5. In
,
a
binary
photomask
will
have
two
tones:
1) the
tone
inside
the
closed
geometry
and
2) the
tone
outside
the
closed
geometry.
Inside
the
geometry
Outside
the
geometry
One
tone
will
be
clear
(
),
the
other
opaque
(dark).
6. The
posi7ve
space
is
clear
Clear
geometry
/
Dark
field
The
nega7ve
space
is
clear
Dark
geometry
/
Clear
field
Two
Possible
Mask
Tones
7. The
on
the
photoblank
is
exposed
to
light
in
the
shape
of
the
mask
design
paNern.
For
,
the
resist
exposed
to
light
becomes
soluble
and
easily
removed,
allowing
the
chrome
to
be
etched
with
.
For
,
the
exposed
resist
becomes
insoluble,
allowing
the
chrome
to
be
etched
.
8. Mask
data
is
This
image
is
wriNen
in
the
chrome
surface
of
the
mask.
The
mask
is
used
in
the
exposure
tool.
The
designer
draws
the
physical
layout
of
how
the
device
should
appear
on
the
wafer.
(mirrored)
The
design
paNern
must
be
mirrored
to
write
the
mask
.
Same
orienta7on
9. Mask
Titles
are
Mask
7tles
are
typically
(mirrored)
when
viewed
in
the
maskshop.
These
same
mask
7tles
will
be
(not
mirrored)
when
viewed
in
the
wafer
fab.
Right-‐Reading
Text
11.
is
the
process
of
conver7ng
complex
polygons
in
the
design
data
into
simpler
shapes
in
a
raster
or
vector
format
used
by
the
mask
writers.
12. -‐
During
mask
fabrica7on,
the
clear
area
a
wriNen
a
liNle
smaller
than
it
was
designed.
This
is
known
as
sizing
or
biasing
the
data.
The
sized
data
is
pushed
back
to
the
original
size
when
the
chrome
is
etched.