Mattson AST 2800 RTP 8 inch Rapid Thermal Processing Equipment
•
0 likes•227 views
Mattson AST 2800 RTP 8 inch Rapid Thermal Processing Equipment. In Asia. It was working. We sell it at AS IS,WHERE IS
Report
Share
Report
Share
Download to read offline
Recommended
Film Properties of ALD SiNx Deposited by Trisilylamine and N2 Plasma
Presented by Dr. Markus Bosund
Silicon nitride is a widely used material in semiconductor applications‚ such as gate dielectrics‚ III/V surface passivation and etch stop layer.
PEALD SiNx films have been previously grown using aminosilanes like BTBAS with N2 plasma [1]. These processes generally have a relatively low growth rate of 0.15 - 0.21 Å/cycle and high film quality can only be reached at above 300 °C deposition temperatures. Trisilylamine (TSA) has been previously combined with N2/H2 plasma at 300–400 °C [2]‚ NH3 plasma at 50–400 °C [3] and N2 plasma at 250 – 350 °C [4] to grow PEALD SiNx films. However‚ in these works the low temperature range has remained either inaccessible or uncharted.
In this work we explored the PEALD TSA-N2 plasma process with a wide deposition temperature range from 50 to 350 °C. Focus was given to the electrical and optical properties of the films. A Beneq TFS 200 capacitively coupled hot wall plasma ALD reactor was used at direct plasma mode. It was found that reactor temperature‚ and plasma power and time had the highest impact on the film properties. Film deposition was observed at temperatures as low as 50 °C. Metal insulator semiconductor (MIS) structures were used to determine the breakdown field and leakage current at different temperatures. Films were dipped in 1 % HF solution for etch rate determination.
Lowering Production Cost of "Big MEMS (and Sensors)" Chip Technologies using ...
Since the 1980’s microelectromechanical systems (“MEMS”) based devices have been manufactured primarily on round silicon (“Si”) substrates. This has been accomplished by primarily riding the “coattails” of the semiconductor (“SEMI”) integrated circuit chip industry, where Si substrate diameters have grown from less than 50 mm to 300 mm. As new larger diameter fabrication equipment was needed the previous generation tools (refurbished) were adopted by the MEMS industry at much lower price points.
Today, the SEMI industry has stalled at 300 mm, likewise the MEMS industry is mired at 200 mm diameter. The issue is that many MEMS chip dimensions can be large, greater than 10 x 10 mm^2 in area and can have expensive wafer-level packaging (“WLP”) utilized to protect its moving parts from inexpensive plastic molded packaging. When considering the $1 per mm^2 ‘rule of thumb’ for unyielded chip production cost, these “Big MEMS” chips are very difficult to fabricate cost effectively for their accompanying product market adoption.
Meanwhile over the last two decades of flat panel display (FPD) technology requirements have continued to increase in complexity and manufacturing capabilities. This includes increasing FPD resolution from today’s 4K to 8K and glass substrate size up to 3.1 x 3.1 m^2, a.k.a. ‘Generation 10 (Gen 10 or G10)’ glass. To achieve these challenging levels many manufacturing obstacles have had to be overcome, such as magnetron sputtering over large areas, including deposition thickness uniformity and optical property uniformity, the reduction of yield detractors, such as particles generated due to plasma arcing, and other process challenges.
What if the MEMS/sensor industry wasn’t restricted in substrate size, such as by utilizing G8 (2.1 x 2.4 m^2) or older (smaller area) fabrication equipment? Then, the chip cost could dramatically decrease.
Introduction to atomic layer deposition (ALD): principles, applications, future
<erratum at the bottom / update 3.5.2019> Introductory lecture on Atomic Layer Deposition (ALD) by Prof. Riikka Puurunen, given at Aalto University School of Chemical Engineering on November 8, 2018. Lecture contents: Principles and concepts of ALD; Some history; Applications of ALD; Words on future. In addition to the core lecture contents, discusses where we have ALD layers in our smart mobile phones; mentions (some) faces of ALD in Finland; STG podcasts; Virtual Project on the History of ALD.
Corresponding lecture capture by Panopto available at: https://aalto.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=bd0aee67-7ca5-4973-8216-a99200e888b1
Erratum! Small errors spotted in the slides are described below. Updated 3.5.2019.
* slide 44 Luminescent: ZnS:Mg —> not Mg but Mn! --> ZnS:Mn
* slide 54 high-k solution: article not from 2017 but 2007
ALD_Kessels.pdf
Atomic layer deposition (ALD) is a thin film deposition technique that relies on self-limiting surface reactions to deposit one atomic layer at a time. It allows for precise thickness control, high conformality, and deposition of a wide range of materials at relatively low temperatures. The ALD process involves alternating exposures of precursor gases separated by purging, with the precursors reacting through ligand exchange reactions on the substrate surface. This allows layer-by-layer growth and results in superior uniformity and conformality compared to other vapor deposition methods.
CATÁLOGO POLTANK
En Poltank diseñamos y fabricamos recipientes a presión en poliéster reforzados con fibra de vidrio (PRFV) para piscinas, acuarios, parques acuáticos, zoológicos, acuicultura, industria alimentaria y bebidas, minería, irrigación, tratamiento de agua potable, tratamiento de aguas residuales, y desaladoras.
HIGH-K DEVICES BY ALD FOR SEMICONDUCTOR APPLICATIONS
This document summarizes research on high-k dielectric devices fabricated using atomic layer deposition (ALD) for semiconductor applications presented by researchers from the Fraunhofer Institute for Photonic Microsystems. It discusses the history of ALD deposition of high-k materials like TiO2 and laminates of Ta2O5 and HfO2 for capacitor applications in the 1990s. It also summarizes the development of TiN/ZrO2-based capacitors and research on ALD HfO2 for emerging ferroelectric memory devices. Finally, it discusses the fabrication of 3D capacitor structures using ALD with densities over 250 nF/mm2 and possibilities for 3D integration of ferroelectric HfO2
BioMEMS Market and Technology 2020
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
LTCC Overview
The document discusses LTCC (low temperature co-fired ceramics) passive integration, including challenges. It provides an overview of LTCC materials and processes, comparing LTCC to other integration technologies. Key advantages of LTCC include its parallel layer process, ability to achieve high layer counts up to 100 layers, compatibility with RF-friendly materials, and potential for high component density and module reliability. However, challenges for LTCC include limitations on forming precise resistors and inductors. The document also reviews common LTCC dielectric materials and provides details on Motorola's high-Q T2000 LTCC dielectric composition.
Recommended
Film Properties of ALD SiNx Deposited by Trisilylamine and N2 Plasma
Presented by Dr. Markus Bosund
Silicon nitride is a widely used material in semiconductor applications‚ such as gate dielectrics‚ III/V surface passivation and etch stop layer.
PEALD SiNx films have been previously grown using aminosilanes like BTBAS with N2 plasma [1]. These processes generally have a relatively low growth rate of 0.15 - 0.21 Å/cycle and high film quality can only be reached at above 300 °C deposition temperatures. Trisilylamine (TSA) has been previously combined with N2/H2 plasma at 300–400 °C [2]‚ NH3 plasma at 50–400 °C [3] and N2 plasma at 250 – 350 °C [4] to grow PEALD SiNx films. However‚ in these works the low temperature range has remained either inaccessible or uncharted.
In this work we explored the PEALD TSA-N2 plasma process with a wide deposition temperature range from 50 to 350 °C. Focus was given to the electrical and optical properties of the films. A Beneq TFS 200 capacitively coupled hot wall plasma ALD reactor was used at direct plasma mode. It was found that reactor temperature‚ and plasma power and time had the highest impact on the film properties. Film deposition was observed at temperatures as low as 50 °C. Metal insulator semiconductor (MIS) structures were used to determine the breakdown field and leakage current at different temperatures. Films were dipped in 1 % HF solution for etch rate determination.
Lowering Production Cost of "Big MEMS (and Sensors)" Chip Technologies using ...
Since the 1980’s microelectromechanical systems (“MEMS”) based devices have been manufactured primarily on round silicon (“Si”) substrates. This has been accomplished by primarily riding the “coattails” of the semiconductor (“SEMI”) integrated circuit chip industry, where Si substrate diameters have grown from less than 50 mm to 300 mm. As new larger diameter fabrication equipment was needed the previous generation tools (refurbished) were adopted by the MEMS industry at much lower price points.
Today, the SEMI industry has stalled at 300 mm, likewise the MEMS industry is mired at 200 mm diameter. The issue is that many MEMS chip dimensions can be large, greater than 10 x 10 mm^2 in area and can have expensive wafer-level packaging (“WLP”) utilized to protect its moving parts from inexpensive plastic molded packaging. When considering the $1 per mm^2 ‘rule of thumb’ for unyielded chip production cost, these “Big MEMS” chips are very difficult to fabricate cost effectively for their accompanying product market adoption.
Meanwhile over the last two decades of flat panel display (FPD) technology requirements have continued to increase in complexity and manufacturing capabilities. This includes increasing FPD resolution from today’s 4K to 8K and glass substrate size up to 3.1 x 3.1 m^2, a.k.a. ‘Generation 10 (Gen 10 or G10)’ glass. To achieve these challenging levels many manufacturing obstacles have had to be overcome, such as magnetron sputtering over large areas, including deposition thickness uniformity and optical property uniformity, the reduction of yield detractors, such as particles generated due to plasma arcing, and other process challenges.
What if the MEMS/sensor industry wasn’t restricted in substrate size, such as by utilizing G8 (2.1 x 2.4 m^2) or older (smaller area) fabrication equipment? Then, the chip cost could dramatically decrease.
Introduction to atomic layer deposition (ALD): principles, applications, future
<erratum at the bottom / update 3.5.2019> Introductory lecture on Atomic Layer Deposition (ALD) by Prof. Riikka Puurunen, given at Aalto University School of Chemical Engineering on November 8, 2018. Lecture contents: Principles and concepts of ALD; Some history; Applications of ALD; Words on future. In addition to the core lecture contents, discusses where we have ALD layers in our smart mobile phones; mentions (some) faces of ALD in Finland; STG podcasts; Virtual Project on the History of ALD.
Corresponding lecture capture by Panopto available at: https://aalto.cloud.panopto.eu/Panopto/Pages/Viewer.aspx?id=bd0aee67-7ca5-4973-8216-a99200e888b1
Erratum! Small errors spotted in the slides are described below. Updated 3.5.2019.
* slide 44 Luminescent: ZnS:Mg —> not Mg but Mn! --> ZnS:Mn
* slide 54 high-k solution: article not from 2017 but 2007
ALD_Kessels.pdf
Atomic layer deposition (ALD) is a thin film deposition technique that relies on self-limiting surface reactions to deposit one atomic layer at a time. It allows for precise thickness control, high conformality, and deposition of a wide range of materials at relatively low temperatures. The ALD process involves alternating exposures of precursor gases separated by purging, with the precursors reacting through ligand exchange reactions on the substrate surface. This allows layer-by-layer growth and results in superior uniformity and conformality compared to other vapor deposition methods.
CATÁLOGO POLTANK
En Poltank diseñamos y fabricamos recipientes a presión en poliéster reforzados con fibra de vidrio (PRFV) para piscinas, acuarios, parques acuáticos, zoológicos, acuicultura, industria alimentaria y bebidas, minería, irrigación, tratamiento de agua potable, tratamiento de aguas residuales, y desaladoras.
HIGH-K DEVICES BY ALD FOR SEMICONDUCTOR APPLICATIONS
This document summarizes research on high-k dielectric devices fabricated using atomic layer deposition (ALD) for semiconductor applications presented by researchers from the Fraunhofer Institute for Photonic Microsystems. It discusses the history of ALD deposition of high-k materials like TiO2 and laminates of Ta2O5 and HfO2 for capacitor applications in the 1990s. It also summarizes the development of TiN/ZrO2-based capacitors and research on ALD HfO2 for emerging ferroelectric memory devices. Finally, it discusses the fabrication of 3D capacitor structures using ALD with densities over 250 nF/mm2 and possibilities for 3D integration of ferroelectric HfO2
BioMEMS Market and Technology 2020
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
LTCC Overview
The document discusses LTCC (low temperature co-fired ceramics) passive integration, including challenges. It provides an overview of LTCC materials and processes, comparing LTCC to other integration technologies. Key advantages of LTCC include its parallel layer process, ability to achieve high layer counts up to 100 layers, compatibility with RF-friendly materials, and potential for high component density and module reliability. However, challenges for LTCC include limitations on forming precise resistors and inductors. The document also reviews common LTCC dielectric materials and provides details on Motorola's high-Q T2000 LTCC dielectric composition.
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Slides of invited "ALD 101" tutorial by Puurunen at ALD 2021
(INVITED) Fundamentals of atomic layer deposition: an introduction (“ALD 101”)
Riikka L. Puurunen, Aalto University School of Chemical Engineering, Department of Chemical and Metallurgical Engineering, AVS 21st International Conference on Atomic Layer Deposition (ALD 2021), Virtual Meeting 27.6.-30.6.2021. Tutorial Session 27.6.2021
ABSTRACT: Atomic layer deposition (ALD) has become of global importance as a processing technology for example in semiconductor device fabrication, and its application areas are continuously expanding. The significance of ALD was highlighted e.g. by the recent (2018) Millennium Technology Prize. Tens of companies are offering ALD tools, and thousands of people are involved in ALD R&D globally. A continuous need exists to educate new people on the fundamentals of ALD.
While ALD for manufacturing may be regarded mature, as a scientific field, ALD—in the author’s view—is developing. For example, understanding of the early history of ALD is evolving, related to the two independent inventions of ALD under the names Atomic Layer Epitaxy in the 1970s and Molecular Layering in the 1960s [1-4]. Also, significantly varying views exist in the field related to the description and meaningfulness of even some core ALD concepts [5].
The purpose of this invited “ALD 101” tutorial is to familiarize a newcomer with fundamentals of ALD. The presentation largely follows the organization of a recent encyclopedia chapter on ALD [6]. Surface chemistry concepts will be introduced, such as ideal ALD from repeated, separate self-terminating (saturating and irreversible) reactions; growth per cycle in ALD; various monolayer concepts relevant to ALD; typical classes of surface reaction mechanisms and saturation-determining factors; growth modes; and ways to describe growth kinetics. Concepts, where differing views exist in the field and which thus need special attention, are pointed out. Typical deviations from the presented ideality are discussed.
For continuous education, a collaborative OpenLearning website on ALD is under construction [7]. Many of the images used in this tutorial—and in Refs. 6 and 7—are available in Wikimedia Commons [8] for easy and free reuse. To contribute to collective learning of the early history of ALD, the open-science effort Virtual Project on the History of ALD [4] still welcomes new volunteer participants.
[1] E. Ahvenniemi et al., J. Vac. Sci. Technol. A 35 (2017) 010801 (2017). [2] R.L. Puurunen, ECS Transactions 86 (6) (2018) 3-17; OA: DOI:10.1149/osf.io/exyv3 [3] G.N. Parsons et al., J. Vac. Sci. Technol. A 38 (2020) 037001. [4] http://vph-ald.com [5] J.R. van Ommen, R.L. Puurunen, ALD 2020, https://youtu.be/jqm_wf49WwM [6] J.R. van Ommen, A. Goulas, R.L. Puurunen, Kirk-Othmer Encyclopedia on Chemical Technology, submitted. [7] http://openlearning.aalto.fi, ALD [8] https://commons.wikimedia.org/wiki/Category:Atomic_layer_deposition
Pas6 ma1
O documento fornece especificações e dimensões para diferentes modelos de caixas acústicas de alto-falantes da Selenium. Inclui opções para sistemas de caixa única e caixa dividida, com vários drivers e woofers sugeridos para cada configuração. Além disso, fornece detalhes construtivos e dimensionais para o modelo PAS1G1, incluindo lista de componentes e medidas.
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Hb1505 d1 p
O documento descreve as especificações e dimensões de um alto-falante modelo HB1505D1 fabricado pela Selenium, incluindo suas características, componentes e detalhes de construção.
SemiStar Corp Brochure All for website.pdf
SemiStar Corp is a privately owned company that provides comprehensive technical and business development solutions in high-tech manufacturing and research, with applications in the semiconductor, MEMs, biomedical, nanotechnology, solar, LEDs sectors. More specifically, SemiStar Corp. specializes in providing high quality reconditioned semiconductor equipments and express spare parts delivery worldwide.
Based in the heart of Silicon Valley, our experienced management and engineers are dedicated to ensuring optimal quality and customer satisfaction through a timely support system. Our team is committed to being your long term business partner to help you achieve your business goals.
Main Refurbished Equipment
By Equipment Type
Plasma Asher
Plasma Etcher
ICP DRIE RIE Bosch
Evaporator PVD
Sputtering PVD
PECVD CVD ALD
RTA RTP RTO RTN
Robot Controller Aligner
SEM
Wafer Probes
Metrology
Tester
By OEM Names with Models
AG Associates -4100 8108 610
Agilent HP –HP 4062UX
AnnealSys -100
AST
Branson – 3000 Series
Brooks Equipe PRI -ATM-105 104 ESC-100 200
CDE ResMap 178
CHA -Mark 50
CPA -S-Gun Sputter
ElectroGlas –2001 4090u+ 1034
Emscope
F.E.I. – FEG 200
Gasonics – 3510
Hitachi S4700 FE-SEM
Jipelec 100 150 200
KLA-Tencor
Lam Research 490 590 4420
March
Matrix -105 302 303
MPT
MRC -603 643
Nikon
Oxford – 80 RIE PECVD
Perkin-Elmer -4400 Series 2400
PlasmaEtch
PlasmaQuest
PlasmaTherm -790 720
SAMCO -RIE
SLOAN
STS SPTS -ICP HRM
Technics -2000 PE-IIA
Tegal -901e 903e
Temescal – FC-1800 BJD-1800
TES -Temescal FC-1800 BJD-1800
Veeco Cambridge -S200
20220311 inventory-semi star corp
The document lists various types of semiconductor fabrication equipment including:
- Plasma etchers such as the Applied Materials Plasma II and Lam AutoEtch 590.
- Thin film deposition equipment such as the AMAT AMP-3300 PECVD and Emscope SC-650 Series.
- Mask aligners including the Canon PLA-501 F and Neutronix PLA 500/501.
- Wet benches, plasma ashers, chillers, ovens, rapid thermal processing equipment, coat/develop/bake tools, metrology systems, and miscellaneous parts.
Plasma asher descum stripper equipment
The document lists various used plasma etch, stripper, and asher equipment for sale from Semistar Corp., ranging in price from $9,500 to $175,000. The most expensive items are a Matrix 209S plasma asher for $175,000 and a Matrix 105 plasma asher for $98,000, while several Branson and Matrix plasma ashers and etchers are listed at $12,500, $22,500, and $29,500. Semistar Corp. sells used semiconductor equipment and provides parts and service in the U.S.
Plasma etcher rie icp drie bosch process equipment
This document lists various used semiconductor fabrication equipment for sale, including plasma etchers, reactive ion etchers (RIE), and asher systems from manufacturers like STS, Lam Research, Oxford Instruments, ICP Bosch, and Tegal. The prices range from $275,000 for a Lam Research 4420 plasma etch tool down to $9,500 for a Yield Engineering Systems dry asher. Models include STS Multiplex ICP systems, Lam AutoEtch and Rainbow tools, Oxford Plasmalab RIEs, and various plasma etchers and asher systems from Tegal, Matrix, Plasma Therm, and others.
Pecvd cvd equipment
This document lists several plasma deposition equipment items for sale including their manufacturer, model, type, and price. The most expensive items are a $79,500 Plasma Therm 790 Series PECVD system and a $77,500 Oxford Instruments Plasmalab 80+ DPCVD system. Also listed are lower cost plasma etchers and deposition systems starting at $5,000 from Oxford Plasma Technology.
Oven furnace hot plate equipment
This document lists various oven and furnace models from different manufacturers along with their prices, ranging from $1,200 to $3,980. It provides contact information for Semistar Corp, a company that sells semiconductor equipment parts and services in the US.
Metrology probe tester equipment instrument
This document lists various semiconductor manufacturing equipment for sale, including their prices. The most expensive items are an electron beam lithography system for $1,000,000 and an X-ray diffraction system for $78,000. Other listed equipment include wafer probers, thin film measurement systems, surface profilers, and microscopy tools, with prices ranging from $35,000 to under $5,000. The document appears to be from a company called Semistar Corp that sells used semiconductor equipment.
Mask aligner equipment
The document lists several used mask aligners for sale from Semistar Corp, including various Canon Neutronix and PLA models priced between $18,500 to $35,000. Contact and company information is provided at the bottom for Semistar Corp, which sells semiconductor equipment parts and used mask aligners in the United States.
Evaporator thin film equipment
This document lists various electron beam evaporators and thermal evaporators for sale from multiple manufacturers including CHA Industries, Temescal, Varian, TES, Airco Temescal, and Kurt J Lesker. The prices range from $145,000 for some combined e-beam and thermal evaporators from Varian and CHA Industries down to $18,500 for older model Varian e-beam evaporators. Contact information is provided for Semistar Corp. regarding sales of semiconductor equipment parts and services.
Wet process srd equipment
This document lists equipment for sale from various manufacturers for semiconductor wet processing including batch developing stations, plating equipment, wet benches, and spin dryers priced between $1,980 to $35,000. Key items include a BOLD batch developing station for $35,000, an EEJA manual plater for $35,000, a Gold Techni plating bath system for $15,000, and various wet process equipment from APT and Wet Process Equipment between $7,500 to $9,500.
Sputter thin film equipment
This document lists various sputtering systems and their prices from different manufacturers including Perkin-Elmer, Materials Research Corporation, Temescal, CPA, and CVC Products. The most expensive systems are three Perkin-Elmer models ranging from $125,000 to $155,000, while the cheapest option is a CVC Products system at $12,500. Contact information is provided for Semistar Corp for additional semiconductor equipment parts and services.
Equipment inventorp list 20201231 1-en
This document contains an inventory list of 215 items located in either Nanjing, China or Morgan Hill, CA USA. The majority of the items are various types of process equipment used in semiconductor manufacturing, including bonders, chillers, coaters, CVD tools, developers, etchers, evaporators, furnaces, metrology equipment, ovens, PECVD tools, plasma ashers, pumps, RTP tools, sputtering systems and more. The items are from various manufacturers such as K&S, SMC, SVG, SOLITEC, PlasmaLab, BOLD, Temescal, Varian, Ditector, CANON, Nanometrics, Gaertner Scientific, Rudolph Research
Semi star equipment parts inventory list dec 2020
Semi star equipment parts inventory list :Asher CVD/PECVD Etcher Evaporator Metrology&Probe RTP Sputter Stepper Tester Carrier
Equipment inventory list dec. 2020-en
Equipment inventory list dec. 2020: Semiconductor equipment Semiconductor process equipment. Rapid Thermal Processing equipment Rapid Thermal Processor
More Related Content
What's hot
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Slides of invited "ALD 101" tutorial by Puurunen at ALD 2021
(INVITED) Fundamentals of atomic layer deposition: an introduction (“ALD 101”)
Riikka L. Puurunen, Aalto University School of Chemical Engineering, Department of Chemical and Metallurgical Engineering, AVS 21st International Conference on Atomic Layer Deposition (ALD 2021), Virtual Meeting 27.6.-30.6.2021. Tutorial Session 27.6.2021
ABSTRACT: Atomic layer deposition (ALD) has become of global importance as a processing technology for example in semiconductor device fabrication, and its application areas are continuously expanding. The significance of ALD was highlighted e.g. by the recent (2018) Millennium Technology Prize. Tens of companies are offering ALD tools, and thousands of people are involved in ALD R&D globally. A continuous need exists to educate new people on the fundamentals of ALD.
While ALD for manufacturing may be regarded mature, as a scientific field, ALD—in the author’s view—is developing. For example, understanding of the early history of ALD is evolving, related to the two independent inventions of ALD under the names Atomic Layer Epitaxy in the 1970s and Molecular Layering in the 1960s [1-4]. Also, significantly varying views exist in the field related to the description and meaningfulness of even some core ALD concepts [5].
The purpose of this invited “ALD 101” tutorial is to familiarize a newcomer with fundamentals of ALD. The presentation largely follows the organization of a recent encyclopedia chapter on ALD [6]. Surface chemistry concepts will be introduced, such as ideal ALD from repeated, separate self-terminating (saturating and irreversible) reactions; growth per cycle in ALD; various monolayer concepts relevant to ALD; typical classes of surface reaction mechanisms and saturation-determining factors; growth modes; and ways to describe growth kinetics. Concepts, where differing views exist in the field and which thus need special attention, are pointed out. Typical deviations from the presented ideality are discussed.
For continuous education, a collaborative OpenLearning website on ALD is under construction [7]. Many of the images used in this tutorial—and in Refs. 6 and 7—are available in Wikimedia Commons [8] for easy and free reuse. To contribute to collective learning of the early history of ALD, the open-science effort Virtual Project on the History of ALD [4] still welcomes new volunteer participants.
[1] E. Ahvenniemi et al., J. Vac. Sci. Technol. A 35 (2017) 010801 (2017). [2] R.L. Puurunen, ECS Transactions 86 (6) (2018) 3-17; OA: DOI:10.1149/osf.io/exyv3 [3] G.N. Parsons et al., J. Vac. Sci. Technol. A 38 (2020) 037001. [4] http://vph-ald.com [5] J.R. van Ommen, R.L. Puurunen, ALD 2020, https://youtu.be/jqm_wf49WwM [6] J.R. van Ommen, A. Goulas, R.L. Puurunen, Kirk-Othmer Encyclopedia on Chemical Technology, submitted. [7] http://openlearning.aalto.fi, ALD [8] https://commons.wikimedia.org/wiki/Category:Atomic_layer_deposition
Pas6 ma1
O documento fornece especificações e dimensões para diferentes modelos de caixas acústicas de alto-falantes da Selenium. Inclui opções para sistemas de caixa única e caixa dividida, com vários drivers e woofers sugeridos para cada configuração. Além disso, fornece detalhes construtivos e dimensionais para o modelo PAS1G1, incluindo lista de componentes e medidas.
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...
Apple integrates in its smartphone the innovative Film Bulk Acoustic Resonators developed by Avago
After a first introduction of Avago’s power amplifier in the iPhone 4S and an integration in iPhone 5 series, Apple integrates again Avago’s LTE Mid Band Front-End Module in the iPhone 6s series.
With the acquisition of Broadcom (Apple’s Wifi FEM first suppliers), Avago becomes a top competitor in wireless communication thanks to its FBAR BAW filter knowledge.
Located on the main board of the smartphone, the Front-End Module of the Apple iPhone 6s Plus for mid-band LTE application is a complete Front-End Module. The component is made with several filter dies, assembled on a coreless PCB substrate.
The filters are hermetically wafer-level packaged with Avago’s Microcap bonded-wafer CSP technology allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
More information on that report at http://www.i-micronews.com/reports.html
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Hb1505 d1 p
O documento descreve as especificações e dimensões de um alto-falante modelo HB1505D1 fabricado pela Selenium, incluindo suas características, componentes e detalhes de construção.
What's hot (7)
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...
Slides of invited "ALD 101" tutorial by Puurunen at ALD 2021
Slides of invited "ALD 101" tutorial by Puurunen at ALD 2021
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...
Avago AFEM-8030 Mid Band FEM FBAR-BAW Filter iPhone 6s Plus 2016 teardown rev...
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...
More from Emily Tan
SemiStar Corp Brochure All for website.pdf
SemiStar Corp is a privately owned company that provides comprehensive technical and business development solutions in high-tech manufacturing and research, with applications in the semiconductor, MEMs, biomedical, nanotechnology, solar, LEDs sectors. More specifically, SemiStar Corp. specializes in providing high quality reconditioned semiconductor equipments and express spare parts delivery worldwide.
Based in the heart of Silicon Valley, our experienced management and engineers are dedicated to ensuring optimal quality and customer satisfaction through a timely support system. Our team is committed to being your long term business partner to help you achieve your business goals.
Main Refurbished Equipment
By Equipment Type
Plasma Asher
Plasma Etcher
ICP DRIE RIE Bosch
Evaporator PVD
Sputtering PVD
PECVD CVD ALD
RTA RTP RTO RTN
Robot Controller Aligner
SEM
Wafer Probes
Metrology
Tester
By OEM Names with Models
AG Associates -4100 8108 610
Agilent HP –HP 4062UX
AnnealSys -100
AST
Branson – 3000 Series
Brooks Equipe PRI -ATM-105 104 ESC-100 200
CDE ResMap 178
CHA -Mark 50
CPA -S-Gun Sputter
ElectroGlas –2001 4090u+ 1034
Emscope
F.E.I. – FEG 200
Gasonics – 3510
Hitachi S4700 FE-SEM
Jipelec 100 150 200
KLA-Tencor
Lam Research 490 590 4420
March
Matrix -105 302 303
MPT
MRC -603 643
Nikon
Oxford – 80 RIE PECVD
Perkin-Elmer -4400 Series 2400
PlasmaEtch
PlasmaQuest
PlasmaTherm -790 720
SAMCO -RIE
SLOAN
STS SPTS -ICP HRM
Technics -2000 PE-IIA
Tegal -901e 903e
Temescal – FC-1800 BJD-1800
TES -Temescal FC-1800 BJD-1800
Veeco Cambridge -S200
20220311 inventory-semi star corp
The document lists various types of semiconductor fabrication equipment including:
- Plasma etchers such as the Applied Materials Plasma II and Lam AutoEtch 590.
- Thin film deposition equipment such as the AMAT AMP-3300 PECVD and Emscope SC-650 Series.
- Mask aligners including the Canon PLA-501 F and Neutronix PLA 500/501.
- Wet benches, plasma ashers, chillers, ovens, rapid thermal processing equipment, coat/develop/bake tools, metrology systems, and miscellaneous parts.
Plasma asher descum stripper equipment
The document lists various used plasma etch, stripper, and asher equipment for sale from Semistar Corp., ranging in price from $9,500 to $175,000. The most expensive items are a Matrix 209S plasma asher for $175,000 and a Matrix 105 plasma asher for $98,000, while several Branson and Matrix plasma ashers and etchers are listed at $12,500, $22,500, and $29,500. Semistar Corp. sells used semiconductor equipment and provides parts and service in the U.S.
Plasma etcher rie icp drie bosch process equipment
This document lists various used semiconductor fabrication equipment for sale, including plasma etchers, reactive ion etchers (RIE), and asher systems from manufacturers like STS, Lam Research, Oxford Instruments, ICP Bosch, and Tegal. The prices range from $275,000 for a Lam Research 4420 plasma etch tool down to $9,500 for a Yield Engineering Systems dry asher. Models include STS Multiplex ICP systems, Lam AutoEtch and Rainbow tools, Oxford Plasmalab RIEs, and various plasma etchers and asher systems from Tegal, Matrix, Plasma Therm, and others.
Pecvd cvd equipment
This document lists several plasma deposition equipment items for sale including their manufacturer, model, type, and price. The most expensive items are a $79,500 Plasma Therm 790 Series PECVD system and a $77,500 Oxford Instruments Plasmalab 80+ DPCVD system. Also listed are lower cost plasma etchers and deposition systems starting at $5,000 from Oxford Plasma Technology.
Oven furnace hot plate equipment
This document lists various oven and furnace models from different manufacturers along with their prices, ranging from $1,200 to $3,980. It provides contact information for Semistar Corp, a company that sells semiconductor equipment parts and services in the US.
Metrology probe tester equipment instrument
This document lists various semiconductor manufacturing equipment for sale, including their prices. The most expensive items are an electron beam lithography system for $1,000,000 and an X-ray diffraction system for $78,000. Other listed equipment include wafer probers, thin film measurement systems, surface profilers, and microscopy tools, with prices ranging from $35,000 to under $5,000. The document appears to be from a company called Semistar Corp that sells used semiconductor equipment.
Mask aligner equipment
The document lists several used mask aligners for sale from Semistar Corp, including various Canon Neutronix and PLA models priced between $18,500 to $35,000. Contact and company information is provided at the bottom for Semistar Corp, which sells semiconductor equipment parts and used mask aligners in the United States.
Evaporator thin film equipment
This document lists various electron beam evaporators and thermal evaporators for sale from multiple manufacturers including CHA Industries, Temescal, Varian, TES, Airco Temescal, and Kurt J Lesker. The prices range from $145,000 for some combined e-beam and thermal evaporators from Varian and CHA Industries down to $18,500 for older model Varian e-beam evaporators. Contact information is provided for Semistar Corp. regarding sales of semiconductor equipment parts and services.
Wet process srd equipment
This document lists equipment for sale from various manufacturers for semiconductor wet processing including batch developing stations, plating equipment, wet benches, and spin dryers priced between $1,980 to $35,000. Key items include a BOLD batch developing station for $35,000, an EEJA manual plater for $35,000, a Gold Techni plating bath system for $15,000, and various wet process equipment from APT and Wet Process Equipment between $7,500 to $9,500.
Sputter thin film equipment
This document lists various sputtering systems and their prices from different manufacturers including Perkin-Elmer, Materials Research Corporation, Temescal, CPA, and CVC Products. The most expensive systems are three Perkin-Elmer models ranging from $125,000 to $155,000, while the cheapest option is a CVC Products system at $12,500. Contact information is provided for Semistar Corp for additional semiconductor equipment parts and services.
Equipment inventorp list 20201231 1-en
This document contains an inventory list of 215 items located in either Nanjing, China or Morgan Hill, CA USA. The majority of the items are various types of process equipment used in semiconductor manufacturing, including bonders, chillers, coaters, CVD tools, developers, etchers, evaporators, furnaces, metrology equipment, ovens, PECVD tools, plasma ashers, pumps, RTP tools, sputtering systems and more. The items are from various manufacturers such as K&S, SMC, SVG, SOLITEC, PlasmaLab, BOLD, Temescal, Varian, Ditector, CANON, Nanometrics, Gaertner Scientific, Rudolph Research
Semi star equipment parts inventory list dec 2020
Semi star equipment parts inventory list :Asher CVD/PECVD Etcher Evaporator Metrology&Probe RTP Sputter Stepper Tester Carrier
Equipment inventory list dec. 2020-en
Equipment inventory list dec. 2020: Semiconductor equipment Semiconductor process equipment. Rapid Thermal Processing equipment Rapid Thermal Processor
Used SMT & PTH &ATE assembly equipment inventory
Used SMT & PTH &ATE assembly equipment inventory:Pls eamil us for the availability of the Used SMT & PTH &ATE assembly equipment. Appreciate your time!
Electronic test equipment, Oscilloscope, Spectrum, Analyzer ,DMM
Electronic test equipment Oscilloscope Spectrum Analyzer DMM:The following items (ID-SS8267-1-1) are subject to prior sale without notice. These items are only for end users.
Lam Research ,Novellus, Gasonics, Tel ,Tokyo Electron Ltd, Matrix etc. Spare ...
Lam Research Novellus Gasonics Tel Tokyo Electron Ltd Matrix etc. Spare Parts:The items are subject to prior sale without notice. These items are only for end users.
Spare Parts List-AMAT, Applied Materials
Spare Parts List-AMAT Applied Materials:The items are subject to prior sale without notice. These items are only for end users.
Semiconductor Equipment
Semiconductor Equipment:Please us for more info and availability. They are subject to prior sale without notice.These items are only for end users. Appreciate your time! sales@semistarcorp.com . ID-8032-1-1
More from Emily Tan (20)
Plasma etcher rie icp drie bosch process equipment
Plasma etcher rie icp drie bosch process equipment
Electronic test equipment, Oscilloscope, Spectrum, Analyzer ,DMM
Electronic test equipment, Oscilloscope, Spectrum, Analyzer ,DMM
Lam Research ,Novellus, Gasonics, Tel ,Tokyo Electron Ltd, Matrix etc. Spare ...
Lam Research ,Novellus, Gasonics, Tel ,Tokyo Electron Ltd, Matrix etc. Spare ...
Recently uploaded
Session 1 - Intro to Robotic Process Automation.pdf
👉 Check out our full 'Africa Series - Automation Student Developers (EN)' page to register for the full program:
https://bit.ly/Automation_Student_Kickstart
In this session, we shall introduce you to the world of automation, the UiPath Platform, and guide you on how to install and setup UiPath Studio on your Windows PC.
📕 Detailed agenda:
What is RPA? Benefits of RPA?
RPA Applications
The UiPath End-to-End Automation Platform
UiPath Studio CE Installation and Setup
💻 Extra training through UiPath Academy:
Introduction to Automation
UiPath Business Automation Platform
Explore automation development with UiPath Studio
👉 Register here for our upcoming Session 2 on June 20: Introduction to UiPath Studio Fundamentals: https://community.uipath.com/events/details/uipath-lagos-presents-session-2-introduction-to-uipath-studio-fundamentals/
"What does it really mean for your system to be available, or how to define w...
We will talk about system monitoring from a few different angles. We will start by covering the basics, then discuss SLOs, how to define them, and why understanding the business well is crucial for success in this exercise.
"NATO Hackathon Winner: AI-Powered Drug Search", Taras Kloba
This is a session that details how PostgreSQL's features and Azure AI Services can be effectively used to significantly enhance the search functionality in any application.
In this session, we'll share insights on how we used PostgreSQL to facilitate precise searches across multiple fields in our mobile application. The techniques include using LIKE and ILIKE operators and integrating a trigram-based search to handle potential misspellings, thereby increasing the search accuracy.
We'll also discuss how the azure_ai extension on PostgreSQL databases in Azure and Azure AI Services were utilized to create vectors from user input, a feature beneficial when users wish to find specific items based on text prompts. While our application's case study involves a drug search, the techniques and principles shared in this session can be adapted to improve search functionality in a wide range of applications. Join us to learn how PostgreSQL and Azure AI can be harnessed to enhance your application's search capability.
Demystifying Knowledge Management through Storytelling
The Department of Veteran Affairs (VA) invited Taylor Paschal, Knowledge & Information Management Consultant at Enterprise Knowledge, to speak at a Knowledge Management Lunch and Learn hosted on June 12, 2024. All Office of Administration staff were invited to attend and received professional development credit for participating in the voluntary event.
The objectives of the Lunch and Learn presentation were to:
- Review what KM ‘is’ and ‘isn’t’
- Understand the value of KM and the benefits of engaging
- Define and reflect on your “what’s in it for me?”
- Share actionable ways you can participate in Knowledge - - Capture & Transfer
“Temporal Event Neural Networks: A More Efficient Alternative to the Transfor...
“Temporal Event Neural Networks: A More Efficient Alternative to the Transfor...Edge AI and Vision Alliance
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/temporal-event-neural-networks-a-more-efficient-alternative-to-the-transformer-a-presentation-from-brainchip/
Chris Jones, Director of Product Management at BrainChip , presents the “Temporal Event Neural Networks: A More Efficient Alternative to the Transformer” tutorial at the May 2024 Embedded Vision Summit.
The expansion of AI services necessitates enhanced computational capabilities on edge devices. Temporal Event Neural Networks (TENNs), developed by BrainChip, represent a novel and highly efficient state-space network. TENNs demonstrate exceptional proficiency in handling multi-dimensional streaming data, facilitating advancements in object detection, action recognition, speech enhancement and language model/sequence generation. Through the utilization of polynomial-based continuous convolutions, TENNs streamline models, expedite training processes and significantly diminish memory requirements, achieving notable reductions of up to 50x in parameters and 5,000x in energy consumption compared to prevailing methodologies like transformers.
Integration with BrainChip’s Akida neuromorphic hardware IP further enhances TENNs’ capabilities, enabling the realization of highly capable, portable and passively cooled edge devices. This presentation delves into the technical innovations underlying TENNs, presents real-world benchmarks, and elucidates how this cutting-edge approach is positioned to revolutionize edge AI across diverse applications."$10 thousand per minute of downtime: architecture, queues, streaming and fin...
Direct losses from downtime in 1 minute = $5-$10 thousand dollars. Reputation is priceless.
As part of the talk, we will consider the architectural strategies necessary for the development of highly loaded fintech solutions. We will focus on using queues and streaming to efficiently work and manage large amounts of data in real-time and to minimize latency.
We will focus special attention on the architectural patterns used in the design of the fintech system, microservices and event-driven architecture, which ensure scalability, fault tolerance, and consistency of the entire system.
GNSS spoofing via SDR (Criptored Talks 2024)
In the realm of cybersecurity, offensive security practices act as a critical shield. By simulating real-world attacks in a controlled environment, these techniques expose vulnerabilities before malicious actors can exploit them. This proactive approach allows manufacturers to identify and fix weaknesses, significantly enhancing system security.
This presentation delves into the development of a system designed to mimic Galileo's Open Service signal using software-defined radio (SDR) technology. We'll begin with a foundational overview of both Global Navigation Satellite Systems (GNSS) and the intricacies of digital signal processing.
The presentation culminates in a live demonstration. We'll showcase the manipulation of Galileo's Open Service pilot signal, simulating an attack on various software and hardware systems. This practical demonstration serves to highlight the potential consequences of unaddressed vulnerabilities, emphasizing the importance of offensive security practices in safeguarding critical infrastructure.
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...
This LF Energy webinar took place June 20, 2024. It featured:
-Alex Thornton, LF Energy
-Hallie Cramer, Google
-Daniel Roesler, UtilityAPI
-Henry Richardson, WattTime
In response to the urgency and scale required to effectively address climate change, open source solutions offer significant potential for driving innovation and progress. Currently, there is a growing demand for standardization and interoperability in energy data and modeling. Open source standards and specifications within the energy sector can also alleviate challenges associated with data fragmentation, transparency, and accessibility. At the same time, it is crucial to consider privacy and security concerns throughout the development of open source platforms.
This webinar will delve into the motivations behind establishing LF Energy’s Carbon Data Specification Consortium. It will provide an overview of the draft specifications and the ongoing progress made by the respective working groups.
Three primary specifications will be discussed:
-Discovery and client registration, emphasizing transparent processes and secure and private access
-Customer data, centering around customer tariffs, bills, energy usage, and full consumption disclosure
-Power systems data, focusing on grid data, inclusive of transmission and distribution networks, generation, intergrid power flows, and market settlement data
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectors
Join us to learn how UiPath Apps can directly and easily interact with prebuilt connectors via Integration Service--including Salesforce, ServiceNow, Open GenAI, and more.
The best part is you can achieve this without building a custom workflow! Say goodbye to the hassle of using separate automations to call APIs. By seamlessly integrating within App Studio, you can now easily streamline your workflow, while gaining direct access to our Connector Catalog of popular applications.
We’ll discuss and demo the benefits of UiPath Apps and connectors including:
Creating a compelling user experience for any software, without the limitations of APIs.
Accelerating the app creation process, saving time and effort
Enjoying high-performance CRUD (create, read, update, delete) operations, for
seamless data management.
Speakers:
Russell Alfeche, Technology Leader, RPA at qBotic and UiPath MVP
Charlie Greenberg, host
Crafting Excellence: A Comprehensive Guide to iOS Mobile App Development Serv...
Crafting Excellence: A Comprehensive Guide to iOS Mobile App Development Serv...Pitangent Analytics & Technology Solutions Pvt. Ltd
Discover top-tier mobile app development services, offering innovative solutions for iOS and Android. Enhance your business with custom, user-friendly mobile applications.From Natural Language to Structured Solr Queries using LLMs
This talk draws on experimentation to enable AI applications with Solr. One important use case is to use AI for better accessibility and discoverability of the data: while User eXperience techniques, lexical search improvements, and data harmonization can take organizations to a good level of accessibility, a structural (or “cognitive” gap) remains between the data user needs and the data producer constraints.
That is where AI – and most importantly, Natural Language Processing and Large Language Model techniques – could make a difference. This natural language, conversational engine could facilitate access and usage of the data leveraging the semantics of any data source.
The objective of the presentation is to propose a technical approach and a way forward to achieve this goal.
The key concept is to enable users to express their search queries in natural language, which the LLM then enriches, interprets, and translates into structured queries based on the Solr index’s metadata.
This approach leverages the LLM’s ability to understand the nuances of natural language and the structure of documents within Apache Solr.
The LLM acts as an intermediary agent, offering a transparent experience to users automatically and potentially uncovering relevant documents that conventional search methods might overlook. The presentation will include the results of this experimental work, lessons learned, best practices, and the scope of future work that should improve the approach and make it production-ready.
Northern Engraving | Modern Metal Trim, Nameplates and Appliance Panels
What began over 115 years ago as a supplier of precision gauges to the automotive industry has evolved into being an industry leader in the manufacture of product branding, automotive cockpit trim and decorative appliance trim. Value-added services include in-house Design, Engineering, Program Management, Test Lab and Tool Shops.
Harnessing the Power of NLP and Knowledge Graphs for Opioid Research
Gursev Pirge, PhD
Senior Data Scientist - JohnSnowLabs
High performance Serverless Java on AWS- GoTo Amsterdam 2024
Java is for many years one of the most popular programming languages, but it used to have hard times in the Serverless community. Java is known for its high cold start times and high memory footprint, comparing to other programming languages like Node.js and Python. In this talk I'll look at the general best practices and techniques we can use to decrease memory consumption, cold start times for Java Serverless development on AWS including GraalVM (Native Image) and AWS own offering SnapStart based on Firecracker microVM snapshot and restore and CRaC (Coordinated Restore at Checkpoint) runtime hooks. I'll also provide a lot of benchmarking on Lambda functions trying out various deployment package sizes, Lambda memory settings, Java compilation options and HTTP (a)synchronous clients and measure their impact on cold and warm start times.
The Microsoft 365 Migration Tutorial For Beginner.pptx
This presentation will help you understand the power of Microsoft 365. However, we have mentioned every productivity app included in Office 365. Additionally, we have suggested the migration situation related to Office 365 and how we can help you.
You can also read: https://www.systoolsgroup.com/updates/office-365-tenant-to-tenant-migration-step-by-step-complete-guide/
Main news related to the CCS TSI 2023 (2023/1695)
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
ScyllaDB Tablets: Rethinking Replication
ScyllaDB is making a major architecture shift. We’re moving from vNode replication to tablets – fragments of tables that are distributed independently, enabling dynamic data distribution and extreme elasticity. In this keynote, ScyllaDB co-founder and CTO Avi Kivity explains the reason for this shift, provides a look at the implementation and roadmap, and shares how this shift benefits ScyllaDB users.
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdf
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
Recently uploaded (20)
Session 1 - Intro to Robotic Process Automation.pdf
Session 1 - Intro to Robotic Process Automation.pdf
"What does it really mean for your system to be available, or how to define w...
"What does it really mean for your system to be available, or how to define w...
"NATO Hackathon Winner: AI-Powered Drug Search", Taras Kloba
"NATO Hackathon Winner: AI-Powered Drug Search", Taras Kloba
Demystifying Knowledge Management through Storytelling
Demystifying Knowledge Management through Storytelling
“Temporal Event Neural Networks: A More Efficient Alternative to the Transfor...
“Temporal Event Neural Networks: A More Efficient Alternative to the Transfor...
"$10 thousand per minute of downtime: architecture, queues, streaming and fin...
"$10 thousand per minute of downtime: architecture, queues, streaming and fin...
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...
LF Energy Webinar: Carbon Data Specifications: Mechanisms to Improve Data Acc...
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectors
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectors
Crafting Excellence: A Comprehensive Guide to iOS Mobile App Development Serv...
Crafting Excellence: A Comprehensive Guide to iOS Mobile App Development Serv...
From Natural Language to Structured Solr Queries using LLMs
From Natural Language to Structured Solr Queries using LLMs
Northern Engraving | Modern Metal Trim, Nameplates and Appliance Panels
Northern Engraving | Modern Metal Trim, Nameplates and Appliance Panels
Harnessing the Power of NLP and Knowledge Graphs for Opioid Research
Harnessing the Power of NLP and Knowledge Graphs for Opioid Research
Nordic Marketo Engage User Group_June 13_ 2024.pptx
Nordic Marketo Engage User Group_June 13_ 2024.pptx
High performance Serverless Java on AWS- GoTo Amsterdam 2024
High performance Serverless Java on AWS- GoTo Amsterdam 2024
The Microsoft 365 Migration Tutorial For Beginner.pptx
The Microsoft 365 Migration Tutorial For Beginner.pptx
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdf
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdf
Mattson AST 2800 RTP 8 inch Rapid Thermal Processing Equipment
- 1. Front Monitor,Keyboard Front-Bottom(opened) Front-Left Front-Center_01 Model: AST 2800 Type: RTP Maker: Mattson /Steage Condition: It was working. We sell it at AS IS,WHERE IS Location: Asia. Price: Pls email (sales@semistarcorp.com ) us your best offer with your company info. Warranty: N/A Refund: N/A Valid time: Subject to prior sale without notice. Appreciate your time. www.semistarcorp.com sales@semistarcorp.com www.semistarcorp.com 1 sales@semistarcorp.com
- 2. Front-Center Front-Right Side-Left_Top Side-Left_Bottom Side-Right_Top Side-Right_Middle www.semistarcorp.com sales@semistarcorp.com www.semistarcorp.com 2 sales@semistarcorp.com
- 3. Side-Right_Bottom Rear Rear_Top-Left,Gas Box Rear_Top-Right,Gas Box Rear_Middle Rear_Bottom-Left_01 www.semistarcorp.com sales@semistarcorp.com www.semistarcorp.com 3 sales@semistarcorp.com
- 4. Rear_Bottom-Left_02 Rear_Bottom-Right_Controllers Rear_Bottom-Right_Controllers,Details Rear_Bottom-Right_Utility Robot Tag.JPG Aligner Tag.JPG www.semistarcorp.com sales@semistarcorp.com www.semistarcorp.com 4 sales@semistarcorp.com
- 5. MFC Tag(Ar)_Brooks#1 MFC Tag(Ar)_Brooks#2 MFC Tag(N2)_Horiba-STEC#1 MFC Tag(N2)_Horiba-STEC#2 MFC Tag(NH3)_Brooks#1 MFC Tag(NH3)_Brooks#2 www.semistarcorp.com sales@semistarcorp.com www.semistarcorp.com 5 sales@semistarcorp.com
- 6. MFC Tag(NH3)_Brooks#3 MFC Tag(O2)_Brooks#1 MFC Tag(O2)_Brooks#2 www.semistarcorp.com sales@semistarcorp.com www.semistarcorp.com 6 sales@semistarcorp.com