2. AM can now enable
âŚcontrol of the overall geometry of a part, which could
be made up of a truss network, where each truss has an
optimized thickness and could have an individually
controllable microstructure or material.
⢠But we canât efficiently:
⢠Design structures this complex in CAD
⢠Predict what our machines will do when we print
a new geometry we havenât printed before
⢠Predict the differences between printing the
same part in two different locations/orientations
⢠Predict how different process parameters affect
accuracy, microstructure and part performance
Courtesy David Rosen, Georgia Tech
3. Typical Process Variation
Effects
⢠2 mm wall made from
Inconel 625
â XZ section showing
effects of scan pattern
variation on
microstructure
⢠Identical geometries in
the same build give
different distortions
4. (left) Prior beta interfaces ~100 Îźm
wide show the hatch spacing
(right) Prior beta interfaces not visible
in the bottom layers: microstructure
changes orientation each layer.
(3DSIM predicted values for angular
distortion is ~12-19Âş, which are in the
observed range.)
⢠Horizontal Tensile Specimens in
the top (last to be processed) layers
⢠Horizontal Tensile Specimens
in the bottom (lowest) layers
4
200 X
Microstructural Variations
due to Orientation in Ti6/4
1000 X
200X Bottom, θleast =12°
200X Intermediate layers
θmax =19°
5. 5
200X Bottom
Horizontal samples
200X Bottom
Vertical samples
⢠Identical process parameters
for identical parts
in an identical layer,
in the same build,
for the same material, but
in different orientations and locations,
result in
different microstructures and properties
⢠Less residual stress in Vertical samples ď
columnar grains
⢠High residual stress in Horizontal samples ď
martensitic streaks
Microstructural Variations
due to Orientation in Ti6/4
6. The âSupportâ Problem in
Metal Laser Sintering
⢠Supports today are
placed based upon
geometric relationships
and user experience
â Extra supports increases
post-processing costs
â Supports can ruin key
features
â Under-supporting regions
causes blade crashes
7. The Current Situation
⢠We Need An Accurate 3D âPrint Previewâ
â Based upon Real Process Parameters & Scan Vectors
â To Give us Accurate Geometry Prediction
⢠Including Distortion and Where we Need Supports
â Internal Microstructure Predictions
â Properties & Performance Predictions
⢠But what we have today isâŚ
â A CAD file and a âPreviewâ of 2D slices of a build
â A lot of experimental data to tell us what âmightâ or
âprobablyâ will happen under different situations
8. Whatâs Wrong with
Existing Simulation Tools?
⢠Manufacturing simulations of the past were
developed with the idea that we can take a long
time to get the right answer because weâll make a
lot of the same thing over and overâŚ
â Most are based upon 20-30 year-old formulations
⢠They are not optimized for multi-physics, multi-
scale modeling or compatible with GPUs.
⢠They donât have a unified computational
infrastructure that enables you to solve all parts of
the problem in one package.
9. ⢠Process simulations that are faster than an AM machine
builds a part
â Predict residual stress and distortion so we know how to place
supports and how to pre-distort our CAD model
⢠Material simulations which can predict crystal level
details and the resulting mechanical properties
⢠Lightning fast solutions on GPU-based platforms
⢠We simulate only what we need to get a practical
answer as FAST as possible
Our Modeling Vision
10. Our Overall Approach
⢠Most Modeling Tools Link
Process Structure Properties
⢠Weâve developed two Separate Solvers:
â Process Solver gives â Process Structure
⢠Thermal history, distortion, residual stress, crystal structureâŚ
â Material Solver gives â Structure Properties
⢠Based upon the crystal structure, what are the properties
12. Benefits of our Dynamic
Meshing Strategy
⢠Demonstrated to be 66x faster than
ANSYS for solving AM problems
⢠ANSYS assembles matrices and calculates
nodal connectivity (stiffness matrix) every
time-step
⢠Our âintelligent assemblyâ of matrices
solves an identical problem with no
recalculation of nodal connectivity
⢠Fine-scale mesh developed for a
particular energy source and/or machine
with no hanging nodes or improperly
skewed meshes
13. Our Core 3DSIM Code
⢠Formulated for moving
energy source problems
⢠Multi-scale mesh fits
any size geometry
â Nano-manufacturing to
meters of manufacturing
⢠Fits whatever energy
source size you choose
â Applicable to ânâ scales
of refinement
14. Top Surface Domain in the x direction
TopSurfaceDomainintheydirection
Thermal contours at arbitary time steps during 1st layer of Laser scanning
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
x 10
-3
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
x 10
-3
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
Unstable thermal contours at turns
Stable thermal
contours
Scan
Strategy
Simulation Results: Example
Thermal History
15. Effect of Powder Packing
Density on Melt Pool Geometry
(10%, 20%, 30%, 40%, 50%, 60%)
18. How difficult is the
Problem We Want to Model?
⢠Finite Element Modeling of a commercial full-scale build:
â 200mmx200mmx200mm powder bed size
â 10 microseconds time steps to capture melting
â 20 micron layer thickness
â 10 micron resolution small-scale mesh (2 elements/layer)
⢠108 elements per layer, 1012 elements per build if fine meshed everywhere
â 50 hours of actual laser scan time
⢠1010 total time steps
19. Time and Efficiency Comparisons
(assuming a 16 teraflops machine)
⢠BASED UPON OUR CALCULATIONS, WE PROJECT:
⢠Fine Gridding (using ANSYS or similar method) = 5.7 10 years
⢠ANSYS (with multi-scale) = 8.9 10 years (89 billion years)
⢠3DSIM (with multi-scale) = 1.3 10 years (1.3 billion years)
â It will be much faster in C++, but not fast enough..
⢠This is why modeling experts only simulate simplified versions of the
problem
⢠We decided to keep trying to find faster ways to do the entire
problemâŚ
21. Eigensolver
⢠Strategy
â Compute 3-4 layers using 3DSIM Multi-Scale FEA
â Use the Eigensolver when more than 3-4 layers away from the melt pool
⢠Advantages
â Time to get the SAME ANSWER is orders of magnitude less
⢠Disadvantages
â Mode computations are hard to derive for new problems, it is only
applicable to physics problems for which weâve derived eigenmodal
solutions
⢠Our Eigensolver is tested and works well for thermal and decoupled
stress/strain problems, but we are still testing our approach for the Material
(crystal plasticity) Eigensolver
22. Comparing Thermal
Eigensolver Answers to FEA
0 1000 2000 3000 4000 5000
0
0.2
0.4
0.6
0.8
1
Linearthermalfieldsolution
(normalized)
# of nodal points
Modal Reconstruction
Finite Element Solution
Solution match for each node when comparing 3DSIM FEA against the
3DSIM Eigensolver for a point heat source
23. Banded Vectorization
Number Sorting
Eliminate Meaningless Computation
7 additively
manufactured
layers
Top surface Boundary condition Optimal tolerance FLOPS
point force 1000 7.00%
center line parallel to X axis 2511.8864 4.00%
Line along one of the diagonal 2511.8864 5.00%
Area force 63.09 40.00%
24. Periodic and Higher
Order Boundary
Conditions (PHOBC)
⢠We have derived and are testing an eigenmodal
approach to:
â Identify Symmetry & 1st to 4th Order Periodicity in
Boundary Conditions BEFORE calculating FEA for a
New Layer
⢠Calculation is Based upon Prior Layer Histories and the
Scanning Parameters that will be used for upcoming layer
⢠If periodicity occurs AND a prior answer is
known⌠then ⌠feed forward the correct answer
into appropriate portions of the layer
â Calculate any unknown answers using FEA
25. Time and Efficiency Comparisons
(assuming 16 teraflops machine)
⢠Fine Gridding (using ANSYS or similar method) = 5.7 10 years
⢠ANSYS (with multi-scale) = 8.9 10 years (89 billion years)
⢠3DSIM (with multi-scale) = 1.3 10 years (1.3 billion years)
⢠3DSIM(âŚ+Z direction Eigenmodes after 4 layers) = 208 years
⢠3DSIM(âŚ+Banded vectorization) = 22.1 years
⢠3DSIM(âŚ+PHOBC) = 22.1 10 years~0.2 hours
ď Typical Desktop Computer will do 3DSIM (âŚ+PHOBC)=166 days
ď Thatâs why we buy $20k-$30k GPU computersâŚ
ď US Fastest GPU Computer (TITAN)
ď 3DSIM (âŚ+Z Direction Eigenmodes)=54 days
ď 3DSIM (âŚ+Banded vectorization)=6 days
ď 3DSIM (âŚ+PHOBC)=720 Âľs
26. What are we working on
Currently?
⢠Converting all our Matlab and Fortran code into
C++ and C# code to run on a CUDA GPU
⢠Running sensitivity analyses on each module as it
is developed
⢠Validating each module against
â Analytical solutions
â Other software tools
â Our software prior to turning on each new module
â Experiments
27. Our Products
⢠Full-blown âEverything 3DSIM Offersâ Products:
â Simulating problem sets for others as consultancy
â Cloud-based solutions on a per-use basis
â Licenses for combined hardware/software platforms
⢠Specialty Software Tools:
â Distortion prediction and compensation tool
â Optimum support structure tool
â Future machine control software
â âŚand moreâŚ
28. ⢠An accurate â3D Print Previewâ is becoming a reality
⢠We have developed a modeling infrastructure with never-
before-seen modeling efficiencies
â Combines âupgradedâ FEA with Eigensolvers to solve for every
point in space within a machine for every time step to achieve
highly accurate solutions
⢠3DSIM tools will:
â Provide guidance to machine users on how to best optimize their
existing machines and build layouts
â Enable rapid materials insertion, optimization & qualification
â Provide a prediction of part performance before building a part
â Make possible the design and manufacture of better AM machines
Conclusions &
Significance
31. 3DSIM Software has Been Developed
and/or is Being Validated Via the
Following Projects
Involving Both 3DSIM and the University of Louisville
⢠Development of Distortion Prediction and Compensation Methods for Metal Powder-
Bed AM â America Makes, 2014-2015
⢠Predicting Residual Stress in Metallic Additive Manufacturing â STFC EU consortium,
2014-2015
⢠Further Development of 3DSIM Models â DARPA (anticipated) 2014-2015
⢠Modeling of DMLS Ti6/4 Residual Stress & Supports -- AFRL/MLPC, 2012-2015
Based Research at the University of Louisville
⢠Modeling of DMLS In625 -- NIST, 2013-2015
⢠Rapid Qualification of DMLS/EBM Ti6/4 -- America Makes, 2013-2015
⢠Modeling of DMLS Ti6/4 Arbitrary Powders âAFRL/MLPC, 2013
⢠Modeling of Friction Stir AM -- NSF, 2012-2015
⢠Modeling & Closed Loop Control of UC -- ONR, 2011-2014
⢠Multi-Material UC â ONR, 2007-2011
33. Arbitrary Powders in Metal
Laser Sintering
⢠Takes simple powder tests as inputs
â Powder density, morphology & chemistry
⢠Uses empirical relationships to convert powder
tests into important processing variables
â Powder bed absorptivity, thermal conductivity, etc.
⢠Runs our simulation algorithms near previously
determined âgoodâ operating parameters for a
well-known powder type to find equivalent
âgoodâ parameters for the new powder
36. Approach for Polymers
⢠Find and derive algorithms for the Material &
Process Solvers
â Mathematical relationships which correlate thermal
history to % crystallinity, spherulite morphology, chain
entanglement, molecular weight, % porosity, etc.
â Correlate microstructural features to mechanical
properties mathematically and via experiments
37. Our Estimation Method
⢠Total # of time steps=50 hours=
â
1.8 10
⢠Total Number of Layers ( )= 10
⢠Time step/layer
Total # of time steps
1.8 10
⢠Total number of thermal degrees of freedom in a
layer( )= 4 10
38. Theoretical Computational
complexity (in flops)
⢠Uses Forward substitution for complexity (This is the
expensive term backward is one order less.)
⢠# of flops= â =
⢠Since N>>>1, N~N+1
⢠# of flops=
⢠Flop Speed per second=F
⢠Total time=