Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Inc281-54261512_3
1. [INC 281 MULTIDISCIPLINARY WORKSHOP WEEKLY REPORT] May 2, 2012
Name-Surname Mr. Tipakorn Sumateenarumit <tum>
Student ID. 54261512
Group Name Conthai
tum54261512,rin54261504,golf54261520,chai54261522,
Engineering Team
dew53219012,golf53211804,banz53211811,champ53211819,
Members
june53211831,bank53211833,
Product Design
P’dukdik, P’ake, P’L, P’friend
Team Members
Weekly Progress
This week, I have circuit design by program for PCB. When I have circuit design finish, I have
printed circuit to transparencies; negative. First, I have cleaned PCB by washing of dishes. Next, I
cut dry film more PCB. After, I striped dry film and I have got stuck to PCB. After then, I have stick
negative transparencies and I brought irradiate of 20 minute. When I have irradiation finish, I
decorate broken lines of PCB and I clear PCB by Sodium Carbonate. Next, I cut copper by pickling
PCB and I perforate on PCB.
Figure 1. Dry film finish
Figure 2. Decorate broken lines of PCB
Engineering Analysis
Strong Point
- I can circuit design by program.
- I can irradiate on PCB.
Weak Point
- Dry film not clarity.
Next Week Job
- Finish rice cooking project
- Sent report of rice cooking project
- Present project with TOSHIBA.
Department of Control System and Instrumentation Engineering
KING MONGKUT’s UNIVERSITY OF TECHNOLOGY THONBURI
![[INC 281 MULTIDISCIPLINARY WORKSHOP WEEKLY REPORT] May 2, 2012
Name-Surname Mr. Tipakorn Sumateenarumit <tum>
Student ID. 54261512
Group Name Conthai
tum54261512,rin54261504,golf54261520,chai54261522,
Engineering Team
dew53219012,golf53211804,banz53211811,champ53211819,
Members
june53211831,bank53211833,
Product Design
P’dukdik, P’ake, P’L, P’friend
Team Members
Weekly Progress
This week, I have circuit design by program for PCB. When I have circuit design finish, I have
printed circuit to transparencies; negative. First, I have cleaned PCB by washing of dishes. Next, I
cut dry film more PCB. After, I striped dry film and I have got stuck to PCB. After then, I have stick
negative transparencies and I brought irradiate of 20 minute. When I have irradiation finish, I
decorate broken lines of PCB and I clear PCB by Sodium Carbonate. Next, I cut copper by pickling
PCB and I perforate on PCB.
Figure 1. Dry film finish
Figure 2. Decorate broken lines of PCB
Engineering Analysis
Strong Point
- I can circuit design by program.
- I can irradiate on PCB.
Weak Point
- Dry film not clarity.
Next Week Job
- Finish rice cooking project
- Sent report of rice cooking project
- Present project with TOSHIBA.
Department of Control System and Instrumentation Engineering
KING MONGKUT’s UNIVERSITY OF TECHNOLOGY THONBURI](https://image.slidesharecdn.com/inc281-542615123-120501172507-phpapp02/85/Inc281-54261512_3-1-320.jpg)
