Axiom Magazine: Volume 1, Issue 3, October 2013


Published on

This issue of AXIOM is dedicated to processing and power and in these pages we bring together a team of industry experts to talk about what you need to know in these areas. Avnet’s advanced architechtures expert Jim Carver gets to the heart of the ARM processor cores – explaining the history of ARM’s first offering through the current ecosystem of products, as well as and their functionality. And because no one likes to be in the dark, Chris Ammann explains why it is so critical for FPGA designers to plan for their board power at the beginning of the design process. Doug Geisler looks at how industrial OEMs have started to act like consumer electronics companies, or the “consumerization” of the market, and outlines the benefits and challenges to this new experience.

Published in: Technology
  • Be the first to comment

  • Be the first to like this

No Downloads
Total views
On SlideShare
From Embeds
Number of Embeds
Embeds 0
No embeds

No notes for slide

Axiom Magazine: Volume 1, Issue 3, October 2013

  1. 1. A N AV N E T E L E C T R O N I C S M A R K E T I N G P U B L I C AT I O N / / V OL U M E 1 / IS S U E 3 / O C TOB ER 2 0 1 3 Shop Smart for Your Processing & Power Solutions Find Out How ARM® Architecture Fuels a Deep Ecosystem for Embedded Systems Designs PAGE 06 When Should You Plan for Power in an FPGA System? PAGE 19 Learn More About the Consumerization of OEMs PAGE 46 Conferences, Trainings & Seminars PAGE 48
  2. 2. Welcome to the Family! Low-cost development tool Off-the-shelf SOM solution Out-of-the-box Linux support Easy migration from prototype to production MicroZed™ is a low-cost development board based on the Xilinx Zynq®-7000 All Programmable SoC. Its unique design allows it to be used as both a stand-alone evaluation board for basic SoC experimentation, or combined with a carrier card as an embeddable system-on-module (SOM). This combined stand-alone/SOM approach can quickly move a design idea from concept to production, making MicroZed the ideal platform for SoC based applications. MicroZed is supported by a community website where users can download kit documentation and reference designs as well as collaborate with other engineers also working on Zynq designs. © Avnet, Inc. 2013. All rights reserved. AVNET is a registered trademark of Avnet, Inc. Xilinx and Zynq are trademarks or registered trademarks of Xilinx, Inc.
  3. 3. PRESIDENT’S MESSAGE Processing and power. The brains and brawn on the board. Both are critical to its functionality and the design community has a lot of considerations surrounding both when making decisions for the next generation of products. We bring you food for thought. This issue of AXIOM is dedicated to processing and power and in these pages we bring together a team of industry experts to talk about what you need to know in these areas. Avnet’s advanced architechtures expert Jim Carver gets to the heart of the ARM processor cores – explaining the history of ARM’s first offering through the current ecosystem of products, as well as and their functionality. And because no one likes to be in the dark, Chris Ammann explains why it is so critical for FPGA designers to plan for their board power at the beginning of the design process. Doug Geisler looks at how industrial OEMs have started to act like consumer electronics companies, or the “consumerization” of the market, and outlines the benefits and challenges to this new experience. We round out this issue of AXIOM with the most current seminars and trainings to keep you up-to-date on what’s available. And, of course, we bring you the latest information on new products and technologies from our supplier partners and the resources you have available from Avnet Electronics Marketing. This is a comprehensive issue featuring component suppliers from a broad spectrum of our line card – with 21 supplier technologies mentioned from nearly A to Z, we go from Analog Devices Inc. to Renesas to Xilinx and many others in between! There is something for everyone in this issue of AXIOM, and I hope you enjoy it. Feel free to drop us a line at and tell us what you think about the publication; we’d love to hear your feedback! Regards, Ed Smith, Avnet Electronics Marketing Americas President
  4. 4. AXIOM ENTS ONT C OCTOBER ISSUE 3 . LUME 1 . VO 6 2013 IN THIS ISSUE 46   FEATURE STORY Consumerization of OEMs 10   PROCESSING PRODUCTS SOLUTIONS Check out the latest offerings from our leading line card manufacturers, including:  • Atmel  • Freescale  • Maxim  • Microsemi  • Renesas  • Silicon Labs  • Texas Instruments  • Xilinx 48   TRAINING EVENTS Get up to speed about the latest technology, products and solutions 50   WHAT’S NEW ARM ® ARCHITECTURE FUELS DEEP ECOSYSTEM FOR NEXT-GENERATION EMBEDDED SYSTEMS DESIGN New product introductions SUBMISSIONS We encourage prospective authors to submit articles. To obtain a copy of AXIOM article submission guidelines, please contact Printed in the U.S.A.
  5. 5. AV N E T E L E C T R O N I C S M A R K E T I N G 19 WHEN SHOULD YOU PLAN FOR POWER IN AN FPGA SYSTEM? RIGHT AT THE BEGINNING 25   POWER PRODUCTS SOLUTIONS Everything you need to know about new and focus manufacturer products and solutions, highlighting design issues, solutions, innovations and trends. Learn more from: Analog Devices Renesas Power One TDK-Lambda Fairchild Semiconductor Freescale OSRAM Opto Semiconductors ON Semiconductor STMicroelectronics Toshiba Vishay NIC Components Bourns Carling Technologies TE Connectivity Molex AVX QUESTIONS, COMMENTS, SUGGESTIONS Please forward your questions, comments and suggestions on this issue and for any future topics to AXIOM IN YOUR IN-BOX Sign up to receive AXIOM, or our other informative ePubs and eNewsletters, at DOWNLOAD AXIOM FOLLOW AVNET EM @avnetdesignwire
  6. 6. ARM® Architecture Fuels Deep Ecosystem for Next-Generation Embedded Systems Design By Jim Carver, Director Technology, Tech Marketing, Avnet Electronics Marketing Electronics systems manufacturers face a growing challenge in meeting specialized market requirements across an expanding range of embedded applications. In the past, systems design companies struggling to address disparate application requirements found themselves driven to correspondingly disparate processor architectures, each with their own development tools and resources. Today, however, engineers can find an extensive array of specialized processors — each designed with features tuned to specific application areas, yet all building on a common processor core from the ARM® family.
  7. 7. With its broad support for silicon, software and systems vendors, the ARM architecture lies at the heart of the industry’s richest, most broadly supported software and silicon ecosystem. Underlying this ecosystem, the ARM architecture ties together processor cores, memory and other system and peripheral IP — all intercommunicating through the standard ARM Advanced Microcontroller Bus Architecture (AMBA®). ARM’s processor IP cores build on the classic RISC architecture with a broad array of specialized types created to serve specific application areas including embedded and general-purpose computing — each core type emphasizing different combinations of key operating characteristics and low power, high performance and dedicated hardware functionality. Since the ARM6 core introduced in the early 1990s, ARM has enhanced the flexibility for incorporating ARM cores with the introduction of synthesizable cores in the late 1990s. With the introduction of the Cortex® family of cores in the mid 2000s, ARM delivered a range of cores able to support the broadest range of applications (Figure 1). Figure 1. The ARM Cortex family targets diverse application areas with specialized series such as the Cortex-A series (left), Cortex-R series (middle) and Cortex-M series (right). Source: ARM ARM Cortex-A series processors are designed to execute complex operating systems such as Linux, Android and Microsoft Windows, integrating a memory management unit (MMU) designed to address OS memory requirements. ARM Cortex-R series embedded real-time processors are designed to deliver highly deterministic real-time behavior in a wide range of power sensitive applications. In many applications, these processors run a Real-Time Operating System (RTOS) alongside user-developed code. In this class of applications, the target design typically requires only a Memory Protection Unit (MPU) as opposed to the MMU available in Cortex-A series cores. At the heart of TrustZone, each physical processor core provides two virtual cores that isolate secure from non-secure operations, using a special monitor mode to safely time-slice operations between the two virtual cores to ensure the protection of privileged operations while maintaining required performance levels (Figure 2). ARM Cortex-M series processors are optimized for deeply embedded designs that require the lowest possible power consumption, typically operating with application firmware to support the very specific requirements of the targeted embedded application. ARM builds on the Cortex-M series architecture to provide specialized solutions such as the ARM SecurCore™ processor family, which includes dedicated hardware security features tuned to support secure embedded applications such as smartcards. In addition, ARM’s TrustZone® architecture builds on the Cortex-A series processors to provide hardware security extensions capable of supporting a trusted execution environment for secure applications and services. Figure 2. ARM TrustZone augments Cortex-A series cores with security extensions that ensure isolation of secure operations from non-secure operations in virtual processor environments managed by a unique monitor mode in the physical core. Source: ARM AVNET ELECTRONICS MARKETING 07
  8. 8. Design Advantages For systems manufacturers, this broad range of specialized cores enables systems designers to more easily address the varied requirements of individual subsystems in complex designs. For example, mobile computing system designers can draw on the unique capabilities of each member of the ARM family — dramatically simplifying development thanks to the use of a consistent instruction-set architecture across the multi-processor design (Figure 3). At the same time, the same members of the ARM family can serve in widely different applications such as smart meters (Figure 4). Figure 3. An optimized mobile computing system design takes advantages of specialized functionality and performance of different member of the ARM family for example, resulting in an overall design that enjoys the development advantages of a single instructionset architecture without compromising requirements of individual subsystems. Source: ARM Figure 4. Designers can combine ICs based on different members of the ARM processor to meet the diverse requirements of embedded applications such as smart meters for sensing, analysis and communications. Source: ARM 08 AXIOM
  9. 9. For IC manufacturers, the combination of ARM specifications, design resources and extensive ecosystems of IP and tools enables chip designers to focus on their unique value-add, sourcing supporting IP and tools from other ARM partners. ARM IP licensees combine specialized ARM processor cores with their own unique combinations of cores for DSP, video processing and peripherals configured for specific application requirements. Tying the IP together, AMBA provides a standard interface specification that ensures compatibility between IP components from different design teams or vendors. AMBA encompasses a number of specifications such as AMBA ACE™ for sharing data, AMBA AXI4™ for multiple master architectures and ARM CHI for ensuring efficient operation in complex architectures. In aggregate, the ARM specifications help simplify IP integration, speeding complex design projects. For IC manufacturers, ARM ties the various elements of an ARMbased chip design together in resources such as ARM System Design Kits (SDK) designed to shorten the learning curve needed to design ICs with the ARM architecture and reduce time to market for those ICs. For example, the Cortex-M SDK (CMSDK) includes reusable IP, hardware design examples and software examples designed to help designers quickly develop complex SoC designs. ARM-based Solutions Together, the combination of high-performance core IP, system IP, third-party IP and specifications provides a very rich source for silicon manufacturers to create ARM-based SoCs for diverse application areas. Indeed, nearly 100 leading IC manufacturers have leveraged the ARM ecosystem to create processor families targeting key application areas. As a result, systems designers can choose from an extensive range of MCUs that combines different ARM cores with peripherals to serve specific markets. Among other ARM-based MCUs, designers can find multiple product families such as the following: • Atmel® SAM family of embedded processors features a wide range of offerings ranging from Cortex-A series families designed for cost-sensitive applications to flash MCUs based on Cortex-M series cores. • Freescale Semiconductor’s i.MX family builds on ARM A series cores and other ARM cores to address embedded smart devices for consumer, automotive and industrial markets; its Kinetis line based on Cortex-M series cores address a wide range of energyefficient embedded design requirements; and its QorIQ family combines Cortex-A series cores with dedicated communications and security IP for next-generation networking systems designs. • STMicroelectronics bases its broad STM32 family of 32-bit flash MCUs on ARM cores with a number of families designed to meet specific requirements for performance and functionality — ranging from its entry-level STM32 F0 series based on the ARM Cortex-M0 to ARM Cortex-M4-based high-performance STM32 F4 MCUs with DSP and FPU functionality. • Texas Instruments addresses different application markets with an extensive set of ARM-based MCU families such as its Tiva™ family for increased connectivity integration, Sitara™ family for embedded designs, DaVinci™ family for video applications, Hercules™ series for safety applications in medical and industrial markets, and OMAP™ platform for multimedia-rich mobile applications. • The Zynq®-7000 All Programmable SoC from Xilinx offers designers the unmatched performance of a dual core processing subsystem based on the Cortex-A9 running up to 1 GHz, paired with a programmable logic subsystem containing block memory, DSP blocks and high-performance interconnect. This processor subsystem includes a DDR3 memory controller, dual 10/100/1000 Ethernet MACs along with a full complement of standard peripherals offering engineers the best of both hard and soft logic functionality. • ARM cores form the centerpiece in advanced FPGA SoCs that combine an ARM processor core with an FPGA fabric and specialized peripheral blocks. For example: • The Microsemi SmartFusion™2 offers a unique combination of ARM-based MCU for high-performance software execution, DSP blocks for specialized computing and flash-based FPGA fabric for implementation of speed-critical algorithms. Along with on-chip SRAM, memory controllers, communications peripherals, the Microsemi FPGA SoC includes specialized security features including security-processing accelerators and secure storage needed in critical applications in industrial, military, aviation, communications and medical segments.   MBEDDED MARKETPLACE  E   RINGING DEVELOPERS  B   ND SOFTWARE VENDORS  A TOGETHER WITH SOLUTIONS    HAT SUPPORT ARM  T   RCHITECTURE  A Working across the broad ARM hardware base, software in the ARM ecosystem spans the complete range of application development requirements. Engineers can find support for ARMbased development in familiar IDEs and draw on an extensive array of hardware development tools including emulators, logic analyzers, evaluation boards and reference designs for ARM-based design. Along with development tools, the ARM ecosystem encompasses a broad range of software offerings including low-level software such as from BIOS, device drivers and board support packages as well as high-level systems software including RTOS, hypervisors and Java virtual machines. Available middleware offerings address a broad range of applications with libraries including audio and voice software, communications protocols, database, power management, security and video codecs, among others. At the application level, third-party software packages target specific requirements including applications in automotive, communications, consumer and industrial. ARM partners also provide a wide variety of training options for companies and individual engineers looking to explore more specific ARM-based solutions. Conclusions The unique combination of standard processor core architectures and specification provides a rich environment for development of ARM-based design solutions and tools that continually expand the extensive ARM ecosystem of ICs, systems and software. As a result, designers can find ARM-based MCUs, tools and software able to meet an increasingly diverse set of market requirements. Drawing from this consistent ecosystem, engineers can rapidly build systems capable of addressing a broad set of designs ranging from deeply embedded smart devices to mobile systems and high-performance computing platforms. Contact your local Avnet Electronics Marketing’s sales representative to learn more about our ARM solutions portfolio or visit AVNET ELECTRONICS MARKETING 09
  10. 10. AXIOM MANUFACTURER PRODUCTS SOLUTIONS SAM D20 Family Brings the Best of MCUs to Cortex®-M0+ Devices PROBLEM SOLUTION • With developers demanding more computational power than ever before the Cortex®-M0+ market is rapidly growing. • Atmel recently launched the SAM D20, based on the Cortex ®-M0+. This family expands Atmel’s already formidable ARM®-based portfolio as it joins the Cortex-M3, Cortex-M4 and Cortex-A5. • This new microcontroller series combines the performance and energy efficiency of an ARM Cortex-M0+ based MCU with an optimized architecture and peripheral set, offering a truly differentiated general-purpose lineup that is ideal for a wide range of low-power, cost-sensitive devices, including GPS trackers, appliance controllers, intelligent remotes and optical transceivers. • Notable power-saving techniques include an event system that allows peripherals to communicate directly with each other without involving the CPU, while SleepWalking peripherals wake up the CPU only upon a pre-qualified event, thereby reducing overall power consumption. • In terms of peripheral flexibility, a serial communication module (SERCOM) is fully software configurable to handle I2C, USART/UART and SPI communications. With multiple SERCOM modules on a device, designers can precisely tailor the peripheral mix to their applications. • The SAM D20’s QTouch® Peripheral Touch Controller offers integrated hardware support for buttons, sliders, wheels and proximity. It also supports both mutual and self-capacitive touch (without the need for external components), while providing noise tolerance and self-calibration. • Additional key hardware specs include a high-precision, 12-bit 350 ksps ADC and a 10-bit DAC, allowing switching between external and internal oscillators on the fly. There are eight 16-bit timer/counters; a 32-bit real time clock and calendar; 48 MHz operation (1.77 CoreMark/MHz), single-cycle IO access; and six serial communication modules (SERCOM) that can be configured to act as a USART, UART, SPI or I2C. Atmel SAM D20E Atmel SAM D20G Atmel SAM D20J 14 15 16 17 14 15 16 17 18 14 15 16 17 18 Flash (KB) 16 32 64 128 16 32 64 128 256 16 32 64 128 256 SRAM (KB) 2 4 8 16 2 4 8 16 32 2 4 8 16 32 SERCOM (I2C, USART, SPI) 4 6 6 Timer/Counter 6 6 8 PWM channels 10 12 16 12-bit 350 ksps ADC 10 ch 14 ch 20 ch 10-bit 350 ksps DAC 1 ch 1 ch 1 ch GPIO Capacitive touch channels Pin count 10 AXIOM 26 38 52 Up to 60 Up to 120 Up to 256 32 48 64
  11. 11. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S i.MX 6 Series Applications Processors PROBLEM • The market for intelligent, multimedia-centric, touch-based devices is increasing exponentially. Tomorrow’s batterypowered smart devices, auto infotainment, in-flight entertainment systems, medical systems, personal and enterprise class intelligent control, data systems and new classes of devices never seen before now need to present data and user interface choices to the end user primarily through rich sound, video, voice, pictures and touch, rather than keyboards and mice. • The need for manufacturers to quickly provide multiple devices to fit specific market segments or niches and provide their customers with a broader range of choices is rapidly increasing. SOLUTION • The i.MX 6 series from Freescale was designed specifically to enable this new market by bringing together high-performance scalable multimedia processing, a software compatible family of five processors, all pin-compatible solutions with integrated power management so that a manufacturer can deploy a full portfolio of products with a single hardware design. • Integrating one, two or four ARM® Cortex®-A9 cores running up to 1.2 GHz, these products represent the industry’s only ARM-based applications processor series featuring software, power and pin compatibility across single-, dual- and quad-core implementations. • Product capabilities include dual-stream 1080p H.264 video processing for 3D class video decoding, Freescale’s Triple Play graphics architecture consisting of console-style 3D graphics with 200 MT/s for exceptional display resolution, separate 2D BLT engine for UI acceleration and separate 2D OpenVG engine for vector-based graphics. TREND axiom_frsiMX6 • As the trend for rich sound, video, voice, pictures and touch continues in industrial, consumer and automotive applications, Freescale continues to innovate with feature-rich processors that fulfill application needs. i.MX 6 Series Applications Processor Block Diagram AVNET ELECTRONICS MARKETING 11
  12. 12. AXIOM MANUFACTURER PRODUCTS SOLUTIONS Kinetis® KL02 Microcontroller Family PROBLEM • ow price point and ease-of-use requirements are critical for entry-level designs that are frequently a barrier to L developers considering 32-bit microcontroller (MCU) solutions. SOLUTION • The Kinetis KL02 family of 32-bit MCUs offers a new level of processing performance and energy efficiency for a range of applications and helping expand the Internet of Things (IoT). • Applications may include portable consumer devices, sensing nodes, wearable devices and even ingestible healthcare sensing. As more of these products add intelligence and become part of the IoT ecosystem, designers need to maintain a small footprint, in terms of size and power consumption, while also delivering a level of connectivity users have come to expect from more traditional connected devices, such as tablets and smartphones. • The tiny KL02 devices have a small appetite for power – six times more efficient than a leading competitor – making them ideal for ultra-small-form-factor and battery-powered products. • Kinetis L series MCUs are powered by a 32-bit ARM® Cortex®-M0+ processor, for which Freescale was a lead partner in definition and development. The Kinetis KL02 MCU family builds upon the energy efficiency of the Cortex-M0+ core and reduces the power consumption of the Kinetis L series to an even lower entry point. • The ultra-efficient KL02 family delivers 15.9 CM/mA and, like the other Kinetis MCUs, includes autonomous, powersmart peripherals – an ADC, UART and timer, 10 flexible power modes and wide clock and power gating to minimize power loss. • A low-power boot mode reduces power spikes during the boot sequence or deep-sleep wakeup. This is useful for systems where battery chemistry limits the allowable peak current, such as those employing lithium-ion batteries frequently used in portable devices. • The Kinetis KL02 family is supported by the FRDM-KL02Z Freescale Freedom development platform and Processor Expert software including an MQX™ Lite RTOS component, along with third-party development resources from the extensive ARM ecosystem. Kinetis KL0 MCU Family Block Diagram 12 AXIOM
  13. 13. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S Tiva™ C Series Microcontrollers PROBLEM SOLUTION • Design engineers are looking for an MCU that features ARM® Cortex ®-M in advanced 65 nm process technology that provides the right balance between higher performance and low power consumption. • The Tiva C Series ARM MCUs from TI provide a broad portfolio of connected Cortex-M4F microcontrollers. Associated Products: EK-TM4C123GXL LaunchPad Evaluation Kit • Designers who migrate to the Tiva C Series MCUs benefit from a balance between the floating-point performance needed to create highly responsive mixed-signal applications and the low power architecture required to enable increasingly aggressive power budgets. • The ARM Cortex-M4F with floating point accelerates math-intensive operations and simplifies digital signal processing implementations. • The devices’ 12-bit ADC accuracy is achievable at the full 1 MSPS rating without any hardware averaging, eliminating performance tradeoffs. • Range of pin-compatible memory and package configurations enables optimal selection of devices. • Additional features include TO SE E T –– Up to 256 KB Flash. L ATE HE PRO ST TIVA –– Up to 32 KB single-cycle SRAM. D FROM UCT S –– Two high-speed 12-bit ADCs up to 1 MSPS. EM.AV TI VISIT NET.C –– Up to two CAN 2.0 A/B controllers. OM/ AX TISL A IOM_ –– Optional full-speed USB 2.0 OTG/Host/Device. UNCH PAD –– Up to 40 PWM outputs. –– Serial communication with up to 8 UARTs, 6 I2Cs, 4 SPI/SSI. –– Intelligent low-power design power consumption as low as 1.6 μA. • Tiva C Series MCUs are supported by TivaWare™ for C Series software, designed specifically for those customers who want to get started easily, write productionready code quickly, and minimize their overall cost of software ownership. TM4C123x ARM® Cortex®-M4F Up to 80 MHz FPU ETM NVIC MPU SWD/T Temperatures Memory Up to 256 KB Flash Up to 32 KB SRAM 2 KB EEPROM ROM 85°C 105°C Power Clocking Precision Oscillator RTC Battery-Backed Hibernate DMA (32 ch) System Modules Debug 6× 32-bit Timer/PWM/CCP 6× 64-bit Timer/PWM/CCP Systick Timer Real-time JTAG 2× Watchdog Timer Control Peripherals Comms Peripherals Analog 2× Quadrature Encoder Inputs 8× UART 4× SSI/SPI 2 6× I C 2× CAN USB Full Speed (Host/Device/OTG) 12ch, 1 S/H 12-bit 1 MSPS ADC 16× PWM Outputs 12ch, 1 S/H 12-bit 1 MSPS ADC LDO Voltage Regulator 3× Analog Comparators Temperature Sensor AVNET ELECTRONICS MARKETING 13
  14. 14. AXIOM MANUFACTURER PRODUCTS SOLUTIONS C8051F85x/6x Microcontroller Family PROBLEM • Motor control and other sensor based applications are driven by cost, device size, performance and ease of use. SOLUTION • he C8051F85x/6x from Silicon Labs has a 25 MHz CPU that is 50% faster than other competing solutions. The T CPU supports a highly-efficient enhanced 8051 pipelined architecture, allowing it to perform 70% of instructions in 1-2 system clock cycles. Additional interrupt priorities enable fast interrupt handling for real-time applications. • igh-performance analog capabilities include a 12-bit multi-channel analog-to-digital converter (up to 16 ADC H channels available), two analog comparators with programmable hysteresis and response time, a precision internal voltage reference and a temperature sensor. • mall package size, high level of integration and patented crossbar architecture provide for an extremely efficient S implementation. The high level of integration eliminates the need for several external components such as a crystal, temperature sensor, level shifters and ADCs, further reducing BOM cost and PCB footprint. The innovative crossbar technology allows developers to choose their desired peripherals and provides flexibility in determining the pin location of those peripherals thus simplifying the layout. • The easiest way to begin development with the C8051F85x/6x AEC-Q100 qualified, low-cost microcontroller family is with the fully functional C8051F850DK development kit. This comprehensive development kit is designed to give customers an out-of-box experience and comes with everything developers need to evaluate hardware and develop code. • Additionally, the TOOLSTK-860-B-SK is offered as a low cost alternative for quick evaluation. It allows designers to develop and debug application firmware directly on the target C8051F85x/6x MCU using the Silicon Labs Integrated Development Environment (IDE). The ToolStick Base Adapter provides a USB debug interface and data communications path between a Windows PC and a target microcontroller. TREND • Though use of 32-bit architectures is on the rise for many embedded applications, 8-bit solutions can offer smaller footprints, better cost and simplified development. It is important to understand the trade-offs with these options in considering the complete system solution. • Peripheral subsystems are most critical in many low end control applications. These will become more sophisticated (analog, timers) taking the performance burden off of the core MCU. C8051F85x/86x 14 AXIOM
  15. 15. TRUELow Power RXRX100 MCUs FOR LOW POWER™ 100 MCUs, for Low-cost, True LOW-COST, HIGH-PERFORMANCE APPLICATIONS High-performance Applications ™ The RX100 is the RX Family’s new entry level 32-bit MCU, extending the RX portfolio to the low end of the spectrum in terms of pin count and flash memory size. This new family is a great fit for those who want to benefit from the higher performance RX 32-bit architecture at the lowest possible cost. The RX111 group is the market’s first 32-bit MCU to feature True Low Power, as well as fast wake-up, zero wait-state flash, multiple safety functions and integrated USB 2.0 host, device and OTG support. mobile health care, smart meters, sensors/ detectors, and industrial and building automation. It consumes only 350nA in sleep mode and snaps into full operation in just 4.8μs. Memory size ranges from 16KB to 128KB and compact, low-pin-count packages are available starting at 36 pins. Wakeup 100μA/MHz* 350nA standby, 4.8μs wake-up USB Connectivity Host, device and OTG High Performance 3.08 CoreMark/MHz 50 DMIPS @ 32MHz Digital Signal Processing RX100 MCUs are great design choices for embedded systems that must minimize power consumption by running in sleep mode whenever possible, yet must wake up quickly whenever there is a need to perform computing or control tasks. Renesas’ True Low Power capability offers designers the lowest possible power consumption across the entire temperature and voltage range, including all peripherals and Flash memory, while also providing maximum flexibility with multiple operational and sleep modes. Wake-up time in low-power mode ranges from less than 1μs to 4.8μs. Zero wait-state Flash 1KB Block size Erase/Write operation down to 1.8V BGO Data Flash (Programmable while code is executed) Designed to support a broad range of markets, the new RX111 group delivers a combination of ultralow-power consumption, on-chip connectivity and superior performance at attractive price points for low-end 32-bit embedded applications, including Safety Features Built in safety features (CAC, DOC, I-WDT, GPIO) Temperature sensor Scalable Fully compatible with RX600 and RX200 Low Pin Count (36 -100 pins), 16KB to 128KB Multifunction Pin Controller (MPC) Memory Zero-wait Flash up to 256KB SRAM up to 24 KB RX100 versus 32-bit Cortex MCUs Data Flash Family/Group 8 KB System Communication Timers Event Link Controller I2C MTU2 Data Mgmt. DTC/DMA Interrupt Cont. 16 levels Clocks SCI/UART 3 ch SPI 4 ch USB 2.0 Host/Device/OTG GPIO Safety CAC DOC CRC Analog Temp. Sensor STM32L STM32F0 K10 KL0 EFM32G 32-bit 32-bit 32-bit 32-bit 32-bit 32-bit (Cortex-M0) (Cortex-M3) (Cortex-M0) (Cortex-M4) (Cortex-M0+) (Cortex-M3) 32MHz 50MHZ 32MHz 48MHz 100MHz 48MHz 32MHz 1.56 Yes 0.85 1.03 0.85 1.25 0.93 1.25 No Yes No Yes No No DSP Instructions Yes No No No Yes No No 3.08 50 5 cycles 1.62 2.17 1.62 2.19 1.77 2.17 DMIPS/MHz CMT 16-bit 2 ch I-WDT RTC Calendar ADC 12-bit 14 ch DAC 8-bit 2 ch Coremarks/MHz Max. DMIPS* Interrupt Latency Run μA/MHz (Lowest Number) Lowest Power Mode with RTC on (μA) Wake-up time from previous mode RX111 Renesas Promotion Board (RPB) The board was designed to showcase RX111 low power modes, featuring Pmod and energy harvesting connectors, and comes loaded with software and tools. Integrated J-Link debugger Power measurement built in Applilet e2 studio toolchain USB Demo LPC11xx MAC/DIV 16-bit 6 ch OSC PLL IRC POR/LVD (RX) Max. Frequency Performance Multifunction Pin Controller 4 ch RX100 32-bit CPU 45 33 38 125 45 40 16 cycles 12 cycles 16 cycles 12 cycles 16 cycles 12 cycles 100 140 290 239 450 89 180 0.6 0.22 (No RTC) 0.9 2.6 2.45 (VLLS1+ RTC) 0.96 (VLLS1+ RTC) 0.9 5µs 56µs 2.6ms 8.05µs 134µs 93µs 2µs (Fast interrupt) RX111 Renesas Starter Kit (RSK) This complete RX111-based hardware/software platform for in-depth application design includes the E1 Debugger, a trial version of the e2 studio and Renesas RX compiler and demonstration firmware. RSK Part Number: YR0K505111S000BE RPB Part Number: YRPBRX111 Learn more at
  16. 16. AXIOM MANUFACTURER PRODUCTS SOLUTIONS SmartFusion®2 SoC FPGAs PROBLEM • mbedded networked systems control an ever-increasing amount of modern systems. Many systems are involved E in controlling complex and sensitive installations and must not be compromised by cyber attacks. Such attacks could originate in the form of software code that has been altered to achieve a malicious goal, i.e., passing control to a third party or compromising a safety system. • To ensure an embedded system is not at risk from these attacks it must be brought in to service via a secure boot process. SOLUTION • he secure boot of a system is a multi-part process and relies on a “Root-of-Trust” — a hardware device that is T immutably trusted and can perform the early stages of the boot process. One of the functions it must provide is the ability to ensure the software that will run in the next highest level is valid BEFORE it is executed. For a fully valid system, code in the “n-1” phase must always perform this check before code in phase “n” is executed. (See Figure 1). • The SmartFusion®2 SoC FPGA provides the most advanced design and data security capabilities, starting with a robust root-of-trust device with secure key storage capability using the SoC FPGA industry’s only physically unclonable function (PUF) key enrolment and regeneration capability from Intrinsic ID. • SmartFusion2 is also the only SoC FPGA resistant to differential power analysis (DPA) attacks using technology from Cryptography Research Incorporated (CRI) portfolio. • Offering user access to a number of several encryption services such as AES-256 and SHA-256, this FPGA can also be used to store and compare the mechanism of validation. • The operation of the SmartFusion2 SoC FPGA for a secure boot process is only used at select times — typically at startup and then possibly by diagnostics in the event of a failure in the system. By using the device as the programmable logic element, you get the validation function included without the need for an additional component. • The FPGA integrates a non-volatile flash based FPGA with a full feature microcontroller subsystem, enhanced FPGA fabric and high speed serial and memory interfaces — making it ideal for logic functions that control the secure boot function. • The FPGA fabric is composed of 4-input LUT logic elements and includes embedded memories and mathblocks for DSP processing capabilities. TREND • The requirement for security in an embedded system is forever growing, but this need must be met while still meeting financial budgets. By using a SmartFusion2 SoC FPGA that is a hardware root-of-trust, it is possible to integrate the logic and secure boot functions into one device. This reduces the system component and real estate cost, and provides the secure boot function for free. SmartFusion2 devices are the only SoC FPGAs available that meet the requirements for a hardware root-of-trust. Figure 1: A Secure Boot Process Validate Phase 1 Code Phase 0 Immutable Boot Loader Validate Phase 2 Code Validate Phase 4 Code Phase 1 Phase 2 Phase 3 Phase 4 BIOS OS Loader OS Application(s) Initial root-of-trust stems from immutable trusted hardware 16 AXIOM Validate Phase 3 Code Code for phases 1-n is validated by already trusted system before execution is transferred to it
  17. 17. Analog for Xilinx® FPGAs Streamline your Xilinx FPGA design with the latest from TI Texas Instruments is the approved and tested vendor for the analog solution around the Xilinx® FPGAs and CPLDs. TI works closely with Xilinx to recommend the best power management, clocking, data converter, and other analog solutions for a wide variety of applications. • ADCs and DACs • Temperature Sensors • Retimers and Redrivers • Power Reference Designs • Serial Digital Interface (SDI) Solutions • Power Solutions for Xilinx FPGAs • Ethernet Solutions • Clocking Solutions for FPGAs To learn more about TI’s analog solutions for Xilinx FPGAs go to: The platform bar is a trademark of Texas Instruments. © 2013 TI
  18. 18. Optimize Design Size and Performance Maxim Integrated Power Architecture Featured on ZedBoard™ ZedBoard™ provides an excellent starting point for both hardware and software designers interested in exploring the many uses of the Xilinx® Zynq®-7000 All Programmable SoC. The Maxim Integrated power architecture chosen for ZedBoard addresses the two highest priorities for the design: small size and low cost. Maxim meets these design parameters and delivers a solution that is compliant with the regulation accuracy, start up and sequencing requirements of the Xilinx Zynq-7000 AP SoC. Learn more at
  19. 19. WHAT YOU CAN EXPECT? WHAT YOU CAN EXPECT? Full-day, how-to training for FPGA embedded systems designers Full-day, how-to training for FPGA embedded systems designers Multiple learning tracks including Xilinx Zynq™-7000 All Programmable SoC, 7 Series Applications, Vivado™ Design Flow, based on the “A Generation Ahead Seminar Series” from Xilinx Multiple learning tracks including Xilinx Zynq™-7000 All Programmable SoC, 7 Series Applications, Vivado™ Design Flow, based on the “A Generation Ahead Seminar Series” from Xilinx Choose from a dozen hour long training courses devoted to design solutions for FPGA design applications Choose from a dozen hour long training courses devoted to design solutions for FPGA design applications Practical, real-world design examples with an emphasis on: Practical, real-world design examples with an emphasis on: • Xilinx ARM Processor solutions • Xilinx ARM Processor solutions • Processor debugging operating system support • Processor debugging operating system support • Design tool flow and verification • Design tool flow and verification • Memory interfaces • Memory interfaces • Agile Mixed signal solutions • Agile Mixed signal solutions By Chris Ammann, Global Technical Marketing Engineer, Avnet Electronics Marketing As FPGAs continue to become increasingly powerful, adequately powering these devices becomes even more critical to unlock their full potential, yet often times the power design is left until nearly the end of the design process. The trend of lower voltages relative to shrinking process geometries is prevalent. Some of today’s devices now run at voltage levels under 1V. Lower voltage requirements for FPGAs and processors create additional challenges, especially at higher currents, that require serious attention when designing the power architecture for a new platform. It’s important to think about and plan for a power system at the outset of the design. Supply placement, passive component selection and PCB design become even more critical as voltage drops across components and even PCB traces and planes can introduce substantial error into your system. It’s not uncommon for each FPGA family to consist of a wide range of products. The smallest FPGA may clock in at less than 100 MHz, and require less than 1 Amp of peak current for core logic, while the largest in the family may need 14 Amps or more for core logic clocked at 300 MHz. FPGAs with lower core voltage needs will require a large amount of current, which must be supplied with a low noise floor and a minimum amount of ripple voltage. Why then isn’t power tackled immediately? FPGA-based board designers may not feel they have sufficient information. They face uncertainty, for example, about actual power requirements of the system since the gate-level design is usually not finalized before the hardware is generated. They also need to deal with dynamic load requirements, as load may move rapidly from an inactive, low current situation to a full processing state and the extent of these requirements may not be appreciated at the onset of design. Since FPGAs are more flexible than the power supply circuits that power them, it is beneficial to consider a worstcase power system at the beginning of the design process. Once the FPGA family is selected, and the core logic supply voltage is set, tools are in place to determine the current consumption of the core logic on the FPGA manufacturer’s website and maximum current estimates can be found in FPGA power applications guides. Power supply design challenges inherent in all designs boil down to cost, size, noise and efficiency, and the tradeoffs between the four. Power design is all about tradeoffs, there is no one golden solution for all applications. While industrial and medical markets typically favor size over cost, wireless tends to favor low noise, handheld and battery applications usually prioritize efficiency, and in consumer apps cost tends to be king. A key part of the design process is to determine the voltage requirements needed and the current requirements of each voltage rail. Xilinx provides assistance by making available power estimation spreadsheets for estimating the power requirements of an FPGA device, based on the required functionality of the FPGA. It is important that designers access and use these spreadsheets to ensure the use of appropriate power-supply and thermalmanagement components. A variety of power supply manufacturers offer complete power solutions for Xilinx FPGAs and have resources available to aid in device selection. Avnet has worked with several power supply manufacturers to create a series of paper designs for different 7 Series and Zynq devices. These designs were created around realistic power budgets and are intended to provide a starting point for the overall power architecture selection of your system. The Avnet Power Solutions Video Series is an educational resource available to guide designers through the power-system maze. Covering such topics as power supply testing, component selection, technology overviews and more, the series is a collection of valuable tutorials designed to let you ramp up your designs rapidly. FPGA development boards from Xilinx are designed with digitally controlled power supplies that make regulation adjustments to ensure supply voltages are within spec. The Mini Module Plus development system from Avnet uses a modular power supply that is available from multiple manufacturers. Remote voltage sensing is used on these power modules to achieve greater regulation accuracy at the load. Comprised of a modular MMP baseboard that supports an MMP FPGA/SoC module, an MMP power supply module, and a Low-Pin-Count (LPC) FPGA Mezzanine Card (FMC), the Mini Module Plus system provides flexibility for FPGA/SoC evaluation and prototyping. Each MMP component is sold separately so that designers can configure their Mini-Module Plus System to meet their particular prototyping needs. At the same time, a path exists for easy upgrading or migration through the replacement of the MMP FPGA or SoC module, while keeping the same MMP baseboard and MMP power module. AVNET ELECTRONICS MARKETING 19 AVNET ELECTRONICS MARKETING 19
  20. 20. MMP FPGA /SoC Module FMC Module (Optional) The kit includes one Avnet Kintex-7 Mini Module Plus with a Kintex-7 K325T-1FFG676 or K410T-1FFG676 FPGA and a Xilinx ISE® Design Suite: Logic Edition Device locked to XC7K325T or XC7K410T and bundled with the Kintex-7 Mini-Module Plus. MMP Power Module MMP Baseboard II Figure 1. MMP Baseboard II The modular MMP allows designers to prototype and easily move the MMP FPGA/SoC module or MMP power module to a custom baseboard. By using off-the-shelf MMP FPGA/SoC or MMP power modules, risk is reduced by using a fully tested module. An example is the Xilinx Zynq®-7000 All Programmable SoC MiniModule Plus, a small system-on-a-module (SOM), with all the necessary functions and interfaces for a Zynq-7000 AP SoC system. The module can be combined with the Mini-Module Plus Baseboard II and a Mini-Module Plus Power Supply for an out-of-box development system ready for prototyping. USB 2.0 Connector USB 2.0 ULPI PHY RJ45 Connector Ethernet PHY 1 GB DDR3 USB Connector USB-UART 8 KB I2C EEPROM 32 MB QSPI XC7Z045 FFG900 Real-Time Clock Processing System PS Clock @ 33 MHz Programmable Logic PJTAG Header LVDS OSC @ 200 MHz JX1 Connector 4 GTXs and 66 User I/O Programmable LVDS Clock 128 MB Flash Power, GTX, User I/O, and Configuration Signals JX2 Connector 4 GTXs and 66 User I/0 Figure 2. The Xilinx Zynq®-7000 All Programmable SoC Mini-Module Plus The kit includes the Zynq-7000 AP SoC Mini-Module Plus with a Zynq-7000 AP SoC XC7Z045-1FFG900 FPGA and the Xilinx ISE® Design Suite: Embedded Edition (device locked to XC7Z045 FPGA) Another example is the Kintex-7 FPGA Mini-Module Plus, a small system-on-a-module (SOM), with all necessary functions and interfaces for a Kintex-7 FPGA system. The FPGA module is a complete system on a module, packaging all the necessary functions needed for an embedded processor system onto a small footprint. Crystal @19.2 MHz EEPROM (16 KB) USB 3.0 MAC/PHY USB 3.0 Connector Kintex-7 XC7K325T or XC7K410T FFG676 BPI 64 MB Flash 256 MB DDR3 8 KB I2C EEPROM Programmable LVDS Clock ARM JTAG Header RJ45 Connector LVDS OSC @200 MHz Ethernet PHY LVCMOS OSC @50 MHz XADC Header JX1 Connector 4 GTXs and 66 User I/O Miscellaneous Voltage Regulaors Power, GTX, User I/O, and Configuration Signals JX2 Connector 4 GTXs and 66 User 1/0 Figure 3. The Xilinx Kintex-7 FPGA Mini-Module Plus Block Diagram 20 AXIOM Voltage Bank Voltage (V) Vcco Vccaux/Vccaux_io/Vccadc/Vcco/ MGTVccaux Current (A) 1 6 3.00% 1.5/1.35 Vccint/Vccbram Vccaux_io Micro SD Card Socket PS Reset The Avnet Power modules are available from several manufacturers. Each partner designed their board to meet a common set of design requirements, making them interchangeable to the user. Providing solutions from multiple partners allows the customer to choose their preferred vendor, as well as choosing the design implementation they feel most comfortable with. Since the intent was to have these power modules work with a variety of boards, the first step was creating a worst case power budget that could support all of our development board needs. After defining the system, the following table was created to represent the worst case current draw for each required rail. Tolerance 4 5.00% 1.8 6 5.00% 2 2 3.00% Vcco 2.5 8 5.00% Vcco 3.3 8 5.00% 1 6 3.00% 1.2 4 2.50% MGTAVcc MGTAVtt/MGTAVTTrcal Figure 4. MMP Power Module requriements table The table defines not only the voltages, currents and voltage banks they power, but also the overall tolerance the supplies needed to be designed to. With tolerance requirements down a low as 2.5%, extra design measures were needed to ensure regulation accuracy. In an ideal design scenario, the power supplies would be placed right next to the load they supply, however in our system architecture that placement was not feasible. As a result, remote sense capability was added, which senses the voltage at your load and makes regulation adjustments to maintain your set point. Remote sense is not trivial and adds its own set of unique challenges, but is one tool available to designers when optimal supply placement isn’t available. Design files are available for each power module as well so that these designs can be reproduced in customer applications. AVNET POWER SOLUTIONS VIDEO SERIES PL8GuerdulPltBrHsnLmSJtoj1xsg8XRWG AVNET POWER DESIGN ZONE XILINX REFERENCE DESIGNS AVNET KINTEX-7 KIT AVNET ZYNQ-7000 MINI-MODULE PLUS DEVELOPMENT KIT AVNET MINI-MODULE PLUS POWER MODULES
  21. 21. Unlock Your System’s True Potential Xilinx® Zynq®-7000 AP SoC Mini-Module Plus System The Xilinx® Zynq®-7000 All Programmable SoC Mini-Module Plus designed by Avnet, is a small system-on-module (SOM) that integrates all the necessary functions and interfaces for a Zynq-7000 AP SoC system. For development purposes, the module can be combined with the Mini-Module Plus Baseboard II and a Mini-Module Plus Power Supply to provide an axiom_MMP-7Z045-G out-of-box development system ready for prototyping. The modular concept also allows the same Zynq-7000 AP SoC to be placed on a user-created baseboard, simplifying the user’s baseboard design and reducing the development risk. © Avnet, Inc. 2013. All rights reserved. AVNET is a registered trademark of Avnet, Inc. Xilinx and Zynq are trademarks or registered trademarks of Xilinx, Inc.
  22. 22. AXIOM MANUFACTURER PRODUCTS SOLUTIONS Avnet Mini-Module Plus System on Modules PROBLEM SOLUTION • In today’s competitive market, all product providers strive to shorten product development time, reduce the overall cost and minimize technical risk. However, most products in the market require a high level of hardware complexity that challenges many developers in meeting the product development requirements. • A System on Module (SoM) offers an innovative path to product development. It helps system designers and architects implement a fully customized product with custom interfaces and form factor without the overhead of a fully customized design. An off-the-shelf SoM can easily be integrated into a custom baseboard to create a fully customized end-product. This approach shortens product development time, reduces overall product development cost and minimizes technical risk. • The Avnet Virtex ®-5, Kintex ®-7 and Zynq ®-7000 All Programmable SoC series of Mini-Module Plus SoM offerings provide the ultimate programmable system that packages all the functionality required of an embedded processor system in a small form factor. These modules provide on-board CPU, RAM, Flash, USB, Ethernet, serial port and access to 132 user IOs along with eight high-speed Gigabit transceivers via the SoM connectors. TREND • Today more system designers and architects rely on integrating an off-the-shelf SoM to their custom baseboard for implementing the processing engine and standard interfaces while using their engineering resources to focus on the company’s core competency and implementing customized interfaces on the baseboard. Using an offthe-shelf SoM results in a much simpler baseboard design, which shortens development time and reduces overall development costs. Xilinx Kintex-7 FPGA Mini-Module Plus Xilinx Zynq-7000 AP SoC Mini-Module Plus Xilinx Virtex-5 FTX Mini-Module Plus 22 AXIOM
  23. 23. AXIOM MANUFACTURER PRODUCTS SOLUTIONS New Product Program PROBLEM • How to communicate what new products are appropriate for broad market, and what are relevant supporting collateral for ADI’s new products. • How to keep designers informed of new products relevant to their new designs. SOLUTION • ADI issues a quarterly “Select” list of new products that Avnet fully stocks and supports. • This Select list is promoted on Avnet’s site and updated quarterly, see THE FOLLOWING ARE JUST SOME OF THE NEWEST PRODUCT ANNOUNCEMENTS: • AD8232 Single-Lead Heart Rate Monitor Analog Front End • AD8422 Low Power High Performance Instrumentation Amplifier • ADuM3190/ADuM4190 Isolated Error Amplifiers with iCoupler ® Technology • AD7091 Low Power, 12-bit 1 MSPS SAR • AD9102/AD9106 180 MSPS, Fully-Programmable Integrated Waveform Generators • ADIS16228 Digital Triaxial MEMS Vibration Sensor with FFT Analysis and Storage • ADP5052 Fully Integrated Quad Buck and LDO in LFCSP • ADL5511 DC to 6 GHz Envelope and TruPwr™ RMS Detector TREND • ADI will continue to release and promote New Products with Avnet to aid designers in their mission of making their new designs. • ADI’s New Products will continue to be supported by eval boards, videos, reference circuits. • Avnet will continue to promote and stock ADI’s New Products. 24 AXIOM
  24. 24. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S ADP5052 Fully Integrated Quad Buck + LDO PROBLEM SOLUTION • Today’s more advanced electronics demand higher power densities with shrinking board space and power budget. • The ADP5052 from Analog Devices is the industry’s first integrated power management solution, integrating a Quad Buck and a general-purpose LDO, to provide a five-rail system power supply (4 x buck regulators and 1 x 200 mA LDO) from a 5 or 12 V input in an LFCSP (48 lead LFCSP 7 x 7 mm). • All five regulator outputs can be fixed or adjustable via resistor programmable output voltages. –– Channel 1 and Channel 2 integrate high-side power MOSFETs and low-side MOSFET drivers. External NFETs can be used in low-side power devices to achieve an efficiency optimized solution and deliver a programmable output current of 1.2, 2.5 or 4 A. Combining Channel 1 and Channel 2 in a parallel configuration can provide a single output with up to 8 A of current. Channel 3 and Channel 4 integrate both high-side and low-side MOSFETs to deliver output current of 1.2 A. –– Channel 5: 200 mA low dropout (LDO) regulator. • The switching frequency can be programmed or synchronized to an external clock. • Individual precision-enable pins allow easier power supply sequencing or adjustable UVLO threshold. • ±1.5% output accuracy over full temperature range. • 250 kHz to 1.4 MHz adjustable switching frequency. • Always alive 5.1 V LDO supply for tiny load demand. • Ideal for small cell base stations, medical, FPGA and processor, and security and surveillance applications. • Dedicated power good pin. TREND • As designs become smaller and smaller and power budgets becoming tighter customers are turning to more integrated and efficient power solutions to help support some of the higher functioning needs such as FPGA, embedded processors and digital basebands for applications such as small cell basestations (femtocell, picocelll and macrocell) and point-to-point applications to mention just a few. Quad Buck Switching Regulator with LDO in LFCSP 1 Resistor programmable current limit (4 A, 2.5 A or 1.2 A). ADP5052 solution size only 28.3 mm x 21.2 mm. AVNET ELECTRONICS MARKETING 25
  25. 25. AXIOM MANUFACTURER PRODUCTS SOLUTIONS isoPower® Integrated, Isolated DC/DC Converters PROBLEM • esigns that need isolated data often need isolated power but lack the board space D to do both in a cost effective manner. SOLUTION • The chip-scale transformers of Analog Devices’ proprietary iCoupler ® technology not only isolate data, they can also be used to create isolated DC/DC converters integrated in a single package with data isolation – saving board space, reducing component count and lowering overall solution cost. • Ideal for the following appications: power supply start-up bias and gate drives, isolated sensor interfaces, industrial PLCs and RS-232 transceivers. • Customers looking for options to large, bulky and expensive isolated DC/DC modules. EVAL-ADUMQSEBZ $25 value • Discrete solutions including optocouplers take up area, reduce reliability and take time to design. TREND Visit axiom_anaisopower and register to qualify for one of three boards: EVAL-ADUM5010EBZ $59 value EVAL-ADuM5211EBZ $69 value Device 2.5 kVrms 3.75 kVrms Channel Directionality 10 K OEM Price ADuM5010 X 0 $1.40 ADuM5210 X 2/0 $2.10 ADuM5211 X 1/1 $2.10 ADuM5212 X 0/2 $2.10 ADuM6010 X 0 $2.02 ADuM6210 X 2/0 $3.04 ADuM6211 X 1/1 $3.04 ADuM6212 X 0/2 $3.04 26 AXIOM
  26. 26. TWO NEW FAMILIES OF LOW-POWER, HIGH-CURRENT DENSITY POWER MANAGEMENT ICs REDUCE COMPONENT COUNT AND BOARD AREA WHILE IMPROVING EFFICIENCY Renesas Electronics offers a complete portfolio of Power Management Solutions for MCUs, SOCs, FPGAs and embedded systems. Key Features J Compact design J 2 or 4 channels J Integrated LDO J Low power The Simple DC/DC family (RAA230xx) offers one or three PWM channels with switching frequency up to 2MHz and currents up to 3A, and one ultra-low power LDO for added efficiency and flexibility. Simple DC/DC Lineup Products RAA230211 RAA230212 RAA230213 RAA230214 Ch 2 Input Voltage (V) Circuit ch1: DC/DC (Stepdown) 3.0 5.5 ch2: LDO RAA230215 RAA230401 RAA230402 RAA230403 RAA230404 RAA230405 4 RAA230406 ch1, ch3, ch4: DC/DC (Stepdown) 2.5 5.5 ch2: LDO RAA230407 RAA230408 Output Current Output Voltage (V) 1.8 (ch1, 2) 2.7 (ch1, 2) 3.0 (ch1, 2) 3.3 (ch1, 2) Adj.1 (different voltage can be set between ch1, ch2) 1.8 (ch1, 2) / 3.3 (ch3) / 1.2 or Adj.1) (ch4) 2.5 (ch1, 2) / 3.3 (ch3) / 1.2 or Adj. (ch4) 3.0 (ch 1,2) / 3.3 (ch3) / 1.2 or Adj. (ch4) 3.3 (ch1,2) / 3.3 (ch3) / 1.2 or Adj. (ch4) 1.8 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4) 2.5 (ch1, 2) / Adj. (ch3) / 1.2 or Adj. (ch4) 3.0 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4) 3.3 (ch1,2) / Adj. (ch3) / 1.2 or Adj. (ch4) Input Voltage Simple DC/DC 16V Package Sequence Ultra Low Power Mode ch1: 3A 20-pin 6.4 x 6.5mm HTSSOP Yes Yes (LDO) – Yes (Low power mode by freq. change) – Ultra Small Package – Light Load Mode – High Efficiency – High Power Density Simple DC/DC 3V – Compact Design – 2 or 4 Channels – Integrated LDO – Low Power 2.5V 3A 2 Channel Evaluation Board Simple DC/DC Efficiency (2ch) ch1: 0.5A ch2: 0.1A ch3: 1.5A ch4: 1.5A 32-pin 5x5mm VQFN or 32-pin 9 x9mm TQFP Outside2 4 Channel Evaluation Board Simple DC/DC Efficiency (4ch) Adj. (ch1,2,3) / 1.2 or Adj. (ch4) RAA230409 1) Adjustable (by using external resistors) 2) Control ON/OFF of each channel by external signal mini-POL The mini-POL family (RAA20770X) achieves the industry‘s highest level of miniaturization and power density (up to 1.4 A/mm2) with six products with currents up to 15A. mini-POL Lineup Part Name Features RAA207700 No LDO RAA207703 Built-in 5V LDO RAA207701 No LDO RAA207704 Built-in 5V LDO RAA207702 No LDO RAA207705 Built-in 5V LDO MAX Current 15A 10A 5A 15A Output Current – ch2: 0.5A Low Power Mode mini-POL 5.5V Input Voltage 3V to 16V* 5.5V to 16V** 3V to 16V* 5.5V to 16V** 3V to 16V* 5.5V to 16V** Key Features J Power density up to 1.4 A/mm2 J Wafer-level chip-size package (WLCSP) J Light load efficiency for long battery life J Integrated LDO version available Package mini-POL Efficiency CSP 35-pin 2.67 mm x 3.87 mm CSP 30-pin 2.67 mm x 3.37 mm CSP 20-pin 2.67 mm x 2.37 mm mini-POL Evaluation Baord * Separate 5V supply needed. ** With internal LDO, 4.5V to 16V with separate 5V supply. Learn more at
  27. 27. AXIOM MANUFACTURER PRODUCTS SOLUTIONS MBC300 Medical AC-to-DC Converter PROBLEM • Medical equipment designers require a high quality AC-to-DC converter with high convection rating to minimize fan use. • The power supply must also operate with high efficiency to reduce size and minimize temperatures in the system. • In addition, the converter must be able to meet the latest Emission and Safety Agency standards for medical equipment. SOLUTION • Power One’s MBC series of efficient medical equipment open-frame power supplies utilizes a universal 90-264 Vac input range with active power factor correction (PFC) and 250 W of output power. • The MBC300 converter features: –– –– –– –– –– –– –– TREND 300 W with air, 200 W convection rated. Small 3 x 5 x 1.5 inch size. 2 x MOPP safety spacing. EN60601-1 3rd edition certifications. Inhibit signal to improve efficiencies and minimize system temperatures. Auxiliary outputs of 5 Vdc @ 2 A and 12 Vdc @ 0.5 A for flexibility. EMI to level be for both conducted and radiated emissions • Convection rating is critical to eliminate fans with reduced system reliability and induced noise. • Small footprints allow designers to increase system functionality so that they can provide a superior product to their customers. • Meeting the latest Safety certifications reduce end system design and certification time, which allows customers to get to market faster. • Reduced emissions meet system qualification standards. ABC150 Industrial AC-to-DC Converter PROBLEM • Industrial product designers face myriad applications that require an economically priced, compact power supply that provides fast prototyping. • Charging system requirements demand a power supply that is flexible in meeting various output voltages, as well as difficult EMI and Safety standards. SOLUTION • Power One’s ABC Series of open-frame power supplies, with its wide universal 90-264 Vac input range and high power density, is available from 40 up to 400 W of output power and a variety of single and multiple output voltages. • The ABC150 converter features: –– –– –– –– –– –– TREND 150 W with air, 110 W convection rated. Tiny 2 x 4 x 1.3 inch fits the smallest applications. EN60950-1 2nd edition meets latest Safety standards. Auxiliary 12 Vdc @ 0.5 A for fan or peripheral devices. EMI to level B for both radiated and conducted emissions. Stocking available through Avnet Electronics Marketing. • Technology advancements require power conversion devices to be as small as possible. • Reduced system airflow, with a preference towards no moving air. • System designers require power flexibility with system design. 28 AXIOM
  28. 28. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S HFE Power Supply Series PROBLEM • Designers needing high wattage power supplies (10 kW+) often turn to power supplies designed for high volume server applications because of their low cost. • Industrial equipment has longer product life cycles than datacom equipment, leading to potential end of life notices on power supplies when the original datacom customers change architecture. • The life cycle for industrial products tends to be around 15 years, compared to 7 years for a server product. SOLUTION • The HFE series of 1600 and 2500 W power supplies are designed as standard catalog products and are not based on the needs of a high volume OEM. • The AC-DC HFEs are rack mounted and are paralleled to provide up to 10 kW in a 1U 19” enclosure. • The units are available in 12, 24, 32 or 48 V outputs and have a similar set of mechanical and electrical specifications across the range. TREND • Rack mounted plug in power supplies are now being used in many industrial applications due to their power density, availability and attractive pricing. This solution also gives redundant operation so a power supply failure will not shut down a system, and the failed module can be replaced while the system is still in use. • Users are enhancing their systems with the added features of the HFE series, including PMBus communications, which allows remote read back and programming. RFE Power Supply Series PROBLEM • Engineers like the power density of the HFE series, but often only need lower power levels (1600-2500 W). As the HFE series is plug in, the user has to either design a back plane or utilize a full 19” enclosure, which takes up system space. • In addition, many 19” racks are not configurable to support different output voltages. SOLUTION • TDK-Lambda introduced the RFE1600 series of stand-alone AC-DC 1600 W power supplies, available with output voltages of 12, 24, 32 and 48 V. • These power supplies are based on the rack mounted HFE, but in place of the connector, the RFE has bus bars and terminal blocks for the output and input connectors, allowing regular cable harnesses to be used. TREND • Bulky standalone industrial power supplies are now being replaced with smaller, higher efficiency units based on the latest technologies. Two or three units can be easily deployed in the system, mounted close to the load to minimize cable drops. AVNET ELECTRONICS MARKETING 29
  29. 29. AXIOM MANUFACTURER PRODUCTS SOLUTIONS Integrated Dual-Coil Relay Drivers Simplify Smart-Meter Design PROBLEM • Smart meters connect the household to the smart grid, which in turn optimizes the production, distribution and usage of energy. • Smart e-meters need the ability to remotely disconnect the loads from the grid to better manage the system during high demand usage or during a shortage of power sources. The function must be tolerant of the noisy environment of the smart meter as it is directly connected to the incoming feed from the grid and controlled by a micro-controller. The best solutions integrate service disconnect switches with accurate input filter timing, XOR input protection, the maximum output pulse-width to protect the relay, and the configurability of either following the input or to always put out a pre-defined maximum pulse width. SOLUTION • Fairchild Semiconductor’s FAN3240 and FAN3241 solutions are designed to drive dual-coil polarized latching relays that connect and disconnect power in smart electronic meters, solar inverter, energy generation, and building and home control applications. • 8 to 60 V operating range for use with 12, 24 or 48 V relays. • Strong DC current to break through welded contacts without using external switches. • Accurate timer pulses regardless of input pulse variations and glitches. –– Accurate input filter time (factory adjustable) and XOR input protection. –– Accurate maximum output pulse width (factory adjustable). • Output can follow input width or give maximum limit (mode factory adjustable). • Internal thermal shutdown protection for switches. • Single bias voltage design for the chip allows isolated and non-isolated designs. • Inputs compatible with 3.3 or 5 V square-wave logic signals. • Enable pin for operational flexibility. • Small overall PCB footprint TREND • With a smaller overall PCB footprint, the integrated FAN3240 and FAN3241 solutions save space and cost as well as add timers and protection functions to make the relay driving solutions safer and smarter in noisy environments. Part Number Minimum Input Pulse Maximum Output Pulse Output Pulse Width Package FAN3240TMX 15 ms 150 ms Follows input width SO-8L NB FAN3241TMX 1 ms 30 ms Always maximum SO-8L NB FAN324xTMX Factory adjustable (0.12 ms – 20 ms) Factory adjustable (1 ms – 350 ms) Factory adjustable between two modes SO-8L NB Relays Driving Smart Meter Disconnect Switch 30 AXIOM
  30. 30. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S Freescale Xtrinsic Sensors PROBLEM SOLUTION • Design engineers need a sensing solution with local computing and sensors management capability in an open, easy-to-use architecture. • Freescale’s Xtrinsic MMA955xL and Xtrinsic FXLC95000L are breakthrough, intelligent, motion-sensing devices that integrate a 3-axis MEMS accelerometer and a 32-bit ColdFire ® MCU. • Xtrinsic family features include: –– 1.71 to 1.89 V supply voltage –– Output data rate (ODR) 488 Hz –– ±2 g, 4 g, 8 g configurable dynamic ranges available –– 14/12/10/8 bit resolution available • The user’s firmware, together with the hardware device, can make system-level decisions required for sophisticated applications, such as gesture recognition, pedometer, and e-compass tilt compensation and calibration. • The embedded microcontroller allows sensor integration, initialization, calibration, data compensation, and computation functions to be added to the platform, thereby offloading those functions from the host processor. • Total system power consumption is significantly reduced because the application processor stays powered down for longer periods of time. • The Xtrinsic MMA955xL family offers 16 K Flash, 2 K RAM. • The Xtrinsic FXLC95000L offers 128 K Flash, 16 K RAM. • The Xtrinsic FXLC95000CL hardware is user-programmable to create an intelligent high-precision, flexible, motion-sensing platform, and the device is programmed and configured with CodeWarrior Development Studio for Microcontroller (Eclipse IDE). • The FXLC95000 platform can act as an intelligent sensing hub and a highly configurable decision engine. Using the Master I2C or SPI module, the FXLC95000 platform can manage secondary sensors such as pressure sensors, magnetometers and gyroscopes. TREND • The marketplace trend is to fuse sensor capabilities with other functions creating combination devices, solutions that have not been seen before. FXLC95000CL Xtrinsic Intelligent Motion Sensing Platform INT_I BKGD/MS Interrupt Controller 16 KB ROM 16 KB RAM 3-Axis Accelerometer Transducer ColdFire V1 Reduced Product Platform 128 KB Flash Memory Drive circuit SSB SCLK MOSI MISO SDAO SCL0 ADC C2V Temperature Sensor Trim SPI Slave Interface Control and Mailbox Register Set RESET B 8 System Integration Module 8 SP_SCR[PS] Freescale Technology 16 8 16 8 8 I2C Slave Interface External Clock Domain 16 Analog Front End Temperature Sensor Internal Clock Domain 16 8 8 16 Flash Controller I2C Master SDA1, SCL1 SPI Master MOSI, MISO SCLK2, SSB2 2 x 8 Port Control 16-bit Modulo Timer Programmable Delay Block Two-Channel TPM Clock Module (16 MHz) RGPIO [15:0] AVNET ELECTRONICS MARKETING 31
  31. 31. AXIOM MANUFACTURER PRODUCTS SOLUTIONS OSLON® Square LED PROBLEM • Powerful, narrow color binning with perfect color quality LEDs are needed for indoor lighting applications. • Compact, environmentally friendly LEDs that feature low thermal resistance are desired for portable lighting designs. • Robust, long lasting and energy efficient LEDs are required for outdoor lighting applications. SOLUTION • OSLON ® Square from OSRAM Opto Semiconductors provides the most compact, high-power LED in its class. • With a maximum driving current of 1.5 A and a broad range of color rendering indexes, the OSLON Square product family is perfect for a large variety of indoor, outdoor and portable applications. • OSLON Square is available in different color temperatures from warm white 2400 to cool white 6500 K. OSRAM’s fine white binning system covers the area of 2-step MacAdams ellipse, ensuring perfect color consistency for all lighting applications. • With a footprint of only 3 x 3 mm, the OSLON Square is one of the smallest high-power LEDs on the market. • White reflective layer of the package allows more useable lumens in the application. • With robust thermal management, lifetimes of more than 50,000 hours are easily obtained – even at high driving currents. OSLON® SSL LED PROBLEM SOLUTION • ompact and energy efficient LEDs are needed for indoor, outdoor and architectural lighting applications. C • The compact OSLON® SSL 80 and 150 offer beam angles optimized for use with lenses and reflectors. This revolutionary feature, combined with a broad range of color temperatures and color rendering indexes, opens up new possibilities for cost-effective, sustainable lighting solutions. • A full color portfolio is available — from Deep Blue 450 nm to Hyper-Red 645 nm. • With a footprint of only 3 x 3 mm, this is one of the smallest high-power lensed LEDs on the market today, enabling compact LED arrays and maximizing flux over area. • OSLON SSL 80 and 150 can be driven up to 1000 mA while OSRAM’s latest power chip technology remains efficient even at the highest drive currents. • A low thermal resistance of 7 K/W ensures cool running and a highly efficient product. • A lifetime of more than 50,000 hours is easily obtainable, even at high drive currents. 32 AXIOM
  32. 32. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S SFH 7770 E6 Two-in-One Digital Sensor PROBLEM SOLUTION • s portable end products like smartphones continue to evolve, engineers need a sensor that measures reflections A to detect horizontal and vertical movements, enabling users to simply flick through photos, or other usable features, without even touching the display. • The SFH 7770 E6 from OSRAM Opto Semiconductors combines the functions of a digital ambient light sensor with those of a digital proximity sensor. • The ambient light sensor, which closely matches the sensitivity of the human eye, features high accuracy from 0.03 – 65,000 lx, a low temperature coefficient of photosensitivity, insensitivity to 50-60 Hz flickering and excellent linearity. • The device determines the ambient brightness, detects the presence of an object nearby (with horizontal or vertical movements) or whether the object is moving closer or further away. • By using two or three IR LEDs instead of one, it is possible to detect gestures with measurements repeated within milliseconds. • The proximity sensor is capable of driving a maximum of three IR LEDs with up to 200 mA and features a detection range of up to 300 mm. In addition, it is optimized for 850 nm emitters and is insensitive to ambient light. • With the high sensitivity of the SFH 7770 E6, the entire cover can now be made of colored plastic with only minimal loss of sensor detection range. As a result, there is no longer any need for transparent windows. • SFH 7770 E6 is contained in a small 2.8 x 2.8 x 0.9 mm package. • I²C bus interface features 100 kbit/s, 400 kbit/s and 3.4 Mbit/s. • Measurement modes are programmable as stand-by, triggered and free-running. • There is very low power consumption in stand-by mode. TREND • As the trend to increase user functionality in mobile phones, cameras, PDAs, notebooks, consumer products and automotive applications continue to expand and include new features like touch free control, OSRAM Opto Semiconductors is at the forefront of the industry by providing the extremely small size and low power consumption SFH 7770 E6 two-in-one proximity and ambient light sensor. AVNET ELECTRONICS MARKETING 33
  33. 33. AXIOM MANUFACTURER PRODUCTS SOLUTIONS Automotive Grade Non-Synchronous Boost Controller PROBLEM • Automotive battery voltage distribution is subject to significant voltage transient events in Start/Stop applications. • To maintain reliable operation, point of load DC/DC regulators have minimum input voltage requirements. Boost voltage converters are commonly used in front of DC/DC regulators to convert a low input voltage to a higher voltage. SOLUTION • ON Semiconductor’s NCV8876 factory adjustable non-synchronous boost controller with automatic wake up and shutdown function supplies a minimum output voltage during start-stop conditions to counteract any sag in a vehicle’s battery voltage. • The device is enabled when the supply voltage drops below 7.3 V, then boost operation is initiated once this voltage goes under 6.8 V. • Protection features include cycle-by-cycle current limiting, thermal shutdown (with a 170 °C threshold) and hiccupmode over-current protection. • Targeted for the automotive segment, the device is ideal for instrument clusters, radios, navigation systems, engine control units and lighting applications. • The AEC qualified device, available in an SOIC-8 package, offers a simple design solution offering reduction of component count and design cost. • Support tools include NCV887601 Evaluation Board, Excel-based design aids and design verification using PSPICE large signal average behavioral modeling. • Features: –– –– –– –– –– –– –– 34 AXIOM 2 V to 45 V operation. Logic output switch monitoring. -40 to 150 °C operation. ±2.0% output voltage accuracy over temperature. Low shutdown current (11 µA typ.). Adjustable current limit, internal soft-start and slope compensation. Peak current mode control.
  34. 34. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S 600 V Series IGBTs PROBLEM SOLUTION • Power electronics designers are looking to improve the reliability and efficiency in applications like welding, solar inverters, UPS, induction heating and SMPS. • The revolutionary V series of IGBTs from STMicroelectronics guarantees a max junction temperature (Tj max) of 175 ˚C, increasing device reliability and lifetime. • Featuring tail-less turn off waveforms and co-packing a very fast freewheeling diode tailored for very low Eon, the new V series offers several benefits in high switching frequency applications demanding superior efficiency, such as welding, solar inverters, induction heating, UPS, PFC and SMPS. • This series has been designed to meet the requirements for higher efficiency and reliability in power. Additional features include: –– –– –– –– –– –– Positive VCE(sat) temperature coefficient allow safer paralleling operation. Very high speed switching. Low saturation voltage: VCE(sat) = 1.85 V (typ.) @ IC = ICN. Low thermal resistance. Co-packed tailored diode. UL Recognized TO-220F package. Ultra Low Dropout Linear Regulators PROBLEM SOLUTION • Providing multiple voltages needed for many small and portable applications while maintaining high efficiency in a minimum space with the fewest external components. • ST’s low dropout (LDO) regulators offer an optimal combination of low dropout voltage, low quiescent current, fast transient response, low noise and good ripple rejection. • Depending on the application requirements, LDOs have been optimized for: –– –– –– –– Ultra low dropout down to 50 mV Low quiescent current down to 1.4 µA Low noise/high PSRR down to 6.3 µVRMS Miniature packages offer space savings to minimize board space. Devices ion these packages are particularly well suited for smart phones, health and fitness monitoring, Bluetooth and remote and other small portable electronic devices. mains External adapter or internal AC/DC DC buses 24 V 12 V 5V DC-DC POST-REGULATION LDOs, Switching Controllers or Converters 5V 3.3 V 1.2 V ... ... 2.5 V .... .... s ASIC s Amp o Audi µC ory Mem RF ... AVNET ELECTRONICS MARKETING 35
  35. 35. AXIOM MANUFACTURER PRODUCTS SOLUTIONS SuperJunction MOSFETs Deliver Ultra-Low RDS(ON) PROBLEM • Increases in output power result in efficiency loss and temperature increases. • Space limitation due to downsizing and density growth. SOLUTION • Toshiba’s DTMOS IV SuperJunction MOSFETs deliver a combination of high conduction and switching efficiency, small die area and high breakdown voltage that conventional devices cannot achieve. • Small packages sizes provide designers with greater flexibility to optimize energy efficiency and power density. • Optimized switching characteristics: easy to control, low EMI. • Wide on-resistance R DS(ON) 0.9 to 0.018 Ω max range. • Improved RDS(ON) x area. • Packages include: DPAK, IPAK, D2PAK, 8 x 8 mm DFN, I2PAK, TO-220, TO-220SIS, TO-247, TO-3P(N) and TO-3P(L). 600 V DTMOS IV SUPERJUNCTION MOSFETS Current Rating (A) RDS(ON) max. (Ω) DPAK (TO-252) IPAK (TO-253) 5.4 0.9 TK5P60W TK5Q60W TK5A60W 10.5 380 6.2 0.75 – 0.82 TK6P60W (0.82 Ω) TK6Q60W (0.82 Ω) TK6A60W 12 390 7 0.6 TK7P60W TK7Q60W TK7A60W 13 490 8 0.5 TK8P60W TK8Q60W TK8A60W 16 530 I2PAK (TO-262) D2PAK (TO-263) 8 x 8 mm DFN TO-220 TO-220SIS TO-3P (N) TO-247 TO-3P (L) Ciss Qg (VDS=300 V) (nC) (pF) 9.8 0.38 – 0.43 TK10P60W TK10Q60W (0.43 Ω) (0.43 Ω) TK10V60W TK10E60W TK10A60W 20 700 11.5 0.3 – 0.34 TK12P60W TK12Q60W (0.34 Ω) (0.34 Ω) TK12V60W TK12E60W TK12A60W TK12J60W 25 890 15.8 0.19 TK16C60W TK16G60W TK16V60W TK16E60W TK16A60W TK16J60W TK16N60W 38 1350 TK20V60W TK20E60W TK20A60W TK20J60W TK20N60W (0.17 Ω) 50 1700 20 0.1550.17 30.8 0.088– 0.098 TK31V60W TK31E60W TK31A60W TK31J60W TK31N60W (0.098 Ω) 86 3000 38.8 0.065 TK39A60W TK39J60W TK39N60W 110 4100 61.8 0.04 TK62J60W TK62N60W 180 6500 100 0.018 TK100L60W 360 15000 36 AXIOM TK20C60W TK20G60W
  36. 36. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S Redefining the Figure of Merit (FOM) for MOSFETs in Power Conversion Applications PROBLEM • Switch mode power supplies (SMPS) in many applications need to work with higher efficiency levels as power and current levels increase. SOLUTION • Vishay Siliconix E Series SuperJunction MOSFETs offer better conduction and switching losses compared to different high-volume production silicon technology on the market today. The E Series achieves this new standard of performance by minimizing gate charge (Q g), gate-to-source charge (Q gs), gate-to-drain charge (Q gd), output capacitance/charge (C oss/Q oss) and on-resistance (Ron) in a way optimized for power conversion applications. TREND • There is a move away from a one-size-fits-all FOM for MOSFETs used in power conversion applications. Instead of just looking at on-resistance multiplied by typical gate charge, the new trend is toward more topology-specific analysis that takes into account additional specifications of the device, such as gate-to-source charge (Q gs), gate-to-drain charge (Q gd), and output capacitance/charge (C oss/Q oss). These do a better job of representing the actual losses that occur within the MOSFET. More than ever, device development continues to be a multi-variable balancing of specifications to achieve optimum performance. Isolated, High-Voltage MOSFET Driver with Integrated Fast Turn-Off Circuit PROBLEM Mechanical relays suffer from contact wear and • are highly susceptible to shock and vibration. • suffer from contact bounce. • offer limited electrical and noise isolation. • generate electrical and acoustic noise. SOLUTION PCB implemented MOSFET based SSR solutions from Vishay • remove contacts and moving parts. • eliminate noise generating arcing. • offer up to 5000 V or isolation in an SOP4 package. TREND • Industrial controls and appliances are finding mechanical relays to be less and less compatible for the increasing demand of high reliability, small package sizes and more intelligent solutions for low power microcontrollerbased systems. The VOM1271 allows engineers to design highly reliable solid state solutions in extremely small packages that can be driven directly from microcontroller-based digital circuits, all while providing an extremely high level of isolation and decoupling from lethal voltages and noise. AVNET ELECTRONICS MARKETING 37
  37. 37. AXIOM MANUFACTURER PRODUCTS SOLUTIONS Power Passives by Design PROBLEM • Power supplies and convertors require high performance from reduced size components. Associated Series: SOLUTION • NIC’s use of alternative and new technologies focus upon the best-in-performance of low ESR capacitors and power inductors. NPIS • Polymer hybrid construction NSPE series of aluminum electrolytic capacitors provide 10X improvement in ESR and impedance at low operating temperatures, compared to standard liquid construction, while offering higher voltage ratings and lower leakage current benefits when compared to solid polymer construction. NSPE NPIM • Transition to automated component production process in multilayer, shielded and metal composite inductors provides high current performance with lower unit costs. • Offering over 20 different case size variations, down to 2 x 2 mm footprints, NIC’s power inductor offering provides power supply designers with a wide range of component solutions for any power design. TREND • Continued trend towards increased performance in the smallest component sizes will increase use of alternative technologies to meet the demands of power designs. • Development of expanded hybrid capacitor technologies focus on meeting the requirements of next-generation power designs. Automated component production assembly allows reduction in component size, while at the same time increasing performance, quality, and in the end, reducing costs. BU YOU ILD R OW PA N PEFO SSIVE R K I T T M A N CE EM.AV ODAY! NET.C A XIOM OM/ _ NICPR OTECT ION Over Voltage Current Protection PROBLEM • ower designs place increased demand upon over-current and over-voltage circuit P protection components. SOLUTION • Expanded circuit protection product offerings from NIC Components include safety agency approved SMT fuses and leaded (LDD) varistors. • The newly released NVR series of large disc metal oxide varistors (MOVs) provide fast-acting absorption of transient energy on 50 or 60 Hz power circuits, with rated operation to 1000 VAC. • Recently added NFVC series of SMT chip fuses feature fast-acting, high inrush withstanding performance in industry-standard 6125 (2410) case sizes, with current ratings up to 20 A and voltage ratings up to 125 VDC. • Both series are UL safety agency (USA Canada) listed. TREND • Rapid development for mobile devices is driving demand for high-performance circuit protection into smaller component sizes. • For AC circuit applications, standard format LDD MOVs continue to see requirements to provide high energy transient absorption at low cost. • While fast acting chip fuses are seen as commodity type product with strong requirements and a wide range of design-in, engineers can expect to see an increase in trend towards resettable fuse technologies verses traditional one-time use components. 38 AXIOM Associated Series: NVR NFVC NCT
  38. 38. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S Transient Current Suppressor (TCS™) High-Speed Protectors (HSPs) PROBLEM • Excessive voltage levels across TVS diodes limit their effectiveness in protecting vulnerable integrated circuits (ICs). Associated Products: • Keeping the cost of the protection circuit low while also providing adequate protection without degrading performance is a significant challenge. CDSOD323-T03C CDSOD323-T05 CDSOS323-T05C SOLUTION • The Bourns family of dual channel TCS HSPs work in conjunction with an overvoltage protection device and the ESD structure of an IC to minimize the energy absorbed by the IC during a surge event. ™ • The voltage level at the IC input/output (IO) is determined by the response of its ESD structure to the limited current through the TCS HSP rather than the response of the TVS diode to the surge event. CDSOD323-T05LC CDSOT23-S2004 SM51589L PT61020L • Each device in the TCS HSP family provides up to 40 V of isolation between the overvoltage protector and the IO of the protected IC. This allows the use of low-cost rail clamp diodes to the supply and ground instead of higher cost TVS diodes. • The low series impedance of the TCS HSP has a minimal impact on performance. The series resistance between channels is well-matched. • Use the links below to access the Bourns® TCS™ HSP training video, as well as two informative white papers: • • • 20 18 PEAK SURGE CURRENT (A) 16 14 “Ideal” diode response of a TVS Diode with the TCS™ HSP device at the interface requiring protection 12 10 8 1/2 TCS-DL004-XXX-WH To Connector CDSOD323-T05C IDEAL DIODE (5.5 V) NEW APPROACH 6 4 Interface Requiring Protection 2 CDSOD323-T05C Overvoltage Device 0 0 2 4 6 8 10 12 14 PEAK VOLTAGE AT INTERFACE (V) 16 18 20 The above graph compares the surge response of a TVS diode and Bourns’ new approach, which uses a TCS™ HSP device/overvoltage protection device combination, to that of an ideal diode. Note, when the new approach is used, the voltage at the protected interface is almost independent of the peak surge current and the voltage across the overvoltage device. AVNET ELECTRONICS MARKETING 39
  39. 39. AXIOM MANUFACTURER PRODUCTS SOLUTIONS L-Series Circuit Breaker PROBLEM • Datacom systems require maximum circuit protection to ensure continued data transmission services. • Power distribution units and rack systems are limited to confined spaces, and traditional circuit breakers take up too much valuable space and are sensitive to ambient temperature. • Circuit protection products must comply with all industry regulations. SOLUTION • The L-Series high-performance, compact hydraulic-magnetic circuit breaker from Carling provides up to 240 VAC ratings protection regardless of ambient temperature. • Its low profile design is ideally suited for the rigors and confined spaces found in today’s telecom/datacom power distribution units and rack systems. • With TUV certification, EN60934 approval and as a UL 489 Listed circuit breaker, the L-series exceeds current worldwide telecom and datacenter capability requirements. TREND • The telecom/datacom industry will continue to require optimum circuit protection in innovative packages that promote spatial reduction objectives while improving performance. MS-Series Circuit Breaker PROBLEM • Military grade power generation and communication equipment requires reliable circuit protection products that ensure continuous equipment performance and functionality. • Harsh environments demand sealed and temperature stable circuit protection. • Military communication equipment requires rugged, high performance components in a compact design. SOLUTION • The MS-Series was designed in accordance with the requirements of MIL-PRF-39019F, MIL-PRF-55629 and MIL STD 202, making it the best compact COTS circuit protection product available. • The MS-Series is an environmentally sealed, hydraulic/magnetic circuit breaker that withstands extreme temperatures, shock and vibration. • Its compact size and reliability make it ideal for ruggedized communication equipment and other mission critical equipment. TREND • The military equipment industry requires reliable, high-performance components that withstand the most demanding operation environments. • COTS (Commercial-Off-The-Shelf) products offer cost-effective solutions while meeting military requirements. 40 AXIOM
  40. 40. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S Power Triple Lock Connectors PROBLEM SOLUTION Associated Products: • Improved connector mating and latching provides performance assurance for improved power and signal applications. Universal MATE-N-LOK Connectors • TE Connectivity’s power triple lock connectors provide cap and plug mating confirmation with audible latch. Commercial MATE-N-LOK Connectors • These connectors eliminate wire snags with ribs designed to protect the latch. • They ensure connector system engagement in high vibration applications with optional Connector Position Assurance (CPA). Power Key Connectors • And, they confirm contacts are fully seated while providing an added measure against contact backout with optional Terminal Position Assurance (TPA). TREND Economy Power II Connectors • Increased reliability and functionality, security and ease of use. Economy Power (EP) II 2.5 Connectors PROBLEM Associated Products: • Reduced connector size helps deliver power to a PC board when space is at a premium. SOLUTION • Connectors with Terminal Position Assurance (TPA) plug housings and molded TPA devices are needed to help prevent terminal back-out. AMP CT Connectors Signal Double Lock Connectors • EP II and EP 2.5 connectors help prevent terminal back-out with TPA terminal plug housings and molded TPA devices. AMP Power Series Connectors • A positive external locking latch helps ensure complete system mating. • Anti-snag feature helps prevent wire from snagging on the latch. • Polarization tabs help prevent mismating with corresponding header. • These connectors are designed to mate with current designs and newly designed EP headers, allowing inventory standardization. TREND • Support mechanical and electrical reliability with a positive locking latch and TPA device AVNET ELECTRONICS MARKETING 41
  41. 41. AXIOM MANUFACTURER PRODUCTS SOLUTIONS MULTI-BEAM XLE Connectors PROBLEM • Industry demands for higher power capabilities in the same amount of PCB space. • Connectors often feature limited power. SOLUTION • MULTI-BEAM XLE connectors provide for greater angular mis-alignment between mating connectors. • Their hot-pluggable contacts allow for high power rated at 75 A/low power rated at 40 A – that’s 35% more power over other connectors in the same space. Associated Products: MULTIGIG RT 2-R Connectors Mid-Range PCB Relays ET Power Connectors • The connectors feature sequenced contacts for mate-first-break-last operation. • They achieve up to 500 mating cycles with high durability design. • Meet industry reliability requirements for telecom equipment. • Dissipate heat with ventilated housings. • Provide lower contact resistance with redundant contact points. • Accommodate a variety of configurations with a modular tooling platform design. TREND • Higher current carrying capability in the same connector footprint. IMPACT Connectors PROBLEM SOLUTION • Difficulty in finding connectors that are designed for increased speed and density to help meet future system upgrades and next generation requirements of data networking and telecommunications equipment. • TE Connectivity’s IMPACT connectors feature a unique broad-edge coupled design that utilizes low impedance, localized ground return path in an optimized differential pair array. • Differential pairs are tightly coupled and surrounded by ground structures to isolate the pairs, reducing crosstalk and increasing overall bandwidth performance with minimal performance variance. • The backplane header construction on IMPACT connectors offers air pockets selectively placed in the header floor to isolate signal pairs. TREND 42 AXIOM • Offers value add approach of speed, density, cost and long term reliability for next generation application requirements Associated Products: STRADA Mesa Mezzanine Connectors ICCON Power Connectors Mini SAS HD Interconnect
  42. 42. M A N U FA C T U R E R P R O D U C T S S O L U T I O N S Motorman Connectors PROBLEM SOLUTION • How to integrate communication, signal and power transmission of locally controlled motors within a single compact rectangular connector, all while providing significant space savings in comparison with traditional rectangular industrial connectors. • Motorman connectors feature the compact size of a traditional rectangular connector and hybrid construction (power, communication, signal), and integrate the needed communication, signal and power transmission within a single connector. • All signals are bundled into one interface which means only one cable for the customer. • Offers space for two 4-pin Ethernet sockets, five power sockets, five signal sockets and one protection earth contact. Associated Products: Universal MATE-N-LOK Connectors HTS Heavy Duty Connectors Ter minal Blocks  Strips Dynamic Series Connectors • Spacious, side internal access assists easy and safe configuration. TREND • Reduction of space and costs due to integration of communication, signal and power transmission of locally controlled motors within a single compact rectangular connector. Power PCB RTX Relays PROBLEM SOLUTION • Finding a relay that is specifically developed to meet the requirements of IEC 60669 with up to 16 A/250 V AC rated load. The key requirement of this standard is the ability to switch high inrush currents from lighting loads. Associated Products: • The RTX relay not only solves the above problem, but it also features high inrush capability due to its tungsten pre-make contact and silver tin oxide carry/break contact. Mini IO Connectors • 16 A/250 VAC make and break capacity according to IEC 60699-1. • Energy efficient with the bi-stable (lathing) DC coil system utilizing one or two coils. • Reinforced insulation helps provide additional safety protection. Corcom FB Series Filters Universal MATE-N-LOK Connectors CoolSplice Connectors • Small product dimensions of 29.1 x 12.7 x 16 mm to meet industry standard. • RoHS compliancy and cadmium free design meet market requirements. TREND • Saves energy with bi-stable DC coil system. • Provides additional safety protection with reinforced insulation. AVNET ELECTRONICS MARKETING 43