Christof Landesberger and Ira Balaj presented a 3-hour tutorial at the IEEE 3DIC Conference in Munich on November 18, 2010 on thin wafer processing and electrostatic carrier technology. They discussed the principles of electrostatic attraction for handling semiconductor substrates, the technical concepts for mobile electrostatic carriers, and the status and future applications of e-carrier technology. Attendees were given a practical demonstration of wafer handling using mobile electrostatic carriers.