOE,Lohegaon,Pune
3. Cont....
BST cell and its VHDL code
BST register
TAP controller
Signal specification
Timing diagram
Conclusion
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 3
4. INTRODUCTION
What is scan test ?
The method in which testing of boards , separate
components and ASIC is carried out in a efficient
way is called as scan test.
It is also known as Boundary Scan Test (BST).
29/09/15 4ME(E&TC engg.),DYPSOE,Lohegaon,Pune
5. BRIEF HISTORY
1985 : JETAG studied a board testing
1986 : JETAG became JTEG
1990 : ANSI provide 2.0 standard
1994 : JTAG formed 2.0 standard with
1149.1 IEEE standard
1994 : New standard for test port and BST
i.e.1149.1b
From 1994 IEEE standard still referred as a
JTAG standard
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 5
6. NEED
Existing technology i.e. Bed-of-nail had limited
specification .
Difficult to test the IC with closer pin spacing.
Testing speed is generally low .
Only one component testing is carried out at
one time .
Separation below 0.1mm or 100 mm with 200
or more pins is not possible in bed-of-nail
testing .
Need standard System Test Port and Bus.
29/09/15 6ME(E&TC engg.),DYPSOE,Lohegaon,Pune
8. WHAT IS FOUR WIRE TEST ?
The method include four basic signal to test
the device.
TDI : Test Data Input
TDO :Test Data Output
TCK :Test Clock
TMS :Test Mode Select
RST (OPTIONAL) : Reset signal
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14. POWER ON RESET FOR TAP
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15. BST INSTRUCTION
SAMPLE /PRELOAD : To get snapshot of
chip output signal i.e. put data on a chip to
be test .
EXTEST : To test off-chip circuits
INTEST : To test on-chip circuits
CLAMP : Forces component output to be
driven by BSR
INCODE :To get the ID of device to be
check
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 15
16. Cont...
USER CODE :To get the ID of user
programmable device under test
HIGH Z: To bring the output all components
at high impedance state
It will avoid damage of components
Need to reset the controller or board when
goes into high impedance state
29/09/15 ME(E&TC engg.),DYPSOE,Lohegaon,Pune 16
17. CONCLUSION
From a given discussion we can conclude that it
is not possible to test printed circuit boards with
bed-of-nails tester to test multi-chip modules at all
without BST hence it is an important tool to test the
circuitry .
29/09/15 17ME(E&TC engg.),DYPSOE,Lohegaon,Pune
18. REFERENCES
Digital system testing and testable design by
M.Abramovici .
Agrawal.V. K. Multiple fault testing of large circuits
IEEE trans.vol c-30,no.11 pp 855 865.
Introduction to testing and BIST by Breuer .M .A. And
A. D. Friedman.
29/09/15 18ME(E&TC engg.),DYPSOE,Lohegaon,Pune