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The production of multilayer printed on the tin plating protection technology
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PCBA The production of multilayer printed on the tin plating protection technology
Abstract: The production of multilayer printed tin plating protection techniques described in detail. Pure tin
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electroplating process, processes and quality control, product quality causes and the measures taken were brief.
Tel: 0086-0755-27348087
Fax: 0086-0755-27348087 Keywords: Multilayer; plating; tin-protection technology; process quality control
E-mail: Sales@raypcb.com Key words: TQ153.1 +3 Document code: A Article ID :1001 -3474 (2001) 04-0144-03
MSN: Raypcb@hotmail.com
Multilayer PCB production process, and always inseparable from the protection of materials technology. Including
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2. Multilayer PCB production process, and always inseparable from the protection of materials technology. Including
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the protection of the production process of electroplating technology, polymer composite materials protection
Equipment technologies and products produced after the non-metallic materials protection technologies. Multilayer PCB with
customer continuous improvement of quality requirements, plus many factors such as environmental protection and
economic considerations, multi-layer PCB production technology to promote innovation and improvement. In the
production of multilayer printed circuit graphics plated tin plated copper layer / pure tin protection technology, is one
example.
So before the peptone used in non-acidic additives pewter fluoroborate plating technology, the drawback is the use
of boric acid stannous fluoride, lead fluoride and fluoride boric acid and other drugs, causing difficulties in removal
PTH pre-scrubbing machine
of coatings, in addition to the operator"s health and adverse treatment. Pure tin plating currently used technology to
follow the green needs of the times (no chlorine, no bromine, lead), not only to overcome these shortcomings, the
copper coating has played a very good protection. This paper describes the technology, based on pure tin plating
process for quality control, product quality causes and the measures taken were brief.
The best value scope of the project
W (H2SO4) is 98% 30-70mL / L 50mL / L
Acid tin additive A (Solfotech Part A) 3-7mL / L 5mL / L
Operating Humidity 15-30 ° C
Operating time 1-2min
1, process
Good graphics boards have been produced on the board of acid to oil → → → two countercurrent washing
washing scanning micro-pitting → → → two countercurrent washing scan washed copper impregnated → → →
scan washing → tinned copper impregnated → → → two counter-current washing tin plates under
2, detailed process
2.1 tin prepreg
2.1.1 Pre-Immersion tin composition and operating conditions
2.1.2 slot open tin cylinder method prepreg
To join the Bangang distilled water, then slowly dip added 15L of 98% mass fraction of sulfuric acid stirring after
cooling, add 1.5L Sulfotech Part A, mix well, add distilled water to a 300L stirred evenly, you can use.
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3. 2.1.3 Tin prepreg maintenance and control of liquid tank
100m2 sheet for each treatment need to add 1L of sulfuric acid and 100mL Sulfotech Part A. Whenever the board
1500m2 bath treatment, the replacement of Bath.
2.2 Tin
2.2.1 tin plating bath composition and operating conditions
2.2.2 Method tin cylinder open slot
To join the Bangang distilled water, then slowly added 98L of 98% mass fraction of sulfuric acid stirring after
cooling, add 40kg Tin Salt 235 cooled to 25 ° C, add 76 L Sulfotech Part A, 15.2 L Solfotech Part B, 30.4 L STH
Additive Sulfolyt, add distilled water to a level, circular (in 1.5A/dm2 electrolysis 2 AH / L).
2.2.3 tin tank maintenance and control of liquid
Tin and sulfuric acid before the analysis work. 100m2 sheet for each treatment need to add 11L sulfuric acid, 600 g
Tin Salt 235,600 mLSulfotech Part A, 800 mL Sulfotech Part B, 750mL STH Additive Sulfolyt. Automatically
added to the system by 200AH Add 56mL Sulfotech Part A.
Solution must be Hull cell test a week to observe the adjustment Sulfotech Part A, Sulfotech Part B.
The best value scope of the project
Sn2 + 20-30 mL / L 24mL / L
W (H2SO4) is 98% 160-185mL / L 175mL / L
Acid tin additive A (Sulfotech Part A) 30-60mL / L 40mL / L
Acid tin additives STH (STH Additive Sulfolyt) 30-80mL / L 40mL / L
Acid tin additive B (Sulfotech Part B) 15-25mL / L 20mL / L
Operating temperature 18-25 ° C 22 ° C
Cathode current density 1.3-2.ASD 1.7ASD
3, processes and quality control
In addition to tin and tin prepreg slot slot to control the concentration of the main liquid monitoring, the need to
complete the process tin layer thickness measured regularly or irregularly. Because only enough tin coating thickness
to the subsequent alkaline etching, the copper coating play a very good protection, to avoid unnecessary quality
defects, increase economic efficiency. Following is a brief two tin coating thickness on the determination of quality
assurance techniques.
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4. 3.1 metallographic sectioning thickness on the determination of tin
Using a dedicated test board under normal production of tin plating operations. For each flight bar top 10 board test
folder in tin plating after taking 1,5,10 three test panels, each four corners and center of the board to take a total of
5 bits. Then do metallographic sections, special sections in the optical microscope, the tin layer thickness
measurements in Table 1.
Table 1 tin tin plating thickness measurement and evaluation capacity of perforated plating
Plate No. 1 # 2 # 3 # 4 # 5 # 6 # 7 # 8 # 9 # 10 #
The average cell wall thickness of the coating of tin d / μm 8.6 8.9 9.1 7.9 8.1 8.9
10.0 8.9 7.6
8.1 7.9 8.9 8.1 7.9 9.1
The average thickness of the coating of tin plate surface d / μm 8.1 9.4 9.4 8.1 8.4 8.9
10.0 8.9 7.6
8.6 8.1 8.9 8.6 8.1 9.4
Capacity of perforated tin plating electroplating 24.1 24.6 24.6 24.6 25.4 24.6
25.4 25.4 25.4
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5. 24.6 24.6 14.6 24.6 25.4 23.9
3.2 X-ray thickness gauges for measuring thickness of the tin layer
Using a dedicated test board under normal production of tin plating operations. Pakistan top folder for each flight
test board 10, in the end of plating tin on each plate of the A, B surface by X-ray thickness measurement, taken on
each board, in the next 9 bits. The results in Table 2.
Location 12,345,678,910
A 8.76 8.81 8.89 8.99 8.27 9.14 9.17 9.02 8.89 9.02
B 9.02 8.89 8.92 8.89 9.04 8.89 8.76 8.64 8.94 9.14
C 9.35 9.14 9.27 9.02 8.26 8.41 8.64 8.51 8.66 8.89
D 8.64 8.76 8.64 8.76 9.14 8.94 8.89 8.79 8.51 8.69
E 9.91 9.78 9.68 9353 8.89 9.02 8.66 8.51 8.38 8.89
F 8.89 8.92 8.76 8.64 8.51 8.38 8.43 8.38 8.38 8.59
G 8351 8.53 8.48 8.64 8.76 8364 8.51 8.38 8.38 8.59
H 8.64 8.56 8.38 8.51 8.64 8.76 8.69 8.53 8.64 8.76
I 8.76 8.41 8.51 8.66 8.76 8.84 8.76 8.89 8.09 9.27
Similarly, the test plate surface tin layer thickness distribution on the same method can be carried out by X-ray
thickness measurement.
4 causes of quality problems and the corresponding measures
4.1 high potential black coating there is no clear demarcation
Because measures
Low metal concentrations increased metal concentration 1 ~ 30g / L
Liquid temperature is low to raise the temperature 25 ° C ± 3 ° C
Increase the swing to swing less than O. 4 ~ 0.8m/min
Current density is too high current density not higher than 2.0 ASD
Part A low concentration (<20mL / L) increased the concentration of Part A (30-80L / L)
4.2 high potential layer of coarse black and crystal clear boundaries
Because measures
Serious use dry carbon core filter pollution, or carbon treatment 6-10g / L charcoal powder, the processing time 4-
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6. 6h
4.3 The poor coverage of low-potential
Because measures
Re-preparation of high chloride concentration bath
High concentrations of nitrate cylinder drag
STH particularly in low-carbon treatment to improve the STH concentration of 80mL / L
High metal concentrations reduced metal concentrations 15 ~ 30g / L
High temperature liquid reduces the liquid temperature 25 ° C ± 3 ° C
Carbon treatment of organic pollutants
4.4 The distribution of poor coating
Because measures
High metal concentration range of metal concentration 15 ~ 30g / L
Low concentration of sulfuric acid concentration 180 ~ 200g / L
Part A Part A low concentration increased the concentration of 30 ~ 80mL / L
Anode contacts and to improve access to poor inspection results
Cathode contacts and to improve access to poor inspection results
4.5 anode bubbles
Because measures
Passivation of the anode surface (anode current density is too high) calculated anodic area (<2.0ASD)
High concentrations of metals and dilute sulfuric acid bath
Anode bags blocking inspection, cleaning or updating the anode bag
4.6 Etching of copper exposed after the hole angle
Because measures
Poor crystal coating, mainly dry pollution or carbon filters use carbon-core processing
4.7 The dry film coating side was light and thin or
Because measures
Dry in the bath checks occur within the phenomenon of dry dialysis process, in particular, exposure time,
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7. development and cleansing process
5 Conclusions
The production of multilayer PCB production process long, complex process, the quality factors much more difficult
to control a manufacturing industry. Through the above description, multi-layer PCB used in the production of the
line graphics copper electroplating pure tin plating layer of protection technology, is effective, as long as the process
is always in control and normal operation, while strengthening tin thickness of the monitoring, we will be able to
guarantee product quality.
RayMing PCB - www.raypcb.com
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