Mohammad Nikpour is seeking a product manager position with over 10 years of experience in semiconductor fabrication. He currently works as a Product Marketing Manager at TOSOH SMD in Columbus, Ohio where he manages product lines and collaborates with an international sales team. Previously, he held process engineering roles at Samsung and Texas Instruments where he improved yield and developed new processes. Nikpour has an MBA and a bachelor's degree in engineering from the University of Texas at Dallas.

1. Mohammad Nikpour
3982 Trail Ridge Drive, Columbus, OH 43228  (614) 282-4968  mnikpour33@gmail.com
C A R E E R O B J E C T I V E
Product manager in a Multinational company with 10+ years process/equipment engineering experience in
semiconducting fabrication factories. Possesses impeccable written and verbal communication skills along with
excellent interpersonal skills. Objective is to attain a marketing/product managerial position.
C O R E C O M P E T E N C I E S
 Technical and Product Strategy
 Cost Efficient
 Detailed and Organized
 Supplier/customer Relationship
P R O F E S S I O N A L E X P E R I E N C E
TOSOH, SMD, Columbus OH
Product Marketing Manager, Jan 2015 – Present
 Manage the entire Titanium, ITO, Solar, and FPD sputter target product line life cycles
from strategic planning to tactical and sales activities.
 Collaborate with 30 + member sales team to increase sales across 250 different
international semiconducting companies.
 Specify market requirements for current and future products Titanium Sputter targets by
conducting market and technical research supported by on-going visits to customers and
non-customer (suppliers, R&D sites, etc..)
 Drive multiple solutions across cross functional development teams (primarily
Development/Engineering, and Marketing Communications) through market requirements,
product contract, and positioning.
 Develop and implementing a company-wide go-to-market plan, working with all departments
to execute.
 Develop and execute commercial and technical strategy across over 250 wafer factories
across the globe.
SAMSUNG INC, Austin, TX
Process Engineer, Jul 2013 – Jan 2015
 Manage cross functional teams across different fabrication departments in
line to enhance yield, defects, and reliability of products.
 Lead technology transfer of 14 and 20nm device processing methodologies via
weekly conference calls with Korea Mother Fab and rollout to Austin Factory.
 Develop new SOP regarding tool down response methodology in cleans
department and manage and train technicians to implement said SOP.
 Responsible for sustaining and developing diffusion and etch tools and
processes in front of line analog wafer fabrication process in a top 2
revenue grossing Multinational company.
 Involved with product definition, qualification, manufacturing, cost
optimization, and quality of semiconductor chips utilized in smart phones and
tablets.
 Design equipment, understanding the reactions taking place, installing
control systems, and starting, running and upgrading the processes.
 Development of production and characterization specifications, creating and
managing product documentation, and providing product development support,
which involves interfacing with design, test engineering, quality engineering,
and other groups.

2. TEXAS INSTRUMENTS, Philippines
Photo and Yield Enhancement Process Engineer, Aug 2010 – Jul 2013
 Project management and collaboration in a multinational company across 7
different countries in Asia & Europe including suppliers in USA and other
countries. Goal was to establish a fabrication process via purchasing the
suitable new/used tools (~$800M USD) and implement a manufacturing process
with the right personal, chemicals, clean room environment, etc.
 Upon initial fab startup completion, I conceived & delegated projects
involving definition and selection of new concepts and approaches in the
development of new processes. These processes included photo, metal
deposition, and many metrology operations within the 1.3 Billion dollar
wafer fab. This fab produces analog chips for tablets, ABS car chips, etc.
 Negotiated multiple contracts for photo stepper, coater, and developer tools
along with yield enhancement inspection tools.
 Identify, design & improve fab equipment with vendor assistance to increase
capacity; improve up time, and decrease cost & inline process/equipment
issues that cause production stops.
 Institute and retrofitted multiple new IT and inline automated systems to
mirror Dallas factories. This streamlined many of the fabrication processes
via accurate and efficient data transfer between tools and our inline data
bases.
TEXAS INSTRUMENTS, Dallas, TX
Wafer fab Process Engineer, Apr 2004 – Aug 2010
Yield enhancement & cost/quality control
 Hardware and Software Design of 3 Macro and 4 Micro inspection tools in a
class 10k clean room environment.
 Monitor, define, eliminate, and most importantly institute systems to
prevent all micro/electrical defects resulted in production stops that
within front & end of fabrication line.
 Worked with assembly sites around the world, and other wafer fabrication
factories to maximize product quality via sharing and implementing best
practices within the processes and end of line process defect detection
methodologies.
 Inline root cause analysis of production stops caused by the photo, plate,
sputter, and ETCH processes, and subsequently assist sustaining team with
definition and implementation of corrective actions.
E D U C A T I O N
THE UNIVERSITY OF TX AT DALLAS, RICHARDSON, TX
Masters, Business Administration
 GPA: 3.74/4.0
THE UNIVERSITY OF TX AT DALLAS, RICHARDSON, TX
Bachelor in Engineering
 GPA: 3.26/4.0
A D D I T I O N A L S K I L L S
• Data Analysis (Jump, Sql server, Excel, spot fire).
• Complex Problem Solving.
• Cost & Cycle time Reduction. • Speak Korean (intermediate)
• Statistical Process Control. • Visual Basic, SharePoint, C++
• SAP use and institution • Microsoft Office
• Read & write Arabic • Access, Microsoft Suite