first level inc.Delivering high quality assemblies First Level Capability Overview
Company Profile• Formerly Electronic Packaging Business Unit of Die-Tech Inc. (1993-1999)• Carol Homsy & Nabil Homsy acquired all assets (Jan. 2000)• 10,000 sq. ft. facility with 4200 sq. ft. dedicated clean room manufacturing space – 2,500 Class 100,000 – 1,500 class 10,000 – 200 class 1000• Total number of employees: 16• More than half of employees have been with company longer than 10 years.• 1 trained Six Sigma Black Belt first level inc.
Company ProfileCustomers rely on FLI for high quality assembly services, consulting,package design, and engineering process development.Target markets require high reliability high precision electronic assembly.• Military & Aerospace• Medical• Automotive• Photonics & Opto-Electronic• RF & MicrowaveAssembly types vary from manual assembly which require hundreds ofcomponent placements per unit at assembly volumes of hundreds permonth to automated high speed high density LED modules at volumes ofthousands per month.Common thread is they are all high reliability applications requiringconsistent and high quality assembly techniques first level inc.
Company Profile Customer Market Breakdown Product Type Medical Commercial Contract manufacturing Military & Aerospace Design services Automotive Consulting services Other• 39 Active customers• Manufacturing service breakdown 70% consignment, 20% captive, 10% turn-key• Of these the top 8 have been working with us for more than 5 years• For most customers First Level is involved in early package design review first level inc.
Core ProcessesDie AttachWire BondingStud BumpingFlip Chip AttachEncapsulationHermetic Lid-SealingFine and Gross Leak TestingPackage AssemblySMT AssemblyLead Frame Attach, Trim and Form first level inc.
Die Attach• Two fully automated Datacon APM 2200• 7000 Placements per hour (5 million per month)• Capable of 10 µm @ 6σ• Flip Chip Attach• Magazine wafer, waffle pack or Gel pack handling capability.• Programmable Automatic Transportation System (substrate/boat/carrier)• volumetric screw pump, time pressure, flip chip, dipping, transfer• Pattern recognition system• Theta-Axis rotary bond head. 0-360 deg• Programmable lighting system first level inc.
Precision Die PlacementSEC 580• Semi-automatic precision die placement• Split Vision System• Heated Stage• Force up to 10Kg• Flip Chip Attach• Thermo Compression BondingPrecision Aligner• 3 um alignment precision first level inc.
Wire BondingFully automated gold wire• X/Y resolution: 2.5 µm• Bond head resolution: 2.54 µm• Bonding accuracy: ± 3.5 µm at 1-sigma• Bonding method: thermosonic• Bonding speed: 100 ms/wire (STD), 115 ms/wire (loop control)• Fine pitch capability: 70 µm• Wire size: 0.9~2.0 milFully automated aluminum wedgeAutomated large area bondersRibbon bondingManual gold and aluminum 60 x first level inc.
Stud Bumping & Flip Chip AttachFully automated gold wire bumping• Full wafers or individual die as small as 0.5mm square• Bump diameter 45 to 55 µm• Bump Height 25 to 85 µm• Bump Pitch 70 um• Flip Chip Attach using silver filled epoxy, anisotropic conductive epoxy, or solder alloy. first level inc.
Dispensing• Fully automated encapsulation processes• Two in line machines with vision, heated bed and positive displacement• Two gantry style machines with large area capability and vision• Positional accuracy of +/- 1 mil.• Stamping / pin transfer capability as small as 4 mil dots with certain materials. first level inc.
Reflow and Epoxy cureMultiple continuous processes• Manix TSC1210 – 10 zones, air• Watkins-Johnson – 5 zones, 10ppm O2• BTU – 3 zones, N2/H2-N2/Air• Sikama – 3 zones conduction• UV with variable lamp intensity 125 – 300 WPI first level inc.
Vacuum Furnace Hermetic Lid Sealing• DAP 110 by SST• Die attach & Lid solder sealing• Vacuum Reflow• Nitrogen or Forming gas• Graphite Boat for uniform heat distribution• Max Temperature up to 900°C first level inc.
Leak Testing• Fine and Gross leak testing• ASM 180T• Per MIL-STD 883• Meets and exceeds all criteria to perform leak testing in accordance with MIL-STD-883E Method 1014.9• Can accurately detect leaks as small as 10-10 mbar. l/s (two decades better than the mil spec.) first level inc.
Lead Attach / Trim and FormLead Frame Attach• Hydrogen flame reflow for localized lead attach• Flat and Clip Lead frame attach• Pitch as small as 0.4mmTrim & Form• Precision lead forming per JEDEC specifications first level inc.
Manual Assembly• Highly skilled and experienced staff accustomed to highly complex assemblies requiring exacting precision and consistency.• Precise component placement; +/- 3um accuracy• Tedious assembly such as epoxy dotting an array of 425 pads with size 300 um on 600 um pitch• High density component placements first level inc.
Design For Manufacturability• DFSS using DMADV for new processes – The team at FLI has many years of experience bringing lab scale concepts to full scale production. We can help define/focus the goals of the product design keeping the resources focused on the important aspects. – FLI has a proven track record of “thinking outside the box” which translates into customer value – FLI provides design assistance built on “real life” manufacturing experiences, years of packaging experience, and expert materials knowledge. – On staff black belt will frame the process with the appropriate SPC to ensure continuous optimum performance.• DMAIC for improvement of existing customer processes – FLI has successfully used this technique to increase process efficiency resulting in reduced manufacturing costs. – Project just recently moved to Control phase. The result was an increase of first pass yields from 18% to 93%. – FLI worked with customer, suppliers and internal process for this result.
QualityQuality management system complies with ISO 9001:1994• Documented quality management system that includes a quality manual, operating procedures and work instructions.• Management fully supports the QMS through directives, resources and driving continuous improvement activities• Identification and Traceability are maintained for each product built• Process for planning and implementing production activities is maintainedProcess control• Process monitoring of performance for continuous processes• Yields are monitored by failure type and frequency which is the driver for improvement activities• Quality and reliability are verified by performing various MIL-STD testing• Control charts are implemented according to customer requirements first level inc.
Contact:Matthew H. FosterPhone: 717-266-2450Cell: 609-280-0289Skype: matthew_h_fosterfirst level Inc.3109 Espresso WayYork, PA 17406 first level inc.