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The document discusses the benefits of exercise for mental health. Regular physical activity can help reduce anxiety and depression and improve mood and cognitive function. Exercise causes chemical changes in the brain that may help protect against mental illness and improve symptoms.
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The purpose of "stress" screening such as environmental stress screening (ESS) or highly accelerated stress screening (HASS) is to precipitate failures in weak or defective populations using some load (stress) condition(s) without reducing the required useful life of the product
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The purpose of "stress" screening such as environmental stress screening (ESS) or highly accelerated stress screening (HASS) is to precipitate failures in weak or defective populations using some load (stress) condition(s) without reducing the required useful life of the product
CALCE Test Services and Failure Analysis (TSFA) Laboratory
The TSFA Lab performs standard and custom tests and failure analysis services, including proprietary services that may range from a day to service year.
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Software reliability engineering has existed for over 50 years, fundamental prerequisite for virtually all modern systems. Diverse set of stakeholders requires pragmatic guidance and tools to apply software reliability models to assess real software or firmware projects during each stage of the software development lifecycle. Reliability engineers may lack software development experience. Software engineers may be unfamiliar with methods to predict software reliability. Both may have challenges acquiring data needed for the analyses.
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Biomass refers to a group of organic materials that can be used to generate electric and thermal power. Sources of biomass are: herbaceous and woody plants, agriculture and forestry wastes and residues, landfill gases, animal wastes, municipal wastes, and other organic material.
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A "m" out of "n" system is a system with "n" components which function if and only if "m" or more of the components function
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Surface mount technology (SMT) secures electronic components to printed circuit boards through soldering the leads directly to the surface rather than passing them through holes. This places more stress on the solder connections and can lead to higher failure rates compared to through-hole technology. SMT offers advantages like being able to mount components on both sides of boards and in closer proximity. However, special design considerations are needed like matching the coefficient of thermal expansion of components and boards and ensuring the soldering surfaces can withstand the temperatures of the soldering process without damage.
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Testability
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testing, whose failure rate is constant or decreasing over time. For technologies where there is adequate
field failure data, alternative methods may be used to establish the early life failure rate.
The purpose of this standard is to define a procedure for performing measurement and calculation of early
life failure rates. Projections can be used to compare reliability performance with objectives, provide line
feedback, support service cost estimates, and set product test and screen strategies to ensure that the
Early life Failure Rate meets customers' requirements.
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This document summarizes a paper that proposes a new methodology called Failure Modes, Mechanisms and Effects Analysis (FMMEA) to enhance traditional Failure Modes and Effects Analysis (FMEA). The standard FMEA process does not identify failure mechanisms or models, limiting its usefulness. FMMEA identifies high priority failure mechanisms and models to help control operational stresses and test product reliability. It was applied to an electronic circuit board assembly in an automotive underhood environment. The full paper discusses the limitations of FMEA and how identifying failure mechanisms can help with virtual qualification, root cause analysis, accelerated testing, and remaining life assessment.
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Surface mount technology (SMT) secures electronic components to printed circuit boards through soldering the leads directly to the surface rather than passing them through holes. This places more stress on the solder connections and can lead to higher failure rates compared to through-hole technology. SMT offers advantages like being able to mount components on both sides of boards and in closer proximity. However, special design considerations are needed like matching the coefficient of thermal expansion of components and boards and ensuring the soldering surfaces can withstand the temperatures of the soldering process without damage.
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Thermal cycling screens involve cycling hardware between high and low temperatures to induce failures. Method A for developing a thermal cycling profile uses a thermal survey to tailor cycle characteristics, equipment conditions, and number of cycles to the specific hardware. An ideal thermal survey involves computer modeling, constructing a test facility replica, instrumenting hardware, and performing experimental trials to establish screening parameters that achieve desired hardware temperature histories. Key parameters include temperature extremes and rates of change, dwell times at extremes, and whether hardware is powered during screening.
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The document discusses various techniques for designing products for reliability, including derating components, accelerated life testing, and reliability estimation methods. It describes how reliability modeling should guide the design process from the beginning to design out potential failure mechanisms. The goal is to develop longer-lived products through an iterative approach of testing, analyzing failures, and redesigning to improve reliability. Key aspects of a reliability-focused design process include understanding failure mechanisms, developing reliability databases, and using super-accelerated life testing techniques.
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This book provides a methodology for engineers to determine if electronic parts can meet performance requirements when used outside of the manufacturer's specified ratings. It aims to give a well-defined, risk-informed process for uprating parts. The book covers determining application environment specifications, avoiding risks of using parts outside ratings, applying an uprating methodology, and mitigating legal risks. It is intended for engineers selecting, qualifying, and managing electronic parts across the supply chain, from product manufacturers to part suppliers.
Vibration before thermal cycling in ESS
Environmental stress screening (ESS) is a process that applies environmental stresses like vibration to products to induce latent defects. This helps improve quality and reliability. Vibration and temperature cycling are effective forms of ESS to stimulate flaws like loose connections or cracks. ESS is intended to find flaws, not simulate actual use, so failures during the process are encouraged and their causes must be identified and addressed. Random and quasi-random vibration are commonly used for ESS to induce a variety of motions that can cause failures through mechanisms like loose parts or solder joints. Thermal cycling and vibration work best together in ESS to find defects that one stress alone may not reveal.
Mechanical component reliability
This document provides methodology for designing reliability into mechanical components. It discusses testing wear-related parts for 2 times their expected cycle life to ensure no failures occur during operational use. It also describes using a probabilistic design method called stress/strength interference to design non-wear parts subjected to reversing loads, selecting a safety margin probability number based on the mean and standard deviation of material strength and stress functions. All components should be designed to have a reliability better than a target for the total operational use time.
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Prognostic health management
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