JCL Inc, is a major chip manufacturing firm that sells its products to computer manufacturers
like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc involves three basic
operations depositing. patterning, and etching - Depositing. Using chemical vapor deposition
(CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer
of solid material on the chip. - Patterning Photolithography projects a microscopic circuit pattern
on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic
film. It is repeated many times as each layer of the chip is built. - Eiching: Etching removes
selected material from the chip suiface to create the device structures. The table below lists the
required processing times and setup times at each of the steps. There is unlimited space for
buffer inventory between these steps. Assume that the unit of production is a wafer, from which
individual chips are cut at a later stage. Do not round intermediate calculations. Round your
answer to 2 decimal places a. What is the process capacity in units per hour with a batch size of
150 wafers? units per hour Do not round intermediate calculations. Round your answer to 2
decimal places b. What is the utilization of depositing if the batch size is 150 wafers?.
JCL Inc, is a major chip manufacturing firm that sells its products t.pdf
1. JCL Inc: is a major chip manufacturing firm that sells its products to computer manufacturers
like Dell, Gateway, and others, In simplified terms, chip making at JCL Inc. involves three basic
operations: depositing, potterning, and etching: - Depositing: Using chemical vapor deposition
(CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer
of solid material on the chip. - Patterning: Photolithography projects a microscopic circuit pattern
on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic
film. It is repeated many times as each layor of the chip is built. - Etching: Etching removes
selected material from the chip surface to create the device structures. The table below lists the
required processing times and setup times at each of the steps. There is unlimited space for
buffer inventory between these steps. Assume that the unit of production is a wafer, from which
individual chips are cut at a later stage. Do not round intermediate calculations. Round your
answer to 2 decimal places. a. What is the process capacity in units per hour with a batch size of
50 wafers? units per hour Do not round intermediate calculations. Round your answer to 2
decimal places. b. What is the utilization of depositing if the batch size is 50 waters?
