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Jim Harris
Principal Software Engineer
Intel Data Center Group
2
Legal Disclaimer
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS.NO LICENSE,EXPRESSOR IMPLIED, BYESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTSIS GRANTED BYTHIS DOCUMENT. EXCEPTAS PROVIDED IN INTEL'S TERMSAND CONDITIONS
OF SALE FOR SUCH PRODUCTS,INTEL ASSUMES NO LIABILITY WHATSOEVERAND INTEL DISCLAIMS ANYEXPRESS OR IMPLIED WARRANTY,RELATING
TO SALE AND/OR USE OF INTEL PRODUCTSINCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR APARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OFANY PATENT, COPYRIGHTOR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTSARE NOT DESIGNED NOR INTENDED FORANY APPLICATION IN WHICH THE
FAILURE OF THE INTEL PRODUCT COULD CREATE ASITUATION WHERE PERSONAL INJURYOR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers mustnot rely on the absence or characteristics of any features or
instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
This document contains information on products in the design phase of development.
Applies only to halogenated flame retardants and PVC in components. Pursuant to JEP-709, halogens are below 1,000ppmbromine and 1,000ppm chlorine. The replacement of
halogenated flame retardants and/or PVC may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2017 Intel Corporation. Allrights reserved.
The Challenge: Media Latency
Latency
(µs)
Technology claimsarebased oncomparisons of latency, density andwritecycling metricsamongst memory technologies recorded onpublishedspecifications of in-market memory productsagainst internal Intel specifications.
0
25
50
75
100
125
150
175
200
10,000
HDD
+SAS/S
ATA
SSD
NAND
+SAS/S
ATA
SSD
NAND
+NVM
e™
SSD
optane™
+NVMe™
kernel driver overhead 1-8%
kernel driver Overhead <0.01%
kernel driver overhead 30%-50%
Drive Latency Controller Latency Driver Latency
Storage Performance Development Kit (SPDK)
What is SPDK?
§ Userspace polled-mode drivers, libraries and applications for storage, storage
networking and storage virtualization
§ Leverages DPDK
§ Started in 2013, open sourced in 2015
§ BSD licensed
§ http://SPDK.io
NVM Express* Driver Throughput Scalability
System Configuration: 2x Intel® Xeon® E5-2695v4 (HT off), Intel® Speed Step enabled, Intel® Turbo Boost Technology disabled, 8x 8GB DDR4 2133 MT/s, 1 DIMM per channel, CentOS*
Linux*
7.2, Linux kernel 4.10.0, 8x Intel® P3700
NVMe SSD (800GB), 4x per CPU socket, FW 8DV101H0, I/O workload 4KB random read, Queue Depth: 128 per SSD, Performance measured by Intel using SPDK perf tool, Linux kernel data using Linux AIO
0
500
1000
1500
2000
2500
3000
3500
4000
1 2 3 4 5 6 7 8
Throughput(KIOps)
Numberof Intel SSD DC P3700
I/O Performance on
Single Intel® Xeon® core
Linux Kernel SPDK
SPDK saturates 8 NVMe SSDs with a single CPU core!
• Systems with multiple NVM Express*
(NVMe) SSDs capable of millions of I/O
per second
• Results in many cores of software
overhead with kernel-based interrupt-
driven driver model
• SPDK enables:
- more CPU cycles for storage services
- lower I/O latency
VM Storage Acceleration
• LeveragesDPDK vhost
• Provides dynamic block
device provisioning
• Increase VM Density
• Decrease Guest Latency
• Works with KVM/QEMU
SPDK
scsi
bdev
vhost-scsi
Target
Blobstore
Logical
volume
NVMe Driver
bdev
NVMe
VM
SSD for Datacenter
SPDK vhost Performance
0
2
4
6
8
Linux SPDK
IO/s (in millions)
0
10
20
30
40
50
Linux QEMU SPDK
QD=1 Latency (in us)
System Configuration: 2S Intel® Xeon® Platinum 8180: 28C, E5-2699v3: 18C, 2.5GHz (HT off), Intel® Turbo Boost Technology enabled, 12x16GB DDR4 2133 MT/s, 1 DIMM per channel, Ubuntu* Server 16.04.2 LTS, 4.11 kernel, 23x Intel®
P4800x Optane SSD – 375GB, 1 SPDK lvolstore or LVM lvgroup per SSD, SPDK commit ID c5d8b108f22ab, 46 VMs (CentOS 3.10, 1vCPU, 2GB DRAM, 100GB logical volume), vhost dedicated to 10 cores
As measured by: fio 2.10.1 – Direct=Yes, 4KB random read I/O, Ramp Time=30s, Run Time=180s, Norandommap=1, I/O Engine = libaio, Numjobs=1
Legend: Linux: Kernel vhost-scsi QEMU: virtio-blk dataplane SPDK: Userspace vhost-scsi
SPDK up to 3x better efficiency and latency
Polled
Mode
Drivers
Storage
Services
Storage
Protocols
iSCSI
Target
NVMe-oF*
Target
SCSI
vhost-user-scsi
Target
NVMe
NVMe
Blobstore
NVMe-oF*
Initiator
Intel®
QuickData
Technology
Block Device Layer (bdev)
Ceph
RBD
Linux
AIO
Logical
Volumes
NVMe
PMD
NVMe*
PCIe
Released
v17.10
vhost-user-blk
Target
BlobFSGPT
virtio-scsi
virtio-scsi
PMD
libpmemblk
Storage Performance Development Kit (SPDK)
DPDK Key Features for SPDK
§ Threads
§ PCIe Device Management
§ Memory Management
§ Rings, Mempools
§ Multi-Process
§ vhost
Storage v. Packet Processing
§ PCIe Device Hotplug
§ Runtime v2phys Translation
§ vhost VM Boot
§ Storage is Endpoint Focused
SPDK Community
Home Page : http://www.SPDK.io/
Github : https://github.com/spdk/spdk
Trello : https://trello.com/spdk
GerritHub : https://review.gerrithub.io/#/q/project:spdk/spdk+status:open
IRC : https://freenode.net/ we’re on #spdk
LF_DPDK_Accelerate storage service via SPDK

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LF_DPDK_Accelerate storage service via SPDK

  • 1. Jim Harris Principal Software Engineer Intel Data Center Group
  • 2. 2 Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS.NO LICENSE,EXPRESSOR IMPLIED, BYESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTSIS GRANTED BYTHIS DOCUMENT. EXCEPTAS PROVIDED IN INTEL'S TERMSAND CONDITIONS OF SALE FOR SUCH PRODUCTS,INTEL ASSUMES NO LIABILITY WHATSOEVERAND INTEL DISCLAIMS ANYEXPRESS OR IMPLIED WARRANTY,RELATING TO SALE AND/OR USE OF INTEL PRODUCTSINCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR APARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OFANY PATENT, COPYRIGHTOR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTSARE NOT DESIGNED NOR INTENDED FORANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE ASITUATION WHERE PERSONAL INJURYOR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers mustnot rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. This document contains information on products in the design phase of development. Applies only to halogenated flame retardants and PVC in components. Pursuant to JEP-709, halogens are below 1,000ppmbromine and 1,000ppm chlorine. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2017 Intel Corporation. Allrights reserved.
  • 3. The Challenge: Media Latency Latency (µs) Technology claimsarebased oncomparisons of latency, density andwritecycling metricsamongst memory technologies recorded onpublishedspecifications of in-market memory productsagainst internal Intel specifications. 0 25 50 75 100 125 150 175 200 10,000 HDD +SAS/S ATA SSD NAND +SAS/S ATA SSD NAND +NVM e™ SSD optane™ +NVMe™ kernel driver overhead 1-8% kernel driver Overhead <0.01% kernel driver overhead 30%-50% Drive Latency Controller Latency Driver Latency
  • 4. Storage Performance Development Kit (SPDK) What is SPDK? § Userspace polled-mode drivers, libraries and applications for storage, storage networking and storage virtualization § Leverages DPDK § Started in 2013, open sourced in 2015 § BSD licensed § http://SPDK.io
  • 5. NVM Express* Driver Throughput Scalability System Configuration: 2x Intel® Xeon® E5-2695v4 (HT off), Intel® Speed Step enabled, Intel® Turbo Boost Technology disabled, 8x 8GB DDR4 2133 MT/s, 1 DIMM per channel, CentOS* Linux* 7.2, Linux kernel 4.10.0, 8x Intel® P3700 NVMe SSD (800GB), 4x per CPU socket, FW 8DV101H0, I/O workload 4KB random read, Queue Depth: 128 per SSD, Performance measured by Intel using SPDK perf tool, Linux kernel data using Linux AIO 0 500 1000 1500 2000 2500 3000 3500 4000 1 2 3 4 5 6 7 8 Throughput(KIOps) Numberof Intel SSD DC P3700 I/O Performance on Single Intel® Xeon® core Linux Kernel SPDK SPDK saturates 8 NVMe SSDs with a single CPU core! • Systems with multiple NVM Express* (NVMe) SSDs capable of millions of I/O per second • Results in many cores of software overhead with kernel-based interrupt- driven driver model • SPDK enables: - more CPU cycles for storage services - lower I/O latency
  • 6. VM Storage Acceleration • LeveragesDPDK vhost • Provides dynamic block device provisioning • Increase VM Density • Decrease Guest Latency • Works with KVM/QEMU SPDK scsi bdev vhost-scsi Target Blobstore Logical volume NVMe Driver bdev NVMe VM SSD for Datacenter
  • 7. SPDK vhost Performance 0 2 4 6 8 Linux SPDK IO/s (in millions) 0 10 20 30 40 50 Linux QEMU SPDK QD=1 Latency (in us) System Configuration: 2S Intel® Xeon® Platinum 8180: 28C, E5-2699v3: 18C, 2.5GHz (HT off), Intel® Turbo Boost Technology enabled, 12x16GB DDR4 2133 MT/s, 1 DIMM per channel, Ubuntu* Server 16.04.2 LTS, 4.11 kernel, 23x Intel® P4800x Optane SSD – 375GB, 1 SPDK lvolstore or LVM lvgroup per SSD, SPDK commit ID c5d8b108f22ab, 46 VMs (CentOS 3.10, 1vCPU, 2GB DRAM, 100GB logical volume), vhost dedicated to 10 cores As measured by: fio 2.10.1 – Direct=Yes, 4KB random read I/O, Ramp Time=30s, Run Time=180s, Norandommap=1, I/O Engine = libaio, Numjobs=1 Legend: Linux: Kernel vhost-scsi QEMU: virtio-blk dataplane SPDK: Userspace vhost-scsi SPDK up to 3x better efficiency and latency
  • 8. Polled Mode Drivers Storage Services Storage Protocols iSCSI Target NVMe-oF* Target SCSI vhost-user-scsi Target NVMe NVMe Blobstore NVMe-oF* Initiator Intel® QuickData Technology Block Device Layer (bdev) Ceph RBD Linux AIO Logical Volumes NVMe PMD NVMe* PCIe Released v17.10 vhost-user-blk Target BlobFSGPT virtio-scsi virtio-scsi PMD libpmemblk Storage Performance Development Kit (SPDK)
  • 9. DPDK Key Features for SPDK § Threads § PCIe Device Management § Memory Management § Rings, Mempools § Multi-Process § vhost
  • 10. Storage v. Packet Processing § PCIe Device Hotplug § Runtime v2phys Translation § vhost VM Boot § Storage is Endpoint Focused
  • 11. SPDK Community Home Page : http://www.SPDK.io/ Github : https://github.com/spdk/spdk Trello : https://trello.com/spdk GerritHub : https://review.gerrithub.io/#/q/project:spdk/spdk+status:open IRC : https://freenode.net/ we’re on #spdk