Call for Papers - International Journal of Intelligent Systems and Applicatio...
seminar ppt.pptx
1. Dr AMBEDKAR INSTITUTE OF TECHNOLOGY
Near Jnana Barathi campus, Bangalore-560056
(An Autonomus Institution, Affiliated to Visvesvaraya Technological University, Belgam, aided by
Government of Karnataka)
Seminar Report on
“GI-FI TECHNOLOGY”
UNDER THE GUIDANCE OF
PRAVEEN K .B ASSISTANT PROFESSER
DEPARTMENT OF TELECOMMUNICATION ENGINEERING
SUBMITTEB BY:
CHARAN S B 1DA18TE404
3. CONTENTS
o Introduction
o Network Evolution
o Why Gi-Fi is used
o Bluetooth and Wi-Fi
o Architecture and Fundamentals technologies of Gi-Fi
o Working
o Features /Advantages
o Disadvantages
o Applications
o Technology Considerations
o Conclusion
4. Introduction to Gi-Fi:
Gi-Fi or Gigabit wireless is the world’s first transceiver integrated on a
single chip that operates at 60 GHz on the CMOS process
Gi-Fi allows wireless transfer of audio and video data up to 5 gigabits per
second
Gi-Fi is ten times the current maximum wireless transfer rate usually within
a range of 10 meters
6. Man Behind Gi-Fi Technology:
Professer stan stefieds of Melbourne
university
7. Why Gi-Fi ?
o The reason of pushing into Gi-Fi technology is because of
Slow rate
High power consumption
Low range of frequency operation
Of earlier technologies i.e. Bluetooth and Wi-Fi.
9. Disadvantages of bluetooth and Wi-Fi
The bit rates of Bluetooth is 800 Kbps and Wi-Fi has maximum of 11Mbps
Both are having power consumptions 5mw and 10mw
The lower frequency of operation 2.4Ghz.
So , to have higher data transfer rate at lower power consumption we move
onto Gi-Fi technology
10. Architecture of Gi-Fi
The core component of a Gi-Fi system is the subscriber station
It supports standard od IEEE 802.15.3C Wireless PAN
An 802.15.3C based system often uses small antenna at the subscriber
station
It supports line of sight operation.
11. FUNDAMENTAL TECHNOLOGIES IN
802.25.3C
It transmits multiple signals simultaneously across the wireless
transmission paths within separate frequencies to avoid interference.
It use ultra wide band which consists of:
1. High bit rate
2. High security
3. Faster data transmission
12. WORKING
Time division duplex
Intermediate frequency
Radio frequency
Heterodyne principle
13. Why 60 GHz?
Immunity to co-channel interference
High security
Frequency reuse
High oxygen absorption at 60 GHz attenuates signals over distance
14. Features of Gi-Fi
High speed of data transfer
Low power consumption
High security
Cost effective
Small size
Quick deployment
Highly portable
15. Disadvantages
The main draw back of this technology is data transfer in short distance,
rane of 10 meters.
The Gifi signals are easily blocked by objects due to lesser operating
wavelength.
It is less secure compare to LiFi system.
16. Applications of Gi-Fi
• Household appliances:
it makes the wireless home and office of the future.
• Office appliances:
as it transfers data at high speeds that made work very easy.
• Video information transfer:
we can transfer at a speed of Gbps .
• Inter vehicle communication system:
17. Technological considerations
Due to less cost of chip so many companies are looking forward to launch
with lower cost
Specifically, wireless HD has a stated goal of enabling wireless connectivity
for streaming high definition content between source devices and high
definitions displays.
18. Conclusion
Within five years, we expect GI-Fi to be the dominant technology for
wireless networking.
GI-Fi can bring wireless broadband to the enterprise in an entirely new
way.
19. REFERENCES
[1]P.Srikanth, J.R.Thresphine, “Innovative With GI-FI Technology”, In:
International Journal of Advanced Research in Computer Science &
Technology - Vol. 2 Issue 1 Jan-March 2014.
[2]J. Santhan Kumar Reddy, “Gi-Fi Technology”, In: International Journal of
Advanced Scientific and Technical Research, Issue 3, Volume 1, January-
February 2013.
[3][1]S. Dheeraj and S. Gopichand, 2002,” Gi-Fi: Technology,” IEEE Trans.
Commun., vol. 52, no.5, pp. 1195-1203.
[4]Gowtham S Shetty, 2006,” Gi-Fi: Next Generation Wireless Technology,”
IEEE Trans. Commun., vol. 11, no. 4, pp. 324- 352
