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Karimanal modeling course_sneakpeek

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This is an overview of the short course to be taught by Kamal Karimanal at the 2013 ECTC conference (May 28th).

This is an overview of the short course to be taught by Kamal Karimanal at the 2013 ECTC conference (May 28th).

Published in: Technology, Business

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  • 1. Kamal KarimanalCielution LLCThermal and Mechanical SimulationTechniques - An Introductory Coursefor 3D IC Enablement ProfessionalsA Sneak Peek(c) Cielution LLC
  • 2. Intended AudienceThermal and Mechanical Simulation Experts withinterest applicability to 3D IC TechnologyEngineering Professionals engaged in enabling 3DIC productsSystem on Chip (SOC) Architects and designprofessionals interested in Thermo-Mechanicallyaware methodology implementationCustomer support / supply chain technical interfaceprofessionals who are interested in collaborativeEngineering.(c) Cielution LLC
  • 3. Motivation for Thermo-Mechanical Simulation3D IC roadmap has introduces brand newThermal and Mechanical challenges.Test Chip & Test vehicle programs effective, butexpensive• May not offer information for root cause identificationThermo Mechanical modeling is an effective filterbefore finalizing test vehicle design and testingplans.Hence, knowledge about Engineering Simulationtools, methodologies and capabilities willempower modeling professionals as well asother technologists enabling 3D IC technology.(c) Cielution LLC
  • 4. (c) Cielution LLCTemperature Distribution on the chips
  • 5. (c) Cielution LLCTemperature Distribution on the chipsTemperature increased by 16% due to hot spot proximity
  • 6. CielSpot: High Level Workflow(c) Cielution LLCCielSpot™Stack InfoPackageInfoMaterial PropertiesSolve inCommercialThermal SolverAccess to Model in the commercial solver’s native formatAutomated Geometry,Meshing & Problem SetupIntelligent Solver ControlsAutomated Thermal Snapshots& Temperature dataCompact ThermalModel
  • 7. Demo of CielSpot CTM for QuickEstimation of TemperatureDistribution(c) Cielution LLC
  • 8. Validation ResultsFEA (ANSYS) Prediction of TemperatureDistribution on Memory-ICielSpot-CTM Prediction ofTemperature Distribution on Memory-I(c) Cielution LLC
  • 9. CielSpot CTM ValidationPredicted Temperature Rise_vs. Error-1.50%-1.00%-0.50%0.00%0.50%1.00%1.50%50 55 60 65 70 75Predicted TemperatureError%(c) Cielution LLC
  • 10. Mechanical Stress Modeling of3D ICs(c) Cielution LLC
  • 11. 3D Assembly Flow I: D2D, Chip Stack First, CUF(c) Cielution LLCStep 1: Mem Stack to Logic(@ reflow Temperature 230 C)Step 2: Capillary UnderfillStep 3: Chip Stack to Substrate(@ reflow Temperature 230 C)Step 4: Capillary Underfill Step 5: Overmolding or Lid Attach
  • 12. Underfilling Options(c) Cielution LLCCapillary Underfill (CUF)No Flow UnderfillMolded Underfill (Vacuum Assist)Copper Nails + ThermoCompressionNo Need to Underfill
  • 13. Flow I & Flow II substrate warpage on attach to Chipstack, overmolding & Cool down(c) Cielution LLCT=20 Deg C resultsNo Warpage at attach temperature since intrinsic stresses at attachwere not considered
  • 14. -10001002003004005000 5000 10000 15000 20000 25000 30000 35000 40000Chart TitleLogic_die_warpage_after_stack_attach Substrate_warpage_after_stack_attachSub_warpage_after_full_assemblyFlow I Consolidated Room Temperature WarpageEvolution(c) Cielution LLCT=20 Deg C results
  • 15. Thermo-Mechanical Model Supply Chain Gaps?Materials CharacterizationCharacterization• Materials• Failure Metrics & CriteriaUnderfill Characterizationneeds:• Non Linear MaterialPropertieso Modulus, CTE, Poisson’s Ratioo Temperaturedependenceo Viscoelasticity?(c) Cielution LLC01234567890 50 100 150 200RelaxationModulus(GPa)Temperature (Deg C)5 sec120 SecTgTgPark & FegerECTC, 2008Huang et al., ElectronicMaterials &Packaging, 2002
  • 16. CielMech™ for Thermo-Mechanical ModelingAutomation(c) Cielution LLC
  • 17. Stress Drop off in the vicinity of TSV(c) Cielution LLC0.00E+005.00E+071.00E+081.50E+082.00E+082.50E+083.00E+080.00E+00 5.00E-06 1.00E-05 1.50E-05 2.00E-05 2.50E-05 3.00E-05 3.50E-05AxialStress(Pa)Radial Distance from TSV peripheryChart Title5 um Dia10 um Dia Via
  • 18. % Mobility Change Plot from FEA(c) Cielution LLCn-type (electron Carriers)100 Plane6
  • 19. Failure ModesBarrier/Liner Delamination• Ryu et al. StressInducedDelamination Of Through SiliconVia Structures, AIP, conferenceLow K and Metal Failure Dueto Copper Pumpout• Vogel et al, Nonlinear copperbehavior of TSV for 3D-IC-integration and cracking risksduring BEoL-built-up(c) Cielution LLCShear modeLiner/Barrier Delamination
  • 20. Why Fracture Mechanics?Stress at any location is only an indicator of loadtransferred.It doesn’t tell us if the material will fail under agiven stress level• So, a somewhat justifiable use of stress estimate areas follows:o for apple to apple comparison of the maximum stresses asa function of on design and process parameterso Ensuring equivalent stresses to be below Yield stress(assuming yield as the critical criteria)• So long as singularity and mesh dependence effectsare eliminated in the stress estimates beingcompared.Fracture mechanics modeling addresses theseissues(c) Cielution LLC
  • 21. Questions? Comments?Kamal Karimanalkamal@cielution.comOnly a sneak peek…Register to ECTC 2013 PDC to attend the full Course:http://www.ectc.net/program/63ECTC-FINAL.pdf(c) Cielution LLC

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