2.  BGA means a Ball Grid Array.
 Invented in the early 1990.
 BGA packages are used to permanently mount devices such as
Microprocessors or Processors or CPU.
 Provide more interconnection pins than can be put on dual in-line or flat
package
 It is use for various applications such as hand held electronics to
computing to automotive environments.

3.  Small package area.
 Greater functions and more pins.
 More Reliable.
 Good conductivity and low overall cost.
 Self - Centerize while PCB puddle welding, easy to put on tin.
 Compared with TSOP, BGA is much smaller and better at radiating and
conducting electricity.

4.  What is the Re-works ?

5.  BGA Re-works process as following Steps :
Step 1:
BGA Removal from circuit board:
Step 2:
Circuit board site cleaning:
Step 3:
BGA Reballing :
Step 4:
Component Attach/Re-soldering:

6. Away from inflammable and explosives.
Away from water and other liquids
Ventilated, dry place.
Less dust.
No heavy objects on the controlling box.
 Not affected by airflow of air conditioner, heater or ventilator.

7. Use a power supply with little fluctuations in voltage
Fluctuation : 220V +-10.
Frequency fluctuation : 50Hz+-3

8.  It is used to replace the faulty north bridge IC or south bridge IC.
 It is also use to repair Mobile, Laptop, Servers, Desktop boards.
 It is safely removed any IC from motherboard without damaging any
thing.
 Upgradation of on board or motherboard functionality.