The document discusses Honeywell's phase change material (PCM) thermal interface technology. It states that PCM transforms from solid to liquid at an optimal temperature, providing better surface wetting and lower contact resistance than other thermal interface materials like grease. The document claims Honeywell's PCM formulation uses advanced additives and a rigid polymer structure to create stronger molecular bonds and limit material mobility, reducing the risk of pump-out and improving reliability over long-term use. Test results shown indicate Honeywell PCM maintains stable thermal performance compared to degradation in grease over thermal cycling and high temperature baking.

1. copyright2016HoneywellInternationalInc.Allrightsreserved.

2. “Although all statements and information contained herein are
believed to be accurate and reliable, they are presented without
guarantee or warranty of any kind, express or implied. Information
provided herein does not relieve the user from the responsibility of
carrying out its own tests and experiments, and the user assumes all
risks and liability for use of the information and results obtained.
Statements or suggestions concerning the use of materials and pro-
cesses are made without representation or warranty that any such
use is free of patent infringement and are not recommendations to
infringe any patent. The user should not assume that all toxicity data
and safety measures are indicated herein or that other measures
may not be required.”
2

3. OUTLINE 概要
1. Industry thermal trends
行业热需求发展趋势
2. TIM introduction
热界面材料介绍
3. PCM technology and advantage
相变化技术和优势
4. Strength of HEM TIM and data sharing
霍尼韦尔热界面材料的性能
5. HEM TIM applied in LED application
霍尼韦尔相变化热界面材料在LED的实际应用
6. Q&A
讨论

4. TIM Thermal Management
导热界面材料热管理需求
- Lower Thermal Impedance 低热阻
- Harsher Test Conditions 更严苛工作环境
- Increased Thermal Stability and Reliability 杰出的热稳定性和可靠性
INDUSTRY TREND: ACCELERATING POWER
DENSITIES 行业趋势
• Greater Functionality 高集成度
• Increase Power consumption 高功耗
• Device / Package shrink 小尺寸
• Higher Power densities 高功率密度
• Greater density board layout 高密度设计
• Increasing Device Temperatures 高工作温度
Rising Power Densities Drive Greater Thermal Needs
日益增长的热密度对于热管理有更高需求
Server and Telecom
Heat Load

5. • Power increases more than
seven times after the year
2000
功耗提升7倍
• Power cycling trends in
networking applications
典型网络设备的应用环境
MERCHANT SILICON POWER IN NETWORKING
APPLICATIONS 典型网络设备的芯片应用趋势

6. LED Market Keeps Increasing & Advance Package Grows
LED市场持续增长先进封装逐渐普及
LED MARKET TREND
LED产业发展趋势
LED Market Growth
LED市场日益增长
Advance Packaging Increasing
先进封装逐渐普及

7. THERMAL CHALLENGES FOR LED DESIGN
LED设计中的散热挑战
• Thermal performance and design is
critical to optimum HBLED performance
优化LED设计
- Higher Efficacy 更高效
- More light with less energy 更节能
- Longer reliability 更持久
• Minimize Thermal Resistance
降低热阻达到最佳性能
- Junction to substrate to heat sink
- Essential to maximum thermal
performance
• Thermal Interface Material (TIM)
selection is key to LED thermal design
热界面材料选择至关重要
7
●
●
LED Die
LED Junction
LED COB Substrate
TIM
Heat Sink
Rth J-C
●
●

8. ROLE OF TIMS 热界面材料
TIMs 热界面材料
- Critical thermal path, dissipating heat from
device to spreader
散热系统中的关键因素
Important Properties 主要特性
- Wetting at the interface 表面浸润性
- Thermal Contact Resistance 接触热阻
- Bulk Thermal Conductivity 材料导热率
- Stability 稳定性/可靠性
IC
Heat Sink
TIM 2
TIM 1
Heat Spreader
BGA substrate
PC board
IC
PC board
TIM 1.5
Heat Spreader
Heat Sink
Thermal Bulk of TIM
Thermal Contact at Interface
Thermal Contact at Interface
Thermal Interface Materials fill the microscopic gaps between mating surfaces
IC Device
Constriction of heat flow contacting rough surfaces

9. Thermal Impedance Most Critical to Thermal Dissipation and Performance
热阻对于散热性能起决定性作用
KEY THERMAL PROPERTIES OF TIM
热界面材料的关键参数
Thermal Impedance (C.cm2/W)
热阻
• Thermal bulk resistance + interface contact resistance
• Bond line thickness
TIM
Heat Spreader
Heat Sink
IC Rc1
Rc2
BLTRTIM =
KTIM
BLT
RTIM
TIM Thermal Impedance:
TIT = BLT/K + RC
TIT = Total Thermal Impedance
BLT = Bond Line Thickness of TIM
K = Bulk Thermal Conductivity of TIM
RC = Thermal Contact Resistance at the Interfaces
Bulk Thermal Conductivity (W/mK)
导热率
• Material property only
• Does not consider:
- Interface contact resistance
- Bond line thickness
A
q
T
TI
x
T
kAq





k: thermal conductivity
x: thickness of sample
T: temperature difference across sample
A: cross-sectional area of sample

10. TIM
Solution
Thermal Grease 导热硅脂
• silicone-based, greases are non-curing,
conformable
• provide low thermal resistance for
applications that do not require long term
reliability and thermal shock
Gap Pad 导热垫片
• typically thicker (>1mm) than other TIMs and
designed to have good compression
properties
• however, they usually can not deliver the
same level of thermal performance as other
TIM materials
Phase Change Material 相变化材料
• transforms from a solid state to a liquid
or gel state
• no bleed out, pump out and
degradation issues normally found in
thermal greases
Thermal Adhesives 导热粘合剂
• one or two-part crosslinkable
materials based on epoxies or
silicones
• known for their structural support -
this can eliminate the need for
mechanical clamps, but cure time is
required and they are not reworkable
TIM MATERIAL CHOICES 常用热界面材料
Others 其他
• thermal compound, tapes,
films, epoxy, etc.
Thermal Gel 导热凝胶
• normally is one-component, cross-
linked or pre-cured gel structure
• good compressibility and dispense
process automation
Metallic 金属
• all-metal (e.g., solder) or utilize
a metal matrix or binder to
which metallic or nonmetallic
fillers have been added
• good thermal conductivity but
normally contact resistance or
surface wetting is not good

11. Viscosity粘度
Melt temp
相变化温度
Solid Liquid/gel state 熔融状态
• Optimal Surface wetting 优化表面浸润性
• Low Contact Resistance 降低接触热阻
• Low Thermal Impedance 降低材料热阻
Temperature 温度 
xx C
Theoretical Curve: PCM Viscosity vs. Temperature
理论曲线 : 相变化材料的粘度与温度的关系
WHAT IS PCM? 什么是相变化材料？

12. • Fundamentally three primary
components in PCM
相变化材料的三大构成
• Each are vital to robust
polymer matrix integrity and
filler optimization
每一项都至关重要
• Filler 填料
- Thermal
• Wax/Polymer 蜡/聚合物
- Structural integrity
• Additives 添加剂
- Cross linking, ATO, etc
TIM
Performance
and
Reliability
Thermal
Filler
Wax/
Polymer
Additives
PCM Formulation is Critical to Performance
配方决定性能
HONEYWELL PCM TECHNOLOGY
霍尼韦尔相变化技术

13. steric hindrance
PCM Enables Reliable, Long-Term Performance
相变化材料提供长期可靠的高性能
HONEYWELL PCM TECHNOLOGY
霍尼韦尔相变化技术
vs.
PCM: Long Chain
长链
Grease: Short Chain
短链
• Rigid Polymer Structure
坚固聚合物结构
Grease: Si-O-Si
structure
“Less Rigid Structure”
脆弱架构
PCM: C-C-C with H steric
hindrance
“Rigid Structure”
坚固架构
• Good flow-ability but…
优秀的流动性，但是。
。。。。。
• Potential for migration,
dry-out and pump-out
issues.
潜在填料迁移，变干，
泵出风险
• Stable and consistent
filler
稳定填料状态
• Minimizes filler
migration and
separation
降低填料分离风险
• Long Polymer Chain
聚合物长分子链
Honeywell Phase Change
 Higher molecular weight 大分子量
 Less material mobility 少材料迁移
 Reduced risk of pump-out 低泵出风险
 Improved reliability 高可靠性

14. Honeywell PCM Technology Delivers Unequaled Reliability
霍尼韦尔相变化材料提供杰出的可靠性
Other TIM :
Linear Structure
线状结构
HEM PCM :
Branch Structure
枝状结构
• Non-Linear, Branch Structure
枝状结构
vs.
• Additive & Polymer Technology
添加剂以及聚合物科技
HEM PCM :
Chemical &
Physical Bond
Combination
物理化学混合
Other TIM :
Physical
Absorption
物理吸附
HEM PCM: continuous
interface between heat
sink and ASIC lid
Grease pump-out
and creation of
voids
• Advanced Additive-polymer Technology
先进添加剂技术
 Superior intermolecular force
加强分子键合力
 Great surface tension
出众表面张力
 Limited material mobility
少材料迁移率
 Robust polymer structure
杰出聚合物结构
 Lower risk of pump out
低泵出风险
 Excellent reliability
卓越可靠性能
HONEYWELL PCM TECHNOLOGY
霍尼韦尔相变化技术

15. Honeywell
PCM
Initial 1000 cycles
Silicone
Grease
Thermal Cycling Test Condition 温度循环测试条件 :
• -55°Cx5min + 125°Cx5 min, ramp up/down 15min, for 500 to 1000 cycles
• Sandwich PCM & grease between aluminum and glass plates set at 200μm gap
• TI Test : ASTM D5470
Thermal Cycle (-55 C to 125 C)
vs. Grease
PCM Stable Polymer Structure with No Pump-Out Issue
低泵出风险
HEM PCM VS. SILICONE GREASE
相变化材料和导热硅脂
Grease breaks down Grease TI degrades
Silicone Grease
Honeywell PCM

16. Honeywell
PCM
Initial 400 hr
Silicone
Grease
High Temperature Baking (HTB) Test Condition 高温烘烤条件:
• HTB = 150C
• PCM & thermal grease dispensed on glass plates
• TI Test : ASTM D5470
High Temp Bake at 150 C
vs. Grease
Oil bleeding from grease Grease TI degrades
0.09 0.110.12
1.78
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
Initial Baking 400 Hr
Honeywell PCM
Competitor greaseSilicone Grease
Honeywell PCM
Honeywell PCM Does Not Suffer From Silicone Oil Bleed
无硅油分离现象
HEM PCM VS. SILICONE GREASE
相变化材料和导热硅脂

17. 17HEM PCM HIGH RELIABILITY PERFORMANCE
相变化材料的高可靠性
Honeywell PCM Provides Superior Long Term Reliability
霍尼韦尔热界面材料提供出众的长期可靠性
Test Condition: 150°C continuous baking
Test Method: Laser Flash, ASTM E1461
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
T0 200Hrs 400Hrs 600Hrs 800Hrs 1000Hrs 1300Hrs 1500Hrs 2000Hrs 2400Hrs 2800Hrs 3000Hrs 3200Hrs
ThermalImpedance(°C-cm2/W)
Time
Reliability Performance Comparison
长期可靠性比较
LTM6300 PTM5000 PTM6000 PTM7000 Grease1
Grease2 Grease3 Grease4 Other PCM1 Other PCM2

18. 18HEM PCM HIGH RELIABILITY PERFORMANCE
相变化材料的高可靠性
7.3
14.6
29.2
11.0
21.9
43.8
3.7
7.3
14.6
2.9
5.8
11.7
0
5
10
15
20
25
30
35
40
45
50
150'C 120'C 100'C 90'C 80'C
Year
Lifetime Comparison
使用寿命比较
PTM7000
PTM6000
PTM5000
LTM6300
Grease1
Grease2
Grease3
Grease4
Other PCM1
Other PCM2
Honeywell PCM Enables Longer Product Life Time
霍尼韦尔热界面材料提供更长久产品使用寿命
Assumption is based on 150’C baking data and Arrhenius equation
使用寿命预期是根据150’C烘烤性能以及阿累尼乌斯经验公式推导而来

19. © 2015 by Honeywell International Inc. All rights reserved .
HEM PCM Shows Superior Performance
霍尼韦尔热界面材料显示更卓越性能
19HEM PCM ACTUAL APPLICATION ON LED
相变化材料在LED上的实际应用
TIM2
导热界面材料
Heat Sink
散热器
LED L2 Package
LED 芯片
Temperature
界面温度
HEM LTM6300
霍尼韦尔材料
Other Silicone TIM
其他有机硅材料
#1 156.0’C 160.0’C
#2 86.5’C 89.2’C
#3 80.7’C 82.0’C
#1
#2
#3
Test Condition 测试条件：
• Room Temperature 室温 : 33.0’C
• Input Voltage/Current 输入电压/电流 : 220V/50Hz, 0.138A
• LED Lamp Input Power 灯具输入功率 : 30W
• Silicone TIM TC 有机硅材料导热率 : >10W

20. © 2015 by Honeywell International Inc. All rights reserved .
10.2
14.1
11.7
10.6
15.8
11.6
HEM LTM6300 Silicone Grease#1 Silicone Grease#2 HEM LTM6300 Silicone Grease#1 Silicone Grease#2
Temperature('C)
TIM Material
20HEM PCM ACTUAL APPLICATION ON LED
相变化材料在LED上的实际应用
HEM PCM Shows Superior Performance
霍尼韦尔热界面材料显示更卓越性能
20W 40W
Test Method 测试方法 :
• Two different power COB LED : 20W/40W
两种不同功率COB LED
• Test COB & Heat Sink temperature
测量COB芯片温度和散热器温度
• Delta T is the temperature difference between COB and Heat Sink
温度差是COB芯片的温度和散热器温度的差值
T

21. HONEYWELL TIM PRODUCT PORTFOLIO
霍尼韦尔相变化热界面材料
Application
Classification
Product
Series
TI*
(C-cm2/W),
No Shim
TC
(W/m˚C)
Reliability
(hrs), 150°C
baking
Note
High-End
高阶产品
PTM7000-SP 0.056 6.50 2000 hrs High Thermal performance
PTM6000-SP 0.070 4.40 3000hrs Advanced Reliability
Mid-Range
中档产品
PTM5000-SP 0.070 4.40 1000hrs
Entry Level
Low COO
高性价比产品
LTM6300-SP 0.130 2.03 600hrs
Remarks:
1. All TI data is collected after fully phase changed.

22. THANK YOU
谢谢！
QUESTIONS?

23. • Per Fourier’s Law of Heat Conduction:
Connect to data
acquisition set-up
Cooling Block
(maintain constant low temp.)
Lower Intermediate Block
Test Sample
Upper Intermediate Block
Heater Block
(provide constant heat)
T1
T3
T2
T4
T6
T5
A
q
T
TI
x
T
kAq





q = heat flux
K = thermal conductivity
x = thickness of sample
T = temperature difference across sample
A = cross-sectional area of sample
THERMAL IMPEDANCE TEST METHOD:
CUT BAR
• ASTM D5470
- Destructive, one time test only
- Fast test for immediate results
- Most common test method

24. THERMAL IMPEDANCE TEST METHOD:
LASER FLASH
ASTM E1461
• Thermal Impedance Between Si, Ni-plated Cu Surfaces
- Includes the CTE mismatch
- includes actual surface finish
• Typical Coupons:
- Ni-plate copper, 0.5”X0.5”X0.03”
- Si, 0.5”X0.5”X0.02”
• Suitable for Accelerated Life Test
Die
TIM
Spreader
Flash
IR Sensor
Time
Temperature
Laser Pulse
Netzsch Laser Flash
k = ()(Cp)()
k = Thermal Conductivity (W/cmK)
 = Thermal Diffusivity (cm2/s)
 =0.13879L2 /t1/2
L=specimen thickness, meter
t1/2=the time required for the temperature
rise to reach 50% percent of ΔTmax
Cp = Specific Heat Capacity (J/gK)
 = Density (g/cm3)
• Determines Thermal Diffusivity
• Thermal Conductivity/Resistance Calculated

25. RELIABILITY TEST CONDITION
长期老化性能测试条件
• Highly-Accelerated Temperature and Humidity Stress
Test (HAST)
- Standard: JESD22-A110-B
- Testing Condition: 130°C, 85%RH, 96 hours
- Objective: Accelerate corrosive impact of high humidity and
temperature on the thermal performance of the test structure
• Temperature Cycling Test
- Standard: JESD22-A104C
- Testing Condition: -55°C to 125°C (TCB), 1000 cycles
- Objective: Determine the resistance of TIM to extremes of high
and low temperatures, and its ability to withstand cyclical
stresses
• High Temperature Storage
- Standard: JESD22-A103
- Testing Condition: 150°C, 1000 hours
- Objective: Accelerate changes in TIM’s material and
performance characteristics relative to prolonged and elevated
temperature
HAST chamber
TC chamber
Oven