Nano Surface Generation:Introduction
• Definition: Creation/modification of surfaces
with features in 1–100 nm scale
• Importance in optics, electronics, biomedical,
and energy sectors
• High surface-to-volume ratio leads to unique
physical and chemical properties
2.
Principles of NanoSurface Engineering
• Manipulation of surface energy and atomic-
level roughness
• Top-down vs Bottom-up approaches for nano-
scale fabrication
• Role of characterization: AFM, SEM, TEM for
nanoscale verification
3.
Applications of NanoSurface Generation
• Superhydrophobic coatings for self-cleaning
surfaces
• Low-friction tribological coatings for
aerospace components
• Photonic crystals and anti-reflective layers in
optics
• Bio-compatible surfaces for implants and drug
delivery
4.
Types of NanoSurface Generation:
Mechanical/Physical
• Ultra-precision machining: diamond turning,
nano grinding
• Laser texturing with femtosecond lasers for
LIPSS
• Focused Ion Beam (FIB) milling for sub-10 nm
patterning
5.
Types: Chemical &Electrochemical Methods
• Atomic Layer Deposition (ALD) for angstrom-
level thin films
• Chemical Vapor Deposition (CVD) for
conformal coatings
• Electrochemical polishing for atomic flatness
on metals
6.
Types: Lithographic Techniques
•Photolithography and Electron Beam
Lithography (EBL)
• Nanoimprint Lithography for low-cost, high-
volume patterning
7.
Ductile Mode ofMachining: Concept
• Material removal in a plastic/ductile state
rather than brittle fracture
• Critical depth of cut determines ductile vs
brittle removal
8.
Mechanism of DuctileMode
• High compressive stresses and localized
heating promote plastic flow
• Tool penetrates below critical depth,
suppressing crack formation
• Material flows plastically to form a continuous
chip
9.
Conditions Favoring DuctileMode
• Depth of cut < critical depth
• small rake angle
• High cutting speed to generate localized
heating
• Temperature control to lower yield strength
10.
Applications of DuctileMode Machining
• Optical components: lenses and mirrors
• Microfluidic devices and MEMS structures
• Ultra-precision finishing of semiconductor
wafers
11.
Diamond Turning: Introduction
•Ultra-precision machining using single-crystal
diamond tools
• Achieves nanometer-level accuracy and
optical surface finish
• Critical for freeform optics and semiconductor
components
12.
Machine Architecture
• Air-bearingspindle for near-zero runout
• Hydrostatic slideways for vibration isolation
• Laser interferometers for nanometer
positioning feedback
