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Kamal Karimanal
Cielution LLC
Assembly Process Modeling
Webinar Sneak Peak
Webinar Details
This is a Sneak Peak to Cielution Webinar on
June 3rd and 4th
Registration Link:
• https://global.gotowebinar.com/webinars.tmpl#we
binar-3464645060432088577_tip
Define Stack up
Define Interconnects
Packaging Options
Substrate Build up
Define Process Sequence in ANSYS
Step 1 RDL
Deposition
Step 2 Interposer
Substrate Attach
Step 3 Estimate
Warpage
Step 4 Chip
Attach
Step 5 Estimate
Warpage
Step 6 Lid Attach
Automatic & Intelligent Meshing &
Problem set up by CielMech &
Solution using ANSYS
Evaluate Results
Evaluate & Optimize Design/Process
More Details
CielMech is Available to Customers
Attend Webinar or Contact Cielution For
More details
• Kamal Karimanal
• 408 898 2435
• info@cielution.com

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