From AltiumLive 2017 Hieu Duong, Head of Dialexa’s Hardware Department, presents on "The Four Pillars of PCB Design for Creating a Successful IoT Product"

1. AltiumLive 2017:
ANNUAL PCB
DESIGN SUMMIT
Presenter
Hieu Duong
San Diego, CA
October 3rd-4th, 2017
The Four Pillars of PCB Design for
Creating a Successful IoT Product

2. The Four Pillars of PCB Design for
Creating a Successful IoT Product

3. ROLES:
• Electrical Engineer
• Head of Dialexa’s Hardware Department
RESPONSIBILITIES:
• Hardware Research
• Technology Evaluation
• Product Architecture
• PCB Design
• Certification & Production Planning
About Myself

4. About Dialexa
Dialexa is the technology research, design, &
creation firm, where we design and create custom
hardware and software products and platforms.
www.dialexa.com

5. The Four Pillars of PCB Design For
Creating a Successful IoT Product
Connectivity
1
Time to Market
Form Factor
Cost
2
3
4

6. IoT Devices on the Market
• Nest Cam
• Ecobee4 Thermostat
• Philips Hue
• Fitbit Smart Watch
• Ring Smart Video Doorbell

7. Form Factor Challenges for IoT Devices
• Lightweight
• Miniaturized
• Ergonomic
• Ruggedized
AMBER ALERT GPS CHILD TRACKER

8. Best Practices: MCAD & ECAD Collaboration
• Become best friends with your Mechanical
Engineers
• Verify potential mechanical interferences
• Ensure enough structural support
• Perform thermal/airflow simulations
• Leverage built-in collaboration tools

9. Multiple Board Designs
• Reduce horizontal footprint
• Utilize rigid-flex designs
• Conformal antennas

10. Additional Resources
1. THE FUTURE OF ELECTROMECHANICAL DESIGN:
• Machine Design
• http://www.machinedesign.com/archive/future-electromechanical-design
2. THE REAL COST OF FAILED DESIGN COLLABORATION:
• EDN Network
• http://www.edn.com/electronics-blogs/all-aboard-/4439959/The-real-costs-of-failed-
design-collaboration

11. Connectivity
Time to Market
Form Factor
Cost
1
3
4
2
The Four Pillars of PCB Design For
Creating a Successful IoT Product

12. Connectivity Challenges
• Technologies
• Power
Consumption
• Compatibility
• Certifications

13. Types of IoT Connectivity
http://postscapes2.webhook.org/internet-of-things-
technologies

14. Best Practices: Common Layout Practices
• Power analysis
• PCB stack-up
• Grounding
• Stitching vias
• Antenna de-tuning

15. Certifications
• FCC, CE, IC
• Intentional/Unintentional Radiators
• Multiple radios
• Others: PTCRB, WEEE, etc.

16. Additional Resources
1. 5 CHALLENGES OF INTERNET OF THINGS
CONNECTIVITY:
• PubNub
• https://www.pubnub.com/blog/2014-06-17-5-challenges-of-internet-of-things-
connectivity/
2. THE 4 STAGES OF AN IOT ARCHITECTURE:
• TechBeacon
• https://techbeacon.com/4-stages-iot-architecture

17. Connectivity
Time to Market
Form Factor
Cost
1
2
4
3
The Four Pillars of PCB Design For
Creating a Successful IoT Product

18. Cost Challenges
• Research & Development
• MSRP
• Production NRE
• Certifications

19. Hardware Cost Break-Down
• Research & Development: 9 – 24 months
• MSRP: $50 - $200
• Production NRE: $30k - $70k
• Certifications: $20k - $50k

20. Best Practices: Test Early and Often
TIME INTO
DEVELOPMENT
$
MISTAKES
• Late mistakes are costly
• Pick the right architecture & technologies
• Reduce the design feedback loops

21. Design for Manufacturing & Assembly
• Engage with Contract Manufacturer as
early as you can
• Reduce the number of components
• Use standard components & common parts
among product lines
• Relax design tolerance
• Utilize plastics for structural support

22. Design for Certifications
• Start the certification process early
• Use pre-cert modules
• Design & re-used own modules
• 20cm rules for co-located
antennas
• Perform multiple certifications at
the same time

23. Additional Resources
1. CHOOSING THE BEST HARDWARE FOR YOUR NEXT IOT
PROJECT:
• IBM
• https://www.ibm.com/developerworks/library/iot-lp101-best-hardware-devices-iot-
project/index.html
2. HOW MUCH DOES IT COST TO BUILD IOT SOLUTION:
• R-Style Lab
• http://r-stylelab.com/company/blog/iot/internet-of-things-how-much-does-it-cost-to-
build-iot-solution

24. Connectivity
Time to Market
Form Factor
Cost
1
2
3
4
The Four Pillars of PCB Design For
Creating a Successful IoT Product

25. Why Improving Time to Market?
• Improved operational efficiency
• Efficient resource management
• Better market position
• Increased revenues

26. Time-to-Market Challenges
• Everyone wants to be the first
to markets
• Few weeks delay can affect
market share significantly
• Rapid-changing markets and
technologies

27. Best Practices: Avoid Mistakes
• Avoid unwanted design cycle due to mistakes
• Spending more time on planning
• Engage with vendors and test agencies early
• Know the market

28. Design for Rapid Prototyping
• Future-proof designs
• Modular designs and re-usability
• Re-used own certified modules
• Leverage existing IoT platforms

29. Additional Resources
1. THE INTERNET OF THINGS: SIZING UP THE
OPPORTUNITY:
• McKinsey
• http://www.mckinsey.com/industries/semiconductors/our-insights/the-internet-of-things-
sizing-up-the-opportunity
2. IMPROVING TIME TO MARKET:
• Arena
• https://www.arenasolutions.com/resources/articles/time-to-market/

30. Key Take-Aways
• Pick the right technologies
• MCAD & ECAD Collaboration
• DFMA
• Plan early for certifications &
manufacturing
• Leverage existing platforms and
modules
• Mistakes = time + cost
Slideshare link:
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