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Meiling 
Chung 
meilingchung168@gmail.com 
• 
(510) 
366-­‐8309 
SKILLS 
Mentor: 
Calibre 
LVS/DRC, 
Bump, 
Antenna, 
XRC, 
Dummy 
filled 
Synopsys: 
Star 
RC 
Cadence: 
OPUS/Virtuoso 
IC5, 
IC6 
Laker: 
Laker_L4 
EXPERIENCE 
Senior 
Layout 
Designer, 
VIA 
Alliance 
Technology, 
Fremont, 
CA 
2013 
– 
Present 
• Work 
on 
bandgap, 
Regulator, 
and 
RTN 
using 
TSMC 
16nm 
process 
Mobile 
Industry 
Processor 
Interface 
(MIPI) 
IP 
Technologies 
used: 
TSMC 
28nm 
6x2z 
process 
and 
TSMC 
28nm 
5x2z 
process 
Designed 
layout 
of 
low 
power 
(LP) 
single 
ended 
transmitter 
and 
high 
speed 
(HS) 
differential 
transmitter, 
LP 
receivers, 
PLL, 
EDS 
pads, 
and 
digital 
circuits 
Display 
Port/High-­‐Definition 
Multimedia 
Interface 
(DP/HDMI) 
IP 
Technologies 
used: 
TSMC 
28nm/40nm/80nm 
process 
Designed 
layout 
for 
DP/HDMI 
differential 
transmitters, 
AUX 
receivers, 
PLL, 
EDS 
pads, 
and 
digital 
circuits 
Power 
Management 
IC 
Technologies 
used: 
TSMC 
0.35um 
process 
Worked 
on 
ESD 
pad 
ring 
arrangement 
for 
the 
bond 
wiring. 
Designed 
the 
layout 
of 
OpAmp, 
comparator, 
bandgap, 
LDO, 
and 
digital 
circuits 
Power 
Management 
IC 
Technologies 
used: 
TSMC 
0.5um 
process 
Worked 
on 
laptop 
power 
management 
IC 
that 
included 
a 
battery 
charger 
and 
10 
BUCKs. 
Additionally 
worked 
on 
different 
OpAmps, 
OSC, 
and 
digital 
circuits 
Senior 
Layout 
Designer, 
VIA 
Technology, 
Fremont, 
CA 
2003 
– 
2013 
USB 
IP 
Technologies 
used: 
TSMC 
80nm 
process 
Designed 
layout 
of 
USB 
receiver, 
transmitter, 
PLL, 
and 
control 
logics, 
matching 
and 
balancing 
devices 
for 
differential 
input 
receivers 
SATA 
IP 
Technologies 
used: 
TSMC 
80nm 
process 
Designed 
layout 
of 
SATA 
receiver 
used 
in 
the 
chipset 
chip, 
including 
front 
end 
cells 
and 
control 
logics 
Layout 
Designer, 
VIA 
Technology, 
Fremont, 
CA 
2001 
– 
2003 
GTL 
PHY 
Interface 
Technologies 
used: 
TSMC 
80nm 
process 
Designed 
layout 
of 
digital 
interface 
for 
communication 
between 
chipset 
chip 
and 
CPU, 
including 
level 
shifter, 
clock 
tree 
and 
DLL, 
and 
balanced 
data 
path 
pipeline
IC 
Layout 
Designer, 
Integrated 
Circuit 
Technology 
Corp, 
San 
Jose, 
CA 
1991 
– 
2001 
• Utilized 
0.18um 
1P5M 
CMOS 
technology 
to 
create 
custom 
layout 
design 
of 
embedded 
PLD 
IC 
Layout 
Designer, 
Media 
Reality 
Technologies 
Inc, 
Sunnyvale, 
CA 
1998 
– 
1999 
• Utilized 
0.35um 
1P4M 
CMOS 
technology 
to 
create 
custom 
layout 
design 
of 
LCD 
OSD 
chip 
EDUCATION 
Institute 
of 
Business 
and 
Technology, 
Santa 
Clara, 
CA 
Certificate 
of 
CMOS 
Layout 
Design, 
1998 
Mesa 
Community 
College, 
Mesa, 
AZ 
Computer 
Information 
Systems 
and 
Accounting, 
1993 
Catholic 
Fu-­‐Jen 
University, 
Taipei, 
Taiwan 
B.S. 
in 
Law, 
1986

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Meiling Chung_Resume

  • 1. Meiling Chung meilingchung168@gmail.com • (510) 366-­‐8309 SKILLS Mentor: Calibre LVS/DRC, Bump, Antenna, XRC, Dummy filled Synopsys: Star RC Cadence: OPUS/Virtuoso IC5, IC6 Laker: Laker_L4 EXPERIENCE Senior Layout Designer, VIA Alliance Technology, Fremont, CA 2013 – Present • Work on bandgap, Regulator, and RTN using TSMC 16nm process Mobile Industry Processor Interface (MIPI) IP Technologies used: TSMC 28nm 6x2z process and TSMC 28nm 5x2z process Designed layout of low power (LP) single ended transmitter and high speed (HS) differential transmitter, LP receivers, PLL, EDS pads, and digital circuits Display Port/High-­‐Definition Multimedia Interface (DP/HDMI) IP Technologies used: TSMC 28nm/40nm/80nm process Designed layout for DP/HDMI differential transmitters, AUX receivers, PLL, EDS pads, and digital circuits Power Management IC Technologies used: TSMC 0.35um process Worked on ESD pad ring arrangement for the bond wiring. Designed the layout of OpAmp, comparator, bandgap, LDO, and digital circuits Power Management IC Technologies used: TSMC 0.5um process Worked on laptop power management IC that included a battery charger and 10 BUCKs. Additionally worked on different OpAmps, OSC, and digital circuits Senior Layout Designer, VIA Technology, Fremont, CA 2003 – 2013 USB IP Technologies used: TSMC 80nm process Designed layout of USB receiver, transmitter, PLL, and control logics, matching and balancing devices for differential input receivers SATA IP Technologies used: TSMC 80nm process Designed layout of SATA receiver used in the chipset chip, including front end cells and control logics Layout Designer, VIA Technology, Fremont, CA 2001 – 2003 GTL PHY Interface Technologies used: TSMC 80nm process Designed layout of digital interface for communication between chipset chip and CPU, including level shifter, clock tree and DLL, and balanced data path pipeline
  • 2. IC Layout Designer, Integrated Circuit Technology Corp, San Jose, CA 1991 – 2001 • Utilized 0.18um 1P5M CMOS technology to create custom layout design of embedded PLD IC Layout Designer, Media Reality Technologies Inc, Sunnyvale, CA 1998 – 1999 • Utilized 0.35um 1P4M CMOS technology to create custom layout design of LCD OSD chip EDUCATION Institute of Business and Technology, Santa Clara, CA Certificate of CMOS Layout Design, 1998 Mesa Community College, Mesa, AZ Computer Information Systems and Accounting, 1993 Catholic Fu-­‐Jen University, Taipei, Taiwan B.S. in Law, 1986